NTE622

NTE622 Silicon Rectifier, General Purpose, High Voltage, Fast Recovery DO−213AA Surface Mount Type Case Features: D High Temperature Metallurgically Bonded D Glass Passivated Junction D High Temperature Soldering Guaranteed: +450°C/5 Seconds at Terminals. Complete Device Submersible Temperature of +260°C/10 Seconds in Solder Bath. Maximum Ratings and Electrical Characteristics: (TA = +25°C unless otherwise specified. 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.) Maximum Recurrent Peak Reverse Voltage, VRRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V Maximum RMS Voltage, VRMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280V Maximum DC Blocking Voltage, VDC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V Maximum Average Forward Rectified Current (TT = +75°C), IT(AV) . . . . . . . . . . . . . . . . . . . . . . . 0.5A Peak Forward Surge Current, IFSM (8.3ms Single Half Sine−Wave Superimposed on Rated Load) . . . . . . . . . . . . . . . . . . . . . 10A Maximum Instantaneous Forward Voltage (IT = 0.5A), VF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2V Maximum DC Reverse Current (VDC = 400V), IR TA = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5μA TA = +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50μA Maximum Reverse Recovery Time (TJ = +25°C, Note 1), trr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50ns Typical Junction Capacitance (Note 2), CJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4pF Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65° to +175°C Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65° to +175°C Maximum Thermal Resistance, Junction−to−Terminal (Note 3), RthJL . . . . . . . . . . . . . . . . . . 70°C/W Maximum Thermal Resistance, Junction−to−Ambient (Note 4), RthJA . . . . . . . . . . . . . . . . . 150°C/W Note Note Note Note 1. 2. 2. 3. Reverse Recovery Test Conditions: IF = 0.5A, IR = 1A, IRR = 0.25A.. Measured at 1MHz and applied reverse voltage of 4VDC. Thermal resistance, junction−to−terminal, 5.0mm2 copper pads to each terminal. Thermal resistance, junction−to−ambient, 5.0mm2 copper pads to each terminal. Rev. 1−11 Solderable Ends 1st Band (Device Type) 2nd Band (Voltage Type) .066 (1.676) Max Dia .022 (.559) Max .022 (.559) Max .145 (3.683) Max Two Bands Indicates Cathode