NTE74HCT240 & NTE74HCT244
Integrated Circuit
TTL − High Speed CMOS,
Octal Buffer/Line Driver/Receiver
with 3−State Outputs
Description:
The NTE74HCT240 (Inverting Outputs) and NTE74HCT244 (Non−Inverting Outputs) are 3−STATE
buffers in a 20−Lead DIP type package that utilize advanced silicon−gate CMOS technology and are
general purpose high speed buffers. They possess high drive current outputs which enable high
speed operation even when driving large bus capacitances. These circuits achieve speeds comparable to low power Schottky devices, while retaining the low power consumption of CMOS. Both
devices are TTL input compatible and have a fanout of 15 LS−TTL equivalent inputs. Each device
has two active low enables (1G and 2G), and each enable independently controls 4 buffers.
These devices are intended to interface between TTL and NMOS components and standard CMOS
devices and are also plug−in replacements for LS−TTL devices and can be used to reduce power
consumption in existing designs.
All inputs are protected from damage due to static discharge by diodes to VCC and GND.
Features:
D TTL Input Compatible
D Typical Propagation Delay: 14ns
D 3−STATE Outputs for Connection to System Buses
D Low Quiescent Current: 80μA
D High Output rive Current: 6mA (min)
Absolute Maximum Ratings: (Note 1, Note 2)
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 to +7.0V
DC Input Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1.5 to VCC +1.5V
DC Output Voltage, VOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 to VCC + 0.5V
Clamp Diode Current, IIK, IOK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20mA
DC Output Current (Per Pin), IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35mA
DC VCC or GND Current (Per Pin), ICC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70mA
Power Dissipation (Note 3), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600mW
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Lead Temperature (During Soldering, 10sec), TL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +260°C
Note 1. Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2. Unless otherwise specified, all voltages are referenced to GND.
Note 3. Power Dissipation temperature derating: 12mW/°C from +65°C to +85°C.
Recommended Operating Conditions:
Parameter
Symbol
Min
Typ
Max
Unit
VCC
4.5
−
5.5
V
VIN, VOUT
0
−
VCC
V
Operating Temperature Range
TA
−40
−
+85
°C
Input Rise or Fall Times
tr, tf
−
−
500
ns
Supply Voltage
DC Input or Output Voltage
DC Electrical Characteristics: (VCC = 5V ±10% unless otherwise specified)
TA = +25°C
Typ
Guaranteed Limits
Parameter
Symbol
Minimum High Level Input Voltage
VIH
−
2.0
2.0
V
Maximum Low Level Input Voltage
VIL
−
0.8
0.8
V
Minimum High Level Output Voltage
Maximum Low Level Output Voltage
VOH
VOL
Test Conditions
TA = −40° to +85°C
VIN = VIH
or VIL
VIN = VIH
−0.1
|IOUT| = 20μA
VCC VCC
|IOUT| = 6.0mA, VCC = 4.5V
4.2
3.98
3.84
V
|IOUT| = 7.2mA, VCC = 5.5V
5.7
4.98
4.84
V
0
0.1
0.1
V
|IOUT| = 6.0mA, VCC = 4.5V
0.2
0.26
0.33
V
|IOUT| = 7.2mA, VCC = 5.5V
0.2
0.26
0.33
V
|IOUT| = 20μA
VCC
−0.1
Unit
V
Maximum Input Current
IIN
VIN = VCC or GND, VIH or VIL
−
±0.05
±0.5
μA
Maximum 3−STATE Output
Leakage Current
IOZ
VOUT = VCC or GND, G = VIH, G = VIL
−
±0.25
±2.5
μA
Maximum Quiescent Supply Current
ICC
VIN = VCC or GND, IOUT = 0μA
−
4.0
40
μA
0.6
1.0
1.3
mA
VIN = 2.4V or 0.5V, Note 4
Note 4. This is measured per input with all other inputs held at VCC or GND.
AC Electrical Characteristics: (VCC = 5V, tr = tf = 6ns, TA = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Typ
Guaranteed Limits
Unit
Maximum Output Propagation Delay
tPHL, tPLH CL = 45pF
14
18
ns
Maximum Output Enable Time
tPZL, tPZH CL = 45pF, RL = 1kΩ
20
30
ns
Maximum Output Disable Time
tPLZ, tPHZ CL = 5pF, RL = 1kΩ
16
25
ns
AC Electrical Characteristics: (VCC = 5V ±10%, tr = tf = 6ns unless otherwise specified)
TA = +25°C
Parameter
Maximum Output Propagation Delay
TA = −40° to +85°C
Symbol
Test Conditions
tPHL, tPLH CL = 50pF
Typ
Guaranteed Limits
14
20
25
Unit
ns
CL = 150pF
20
28
35
ns
CL = 50pF
21
30
38
ns
CL = 150pF
Maximum Output Enable Time
tPZH, tPZL RL = 1kΩ
26
42
53
ns
Maximum Output Disable Time
tPHZ, tPLZ RL = 1kΩ, CL = 50pF
16
25
32
ns
Maximum Output Rise and Fall Time
tTHL, tTLH CL = 50pF
6
12
15
ns
10
15
15
pF
Maximum Input Capacitance
CIN
Maximum Output Capacitance
COUT
Power Dissipation Capacitance
(Per Buffer, Note 5)
CPD
15
20
20
pF
G = VCC, G = GND
5
−
−
pF
G = GND, G = VCC
90
−
−
pF
Note 5. CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and
the no load dynamic current consumption, IS = CPD VCC f + ICC.
Truth Tables:
NTE74HCT240:
1G
L
L
H
H
1A
L
H
L
H
1Y
H
L
Z
Z
2G
L
L
H
H
2A
L
H
L
H
2Y
H
L
Z
Z
2A
L
H
L
H
2Y
L
H
Z
Z
H = HIGH Level
L = LOW Level
Z = High Impedance
NTE74HCT244:
1G
L
L
H
H
1A
L
H
L
H
1Y
L
H
Z
Z
2G
L
L
H
H
H = HIGH Level
L = LOW Level
Z = High Impedance
Pin Connection Diagram
1G 1
1 A1 2
1 Y4 3
20 VCC
1 A2 4
17 2 A4
2 Y3 5
16 1 Y2
1 A3 6
15 2 A3
2 Y2 7
14 1 Y3
1 A4 8
13 2 A2
2 Y1 9
12 1 Y4
GND 10
11 2 A1
19 2G
18 1 Y1
20
11
1
10
.300 (7.62)
.260 (6.6) Max
1.200 (30.5) Max
.200
(5.08)
Max
.012
(0.30)
.100 (2.54) Typ
.100 (2.54) Min
.350
(8.89)