1323XUSB

1323x Development Hardware Reference Manual Document Number: 1323xDHRM Rev. 1.1 07/2011 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2007, 2008, 2009, 2010. All rights reserved. Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Chapter 1 Safety Information 1.1 1.1.1 1.1.2 1.1.3 1.1.4 1.2 1.2.1 1.3 1.4 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Antenna Restrictions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1-1 1-1 1-1 1-1 1-2 1-2 1-2 1-2 Chapter 2 MC1323x Development Platform Overview and Description 2.1 2.2 2.3 2.4 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General System Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 2-2 2-5 2-5 Chapter 3 1323x-Modular Reference Board 3.1 3.1.1 3.1.2 3.1.3 3.2 3.2.1 3.2.2 3.3 3.3.1 3.3.2 3.3.3 3.4 3.4.1 1323x-MRB Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 Reset and BDM Debug Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 IO Connectors J2 and J3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 1323x-MRB Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18 Chapter 4 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor i 1323x Remote Control Motherboard 4.1 4.1.1 4.1.2 4.1.3 4.2 4.2.1 4.2.2 4.2.3 4.3 4.3.1 1323x-RCM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 GPIO Connection to 1323x-MRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 1323x-RCM Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14 1323x-RCM Bill of Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21 Chapter 5 1323x Remote Extender Motherboard 5.1 5.1.1 5.1.2 5.1.3 5.2 5.2.1 5.2.2 5.2.3 5.2.4 5.2.5 5.2.6 5.2.7 5.3 5.3.1 1323x-REM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5 GPIO Connection to 1323x-MRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7 1323x-REM Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 IR Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 Pushbutton 2x4 Switch Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 Blue Indicator LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 1323x-REM Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16 Chapter 6 PCB Manufacturing Specifications 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 6-3 6-3 6-3 6-4 6-4 6-4 6-4 6-4 1323x Development Hardware Reference Manual, Rev. 1.1 ii Freescale Semiconductor About This Book This manual describes Freescale’s MC1323x development platform hardware. The MC1323x development platform is an IEEE 802.15.4 compliant evaluation environment based on the Freescale MC1323x device. The heart of the MC1323x platform is Freescale’s low cost System-on-Chip (SoC) for the IEEE® 802.15.4 Standard that incorporates a complete, low power, 2.4 GHz radio frequency transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin LGA package. This family of products is targeted for wireless RF remote control and other cost-sensitive applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer (RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes. Audience This manual is intended for system designers. Organization This document is organized into 6 chapters. Chapter 1 Safety Information — Highlights some of the FCC requirements. Chapter 2 HCS08 Development Platform Overview and Description — Provides an overview of the three boards that comprise the MC1323x development platform. Chapter 3 Modular Reference Board — This chapter details the 1323x-MRB which is an IEEE, 802.15.4 compliant evaluation board based on the Freescale MC1323x device. Chapter 4 1323x-Remote Control Module — This chapter details the 1323x-RCM motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB) plug-in module (daughter card) and supplies a power supply and a rich set of interface peripherals. Chapter 5 1323x-Remote Extender Board — This chapter details the 1323x REM motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB) plug-in module (daughter card) and supplies a power supply and set of interface peripherals. Chapter 6 PCB Manufacturing Specifications — This chapter provides the specifications used to manufacture the various MC1323x printed circuit boards (PCBs). Revision History The following table summarizes revisions to this document since the previous release (Rev 1.0). Revision History Location Chapter 5 Revision Inserted missing page 2 of REM schematic. 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor iii Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard ARM Advanced RISC Machine CTS Clear to Send DAC Digital to Analog Converter DMA Direct Memory Access I2C Inter-Integrated Circuit is a multi-master serial computer bus ISM Industrial Scientific Medical 2.4 GHz radio frequency band JTAG Joint Test Action Group LGA Land Grid Array MAC Media Access Controller MCU Microcontroller Unit NEXUS An embedded processor development tool interface that helps design engineers identify software and hardware-level issues. PCB Printed circuit board PiP Platform in Package PWM Pulse-width modulation RCM Remote Control Module REM Remote Extender Board RTS Request to Send SMA Connector SubMiniature version “A” connector SPI Serial Peripheral Interface SSI Synchronous Serial Interface TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function. TELCO Telephone Company USB Universal Serial Bus VCP Virtual Com Port 1323x Development Hardware Reference Manual, Rev. 1.1 iv Freescale Semiconductor Chapter 1 Safety Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and Industry Canada and make operation of the product unlawful. 1.1.1 Labeling FCC labels are physically located on the back of the board. 1.1.2 Operating Conditions This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: • This device may not cause harmful interference. • This device must accept any interference received, including interference that may cause undesired operation. 1.1.3 Exposure Limits This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. 1.1.4 Antenna Restrictions An intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 1-1 Safety Information radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.2 Regulatory Approval For Canada (IC RSS 210) This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: 1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device. 