LM759MH

LM759 LM77000 Power Operational Amplifiers November 1994 LM759 LM77000 Power Operational Amplifiers General Description The LM759 and LM77000 are high performance operational amplifiers that feature high output current capability The LM759 is capable of providing 325 mA and the LM77000 providing 250 mA Both amplifiers feature small signal characteristics that are better than the LM741 The amplifiers are designed to operate from a single or dual power supply with an input common mode range that includes the negative supply The high gain and high output power provide superior performance Internal current limiting thermal shutdown and safe area compensation are employed making the LM759 and LM77000 essentially indestructible Features Y Y Y Y Y Output current LM759 325 mA minimum LM77000 250 mA minimum Internal short circuit current limiting Internal thermal overload protection Internal output transistors safe-area protection Input common mode voltage range includes ground or negative supply Applications Y Y Y Y Voltage regulators Audio amplifiers Servo amplifiers Power drivers Connection Diagrams and Ordering Information TL H 10075 – 2 Top View TL H 10075 – 1 Lead 4 connected to case Order Number LM759CP or LM77000CP See NS Package Number P04A Top View Order Number LM759MH LM759CH or LM759H 883 See NS Package Number H08C C1995 National Semiconductor Corporation TL H 10075 RRD-B30M115 Printed in U S A Absolute Maximum Ratings If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Range Metal Can Plastic Package b 65 C to a 175 C b 65 C to a 150 C Internal Power Dissipation (Note 1) Supply Voltage Differential Input Voltage Input Voltage (note 2) Internally Limited g 18V 30V g 15V Operating Junction Temperature Range b 55 C to a 150 C Military (LM759M) Commercial (LM759C LM77000C) 0 C to a 125 C Lead Temperature Metal Can (soldering 60 sec) 300 C Plastic Package (soldering 10 sec) 265 C LM759 Electrical Characteristics TJ e 25 C Symbol VIO IIO IIB ZI ICC VIR IOS IO PEAK AVS TR Parameter Input Offset Voltage Input Offset Current Input Bias Current Input Impedance Supply Current Input Voltage Range Output Short Circuit Current Peak Output Current Large Signal Voltage Gain Transient Response Rise Time Overshoot SR BW Slew Rate Bandwidth VCC e g 15V unless otherwise specified Conditions Min Typ 10 50 50 0 25 15 12 V a b 2V to Vb V a b 2V to Vb g 200 g 325 g 500 Max 30 30 150 Units mV nA nA MX RS s 10 kX 18 mA V mA mA V mV ns % V ms MHz lVCC – VOl e 30V 3 0V s lVCC –VOl s 10V RL t 50X VO e g 10V RL e 50X AV e 1 0 50 200 300 50 RL e 50X AV e 1 0 AV e 1 0 06 10 The following specifications apply for b55 C s TJ s a 150 C VIO IIO IIB CMRR PSRR AVS VOP Input Offset Voltage Input Offset Current Input Bias Current Common Mode Rejection Ratio Power Supply Rejection Ratio Large Signal Voltage Gain Output Voltage Swing RS s 10 kX RS s 10 kX RL t 50X VO e g 10V RL e 50X 80 80 25 g 10 RS s 10 kX 45 60 300 100 100 200 g 12 5 mV nA nA dB dB V mV V 2 LM759C Electrical Characteristics TJ e 25 C Symbol VIO IIO IIB ZI ICC VIR IOS IO PEAK AVS TR Parameter Input Offset Voltage Input Offset Current Input Bias Current Input Impedance Supply Current Input Voltage Range Output Short Circuit Current Peak Output Current Large Signal Voltage Gain Transient Response Rise Time Overshoot SR BW Slew Rate Bandwidth VCC e g 15V unless otherwise specified Conditions Min Typ 10 50 50 0 25 15 12 V a b 2V to Vb V a b 2V to Vb g 200 g 325 g 500 Max 60 50 250 Units mV nA nA MX RS s 10 kX 18 mA V mA mA V mV ns % V ms MHz lVCC –VOl e 30V 3 0V s lVCC –VOl s 10V RL t 50X VO e g 10V RL e 50X AV e 1 0 25 200 300 10 RL e 50X AV e 1 0 AV e 1 0 05 10 The following specifications apply for 0 s TJ s a 125 C VIO IIO IIB CMRR PSRR AVS VOP Input Offset Voltage Input Offset Current Input Bias Current Common Mode Rejection Ratio Power Supply Rejection Ratio Large Signal Voltage Gain Output Voltage Swing RS s 10 kX RS s 10 kX RL t 50X VO e g 10V RL e 50X 70 80 25 g 10 RS s 10 kX 75 100 400 100 100 200 g 12 5 mV nA nA dB dB V mV V 3 LM77000 Electrical Characteristics TJ e 25 C Symbol VIO IIO IIB ZI ICC VIR IOS IO PEAK AVS TR Parameter Input Offset Voltage Input Offset Current Input Bias Current Input Impedance Supply Current Input Voltage Range Output Short Circuit Current Peak Output Current Large Signal Voltage Gain Transient Response Rise Time Overshoot SR BW Slew Rate Bandwidth VCC e g 15V unless otherwise specified Conditions Min Typ 10 50 50 0 25 15 12 a 13 to Vb a 13 to Vb g 200 g 250 g 400 Max 80 50 250 Units mV nA nA MX RS s 10 kX 18 mA V mA mA V mV ns % V ms MHz lVCC – VOl e 30V 3 0V s lVCC –VOl s 10V RL t 50X VO e g 10V RL e 50X AV e 1 0 25 200 300 10 RL e 50X AV e 1 0 AV e 1 0 05 10 The following specifications apply for 0 s TJ s a 125 C VIO IIO IIB CMR PSRR AVS VOP Input Offset Voltage Input Offset Current Input Bias Current Common Mode Rejection Power Supply Rejection Ratio Large Signal Voltage Gain Output Voltage Swing RS s 10 kX RS s 10 kX RL t 50X VO e g 10V RL e 50X 70 80 25 g 10 RS s 10 kX 10 100 400 100 100 200 g 12 5 mV nA nA