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13192RFC-A00

13192RFC-A00

  • 厂商:

    NXP(恩智浦)

  • 封装:

  • 描述:

    BOARD DAUGHTER FOR MC13192

  • 数据手册
  • 价格&库存
13192RFC-A00 数据手册
Freescale Semiconductor User’s Guide Document Number: MC13192RFCUG Rev. 1.2, 09/2006 MC13192 RF Daughter Card User’s Guide 1 Introduction The MC13192 RF Daughter Card (13192RFC-A00) is used in conjunction with a microcontroller development board for RFIC evaluation, code development, and system evaluation. It interfaces directly to the M68EVB908GB60 HCS08 family Microcontroller Development Board but it can be adapted to other boards that offer access to the MCU input/output ports. The RF Daughter Card is configured with all the off-chip circuitry required for functional performance of the MC13192 RF data modem except the MCU. The MCU interface required by the RFIC is pinned out at the edge of the card using standard header pins. The RF interface is accomplished through SMA connectors for the TX and RX ports. The SMA connectors can be connected to test equipment using coax cables for testing or connected to screw-on antennas (two provided) for testing purposes. Figure 1-1 shows the RF Daughter Card with the two detachable dipole antennas. Figure 1-1. MC13192 RF Daughter Card with Antennas © Freescale Semiconductor, Inc., 2004, 2005, 2006. All rights reserved. MCU Interface Figure 1-2 shows the RF Daughter Card installed in a GB60 development board. Figure 1-2. RF Daughter Card Installed in the GB60 Development Board 2 MCU Interface Refer to the MC13192 Data Sheet and/or MC13192 Reference Manual for interface details. MC13192 RF Daughter Card, Rev. 1.2 2 Freescale Semiconductor Safety Information 3 Safety Information Any modifications to this product may violate the rules of the Federal Communications Commission and make operation of the product unlawful. 47 C.F.R. Sec. 15.21 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. 47 C.F.R. Sec.15.105(b) This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: • This device may not cause harmful interference. • This device must accept any interference received, including interference that may cause undesired operation. MC13192 RF Daughter Card, Rev. 1.2 Freescale Semiconductor 3 Daughter Card Description 4 Daughter Card Description Figure 4-1 shows the top side and component layout of the RF Daughter Card PCB. Figure 4-1. RF Daughter Card PCB (Top View) Figure 4-2 shows the bottom side of the RF Daughter Card PCB. Figure 4-2. RF Daughter Card PCB (Bottom View) As shown in Figure 1-2 and Figure 4-1 , connector J1 is the main interface to the GB60 Development Board. The interface connections described in Section 4.2, “Connections”, fall under the following three broad categories: 1. Serial Peripheral Interface (SPI) 2. Control 3. Power MC13192 RF Daughter Card, Rev. 1.2 4 Freescale Semiconductor Daughter Card Description 4.1 SPI Connections J1 Pins 35 through 38 provide the following four wire SPI interface: • MOSI • SPICLK • CE • MISO The MC13192 always functions as a slave device. SPI operation is described in detail in the MC13192 Data Sheet and/or MC13192 Reference Manual. 4.2 Connections The following sections describe the interconnects for the GB60 Development Board. 