1.2.1 26 PART 5 – Appendix Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 1.3 Electrostatic Discharge Considerations Although damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the charge device model (CDM). All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test. When operating or handling the development boards or components, Freescale strongly recommends using at least the grounding wrist straps plus any or all of the following ESD dissipation methods: • Flexible fabric, solid fixed size, or disposable ESD wrist straps • Static control workstations, static control monitors and table or floor static control systems • Static control packaging and transportation materials and environmental systems 1.4 Disposal Instructions This product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal. 1323x Development Hardware Reference Manual, Rev. 1.1 1-2 Freescale Semiconductor Chapter 2 MC1323x Development Platform Overview and Description 2.1 Introduction The MC1323x development platform is an IEEE 802.15.4 compliant evaluation environment based on the Freescale MC1323x device. The heart of the MC1323x platform is Freescale’s low cost System-on-Chip (SoC) for the IEEE® 802.15.4 Standard that incorporates a complete, low power, 2.4 GHz radio frequency transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin LGA package. This family of products is targeted for wireless RF remote control and other cost-sensitive applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer (RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes. The MC1323x development platform is comprised of three boards: • 1323x-Modular Reference Board (1323x-MRB) - this board contains the MC1323x device with 32 MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry. The board can be used as a simple standalone evaluation platform or as a daughter card to the other MC1323x development platform boards or to a custom, application specific motherboard. See Chapter 3, “1323x-Modular Reference Board” for detailed information. — Provides compact reference design for device footprint and RF layout — Provides pre-designed MC1323x hardware (device and function) — Provides access to the MC1323x full set of GPIO — Provides MCU BDM debug port — Provides optional local 2 Mbit serial FLASH, 32.768 kHz oscillator crystal, IR “blaster” LED and power management. • 1323x-Remote Control Motherboard (1323x-RCM) - this board accepts the 1323x-MRB as a plug-in module (daughter card) and supplies a variety of peripheral functions to the MC1323x through the IO connectors. The peripheral functions are targeted primarily to a consumer TV or entertainment remote control application. See Chapter 4, “1323x Remote Control Motherboard” for detailed information. — Provides 36-switch matrix for remote control pushbuttons — USB serial interface for communication to a PC and provides board power — Touchpad for user interface — Onboard 128 x 32 pixel graphic LCD for menus and host feedback - a unique feature to RF-based remote controls — Accelerometer for motion detection and game play • 1323x-Remote Extender Motherboard (1323x-REM) - this board also accepts the 1323x-MRB plug-in module (daughter card) and supplies a very simple set of peripheral functionality. See 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 2-1 MC1323x Development Platform Overview and Description Chapter 5, “1323x Remote Extender Motherboard” for detailed information. A small 8-switch matrix, IR receiver, and USB interface provides means for communication to the MC1323x for: — Simple keypad-only applications — Connection to a PC — Host connection such as for a remote control extender or remote control receiver Whether the 1323x-MRB is used in a simple standalone application or in combination with another host card, Freescale provides a complete software development environment called the Freescale BeeKit Wireless Connectivity Toolkit (BeeKit). BeeKit is a comprehensive codebase of wireless networking libraries, application templates, and sample applications. The BeeKit Graphical User Interface (GUI) allows users to create, modify, and update various wireless networking implementations. A wide range of software functionality is available to complement the 1323x-MRB and these are provided as codebases within BeeKit. 2.2 Features The MC1323x development platform is built around the concept of having a single daughter card (1323x-MRB) that contains the MC1323x IC and all necessary I/O connections for use as a self-contained module or for connection to an application motherboard. Figure 2-1 shows a simplified block diagram of the more powerful Freescale configuration of the 1323x-MRB combined with the 1323x-RCM. DC Supply 2xAA Battery VDD Power ManageV_LCD ment BDM Debug Port IR Blaster USB USB Conn USB Interface FT232RQ UART SPI MC13233 QFN IIC PCB F-Antenna GPIO 2 Mbit Serial FLASH 6x6 Switch Matrix 32 MHz 3-Axis Accelerometer 128x32 Graphic LCD 32.768 KHz Buzzer Touchpad 4 LED Indicators Figure 2-1. Simplified RCM+MRB Block Diagram Figure 2-2 shows a photo of the combined boards with the 1323x-MRB mounted on the 1323x-RCM. 1323x Development Hardware Reference Manual, Rev. 1.1 2-2 Freescale Semiconductor MC1323x Development Platform Overview and Description Figure 2-2. 1323x-MRB Mounted on the 1323x-RCM Features of the MC1323x development platform include: • Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack • Based on Freescale’s low-cost MC1323x IEEE® 802.15.4 SoC platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin LGA package • Reference design area with small footprint, low cost RF node — Integrated transmit/receive switch — Differential input/output port (typically used with a balun) — Low external component count — Programmable output power with 0 dBm nominal output power, programmable from -30 dBm to +3 dBm typical — Receive sensitivity of -93 dBm (typical) at 1% PER, 20-byte packet, much better than the IEEE 802.15.4 Standard of -85 dBm 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 2-3 MC1323x Development Platform Overview and Description • • • • • • • • • • — Onboard printed metal F-Antenna 32 MHz reference oscillator BDM serial MCU debug port Optional secondary 32.768 kHz crystal oscillator for accurate low power timing IR blaster 2 Mbit serial FLASH (uses SPI interface) Master reset switch Full power regulation and management 1323x-MRB board provides — Required circuitry for MC13233 - crystals and RF circuitry including F-Antenna and optional SMA connector — Local power supply regulation — Access to all GPIO — Standalone or daughter card use models — Serial FLASH, IR blaster, and BDM functions 1323x-RCM when used with 1323x-MRB provides — USB to UART serial interface that is USB bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications — Power supply source from two AA batteries, USB connector, or DC source — 128x32 pixel graphic LCD — 3-axis Accelerometer (uses IIC interface) — Touch pad interface with interrupt capability (uses IIC interface) — 6x6 Switch matrix — Single tone buzzer — 4 Blue LED indicators 1323x-REM when used with 1323x-MRB provides — USB to UART serial interface that is USB bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications — Power supply source from two AA batteries, USB connector, or DC source — IR receiver — 4x2 Switch matrix — 4 Blue LED indicators 1323x Development Hardware Reference Manual, Rev. 1.1 2-4 