dB dB V mV V Note 1 Although the internal power dissipation is limited the junction temperature must be kept below the maximum specified temperature in order to meet data sheet specifications To calculate the maximum junction temperature or heat sink required use the thermal resistance values which follow the Equivalent Circuit Schematic Note 2 For a supply voltage less than 30V between V a and Vb the absolute maximum input voltage is equal to the supply voltage Note 3 For military electrical specifications RETS759X are available for LM759H 4 Equivalent Circuit 5 TL H 10075 – 3 Note All resistor values in ohms Package Plastic Package (P) Metal Can (H) PD Max e TJ Max b TA Typ iJC CW 80 30 Max iJC CW 12 40 Typ iJA CW 75 120 Max iJA CW 80 150 Mounting Hints Metal Can Package (LM759CH LM759MH) The LM759 in the 8-Lead TO-99 metal can package must be used with a heat sink With g 15V power supplies the LM759 can dissipate up to 540 mW in its quiescent (no load) state This would result in a 100 C rise in chip temperature to 125 C (assuming a 25 C ambient temperature) In order to avoid this problem it is advisable to use either a slip on or stud mount heat sink with this package If a stud mount heat sink is used it may be necessary to use insulating washers between the stud and the chassis because the case of the LM759 is internally connected to the negative power supply terminal Plastic Package (LM759CP LM77000CP) The LM759CP and LM77000CP are designed to be attached by the tab to a heat sink This heat sink can be either one of the many heat sinks which are commercially available a piece of metal such as the equipment chassis or a suitable amount of copper foil as on a double sided PC board The important thing to remember is that the negative power supply connection to the op amp must be made through the tab Furthermore adequate heat sinking must be provided to keep the chip temperature below 125 C under worst case load and ambient temperature conditions or iJC a iCA b TA T e J Max (without a heat sink) iJA iCA e iCS a iSA Solving TJ TJ e TA a PD (iJC a iCA) or e TA a PDiJA (without a heat sink) Where TJ e Junction Temperature TA e Ambient Temperature PD e Power Dissipation iJA e Junction to ambient thermal resistance iJC e Junction to case thermal resistance iCA e Case to ambient thermal resistance iCS e Case to heat sink thermal resistance iSA e Heat sink to ambient thermal resistance 6 Typical Performance Characteristics Frequency Response for Various Closed Loop Gains Open Loop vs Frequency Response Output Voltage vs Frequency Output Voltage vs Load Resistance Voltage Follower Large Signal Pulse Response Voltage Follower Transient Response Total Harmonic Distortion vs Frequency Total Harmonic Distortion vs Power Output Input Noise Voltage vs Frequency Noise Current vs Frequency Short Circuit Current vs Junction Temperature Peak Output Current vs Output Voltage TL H 10075 – 4 7 Applications Offset Null Circuit Paralleling LM759 Power Op Amps TL H 10075–5 Audio Applications Low Cost Phono Amplifier TL H 10075 – 6 Speaker Impedance (Ohms) 4 8 16 32 Output Power (Watts) 0 18 0 36 0 72 1 44 Min Supply (Volts) 9 12 15 25 VOP – P (Volts) 24 48 96 19 2 TL H 10075–7 8 Applications (Continued) Bi-Directional Intercom System Using the LM759 Power Op Amp TL H 10075 – 9 Features Circuit Simplicity 1 Watt of Audio Output Duplex operation with only one two-wire cable as interconnect Note 1 All resistor values in ohms 9 Applications (Continued) High Slew Rate Power Op Amp Audio Amp Servo Applications AG Servo Amplifier Bridge Type TL H 10075 – 10 Features High Slew Rate 9 V ms High 3 dB Power Bandwidth 85 kHz 18 Watts Output Power into an 8X load Low Distortion 0 2% 10 Vrms 1 kHz into 8X Design Consideration AV t 10 TL H 10075 – 11 Features Gain of 10 Use of LM759 Means Simple Inexpensive Circuit Design Considerations 325 mA Max Output Current DC Servo Amplifier TL H 10075 – 12 Features Circuit Simplicity One Chip Means Excellent Reliability Design Considerations IO s 325 mA Note 1 All resistor values in ohms 10 Regulator Applications Adjustable Dual Tracking Regulator TL H 10075 – 13 Features Wide Output Voltage Range ( g 2 2V to g 30V) Excellent Load Regulation DVO k g 5 mV for DIO e g 0 2 A Excellent Line Regulation DVO k g 2 mV for DVI e 10V Note 1 All resistor values in ohms 10 Amp 12 Volt Regulator Features Excellent Load and Line Regulation Excellent Temperature Coefficient-Depends Largely on Tempco of the Reference Zener Note 1 All resistor values in ohms TL H 10075 – 14 11 12 Physical Dimensions inches (millimeters) 8-Lead Metal Package Order Number LM759MH LM759CH or LM759H 883 NS Package Number H08C 13 LM759 LM77000 Power Operational Amplifiers Physical Dimensions inches (millimeters) (Continued) Order Number LM759CP or LM77000CP NS Package Number P04A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 1111 West Bardin Road Arlington TX 76017 Tel 1(800) 272-9959 Fax 1(800) 737-7018 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Europe Fax 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