LM567/LM567C Tone Decoder
February 2003
LM567/LM567C Tone Decoder
General Description
The LM567 and LM567C are general purpose tone decoders designed to provide a saturated transistor switch to ground when an input signal is present within the passband. The circuit consists of an I and Q detector driven by a voltage controlled oscillator which determines the center frequency of the decoder. External components are used to independently set center frequency, bandwidth and output delay. n n n n High rejection of out of band signals and noise Immunity to false signals Highly stable center frequency Center frequency adjustable from 0.01 Hz to 500 kHz
Applications
n n n n n n n Touch tone decoding Precision oscillator Frequency monitoring and control Wide band FSK demodulation Ultrasonic controls Carrier current remote controls Communications paging decoders
Features
n 20 to 1 frequency range with an external resistor n Logic compatible output with 100 mA current sinking capability n Bandwidth adjustable from 0 to 14%
Connection Diagrams
Metal Can Package Dual-In-Line and Small Outline Packages
00697501
Top View Order Number LM567H or LM567CH See NS Package Number H08C
00697502
Top View Order Number LM567CM See NS Package Number M08A Order Number LM567CN See NS Package Number N08E
© 2004 National Semiconductor Corporation
DS006975
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LM567/LM567C
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Pin Power Dissipation (Note 2) V8 V3 V3 Storage Temperature Range Operating Temperature Range 9V 1100 mW 15V −10V V4 + 0.5V −65˚C to +150˚C
LM567H LM567CH, LM567CM, LM567CN Soldering Information Dual-In-Line Package Soldering (10 sec.) Small Outline Package Vapor Phase (60 sec.) Infrared (15 sec.)
−55˚C to +125˚C 0˚C to +70˚C
260˚C 215˚C 220˚C
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
Electrical Characteristics
AC Test Circuit, TA = 25˚C, V+ = 5V Parameters Power Supply Voltage Range Power Supply Current Quiescent Power Supply Current Activated Input Resistance Smallest Detectable Input Voltage Largest No Output Input Voltage Largest Simultaneous Outband Signal to Inband Signal Ratio Minimum Input Signal to Wideband Noise Ratio Largest Detection Bandwidth Largest Detection Bandwidth Skew Largest Detection Bandwidth Variation with Temperature Largest Detection Bandwidth Variation with Supply Voltage Highest Center Frequency Center Frequency Stability (4.75–5.75V) 0 < TA < 70 −55 < TA < +125 Center Frequency Shift with Supply Voltage Fastest ON-OFF Cycling Rate Output Leakage Current Output Saturation Voltage Output Fall Time Output Rise Time V8 = 15V ei = 25 mV, I8 = 30 mA ei = 25 mV, I8 = 100 mA 4.75V–6.75V 4.75V–9V 4.75–6.75V 100 Bn = 140 kHz 12 IL = 100 mA, fi = fo IC = 100 mA, fi = fo 10 RL = 20k RL = 20k 18 Conditions LM567 Min 4.75 Typ 5.0 6 11 20 20 15 6 −6 14 1 16 2 10 25 10 Max 9.0 8 13 15 LM567C/LM567CM Min 4.75 Typ 5.0 7 12 20 20 15 6 −6 14 2 18 3 25 Max 9.0 10 15 Units V mA mA kΩ mVrms mVrms dB dB % of fo % of fo %/˚C
± 0.1 ±1
500 35 ± 60 35 ± 140 0.5 fo/20 0.01 0.2 0.6 30 150 25 0.4 1.0 1.0 2.0
± 0.1 ±2
100
±1
500 35 ± 60 35 ± 140 0.4 fo/20 0.01 0.2 0.6 30 150
±5
%V kHz ppm/˚C ppm/˚C
2.0 2.0 25 0.4 1.0
%/V %/V µA V ns ns
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 2: The maximum junction temperature of the LM567 and LM567C is 150˚C. For operating at elevated temperatures, devices in the TO-5 package must be derated based on a thermal resistance of 150˚C/W, junction to ambient or 45˚C/W, junction to case. For the DIP the device must be derated based on a thermal resistance of 110˚C/W, junction to ambient. For the Small Outline package, the device must be derated based on a thermal resistance of 160˚C/W, junction to ambient. Note 3: Refer to RETS567X drawing for specifications of military LM567H version.