Freescale Semiconductor MC1323x Development Platform Overview and Description 2.3 Driver Considerations When users first connect a 1323x-RCM or 1323x-REM based platform to a PC, they may be prompted to install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and install the drivers. Instead, select manual installation and steer Windows to the following directory: C:\Program Files\Freescale\Drivers If installing the BeeKit software package to another drive or directory, indicate the Drivers directory created by the installer in the custom location where BeeKit was installed. Follow the instructions as they appear on the screen to complete driver installation. If BeeKit is not installed, be aware of the following: • The boards use the FTDI serial to USB converter, Virtual COM Port (VCP) driver for Windows, available at www.ftdichip.com/ftdrivers.htm. (Direct (D2XX) drivers are also available.) • The FTDI web site offers drivers for other platforms including Windows® (98 through Vista x64 and CE), MAC OS (8 through X) and Linux. • Download the appropriate driver and follow the instructions to complete driver installation. 2.4 General System Specifications Table 2-1. MC1323x Platform Specifications Parameter Units Notes/Conditions MIN TYP MAX Voltage supply (DC) 2.5 5 6 V When using REM or RCM Voltage supply (USB) 4.4 5 5.25 V USB 2.0/1.1 standard specification 2.8 3.2 V -20 +25 +70 °C Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C. 0 +25 +50 °C Operating temperature is limited by battery temperature range -30 +25 +70 °C Power Voltage supply (Batteries) Temperature Operating temperature; non-battery operation (see note) Operating temperature; battery operation (see note) Storage temperature USB interface USB 2.0 and 1.1 full-speed compatible RF (1323x-MRB) 802.15.4 Frequency range Range (outdoor / line of sight) 2405 2480 300 MHz All 16 channels in the 2450 MHz band Meter 1 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3V »SHUNT 3->2 ONLY IF V_EXT = 3V »NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J9, PINS 3 & 4 SHUNTED 1 3 5 7 9 11 13 15 17 A 2 4 6 8 10 12 14 16 18 MRB-PTA1 MRB-PTA3/IRQb MRB-KBI1P4 MRB-KBI1P6 MRB-KBI2P1 MRB-KBI2P3 MRB-PTD3/TPM3 ICAP Classification: Drawing Title: FCP: FIUO: ___ X PUBI: ___ 1323X MODULAR REFERENCE BOARD HDR 2X9 Page Title: GPIO POWER MANAGEMENT 4 BKGD 6 4 2 D1 GREEN GND 3.3V LDO REGULATOR 5 5 3 1 V_BRD TP4 LP2985AIM5-3.3 C14 0.01UF TP3 2 4 6 8 C 4 C12 1UF VIN MRB-SPI_SS MRB-SPI_MOSI MRB-SPI_MISO MRB-SPI_CLK MRB-RSTb MRB-UART_RTS/KBI1P7 MRB-UART_CTS/TPM2 MRB-PTD7 MRB-KBI1P1 MRB-KBI1P3 HDR_10X2 A V_UNREG TP2 J4 2 4 6 8 10 12 14 16 18 20 MAIN SCHEMATIC GPIO MAPPING 3 3-15 Figure 3-11. 1323x-MRB Schematic 2 Size C Document Number Date: Thursday, February 10, 2011 Rev E4 SCH-26115 PDF: SPF-26115 1 Sheet 3 of 3 1323x-Modular Reference Board MRB-KBI1P0 MRB-KBI1P2 VDD TP1 1 V_IC J2 1 3 5 7 9 11 13 15 17 19 TP12 MBR0520LT1G HDR 1X2 INFRARED LED V_BRD 1 2 3 D4 1 2 2MBit (256KB) FLASH J6 J5 A TP8 R6 1.5K U2 2 3 J8 4 C Y2 1 2 1323x Development Hardware Reference Manual, Rev. 1.1 R11 4 5 6 7 8 MRB-I2C_SDA MRB-I2C_SCL PTA0/XTAL_32K 1 PTA1/EXTAL_32K 1 V_IC 2 MRB-RSTb C1 1000pF 1 PTA0/XTAL_32K 1 4 3 2 2 D 1323x-Modular Reference Board Figure 3-12. Modular Reference Board PCB Component Location (Top View) Figure 3-13. Modular Reference Board PCB Test Points 1323x Development Hardware Reference Manual, Rev. 1.1 3-16 Freescale Semiconductor 1323x-Modular Reference Board Figure 3-14. Modular Reference Board PCB Layout (Top View) Figure 3-15. Modular Reference Board PCB Layout (Bottom View) 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 3-17 1323x-Modular Reference Board 3.4.1 Bill of Materials Table 3-6. Bill of Materials Item Qty Reference Value F_Antenna Description 1 1 ANT1 2 4 BH1,BH2,BH3, 125 BH4 NON-PLATED MOUNTING HOLE 125 DRILL / 160 KEEPOUT NO PART TO ORDER 3 1 C1 CAP CER 1000PF 50V 5% C0G 0402 4 3 5 Mfg Part Number Not A Part NOT A PART Murata GRM1555C1H102JA01 D C2,C17,C23 10PF (No Not {Place) CAP CER 10PF 50V 5% C0G Murata 0402 GJM1555C1H100JB01 2 C3,C6 10PF CAP CER 10PF 50V 5% C0G Murata 0402 GJM1555C1H100JB01 6 4 C4,C5,C10,C1 1 12PF CAP CER 12PF 50V 5% C0G Murata 0402 GRM1555C1H120JZ01 D 7 1 C7 1PF CAP CER 1.0PF 50V +/-0.25PF C0G 0402 Murata GJM1555C1H1R0CB01 D 8 4 C8,C9,C18,C2 2 0.22UF CAP CER 0.22UF 10V 10% X5R 0402 Murata GRM155R61A224KE19 B 9 1 C12 1UF CAP CER 1.0UF 10V 10% X7R 0603 Murata GRM188R71A105KA61 D 10 1 C13 2.2UF CAP CER 2.2UF 10V 10% X7R 0603 Murata GRM188R71A225KE15 D 11 2 C14,C20 0.01UF CAP CER 0.01UF 50V 10% X7R 0402 Murata GCM155R71H103KA55 D 12 1 C15 10UF CAP CER 10UF 10V 10% X5R Murata 0805 GRM21BR61A106KE19 _ 13 1 C16 0.1UF CAP CER 0.1UF 16V 10% X7R 0402 Tdk C1005X7R1C104KT 14 2 C25,C26 8.2PF CAP CER 8.2PF 50V 0.25PF C0G 0402 Avx 04025A8R2CAT2A 15 1 D1 GREEN LED GRN SGL 30MA SMT 0805 Lite On LTST-C171KGKT 16 1 D2 VSLB3940 LED IR SGL 100MA RA TH Vishay Intertechnology VSLB3940 17 2 D3,D4 MBR0520LT1G DIODE SCH 0.5A 20V SOD-123 On Semiconductor MBR0520LT1G 18 1 J1 SMA_EDGE CON 1 SKT SMA EDGE 34MIL Johnson 142-0701-881 BOARD SMT 50 OHM -- 171H Components Inc AU 104L 1000pF PCB F ANTENNA, NO PART ORDER Mfg Name 1323x Development Hardware Reference Manual, Rev. 1.1 3-18 Freescale Semiconductor 1323x-Modular Reference Board Table 3-6. Bill of Materials 19 1 J2 HDR_10X2 HDR 2X10 TH 100MIL CTR 330H AU 100L Samtec TSW-110-07-S-D 20 1 J3 HDR 2X9 HDR 2X9 TH 100MIL CTR 330H AU Samtec TSW-109-07-S-D 21 1 J4 HDR 2X3 HDR 2X3 TH 100MIL CTR 335H AU 95L Samtec TSW-103-07-S-D 22 2 J5,J8 HDR 1X2 HDR 1X2 TH 100MIL SP 330H Samtec SN 115L TSW-102-07-T-S 23 1 J6 HDR TH 1X3 HDR 1X3 TH 100MIL SP 339H Samtec AU 100L TSW-103-07-G-S 24 1 J9 HDR_2X4 HDR 2X4 TH 100MIL CTR 330H AU 100L Samtec TSW-104-07-S-D 25 1 L1 0.0033UH IND -- 0.0027UH@100MHZ 300MA +/-0.3NH 0402 Murata LQG15HS2N7S02D 26 1 L2 0.0039UH (No Not {Place) IND -- 0.0039UH@100MHZ 300MA +/-0.3NH 0402 Murata LQG15HN3N9S02D 27 1 Q1 MMBT3904LT1G TRAN NPN GEN 200MA 40V SOT-23 On Semiconductor MMBT3904LT1G 28 1 RST1 SW_MOM SW SPST MOM PB 50MA 12V Alps Electric SMT (Usa) Inc. SKQYPDE010 29 1 R1 15K RES MF 15K 1/16W 5% 0402 Vishay Intertechnology CRCW040215K0JNED 30 1 R2 18.2 RES MF 18.2 OHM 1/4W 1% 0805 Rohm ESR10EZPF18R2 31 5 R4,R11,R13,R 25,R26 0 RES MF ZERO OHM 1/16W 5% 0402 Rohm MCR01MZPJ000 32 1 R6 1.5K RES MF 1.5K 1/16W 5% 0402 Vishay Intertechnology CRCW04021K50JNED 33 1 R7 330 RES MF 330 OHM 1/16W 5% Vishay 0402 Intertechnology CRCW0402330RJNED 34 1 R9 27K RES MF 27K 1/16W 5% 0402 Vishay Intertechnology CRCW040227K0JNED 35 2 R10,R12 0 (No Not {Place) RES MF ZERO OHM 1/16W 5% 0402 MCR01MZPJ000 36 7 R14,R15,R16, R17,R18,R21, R22 RES MF 10K 1/16W 5% 0402 Vishay Intertechnology CRCW040210K0JNED 37 4 R19,R20,R23, 1K R24 (No Not {Place) RES MF 1.0K 1/16W 5% 0402 Vishay Intertechnology CRCW04021K00JNED 38 3 TL1,TL2,TL3 