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LMH6622MAX

LMH6622MAX

  • 厂商:

    NSC

  • 封装:

  • 描述:

    LMH6622MAX - Dual Wideband, Low Noise, 160MHz, Operational Amplifiers - National Semiconductor

  • 数据手册
  • 价格&库存
LMH6622MAX 数据手册
LMH6622 Dual Wideband, Low Noise, 160MHz, Operational Amplifiers February 2002 LMH6622 Dual Wideband, Low Noise, 160MHz, Operational Amplifiers General Description The LMH6622 is a dual high speed voltage feedback operational amplifier specifically optimized for low noise. A voltage noise specification of 1.6nV/ , a current noise specification 1.5pA/ , a bandwidth of 160MHz, and a harmonic distortion specification that exceeds 90dBc combine to make the LMH6622 an ideal choice for the receive channel amplifier in ADSL, VDSL, or other xDSL designs. The LMH6622 operates from ± 2.5V to ± 6V in dual supply mode and from +5V to +12V in single supply configuration. The LMH6622 is stable for AV ≥ 2 or AV ≤ −1. The fabrication of the LMH6622 on National Semiconductor’s advanced VIP10 process enables excellent (160MHz) bandwidth at a current consumption of only 4.3mA/amplifier. Packages for this dual amplifier are the 8-lead SOIC and the 8-lead MSOP. Features VS = ± 6V, TA = 25˚C, Typical values unless specified n Bandwidth (AV = +2) 160MHz ± 2.5V to ± 6V n Supply Voltage Range +5V to +12 n Slew rate 85V/µs n Supply current 4.3mA/amp n Input common mode voltage −4.75V to +5.7V ± 4.6V n Output Voltage Swing (RL = 100Ω) n Input voltage noise 1.6nV/ n Input current noise 1.5pA/ n Linear output current 90mA n Excellent harmonic distortion 90dBc Applications n n n n n xDSL receiver Low noise instrumentation front end Ultrasound preamp Active filters Cellphone basestation 20029226 xDSL Analog Front End © 2002 National Semiconductor Corporation DS200292 www.national.com LMH6622 Absolute Maximum Ratings (Note 1) Wave Soldering (10 sec) Storage Temperature Range Junction Temperature (Note 4) 260˚C −65˚C to +150˚C +150˚C If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. ESD Tolerance Human Body Model Machine Model VIN Differential Supply Voltage (V – V ) Voltage at Input Pins Soldering Information Infrared or Convection (20 sec) 235˚C + − 2kV (Note 2) 200V (Note 2) Operating Ratings Supply Voltage (V+– V−) Junction Temperature Range (Note 3), (Note 4) 8-pin SOIC 8-pin MSOP (Note 1) ± 2.25V to ± 6V −40˚C to +85˚C ± 1.2V 13.2V V+ +0.5V, V− −0.5V Package Thermal Resistance (Note 4) (θJA) 166˚C/W 211˚C/W ± 6V Electrical Characteristics Unless otherwise specified, TJ = 25˚C, V+ = 6V, V− = −6V, VCM = 0V, AV = +2, RF = 500Ω, RL = 100Ω. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (Note 6) Typ (Note 5) 160 30 85 40 35 2.3 2.3 1.6 1.5 0.03 0.03 −90 −100 −94 −100 −78 −70 dBc Max (Note 6) Units Dynamic Performance fCL BW0.1dB SR TS Tr Tf en in DG DP HD2 HD3 MTPR −3dB BW 0.1dB Gain Flatness Slew Rate (Note 8) Settling Time Rise Time Fall Time Input Referred Voltage Noise Input Referred Current Noise Differential Gain Differential Phase 2nd Harmonic Distortion 3rd Harmonic Distortion Upstream Downstream Input Characteristics VOS TC VOS IOS IB RIN CIN Input Offset Voltage Input Offset Average Drift Input Offset Current Input Bias Current Input Resistance Input Capacitance VCM = 0V VCM = 0V (Note 7) VCM = 0V VCM = 0V Common Mode Differential Mode Common Mode Differential Mode −1 −1.5 −1.2 −2 +0.2 −2.5 −0.04 4.7 17 12 0.9 1.0 1 1.5 10 15 +1.2 +2 mV µV/˚C µA µA MΩ kΩ pF pF VO = 200mVPP VO = 200mVPP VO = 2VPP VO = 2VPP to ± 0.1% VO = 2VPP to ± 1.0% VO = 0.2V Step, 10% to 90% VO = 0.2V Step, 10% to 90% f = 100kHz f = 100kHz RL = 150Ω, RF = 470Ω, NTSC RL = 150Ω, RF = 470Ω, NTSC fc = 1MHz, VO = 2VPP, RL = 100Ω fc = 1MHz, VO = 2VPP, RL = 500Ω fc = 1MHz, VO = 2VPP, RL = 100Ω fc = 1MHz, VO = 2VPP, RL = 500Ω VO = 0.6 VRMS, 26kHz to 132kHz (see test circuit 5) VO = 0.6 VRMS, 144kHz to 