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LM567/LM567C
Schematic Diagram
00697503
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LM567/LM567C
Typical Performance Characteristics
Typical Frequency Drift Typical Bandwidth Variation
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Typical Frequency Drift
Typical Frequency Drift
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Bandwidth vs Input Signal Amplitude
Largest Detection Bandwidth
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00697515
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LM567/LM567C
Typical Performance Characteristics
Detection Bandwidth as a Function of C2 and C3
(Continued) Typical Supply Current vs Supply Voltage
00697517 00697516
Greatest Number of Cycles Before Output
Typical Output Voltage vs Temperature
00697518
00697519
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LM567/LM567C
Typical Applications
Touch-Tone Decoder
00697505
Component values (typ) R1 R2 R3 C1 C2 C3 C4 6.8 to 15k 4.7k 20k 0.10 mfd 1.0 mfd 6V 2.2 mfd 6V 250 mfd 6V
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LM567/LM567C
Typical Applications
(Continued)
Oscillator with Double Frequency Output
Oscillator with Quadrature Output
00697507
00697506
Connect Pin 3 to 2.8V to Invert Output
Precision Oscillator Drive 100 mA Loads
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LM567/LM567C
AC Test Circuit
Applications Information
The center frequency of the tone decoder is equal to the free running frequency of the VCO. This is given by
The bandwidth of the filter may be found from the approximation
Where: Vi = Input voltage (volts rms), Vi ≤ 200mV C2 = Capacitance at Pin 2(µF)
00697509
fi = 100 kHz + 5V
*Note: Adjust for fo = 100 kHz.
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LM567/LM567C
LM567C MDC MWC TONE DECODER
00697523
Die Layout (C - Step)
DIE/WAFER CHARACTERISTICS
Fabrication Attributes Physical Die Identification Die Step Physical Attributes Wafer Diameter Dise Size (Drawn) Thickness Min Pitch Special Assembly Requirements: Note: Actual die size is rounded to the nearest micron. Die Bond Pad Coordinate Locations (C - Step) (Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used SIGNAL NAME OUTPUT FILTER LOOP FILTER INPUT V+ TIMING RES TIMING CAP GND OUTPUT PAD# NUMBER 1 2 3 4 5 6 7 8 X/Y COORDINATES X -673 -673 -673 -356 673 673 178 -318 Y 686 -419 -686 -686 -122 76 686 679 X 91 91 91 91 91 91 117 117 x x x x x x x x PAD SIZE Y 91 91 91 91 91 91 91 104 150mm LM567C C General Die Information Bond Pad Opening Size (min) Bond Pad Metalization Passivation Back Side Metal 1600µm x 1626µm Back Side Connection 63.0mils x 64.0mils 406µm Nominal 198µm Nominal 91µm x 91µm 0.5% COPPER_BAL. ALUMINUM VOM NITRIDE BARE BACK Floating
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LM567/LM567C
LM567C MDC MWC TONE DECODER (Continued)
IN U.S.A Tel #: Fax: IN EUROPE Tel: Fax: IN ASIA PACIFIC Tel: IN JAPAN Tel: 81 043 299 2308 (852) 27371701 49 (0) 8141 351492 / 1495 49 (0) 8141 351470 1 877 Dial Die 1 877 342 5343 1 207 541 6140
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LM567/LM567C
Physical Dimensions
unless otherwise noted
inches (millimeters)
Metal Can Package (H) Order Number LM567H or LM567CH NS Package Number H08C
Small Outline Package (M) Order Number LM567CM NS Package Number M08A
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LM567/LM567C Tone Decoder
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Molded Dual-In-Line Package (N) Order Number LM567CN NS Package Number N08E
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
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