TEST POINT PAD SIZE 3.4MM X 1.8MM SMT 5015 10K TESTLOOP Rohm Keystone Electronics 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 3-19 1323x-Modular Reference Board Table 3-6. Bill of Materials 39 16 TP1,TP2,TP3,T TPAD_040 P4,TP5,TP6,T P7,TP8,TP9,T P10,TP11,TP1 2,TP13,TP14,T P15,TP16 TEST POINT PAD 40MIL DIA SMT, NO PART TO ORDER Notacomponent NOTACOMPONENT 40 1 U1 MC1323X IC MCU+XCVR 8BITS 2.4GHZ Freescale 1.8-3.6V LGA48 Semiconductor PC13233C 41 1 U2 AT45DB021D IC MEM FLASH 256KX8 66MHz 2.7-3.6V 8S1 Atmel AT45DB021D-SSH-T 42 1 U3 LP2985AIM5-3.3 IC VREG LDO 3.3V 150MA 3.8-16V SOT-23-5 National Semiconductor LP2985AIM5-3.3/NOPB 43 1 Y1 32.768KHZ XTAL 32.768KHZ SMT ROHS Epson COMPLIANT Electronics FC-135 32.7680KA-A3 44 1 Y2 32MHZ XTAL 32MHZ 9PF -- SMT 3.2X2.5MM Ndk EXS00A-CS02368 45 1 Z1 50/100 OHMS XFMR BALUN 2.45GHZ +/-50MHZ 50/100OHM 3W SMT Johanson Technology 2450BL15B100_ 1323x Development Hardware Reference Manual, Rev. 1.1 3-20 Freescale Semiconductor Chapter 4 1323x Remote Control Motherboard 4.1 1323x-RCM Overview The Remote Control Motherboard (1323x-RCM) is a motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB) plug-in module (daughter card) and supplies a power supply and a rich set of interface peripherals. The two boards in combination provide a complete platform to evaluate the MC1323x, write software, and develop a full featured IEEE 802.15.4 based wireless remote control. 4.1.1 Features The 1323x-RCM provides the following features: • 4-Layer metal, 0.034 inch thick FR4 board • Two connectors provide daughter card mounting — 20-Pin primary connector — 18-Pin secondary connector — Provide main supply voltage to board — Provide access to all MC13233 GPIO • Handheld battery operation • Flexible power supply — Sources include USB port, two AA batteries, or DC source — Power-On green LED — On-Off switch • Used in conjunction with 1323x-MRB where MRB provides — 2.4 GHz IEEE 802.15.4 wireless node — 2 Mbit serial FLASH for over-the-air programming (OTAP) — IR blaster • USB interface is bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications • 36 Pushbutton 6x6 switch matrix • 128x32 pixel monochrome graphic/alphanumeric LCD - uses SPI serial interface • Synaptics® Touchpad™ - capacitive touch sensor • 3-Axis accelerometer with IIC serial interface • Four application-controlled blue indicator LEDs • Single tone buzzer 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-1 1323x Remote Control Motherboard 4.1.2 Form Factor Figure 4-1 shows a photo of the 1323x-RCM with the location of connectors and headers designated. Primary 20-Pin IO Connector (J8) Power-On LED 1323x-MRB Outline (When mounted) Secondary 18-Pin IO Connector (J9) Buzzer (Mounted on back side) GPIO Enable Pin Header P1 Accelerometer GPIO Enable Pin Header P2 128x32 Graphic LCD LCD J10 Touchpad 7.0 Inches 178 mm Pushbutton Matrix 4 Blue LEDs External Supply J14 On / Off Switch SL1 USB Connector J15 3.4 Inches 86 mm Figure 4-1. 1323x-RCM (1323x-MRB) The1323x-Modular Reference Board (1323x-MRB) mounts on the 1323x-RCM via receptacles J8 and J9. Figure 4-1 shows an outline of the 1323x-MRB placement when mounted. 1323x Development Hardware Reference Manual, Rev. 1.1 4-2 Freescale Semiconductor 1323x Remote Control Motherboard 4.1.3 Board Level Specifications NOTE Temperature range specifications apply to RCM used in combination with MRB. Table 4-1. 1323x-RCM Specifications Parameter Units MIN TYP Notes/Conditions MAX General Size (PCB: X, Y) 86 x 178 3.40 x 7.00 Layer build (PCB) 0.8 0.034 mm inches mm 4-Layer inches Dielectric material (PCB) FR4 Power Voltage supply (DC) 2.3 5 6 V Voltage supply (USB) 4.4 5 5.25 V 2.8 3.2 V 100 mA Voltage supply (Batteries) Current consumption USB 2.0/1.1 standard specification Temperature Operating temperature; non-battery operation (see note) Operating temperature; battery operation (see note) Storage temperature USB interface -20 +25 +70 °C Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C. 0 +25 +50 °C Operating temperature is limited by battery temperature range -30 +25 +70 °C USB 2.0 and 1.1 full-speed compatible Buzzer CUI #CMI-1240 See data sheet Touchpad Synaptics Semi-custom Tri-axis Low-g Accelerometer MMA7660FC (Freescale Semi) See data sheet LCD CRYSTALFONZ #CFAG12832A-YGH-N See data sheet Regulatory Approval 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-3 1323x Remote Control Motherboard Table 4-1. 1323x-RCM Specifications (continued) Parameter Units Notes/Conditions CE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standard CE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards Safety UL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards Environment RoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003 WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003 4.2 Functional Description The 1323x-RCM is a host motherboard for the 1323x-MRB. The two-board combination provides a powerful evaluation and development platform for the MC13233. Figure 4-2 shows a simple block diagram. The 4-layer board provides a flexible power supply, 36 pushbutton matrix, 128x32 LCD, Touchpad sensor, 3-axis accelerometer, four indicator LEDs, buzzer, and a USB UART serial port. As the board name implies this platform is useful to develop an RF remote control application for a DTV, entertainment console, or similar function. The 1323x-MRB provides the RF node and an IR transmitter is available to support legacy IR protocol remote controls. The rich set of peripherals of the 1323x-RCM allows a user to develop a remote control ranging from a simple input device to a higher end unit with display. In the following sections, refer to: • Figure 4-1 for location of connectors and features • Figure 4-2 for the functional blocks • Figure 4-10 for the board schematic 1323x Development Hardware Reference Manual, Rev. 1.1 4-4 Freescale Semiconductor 1323x Remote Control Motherboard 1323x-MRB GPIO Header Receptacles On/Off Switch External DC 4 Blue Indicator LEDs Power Management GPIO Pin Headers VCC 2 AA Battery Buzzer On LED USB Type-B Conn USB 2.0 USB UART Serial IC 6x6 Switch Matrix 2 PB Switches 128x32 Graphic/ Alphanumeric LCD SPI IIC Synaptic Touchpad Figure 4-2. 1323x-RCM Block Diagram 4.2.1 Power Management The 1323x-RCM can be powered from two AA batteries, the USB connector 5 V supply, or an external DC supply and is also intended to power the 1323x-MRB. Figure 4-3 shows the power management circuit. TP19 3.3uH D9 D10 5 MBR0520LT1G MBR0520LT1G D11 MBR0520LT1G C32 10UF R45 0 8 6 7 3 9 D8 R38 R41 10K 2 1 4.7K V_LED L2 VIN VOUT VINA EN PS/SYNC GND V_LED 2 D13 1 PGND PPAD 10 R35 R36 Q3 SI2305 C33 0.1UF TP21 V_3V3 MBR0520LT1G FB R47 0 C42 10UF POWER ON VCC TP20 L1 0 LED LED5 RED 0 C43 10UF V_TPD 3 11 R37 TP22 TOUCHPAD TP23 0 TPS63001 V_DC MBR0520LT1G 2 U8 4 2 V_MAIN 1 L3 1 V_USB R39 330 V_ACC R46 200K DNP R40 TP24 ACCELEROMETER 0 V_BUZ TP25 R42 TP26 V_BAT BUZZER 0 V_MRB D12 MBR0520LT1G R43 TP27 MODULAR REFERENCE BOARD 0 Figure 4-3. 