1.1MHz (see test circuit 5) MHz MHz V/µs ns ns ns nV/ pA/ % deg dBc dBc Distortion and Noise Response www.national.com 2 LMH6622 ± 6V Electrical Characteristics Symbol CMVR CMRR Parameter Input Common Mode Voltage Range Common-Mode Rejection Ratio (Continued) Unless otherwise specified, TJ = 25˚C, V+ = 6V, V− = −6V, VCM = 0V, AV = +2, RF = 500Ω, RL = 100Ω. Boldface limits apply at the temperature extremes. Conditions CMRR ≥ 60dB 5.5 Input Referred, VCM = −4.2 to +5.2V VO = 4VPP f = 1MHz No Load, Positive Swing No Load, Negative Swing RL = 100Ω, Positive Swing RL = 100Ω, Negative Swing RO ISC Output Impedance Output Short Circuit Current f = 1MHz Sourcing to Ground ∆VIN = 200mV (Note 3), (Note 9) Sinking to Ground ∆VIN = −200mV (Note 3), (Note 9) IOUT Output Current Sourcing, VO = +4.3V Sinking, VO = −4.3V Input Referred, VS = +5V to +6V Input Referred, VS = −5V to −6V No Load 80 74 75 69 100 100 4.0 3.8 4.8 4.6 80 75 74 70 Min (Note 6) Typ (Note 5) −4.75 +5.7 100 Max (Note 6) −4.5 Units V dB Transfer Characteristics AVOL Xt VO Large Signal Voltage Gain Crosstalk Output Swing 83 −75 5.2 −5.0 4.6 −4.6 0.08 135 130 90 mA −4 −3.8 Ω −4.6 −4.4 dB dB Output Characteristics V mA Power Supply +PSRR −PSRR IS Positive Power Supply Rejection Ratio Negative Power Supply Rejection Ratio Supply Current (per amplifier) 95 90 4.3 6 6.5 dB mA ± 2.5V Electrical Characteristics Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.5V, V− = −2.5V, VCM = 0V, AV = +2, RF = 500Ω, RL = 100Ω. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (Note 6) Typ (Note 5) 150 20 80 45 40 2.5 2.5 1.7 1.5 Max (Note 6) Units Dynamic Performance fCL BW0.1dB SR TS Tr Tf en in −3dB BW 0.1dB Gain Flatness Slew Rate (Note 8) Settling Time Rise Time Fall Time Input Referred Voltage Noise Input Referred Current Noise VO = 200mVPP VO = 200mVPP VO = 2VPP VO = 2VPP to ± 0.1% VO = 2VPP to ± 1.0% VO = 0.2V Step, 10% to 90% VO = 0.2V Step, 10% to 90% f = 100kHz f = 100kHz MHz MHz V/µs ns ns ns nV/ pA/ Distortion and Noise Response 3 www.national.com LMH6622 ± 2.5V Electrical Characteristics Symbol HD2 HD3 MTPR Parameter 2nd Harmonic Distortion 3rd Harmonic Distortion Upstream Downstream Input Characteristics VOS TC VOS IOS IB RIN CIN CMVR CMRR Input Offset Voltage Input Offset Average Drift Input Offset Current Input Bias Current Input Resistance Input Capacitance Input Common Mode Voltage Range Common Mode Rejection Ratio (Continued) Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.5V, V− = −2.5V, VCM = 0V, AV = +2, RF = 500Ω, RL = 100Ω. Boldface limits apply at the temperature extremes. Conditions fc = 1MHz, VO = 2VPP, RL = 100Ω fc = 1MHz, VO = 2VPP, RL = 500Ω fc = 1MHz, VO = 2VPP, RL = 100Ω fc = 1MHz, VO = 2VPP, RL = 500Ω VO = 0.4VRMS,26kHz to 132kHz (see test circuit 5) VO = 0.4VRMS,144kHz to 1.1MHz (see test circuit 5) VCM = 0V VCM = 0V (Note 7) VCM = 0V VCM = 0V Common Mode Differential Mode Common Mode Differential Mode CMRR ≥ 60dB 2 Input Referred, VCM = −0.7 to +1.7V VO = 1VPP f = 1MHz No Load, Positive Swing No Load, Negative Swing RL = 100Ω, Positive Swing RL = 100Ω, Negative Swing RO ISC Output Impedance Output Short Circuit Current f = 1MHz Sourcing to Ground ∆VIN = 200mV (Note 3), (Note 9) Sinking to Ground ∆VIN = −200mV (Note 3), (Note 9) IOUT Output Current Sourcing, VO = +0.8V Sinking, VO = −0.8V Input Referred, VS = +2.5V to +3V Input Referred, VS = −2.5V to −3V 4 Min (Note 6) Typ (Note 5) −88 −98 −92 −100 −76 −68 Max (Note 6) Units dBc dBc dBc −1.5 −2.3 −1.5 −2.5 +0.3 −2.5 +0.01 4.6 17 12 0.9 1.0 −1.25 +2.2 100 +1.5 +2.3 1.5 2.5 10 15 mV µV/˚C µA µA MΩ kΩ pF pF −1 V dB 80 75 74 Transfer Characteristics AVOL Xt VO Large Signal Voltage Gain Crosstalk Output Swing 82 −75 1.4 1.2 1.7 −1.5 1.2 1 1.5 −1.4 0.1 100 100 137 134 90 mA −1.1 −0.9 Ω −1.2 −1 dB dB Output Characteristics V mA Power Supply +PSRR −PSRR Positive Power Supply