4.2.1 • • • Control Connections J1 Pin 19 is the IRQ line from MC13192. Connection to the MCU depends on how the MCU services interrupts. J1 Pin 31, RXTXEN, allows the MCU to initiate transceiver functions. J1 Pin 34, the ATTN line, allows the MCU to wake up the MC13192 from Doze or Hibernate low power modes. NOTE RXTXEN and ATTN are also available at header J2 for manual control. • • • • • • 4.2.2 J1 Pin 24 provides the MC13192 CLKO to the MCU when a jumper is installed at J4. J1 Pin 32 interfaces with the MCU to provide a Reset to the MC13192 and header J7 controls the functionality. When Pin 2 and Pin 3 of J7 are shunted, the MC13192 and the MCU can be reset simultaneously. When Pin 1 and Pin 2 of J7 are shorted, the MCU will reset the MC13192. Pin 5 and Pin 22 of J1 provide a wake up function to the MCU when a shunt is installed at J3. Pin 13 and Pin 14 of J1 provide access to MC13192 GPIO1 and GPIO2 ports. Power Connections J1 Pin 39 provides the supply voltage to the RF Daughter Card. Voltage on this line should not exceed 3.6 VDC and the nominal supply should not exceed 3.4 VDC. J1 Pin 40 is ground. 4.2.3 Non-MCU connections Header J2 provides connections to a number of MC13192 contacts for non-MCU connections. As already stated, the RXTXEN and ATTN lines are available at J2 for external control using switches or other hardware. The MC13192 GPIO are also available for interface to external hardware. MC13192 RF Daughter Card, Rev. 1.2 Freescale Semiconductor 5 Software Configuration 5 Software Configuration As shown in Figure 4-1, the legend printed on the RF Daughter Card PCB shows the jumper settings for ZigBee and SMAC applications. The SMAC jumper settings on the board can now be ignored because as of this release, the SMAC and 802.15.4 MAC use the same settings. 6 Bill of Materials and Schematic Table 6-1 shows the RF Daughter Card bill of materials (BOM). Table 6-1. Bill of Materials Item Quantity Reference Part 1 3 C1,C2,C3,C8 100pF /0402 2 2 C4,C5 9pF /0402 3 2 C7,C6 1nF /0402 5 1 J1 MCU Interface Header 20X2 6 1 J2 Interface HEADER 10X2 7 1 J3 Wake Up Header 1X2 8 1 J4 CLK SOURCE Header 1X2 9 2 J6,J5 Connector SMA 10 1 L1 8.2nH /0402 11 1 L2 6.8nH /0402 12 1 R1,R4,R5,R6 47kΩ /0402 13 1 R2 200Ω /0402 14 1 R3 10kΩ /0402 15 2 T1,T2 16 1 16 1 Part Number Source 142-0701-881 Johnson Balun Transformer 2450BL15B200 Johnson U1 IC MC13192 Freescale Semiconductor Y1 Crystal TSX-10A@16MHz Toyocom Figure 6-1 shows the RF Daughter Card schematic. MC13192 RF Daughter Card, Rev. 1.2 6 Freescale Semiconductor 1 L1 T1 2450BL15B100 R2 L2 C8 100 pF 3.9 nH 2 SMA 2 200 Ω 6.8 nH 2 J6 C7 1 nF 5 4 1 3 1 1 3 5 4 2 T2 2450BL15B100 C1 100 pF C2 100 pF C4 9 pF RFINRFIN+ GND GND PAO+ PAOGND GPIO4 MC13192 1 2 3 4 5 6 7 8 U1 2 SMA Y1 TSX-10A@16MHz 1 3 5 7 9 11 13 4 6 8 10 12 14 J5 32 31 30 29 28 27 26 25 VDDA VBATT VDDVCO VDDLO1 VDDLO2 XTAL2 XTAL1 GPIO7 GPIO6 GPIO5 VDDINT VDDD IRQ CE MISO MOSI J2 HEADER 10X2 GPIO3 GPIO2 GPIO1 RST RXTXEN ATTN CLKO SPICLK 9 10 11 12 13 14 15 16 15 17 19 MC13192 RF Daughter Card, Rev. 1.2 16 18 20 MOTOROLA 18 17 24 23 22 21 20 19 C5 9 pF RTXEN GPIO1 GPIO2 C3 100 pF C6 1 nF R4 47 kΩ R3 10 kΩ RTXEN MOSI CE VCC IRQ GPIO1 R1 47 kΩ PA2 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 MCU Interface J1 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 R6 47 kΩ RST SPICLK MISO MCU RESET ATTN RXD CLKO from MC13192 GPIO2 R5 47 kΩ 3 2 1 2 1 1 2 RESET J7 CLK Source J4 Wake Up J3 NOTES Figure 6-1. RF Daughter Card Schematic 7 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Document Number: MC13192RFCUG Rev. 1.2 09/2006 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2004, 2005, 2006. All rights reserved.
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