1323x-RCM Power Management Circuit A boost-buck voltage regulator U8 is used in this design to allow operation over a relatively wide, low voltage input range, i.e., the TPS63001 regulator has an input voltage range from 1.8 V to 5.5V. This allows a broad range of power supply sources. The regulated output voltage of the TPS63001 is 3.3 V which delivers about 3.05 V to the board due to the drop across the isolation Schottky diodes. Attributes of the power management circuit include: • Switch SL1 provides an ON/OFF function for all input voltage sources • Red LED5 provides a POWER-ON indicator for all sources • The 1323x-RCM can derive power from three different sources 1. USB port Type-B connector J15 - power can be supplied from an actual USB port connection or from an AC to DC converter that uses the USB connector to supply power. 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-5 1323x Remote Control Motherboard 2. External DC source via header J14 - a standard 0.1 in. spacing 1x2 pin header allows for connection of an external DC supply. 3. Battery Operation - a battery holder that accommodates two AA batteries is mounted on the non-component (back) side of the board and provides for battery operation. – If either the USB or external DC source is present, the battery source is disabled by MOSFET transistor Q3 – The sources are all isolated and protected by Schottky diodes – The minimum effective battery operating voltage is controlled by the use the FTDI FT232RQ USB UART device - leakage current back through the FT232RQ UART connections to the MC13233 on the MRB can cause the Q3 MOSFET to partially turnoff at battery voltage below approximately 2.7-2.8 Vdc. NOTE To avoid current leakage through the USB device and to have lowest minimum battery operating voltage for battery-only operation, remove the following jumpers: • • • • P1, Pins 7-8 P1, Pins 11-12 P1, Pins 17-18 P1, Pins 21-22 NOTE When battery operation is used, the temperature range of the two board system should be limited to within the specified temperature range of the battery technology. Table 4-1 limits temperature range from 0 °C to +50 °C when battery operation is applied. Table 4-2 lists the voltage source attributes. . Table 4-2. 1323x-RCM Voltage Sources Source Connector Input Voltage Range USB Port USB Type-B J15 4.4 V - 5.25 V Description • The input voltage range is set the USB Spec • The voltage can be supplied by either a standard USB cable connection or an AC to DC power adaptor that uses the USB connector J15 • If a power adaptor is in use, the USB serial port cannot be used 1323x Development Hardware Reference Manual, Rev. 1.1 4-6 Freescale Semiconductor 1323x Remote Control Motherboard Table 4-2. 1323x-RCM Voltage Sources 1 Input Voltage Range Source Connector Description External DC Supply 1x2 Pin Header J14 2.3 V - 6 V The input voltage range is determined by the U8 regulator and the diode isolation circuit Two AA Batteries Battery Holder 2.0 V - 3.1 V1 • The input voltage range reflects the usable range of alkaline cells and the voltage drop incurred by the diode isolation circuit. • The battery source is disabled if another source is connected The minimum operating battery voltage is determined by use model, see Note, Section 4.2.1, “Power Management” Again referring to Figure 4-3, a number of zero-ohm resistors are provided to isolate different circuits and to allow current measurement: • VCC (main 1323x-RCM supply) - resistor R35 • V_LED (all LEDs supply) - resistor R36 • V_TPD (touchpad supply) - resistor R37 • V_ACC (accelerometer supply) - resistor R40 • V_BUZ (buzzer supply) - resistor R42 • V_MRB (1323x-MRB supply) - resistor R43 4.2.2 GPIO Connection to 1323x-MRB IO Connectors J8 and J9 (see Figure 4-1) are receptacles that accept the 1323x-MRB pin headers to mount the daughter card. Figure 2-1 shows the 1323x-RCM with the 1323x-MRB mounted. Receptacles J8 and J9 connect to the MC13233 GPIO. To provide better access and versatility to the GPIO, a secondary set of pin headers P1 and P2 is connected in series with the IO signals: • Jumpers must be installed on P1 and P2 to connect 1323x-RCM peripherals and functions • The pin headers provide direct access for connecting custom circuitry to the GPIO • Power and ground to primary connectors J8 and J9 are not enabled though the pin headers Figure 4-4 shows IO Header P1 andP2 pin mapping. 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-7 1323x Remote Control Motherboard P1 P2 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 SPI _MOSI UART_TXD SPI_CLK UART_RXD RSTb LED3 UART_RTS I2C_SDA UART_CTS I2C_SCL BUZZER LED1 LCD_CTL0 KMD5 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 MRB-SPI_SS MRB-SPI_MOSI MRB-SPI_MISO MRB-UART_TXD MRB-SPI_CLK MRB-UART_RXD MRB-RSTb MRB-TPM0 MRB-UART_RTS/KBI1P7 MRB-I 2C_SDA MRB-UART_CTS/TPM2 MRB-I2C_SCL MRB-PTA1 MRB-PTA0 MRB-PTA2/LCD_CTL0 MRB-PTD7/32M_OUT 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 KBI1P0 KBI1P1 KBI1P2 KBI1P3 KBI1P4 KBI1P5 IRQb KMD0 LED2 KMD2 KBI1P6 KMD1 KMD3 LED4 KMD4 HDR_2X16 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 MRB-KBI1P0 MRB-KBI1P1 MRB-KBI1P2 MRB-KBI1P3 MRB-KBI1P4 MRB-KBI1P5 MRB-PTA3/I RQb MRB-KBI2P0 MRB-PTA4/32K_OUT MRB-KBI2P2 MRB-KBI1P6 MRB-KBI2P1 MRB-KBI2P3 MRB-PTD1/TPM1 MRB-PTD3/TPM3 MRB-PTD4/CMT HDR_2X16 Figure 4-4. 1323x-RCM IO Connector J8 and J9 Pin Mapping Table 4-3 list the P1 and P2 pin header function as it relates to the MC13233. Table 4-3. 1323x-RCM P1 and P2 Pin Header Function Description 1323x-REM Header Pins MC13233 Signal Name P1-27, P1-28 PTA0/XTAL_32K Port A Bit 2 / 32.768 kHz oscillator output • Drives LED1; jumper required • 32.768 kHz oscillator can be enabled on MRB P1-25, P1-26 PTA1/EXTAL_32K Port A Bit 3 / 32.768 kHz oscillator input • Drives Buzzer; jumper required • 32.768 kHz oscillator can be enabled on MRB P1-13, P1-14 RESET Device asynchronous hardware reset. Active low. Onboard Pullup • Drives touchpad reset; jumper required • Reset signal driven from MRB P1-29, P1-30 PTA2 Port A Bit 2. Onboard pull-down for TM • Drive LCD_CTL0; jumper required • Application is LCD enable clock • TM enable P2-13, P2-14 PTA3/IRQ Port A Bit 3 / IRQ. • Used; jumper required • Provides interrupt request input IRQ (active low) from accelerometer and touchpad P2-17, P2-18 PTA4/ XTAL_32KOUT Port A Bit 4 / Buffered 32.768 kHz clock output • Drives LED2; jumper required • Optional 32.768 kHz output clock for measuring reference oscillator accuracy (ppm) P1-19, P1-20 PTA5/SDA Port A Bit 5 / IIC Bus data • • • • Used; jumper required Connects to accelerometer Defaults to open drain for IIC Pullup on MRB P1-23, P1-24 PTA6/SCL Port A Bit 6 / IIC Bus clock • • • • Used; jumper required Connects to accelerometer Defaults to open drain for IIC Pullup on MRB P2-1, P2-2 PTB0/KBI1P0 Port B Bit 0 / KBI1 Input Bit 0 RCM switch matrix; jumper required P2-3, P2-4 PTB1/KBI1P1 Port B Bit 1 / KBI1 Input Bit 1 RCM switch matrix; jumper required Description 1323x-REM Application / Notes 1323x Development Hardware Reference Manual, Rev. 1.1 4-8 Freescale Semiconductor 1323x Remote Control Motherboard Table 4-3. 