Rejection Ratio Negative Power Supply Rejection Ratio 78 72 75 70 93 88 dB dB www.national.com LMH6622 ± 2.5V Electrical Characteristics Symbol IS Parameter Supply Current (per amplifier) No Load (Continued) Unless otherwise specified, all limits guaranteed for TJ = 25˚C, V+ = 2.5V, V− = −2.5V, VCM = 0V, AV = +2, RF = 500Ω, RL = 100Ω. Boldface limits apply at the temperature extremes. Conditions Min (Note 6) Typ (Note 5) 4.1 Max (Note 6) 5.8 6.4 Units mA Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 2: Human body model, 1.5kΩ in series with 100pF. Machine model, 0Ω in series with 200pF. Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Note 4: The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly onto a PC board. Note 5: Typical values represent the most likely parametric norm. Note 6: All limits are guaranteed by testing or statistical analysis. Note 7: Offset voltage average drift is determined by dividing the change in VOS at temperature extremes into the total temperature change. Note 8: Slew rate is the slowest of the rising and falling slew rates. Note 9: Short circuit test is a momentary test. Output short circuit duration is infinite for VS ≤ ± 2.5V, at room temperature and below. For VS > ± 2.5V, allowable short circuit duration is 1.5ms. 5 www.national.com LMH6622 Typical Performance Characteristics Current and Voltage Noise vs. Frequency Current and Voltage Noise vs. Frequency 20029224 20029225 Frequency Response vs. Input Signal Level Frequency Response vs. Input Signal Level 20029202 20029203 Inverting Amplifier Frequency Response Non-Inverting Amplifier Frequency Response 20029246 20029247 www.national.com 6 LMH6622 Typical Performance Characteristics Open Loop Gain and Phase Response (Continued) Crosstalk vs. Frequency 20029205 20029201 PSRR vs. Frequency CMRR vs. Frequency 20029204 20029206 Positive Output Swing vs. Source Current Negative Output Swing vs. Sink Current 20029248 20029249 7 www.national.com LMH6622 Typical Performance Characteristics Non-Inverting Small Signal Pulse Response VS = ± 2.5V, RL = 100Ω, AV = +2, RF = 500Ω (Continued) Non-Inverting Small Signal Pulse Response VS = ± 6V, RL = 100Ω, AV = +2, RF = 500Ω 20029207 20029209 Non-Inverting Large Signal Pulse Response VS = ± 2.5V, RL = 100Ω, AV = +2, RF = 500Ω Non-Inverting Large Signal Pulse Response VS = ± 6V, RL = 100Ω, AV = +2, RF = 500Ω 20029208 20029210 Harmonic Distortion vs. Input Signal Level Harmonic Distortion vs. Input Signal Level 20029212 20029213 www.national.com 8 LMH6622 Typical Performance Characteristics Harmonic Distortion vs. Frequency (Continued) Harmonic Distortion vs. Frequency 20029214 20029215 Harmonic Distortion vs. Input Signal Level Harmonic Distortion vs. input Signal Level 20029216 20029217 Harmonic Distortion vs. Input Frequency Harmonic Distortion vs. Input Frequency 20029218 20029219 9 www.national.com LMH6622 Typical Performance Characteristics Full Rate ADSL (DMT) Upstream MTPR @ VS = ± 2.5V (Continued) Full Rate ADSL (DMT) Downstream MTPR @ VS = ± 2.5V 20029256 20029258 Full Rate ADSL (DMT) Upstream MTPR @ VS = ± 6V Full Rate ADSL (DMT) Downstream MTPR @ VS = ± 6V 20029257 20029259 www.national.com 10 LMH6622 Connection Diagram 8-Pin SOIC/MSOP 20029211 Top View Ordering Information Package 8-Pin SOIC 8-Pin MSOP Part Number LMH6622MA LMH6622MAX LMH6622MM LMH6622MMX A80A Package Marking LMH6622MA Transport Media 95 Units per Rail 2.5k Units Tape and Reel 1k Units Tape and Reel 3.5k Units Tape and Reel MUA08A NSC Drawing M08A Test Circuits 20029253 3) Voltage Noise RG = 1Ω for f ≤ 100kHz, RG = 20Ω for f > 100kHz 20029250 1) Non-Inverting Amplifier 20029252 20029251 2) CMRR 4) Current Noise RG = 1Ω for f ≤ 100kHz, RG = 20Ω for f > 100kHz 11 www.national.com LMH6622 Test Circuits (Continued) 20029255 5) Multitone Power Ratio, RF = 500Ω, RG = 174Ω, RL = 437Ω DSL Receive