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TL082CMX

TL082CMX

  • 厂商:

    NSC

  • 封装:

  • 描述:

    TL082CMX - Engineering Project Manager - National Semiconductor

  • 数据手册
  • 价格&库存
TL082CMX 数据手册
Company National Semiconductor Contact Gloria Gordon Part Number URL for Additional Information http://www.national.com/quality/green/ Phone 1-408-721-8435 Peak Body Temp C Title Engineering Project Manager MSL Rating Email Green.Project@nsc.com MaxTime (Sec) Cycles TL082CMX Document Date 1 235 30 Weight (mg) 4 Unit Type 29-Dec-2007 Contains Lead(Pb) and is NOT European RoHS Compliant. NOT China RoHS Compliant 70.000 Each Homogeneous Material Composition Declaration for Electronic Products Item Plastic Weight (mg) Component CAS# 60676-86-0 25928-94-3 1309-64-4 40039-93-8 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-21-3 7429-90-5 7440-31-5 7439-92-1 7440-22-4 25928-94-3 7440-22-4 Weight (mg) 36.215 7.243 0.894 0.358 20.036 0.493 0.025 0.006 2.346 0.014 1.564 0.276 0.203 0.068 0.180 Item-ppm 810,000 162,000 20,000 8,000 974,500 24,000 1,200 300 994,000 6,000 850,000 150,000 750,000 250,000 1,000,000 Part-ppm 517,359 103,472 12,774 5,110 286,225 7,049 352 88 33,512 202 22,343 3,943 2,893 964 2,571 44.710 SiO2 Epoxy Resin Sb2O3 Brominated Epoxy Leadframe 20.560 Cu Fe Zn P Chip Ext. LeadFinish Die Attach Int. LeadFinish 2.360 Si Al 1.840 Sn Pb 0.270 Ag Epoxy Resin 0.180 Ag Wires 0.080 Au 7440-57-5 0.080 1,000,000 1,143 Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing. Additionally, the following should be noted: 1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties. 2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary. RoHS Material Composition Declaration RoHS Directive 2002/95/EC RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date. 1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances 2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A threshold levels, except lead in RoHS exempt applications 5, 7a and 7c. 2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in solder and RoHS exempt applications 5, 7a and 7c. 3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at www.national.com/quality/green/. 4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that Deplete the Ozone Layer and U.S. Clean Air Act, Title VI. National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in connection with the information provided herein unless otherwise provided by a written contract signed by both parties. NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION. Gerry Fields Vice President Quality National Semiconductor Page 1 of 3 Banned Substance Monitoring Part Number TL082CMX Document Date 29-Dec-2007 NOT China RoHS Compliant Hg
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