1323x-RCM P1 and P2 Pin Header Function Description (continued) 1323x-REM Header Pins MC13233 Signal Name Description 1323x-REM Application / Notes P2-5, P2-6 PTB2//KBI1P2 Port B Bit 2 / KBI1 Input Bit 2 RCM switch matrix; jumper required P2-7, P2-8 PTB3//KBI1P3 Port B Bit 3 / KBI1 Input Bit 3 RCM switch matrix; jumper required P2-9, P2-10 PTB4//KBI1P4 Port B Bit 4 / KBI1 Input Bit 4 RCM switch matrix; jumper required P2-11, P2-12 PTB5//KBI1P5 Port B Bit 5 / KBI1 Input Bit 5 RCM switch matrix; jumper required P2-21, P2-22 PTB6//KBI1P6 Port B Bit 6 / KBI1 Input Bit 6 RCM switch matrix; jumper required P1-17, P1-18 PTB7//KBI1P7 Port B Bit 7 / KBI1 Input Bit 7 • UART flow control RTS input to MCU; jumper required • Connects to RCM USB UART device P2-15, P2-16 PTC0/KBI2P0 Port C Bit 0 / KBI2 Input Bit 0 RCM switch matrix; jumper required P2-23, P2-24 PTC1/KBI2P1 Port C Bit 1 / KBI2 Input Bit 1 RCM switch matrix; jumper required P2-19, P2-20 PTC2/KBI2P2 Port C Bit 2 / KBI2 Input Bit 2 RCM switch matrix; jumper required P2-25, P2-26 PTC3/KBI2P3 Port C Bit 3 / KBI2 Input Bit 3 RCM switch matrix; jumper required P1-9, P1-10 PTC4/SPICLK Port C Bit 4 / SPI clock • Used; jumper required • Connected to serial FLASH on MRB • Connected to serial LCD interface P1-2 PTC5/SS Port C Bit 5 / SPI slave select • Unused on RCM • Must be in-active for LCD access • Connected to serial FLASH on MRB P1-6 PTC6/MISO Port C Bit 6 / SPI MISO • Unused on RCM • Connected to serial FLASH on MRB P1-3, P1-4 PTC7/MOSI Port C Bit 7 / SPI MOSI • Used; jumper required • Connected to serial FLASH on MRB • Connected to serial LCD interface P1- 15, P1-16 PTD0/TPM0 Port D Bit 0 / TPM0 signal Drives LED3; jumper required P2-27, P2-28 PTD1/TPM1 Port D Bit 1/ TPM1 signal Drives LED4; jumper required P1-21, P1-22 PTD2/TPM2 Port D Bit 2 / TPM2 signal • UART flow control CTS output from MCU; jumper required • Connects to RCM USB UART device P2-29, P2-30 PTD3/TPM3 Port D Bit 3 / TPM3 signal RCM switch matrix; jumper required P2-32 PTD4/CMT Port D Bit 4/ CMT output • Not used on RCM • Connected to IR blaster on MRB P1-7, P1-8 PTD6/RXD Port D Bit 6 / UART RXD input • UART RXD input to MCU; jumper required • Connects to RCM USB UART device P1-11, P1-12 PTD5/TXD Port D Bit 5 / UART TXD output • UART TXD output from MCU; jumper required • Connects to RCM USB UART device P1-31, P1-32 PTD7/32MOUT Port D Bit 7 • RCM switch matrix; jumper required 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-9 1323x Remote Control Motherboard 4.2.3 1323x-RCM Onboard Peripheral Functions The 1323x-RCM has a rich set of peripheral functions useful to evaluate the MC13233 and to implement a full featured remote control. 4.2.3.1 USB Interface For many applications or demonstrations it is desirable to connect the 1323x-RCM to a PC or other device. A USB port is provided with a USB “B” receptacle plug. The port is connected to a FTDI FT232RQ USB UART device that appears as a Virtual COM port (VCP) to the PC. PC drivers are available with the module. The USB interface is configured as a "Bus Powered" device and can draw all required power from the USB interface. The device is USB 2.0 full speed compatible. The USB connector is designated as J15. Figure 4-5 shows the connector pinout. V_BUS 4 3 2 -D +D G V 1 USB_TY PE_B S1 1 4 3 2 S2 DATA_P DATA_M J15 Figure 4-5. USB Connector Pinout 4.2.3.2 128x32 Graphic/Alphanumeric LCD The 1323x-RCM supports a 128x32 pixel STN passive trans-reflective monochrome graphic LCD that provides for alphanumeric or graphic readout. The LCD module is mounted on top of the main circuit board and connects via a 16-pin connector. Figure 4-6 shows the LCD interface schematic. • The display is an CRYSTALFONZ #CFAG12832A-YGH-N • Viewing area is 51.0 (W) × 17.8 (H) mm • The LCD operates from 5 Vdc generated from the main operating voltage through a boost switching regulator. The LCD module requires a highly regulated 5 V so that the high voltages generated onboard the display are consistent. • The LCD has optional yellow-green LED backlighting — Typical current of 30 mA when full on — Enabled via Jumper J10 — Always on when enabled. • LCD interface to the MCU is via the SPI port - although the LCD module only supports a parallel interface (8-bit or 4-bit modes), the 1323x-RCM uses a serial interface derived from the SPI port — The SPI serial stream is loaded into an 8-bit shift register (74AHCT164) used as a serial-to-parallel converter 1323x Development Hardware Reference Manual, Rev. 1.1 4-10 Freescale Semiconductor 1323x Remote Control Motherboard — Nibble (4-bit) parallel mode is used on the LCD and the shift register provides the 4 data bits and the RS control signal — The 4-data and RS control are strobed into the LCD via the LCD_CTL0 control signal derived from MC13233 PTA2 output. — LCD write mode only is supported; the LCD cannot be read. — The SPI port is shared with the serial FLASH on the 1323x-MRB. SS must be inactive (high) when writing to the LCD The onboard controller is a member of the Sitronix ST7920 Series family with an integrated display data RAM and alphanumeric character set • V_LCD CONTRAST ADJUST R53 V_LCD C31 B1 C45 2.2uF A1 C+ C- C2+ C2- C44 2.2uF C2 C3 LCD 0 SPI_MOSI 1 2 C46 2.2uF SPI_CLK FAN5665 8 0.1UF V_LCD DSA DSB CP 7 MR Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 9 3 4 5 6 10 11 12 13 Q0 Q1 Q2 Q3 Q4 U7 SN74AHCT1G08 1 LCD_CTL0 R31 43 Q4 4 2 R32 10K 74AHCT164 8-BIT SHIFT REGISTER R51 3 VCC 3.3K DNP V_LCD 1 2 HDR 1X2 14 U6 5 V_OUT V_5V EN A2 C38 2.2uF V_IN C1 TP33 GND A3 GND B3 R30 1K V_LCD R50 VCC U10 3 5V BOOST CHARGE PUMP VCC J10 5K 2 1 V_LCD Q0 Q1 Q2 Q3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DS1 VSS VDD Vo RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 ANODE KATODE LCD + HDR 1X16 + CON 1X16 Figure 4-6. 1323x-RCM LCD Interface Circuit 4.2.3.3 36 Pushbutton 6x6 Switch Matrix The1323x-RCM provides an 36 pushbutton 6x6 switch matrix for user application input interface. • The matrix utilizes MC13233 KBI inputs • All switches have interrupt and device wake up capability • For these 36 switches — Includes the pushbutton array — Includes two switches located to the right and two switches to the left of the LCD — Includes switches SW31 and SW32 located on the bottom (non-component) side of the board — Does not support the two switches (KB0 and KB1) located near the touchpad. 