Channel Applications 20029223 FIGURE 1. ADSL Signal Description The LMH6622 is a dual, wideband operational amplifier designed for use as a DSL line receiver. In the receive band of a Customer Premises Equipment (CPE) ADSL modem it is possible that as many as 255 Discrete Multi-Tone (DMT) QAM signals will be present, each with its own carrier frequency, modulation, and signal level. The ADSL standard requires a line referred noise power density of -140dBm/Hz within the CPE receive band of 100KHz to 1.1MHz. The CPE driver output signal will leak into the receive path because of full duplex operation and the imperfections of the hybrid coupler circuit. The DSL analog front end must incorporate a receiver pre-amp which is both low noise and highly linear for ADSL-standard operation. The LMH6622 is designed for the twin performance parameters of low noise and high linearity. Applications ranging from +5V to +12V or ± 2.5V to ± 6V are fully supported by the LMH6622. In Figure 2, the LMH6622 is used as an inverting summing amplifier to provide both received pre-amp channel gain and driver output signal cancellation, i.e., the function of a hybrid coupler. www.national.com 12 LMH6622 DSL Receive Channel Applications (Continued) 20029227 FIGURE 2. ADSL Receive Applications Circuit 13 www.national.com LMH6622 DSL Receive Channel Applications (Continued) The two RS resistors are used to provide impedance matching through the 1:N transformer. Receive Channel Noise Calculation The circuit of Figure 2 also has the characteristic that it cancels noise power from the drive channel. The noise gain of the receive pre-amp is found to be: Where RL is the impedance of the twisted pair line. N is the turns ratio of the transformer. The resistors R2 and RF are used to set the receive gain of the pre-amp. The receive gain is selected to meet the ADC full-scale requirement of a DSL chipset. Resistor R1 and R2 along with RF are used to achieve cancellation of the output driver signal at the output of the receiver. Since the LMH6622 is configured as an inverting summing amplifier, VOUT is found to be, Noise power at each of the output of LMH6622: where Vn in inon-inv iinv k Input referred voltage noise Input referred current noise Input referred non-inverting current noise Input referred inverting current noise Boltzmann’s constant, K = 1.38 x 10−23 Resistor temperature in k Source resistance at the non-inverting input to balance offset voltage, typically very small for this inverting summing applications The expression for V1 and V2 can be found by using superposition principle. When VS = 0, T R+ For a voltage feedback amplifier, When VA = 0, Therefore, total output noise from the differential pre-amp is: Therefore, The factor ’2 ’ appears here because of differential output. Differential Analog-to-Digital Driver And then, Setting R1 = 2*R2 to cancel unwanted driver signal in the receive path, then we have We can also find that, And then 20029239 FIGURE 3. Circuit for Differential A/D Driver In conclusion, the peak-to-peak voltage to the ADC would be, www.national.com 14 LMH6622 DSL Receive Channel Applications (Continued) The LMH6622 is a low noise, low distortion high speed operational amplifier. The LMH6622 comes in either SOIC-8 or MSOP-8 packages. Because two channels are available in each package the LMH6622 can be used as a high dynamic range differential amplifier for the purpose of driving a high speed analog-to-digital converter. Driving a 1kΩ load, the differential amplifier of Figure 3 provides 20dB gain, a flat frequency response up to 6MHz, and harmonic distortion that is lower than 80dBc. This circuit makes use of a transformer to convert a single-ended signal to a differential signal. The input resistor RIN is chosen by the following equation, 20029222 The gain of this differential amplifier can be adjusted