4.2.3.4 Synaptics Touchpad A Synaptics® Touchpad™ capacitive touch sensor is mounted on the 1323x-RCM for pointing functionality. • The touchpad is approximately 30mm tall x 45mm wide • Interface to the MCU uses the IIC interface • The touchpad has a separate interrupt request line that is tied to the KBI1P6 MCU input • The MCU reset is tied to the touchpad and resets the touchpad whenever a system reset occurs • The touchpad support two independent KBI signals that are connected to pushbuttons KB0 and KB1and used for touchpad select functions • The touchpad is soldered to the 1323x-RCM using two SMT headers 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-11 1323x Remote Control Motherboard Figure 4-7 shows the touchpad circuit. V_TPD TPKBI0 TPKBI1 1 1 V_TPD TPKBI0 R52 10K R34 10K R33 10K 1 2 3 4 5 6 7 8 I2C_SDA I2C_SCL KBI1P6 RSTb TPKBI0 TPKBI1 J11 VDD SDA SCL GND IRQ RESET KBI0 KBI1 TPKBI1 2 NC1 NC2 NC3 NC4 NC5 NC6 9 10 11 12 13 14 KB0 PB switch 3 2 KB1 PB switch 3 4 4 TOUCHPAD Figure 4-7. 1323x-RCM Touchpad Circuit 4.2.3.5 3-Axis Accelerometer The 1323x-RCM contains a Freescale MMA7660 3-axis accelerometer with IIC interface. • Uses a 3mm x 3mm x 0.9mm DFN package • Device interface supports IIC bus and system reset • Supports an auto-wake/sleep feature for Low power consumption. • When the device is in auto-sleep state, if a shake interrupt, tap interrupt, Delta G, or orientation detection interrupt occurs, the device comes out of sleep mode and generates an interrupt request via the IRQ signal Figure 4-8 shows the accelerometer circuit. V_AC C V_AC C U5 C28 10UF C29 0.1U F IRQb 1 2 3 4 5 RESERVED NC 2 NC 1 DVDD AVD D DVSS AVSS SDA INT SC L 10 9 8 7 6 C26 10UF C27 0.1UF I2C_SDA I2C_SCL MMA7660FC Figure 4-8. 1323x-RCM Accelerometer Circuit 4.2.3.6 Buzzer The 1323x-RCM provides a single tone audio buzzer. • • • Device LS1, CUI Inc., Part No. CMI-1240 4.0 kHz resonant frequency Device is buffered by Q2 and active when MCU output PTA1 is high (see Table 4-3) Figure 4-9 shows the buzzer circuit. 1323x Development Hardware Reference Manual, Rev. 1.1 4-12 Freescale Semiconductor 1323x Remote Control Motherboard Figure 4-9. 1323x-RCM Buzzer Circuit 4.2.3.7 Blue Indicator LED The1323x-RCM provides 4 blue LEDs for user application indicator outputs. Refer to Table 4-3 for listings of the MC13233 outputs that drive the LEDs. 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-13 Schematic, Board Layout, and Bill of Material 5 4 3 2 1 V_USB FT232RQ V_LED USBDP NC1 NC2 NC3 NC4 NC5 18 23 27 28 16 RESET# NC6 OSCI OSCO 3V3OUT 0 C23 15PF D C24 15PF V_LED TXD RXD RTS# CTS# DTR# DSR# DCD# RI# CBUS0 CBUS1 CBUS2 CBUS3 CBUS4 V_LED V_MRB UART_RXD R21 R22 TP13 1K TP14 LED4 BLUE TP15 MRB-UART_TXD MRB-UART_RXD MRB-TPM0 MRB-I2C_SDA MRB-I2C_SCL TP16 UART_CTS TP31 R23 390 TP32 R24 390 V_MRB J8 LED3 BLUE 1K UART_RTS TP30 LED2 BLUE R25 390 R26 390 MRB-KBI1P0 MRB-KBI1P2 J9 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 MRB-SPI_SS MRB-SPI_MOSI MRB-SPI_MISO MRB-SPI_CLK MRB-RSTb MRB-UART_RTS/KBI1P7 MRB-UART_CTS/TPM2 MRB-PTD7/32M_OUT MRB-KBI1P1 MRB-KBI1P3 1 3 5 7 9 11 13 15 17 MRB-PTA0 MRB-PTA2/LCD_CTL0 MRB-PTA4/32K_OUT MRB-KBI1P5 MRB-KBI2P0 MRB-KBI2P2 MRB-PTD1/TPM1 MRB-PTD4/CMT 2 4 6 8 10 12 14 16 18 MRB-PTA1 MRB-PTA3/IRQb MRB-KBI1P4 MRB-KBI1P6 MRB-KBI2P1 MRB-KBI2P3 MRB-PTD3/TPM3 D CON_2X9 CON_2X10 LED1 LED2 LED3 GPIO 20-PIN GPIO STANDARD HEADER LED4 SOCKETS FOR 1323X-MRB ASSEMBLY 33 24 4 17 20 26 C25 0.1UF V_LED LED1 BLUE EP AGND GND1 GND2 GND4 TEST R49 1K 2 14 5 12 13 25 29 1K R20 1 DATA_P R19 UART_TXD 30 2 32 8 31 6 7 3 22 21 10 11 9 2 USBDM 1 15 2 DATA_M 2 VCCIO VCC 0.1UF 0 1 1 19 R48 1 U4 C30 V_BUZ R27 0 P1 LS1 TP17 1 2 SPI_MOSI + UART_TXD SPI_CLK UART_RXD RSTb LED3 UART_RTS I2C_SDA UART_CTS I2C_SCL BUZZER LED1 LCD_CTL0 KMD5 V_ACC 4.7K C28 10UF C29 0.1UF 1 2 3 4 5 IRQb 10 9 8 7 6 RESERVED NC2 NC1 DVDD AVDD DVSS AVSS SDA INT SCL C26 10UF Q2 MMBT3904LT1G 1 BUZZER U5 C C27 0.1UF BUZZER 3 R28 V_ACC R29 47K 2 1323x Development Hardware Reference Manual, Rev. 1.1 USB/UART TRANSCEIVER I2C_SDA I2C_SCL MMA7660FC 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 P2 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 MRB-SPI_SS MRB-SPI_MOSI MRB-SPI_MISO MRB-UART_TXD MRB-SPI_CLK MRB-UART_RXD MRB-RSTb MRB-TPM0 MRB-UART_RTS/KBI1P7 MRB-I2C_SDA MRB-UART_CTS/TPM2 MRB-I2C_SCL MRB-PTA1 MRB-PTA0 MRB-PTA2/LCD_CTL0 MRB-PTD7/32M_OUT 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 KBI1P0 KBI1P1 KBI1P2 KBI1P3 KBI1P4 KBI1P5 IRQb KMD0 LED2 KMD2 KBI1P6 KMD1 KMD3 LED4 KMD4 HDR_2X16 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 MRB-KBI1P0 MRB-KBI1P1 MRB-KBI1P2 MRB-KBI1P3 MRB-KBI1P4 MRB-KBI1P5 MRB-PTA3/IRQb MRB-KBI2P0 MRB-PTA4/32K_OUT MRB-KBI2P2 MRB-KBI1P6 MRB-KBI2P1 MRB-KBI2P3 MRB-PTD1/TPM1 MRB-PTD3/TPM3 MRB-PTD4/CMT C HDR_2X16 LED'S & BUZZER P1 & P2: IO PIN MAPPING MUST USE SHUNTS TO ENABLE BOARD FUNCTIONALLITY. DIGITAL ACCELEROMETER KEYBOARD MATRIX KBI1P0 KBI1P1 KBI1P2 KBI1P3 KBI1P4 KBI1P5 KMD0 SW1 PB switch SW2 PB switch 1 4 2 SW3 PB switch 1 3 4 2 1 SW4 PB switch 1 3 4 2 2 SW5 PB switch 1 3 4 2 3 SW6 PB switch 1 3 4 2 4 1 3 4 2 5 3 6 B B KMD1 SW7 PB switch SW8 PB switch 1 4 2 SW9 PB switch 1 3 4 2 7 SW10 PB switch 1 3 4 2 8 SW11 PB switch 1 3 4 2 9 SW12 PB switch 1 3 4 2 CLEAR 1 3 4 2 0 3 ENTER KMD2 SW13 PB switch SW14 PB switch 1 4 2 SW15 PB switch 1 3 4 2 3 4 2 TV POWER SW16 PB switch 1 SW17 PB switch 1 3 4 2 GUIDE SW18 PB switch 1 3 4 2 MP3 1 3 4 2 STOCK 3 MENU KMD3 SW19 PB switch SW20 PB switch 1 4 2 SW21 PB switch 1 3 4 2 STOP SW22 PB switch 1 3 4 2 PAUSE SW23 PB switch 1 3 4 2 REC SW24 PB switch 1 3 4 2 RW 1 3 4 2 PLAY 3 FF Freescale Semiconductor KMD4 SW25 PB switch SW26 PB switch 1 A 4 2 SW27 PB switch 1 3 4 2 VOL+ SW28 PB switch 1 3 4 2 VOL- SW29 PB switch 1 3 4 2 MUTE SW30 PB switch 1 3 4 2 CH+ 1 3 4 2 A 3 DNP CH- KMD5 SK1 PB switch SK2 PB switch 1 4 SK3 PB switch 1 4 SK4 PB switch 1 4 SW31 PB switch 1 4 ICAP Classification: Drawing Title: SW32 PB switch 1 4 1 FCP: FIUO: ___ X PUBI: ___ 1323X REMOTE CONTROL MOTHERBOARD 4 Page Title: 2 SK1 5 3 2 3 2 SK2 SK3 4 3 2 SK4 3 2 3 DNP 2 INTERFACE 3 DNP 3 Figure 4-10. 1323x-RCM Schematic (1 of 3) 2 Size C Document Number Date: Friday, February 05, 2010 Rev B1 SCH-26116 PDF: SPF-26116 Sheet 1 3 of 5 1323x Remote Control Motherboard 4-14 4.3 Freescale Semiconductor 5 4 3 2 1 D D V_LCD CONTRAST ADJUST R53 5K 1 V_LCD C31 R30 1K V_LCD DS1 CP 7 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 3 4 5 6 10 11 12 13 Q0 Q1 Q2 Q3 Q4 Q4 1 LCD_CTL0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 R31 43 U7 SN74AHCT1G08 4 2 R32 10K 3 DSB 8 9 5 14 2 GND SPI_CLK DSA MR Q0 Q1 Q2 Q3 74AHCT164 8-BIT SHIFT REGISTER VSS VDD Vo RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 ANODE KATODE LCD + HDR 1X16 + CON 1X16 C C LCD TPKBI0 V_TPD TPKBI1 V_TPD TPKBI0 R52 10K R34 10K 1 J11 I2C_SDA I2C_SCL KBI1P6 RSTb TPKBI0 TPKBI1 B TPKBI1 R33 10K 1 2 3 4 5 6 7 8 VDD SDA SCL GND IRQ RESET KBI0 KBI1 NC1 NC2 NC3 NC4 NC5 NC6 9 10 11 12 13 14 1 KB0 PB switch 2 3 KB1 PB switch 2 3 4 4 B TOUCHPAD TOUCHPAD A A ICAP Classification: Drawing Title: FCP: FIUO: ___ X PUBI: ___ 1323X REMOTE CONTROL MOTHERBOARD Page Title: LCD & TOUCHPAD 5 4 3 4-15 Figure 4-11. 