by RC and RF, FIGURE 5. Total Output Referred Noise Density 20029221 FIGURE 4. Frequency Response 15 www.national.com LMH6622 DSL Receive Channel Applications (Continued) Circuit Layout Considerations National Semiconductor suggests the copper patterns on the evaluation boards listed below as a guide for high frequency layout. These boards are also useful as an aid in device testing and characterization. As is the case with all highspeed amplifiers, accepted-practice RF design technique on the PCB layout is mandatory. Generally, a good high frequency layout exhibits a separation of power supply and ground traces from the inverting input and output pins. Parasitic capacitances between these nodes and ground will cause frequency response peaking and possible circuit oscillations (see Application Note OA-15 for more information). High quality chip capacitors with values in the range of 1000pF to 0.1µF should be used for power supply bypassing. One terminal of each chip capacitor is connected to the ground plane and the other terminal is connected to a point that is as close as possible to each supply pin as allowed by the manufacturer’s design rules. In addition, a tantalum capacitor with a value between 4.7µF and 10µF should be connected in parallel with the chip capacitor. Signal lines connecting the feedback and gain resistors should be as short as possible to minimize inductance and microstrip line effect. Input and output termination resistors should be placed as close as possible to the input/output pins. Traces greater than 1 inch in length should be impedance matched to the corresponding load termination. Symmetry between the positive and negative paths in the layout of differential circuitry should be maintained so as to minimize the imbalance of amplitude and phase of the differential signal. Device LMH6622MA LMH6622MM Package SOIC-8 MSOP-8 Evaluation Board P/N CLC730036 CLC730123 These free evaluation boards are shipped when a device sample request is placed with National Semiconductor. Component value selection is another important parameter in working with high speed/high performance amplifiers. Choosing external resistors that are large in value compared to the value of other critical components will affect the closed loop behavior of the stage because of the interaction of these resistors with parasitic capacitances. These parasitic capacitors could either be inherent to the device or be a by-product of the board layout and component placement. Moreover, a large resistor will also add more thermal noise to the signal path. Either way, keeping the resistor values low will diminish this interaction. On the other hand, choosing very low value resistors could load down nodes and will contribute to higher overall power dissipation and worse distortion. Driving Capacitive Load Capacitive Loads decrease the phase margin of all op amps. The output impedance of a feedback amplifier becomes inductive at high frequencies, creating a resonant circuit when the load is capacitive. This can lead to overshoot, ringing and oscillation. To eliminate oscillation or reduce ringing, an isolation resistor can be placed between the load and the output. In general, the bigger the isolation resistor, the more damped the pulse response becomes. For initial evaluation, a 50Ω isolation resistor is recommended. www.national.com 16 LMH6622 Physical Dimensions unless otherwise noted inches (millimeters) 8-Pin SOIC NS Package Number M08A 8-Pin MSOP NS Package Number MUA08A 17 www.national.com LMH6622 Dual Wideband, Low Noise, 160MHz, Operational Amplifiers Notes LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Email: support@nsc.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 www.national.com National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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