1323x-RCM Schematic (2 of 3) 2 Size C Document Number Date: Friday, February 05, 2010 Rev B1 SCH-26116 PDF: SPF-26116 Sheet 1 4 of 5 1323x Remote Control Motherboard 1323x Development Hardware Reference Manual, Rev. 1.1 1 SPI_MOSI V_LCD 1 2 HDR 1X2 VCC U6 VCC 3.3K DNP J10 0.1UF R51 3 2 V_LCD Freescale Semiconductor 5 4 3 2 1 D D TP19 3.3uH MBR0520LT1G D10 MBR0520LT1G D11 MBR0520LT1G C32 10UF R45 0 VIN 8 6 7 VINA EN PS/SYNC VOUT GND 3 9 D8 L2 5 D13 PGND PPAD 3 11 C33 0.1UF 1 Q3 SI2305 2 R41 10K R36 C V_BAT TP21 LED MBR0520LT1G 10 R47 0 C42 10UF 0 LED5 RED 0 C43 10UF V_TPD R37 TP22 TP23 TOUCHPAD 0 R38 4.7K R35 V_3V3 1 FB POWER ON V_LED 2 TPS63001 V_DC MBR0520LT1G V_LED VCC TP20 L1 3.3V BUCK/BOOST REGULATOR TO USE TPS63000, REPLACE RESISTORS WITH THE FOLLOWING VALUES: R45 = 100 OHM, R47 = 1.24M AND POPULATE R46. OUTPUT VOLTAGE WILL BE 3.6V R39 330 V_ACC R46 200K DNP R40 TP24 ACCELEROMETER 0 V_BUZ TP25 R42 C TP26 BUZZER 0 V_MRB D12 R43 TP27 MODULAR REFERENCE BOARD MBR0520LT1G 0 3.3V POWER NETWORK V_SER 5V BOOST CHARGE PUMP V_USB V_BUS 11 3 10 4 9 5 8 6 7 V_BHL V_SER TP29 U9 2 60OHM C41 0.01UF C39 0.1UF C40 4.7uF C35 2.2uF J15 C36 2.2uF B3 V_IN A3 EN B1 C+ A1 C- V_BUS R44 V_OUT C1 TP28 V_5V LCD 0 A2 12 2 0.5A DATA_P DATA_M 1 V_LCD VCC L4 2 1 1 F1 1 BT1 BATTERY HOLDER C2+ C2 C2- C3 C34 2.2uF B C37 2.2uF FAN5665 5V POWER NETWORK V_JACK 2 V_SER 4 1 SL1 B 3 2 V_BAT -D +D G V V_DC V_JACK S1 1 4 3 2 S2 GND V_BUS USB_TYPE_B J14 1 2 4P2T SWITCH EXTERNAL SUPPLY. NEVER SHUNT!!! BH1 BH2 BH3 BH4 125 125 BH5 BH6 BH7 HDR 1X2 125 125 FID1 FID2 FID3 FID FID FID TL1 125 TL2 TL3 125 TL4 125 TL5 TL6 A A ICAP Classification: Drawing Title: FCP: FIUO: ___ X PUBI: ___ 1323X REMOTE CONTROL MOTHERBOARD Page Title: POWER MANAGEMENT 5 4 3 4-16 Figure 4-12. 1323x-RCM Schematic (3 of 3) 2 Size C Document Number Date: Friday, February 05, 2010 Rev B1 SCH-26116 PDF: SPF-26116 Sheet 1 5 of 5 1323x Remote Control Motherboard 1323x Development Hardware Reference Manual, Rev. 1.1 D9 2 U8 4 2 V_MAIN 1 L3 1 V_USB 1323x Remote Control Motherboard Figure 4-13. 1323x-RCM PCB Component Location (Top View) 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-17 1323x Remote Control Motherboard Figure 4-14. 1323x-RCM PCB Test Points 1323x Development Hardware Reference Manual, Rev. 1.1 4-18 Freescale Semiconductor 1323x Remote Control Motherboard Figure 4-15. 1323x-RCM PCB Layout (Top View) 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-19 1323x Remote Control Motherboard Figure 4-16. 1323x-RCM PCB Layout (Bottom View) 1323x Development Hardware Reference Manual, Rev. 1.1 4-20 Freescale Semiconductor 1323x Remote Control Motherboard 4.3.1 1323x-RCM Bill of Materials Table 4-4. Bill of Materials Item Qty. Reference Value Description Mfg. Name Mfg. Part Number 1 8 BH1,BH2,BH3,BH 125 4,BH5,BH6,BH7,B H8 NON-PLATED MOUNTING HOLE 125 DRILL / 160 KEEPOUT NO PART TO ORDER 2 1 BT1 BATTERY HOLDER BATTERY HOLDER 2XAA TH Keystone Electronics 2462 3 2 C23,C24 15PF CAP CER 15PF 50V 5% C0G 0402 Kemet C0402C150J5GAC 4 4 C25,C30,C33,C39 0.1UF CAP CER 0.1UF 16V 10% X7R Murata 0402 GRM155R71C104KA88D 5 5 C26,C28,C32,C42 10UF ,C43 CAP CER 10UF 10V 10% X7R Murata 0805 GRM21BR71A106KE51L 6 3 C27,C29,C31 0.1UF CAP CER 0.1UF 50V 10% X7R Murata 0603 GRM188R71H104KA93D 7 4 C34,C35,C36,C37 2.2uF CAP CER 2.2UF 6.3V 10% X5R Murata 0603 GRM188R60J225KE19D 8 1 C40 4.7uF CAP CER 4.7UF 10V 10% X5R Taiyo Yuden 0603 LMK107BJ475KA-T 9 1 C41 0.01UF CAP CER 0.01UF 10V 20% X7R 0402 Avx 0402ZC103MAT2A 10 1 DS1 LCD + HDR SUBASSY LCD 128X32 DOT 1X16 + CON 4.5-5V TH + HDR 1X16 TH 1X16 100MIL SP 330H AU + CON 1X16 SKT TH 100MIL SP 335 AU Freescale Semiconductor 370-76474, 210-75955, 210-77812 11 6 D8,D9,D10,D11,D 12,D13 MBR0520LT DIODE SCH 0.5A 20V 1G SOD-123 On Semiconductor MBR0520LT1G 12 3 FID1,FID2,FID3 FID FIDUCIAL 060 MIL PAD W/120 Generic SOLDERMASK AND 040 MIL PAD W/90 MIL SOLDERMASK NO PART TO ORDER FID-040 13 1 F1 0.5A FUSE FAST 0.5A 63V SMT 1206 Littelfuse 0437.500WR 14 1 J8 CON_2X10 CON 2X10 SKT TH 100MIL CTR 335H AU 104L Samtec SSW-110-01-G-D 15 1 J9 CON_2X9 CON 2X9 SKT TH 100MIL SP 335H AU 194L Samtec SSW-109-02-G-D 16 2 J10,J14 HDR_1X2 HDR 1X2 TH 100MIL SP 375H Tyco AU Electronics 17 1 J11 TOUCHPAD TOUCHPAD SERIAL 3V TH Synaptics, Inc 826629-2 515-000188-0110 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-21 1323x Remote Control Motherboard Table 4-4. Bill of Materials Item Qty. Reference Value Description Mfg. Name Mfg. Part Number Tyco Electronics 292304-2 SW SMT 4.0MM FMS 0.1A MAX 16V MAX ROHS COMPLIANT Bourns 7914J-1-000E LED1,LED2,LED3, BLUE LED4 LED BLUE SGL 20MA SMT 0805 Lite On LTST-C171TBKT-5A 1 LED5 RED LED RED CLEAR SGL 30MA SMT 0805 Lite On LTST-C171KRKT 22 1 LS1 BUZZER BUZZER PIEZO AUDIO 83DB 4KHZ 8MA 12V SMT Cui Stack CMI-1240 23 1 L3 3.3uH IND PWR 3.3UH@100KHZ 3.3A 20% SMT Vishay Intertechnology IHLP2020BZER3R3M01 24 1 L4 60OHM IND FER BEAD 60OHM@100MHZ 500MA -0603 Murata BLM18PG600SN1_ 25 2 P1,P2 HDR_2X16 HDR 2X16 TH 100MIL CTR 330H AU 100L Samtec TSW-116-07-S-D 26 1 Q2 MMBT3904L TRAN NPN GEN 200MA 40V T1G SOT-23 On Semiconductor MMBT3904LT1G 27 1 Q3 SI2305 TRAN PMOS PWR 4.1A 8V SOT23 Vishay Intertechnology SI2305ADS-T1-GE3 28 5 R19,R20,R21,R22 1K ,R30 RES MF 1.0K 1/16W 5% 0402 Vishay Intertechnology CRCW04021K00JNED 29 4 R23,R24,R25,R26 390 RES MF 390 OHM 1/16W 5% 0402 Bourns CR0402-JW-391GLF 30 2 R27,R45 RES MF 100 OHM 1/16W 5% 0402 Vishay Intertechnology CRCW0402100RJNED 31 10 R28,R35,R36,R37 0 ,R40,R42,R43,R4 4,R48,R49 RES TF ZERO OHM 1/16W RC0402 Vishay Intertechnology CRCW04020000ZS 32 6 R29,R32,R33,R34 10K ,R41,R52 RES MF 10K 1/16W 5% 0402 Vishay Intertechnology CRCW040210K0JNED 18 1 J15 USB_TYPE_ CON 2X2 USB_TYPE_B SKT B RA SHLD TH 2.5MM SP 453H AU 19 35 SW1,SK1,KB1,SW PB switch 2,SK2,SW3,SK3,S W4,SK4,SW5,SW 6,SW7,SW8,SW9, SW10,SW11,SW1 2,SW13,SW14,S W15,SW16,SW17, SW18,SW19,SW2 0,SW21,SW22,S W23,SW24,SW25, SW26,SW27,SW2 8,SW29,KB0 20 4 21 100 1323x Development Hardware Reference Manual, Rev. 1.1 4-22 Freescale Semiconductor 1323x Remote Control Motherboard Table 4-4. Bill of Materials Item Qty. Reference Value Description Mfg. Name Mfg. Part Number 33 1 R31 39 RES MF 39 OHM 1/16W 5% 0402 Smec RC73L2Z390JTF 34 1 R38 4.7K RES MF 4.7K 1/16W 5% 0402 Smec RC73L2Z472JTF 35 1 R39 330 RES MF 330 OHM 1/16W 5% 0402 Vishay Intertechnology CRCW0402330RJNED 36 1 R46 200K RES MF 200K 1/16W 5% 0402 Yageo America RC0402JR-07200KL 37 1 R47 1.24M RES MF 1.24M 1/16W 1% 0402 CRCW04021M24FKED 38 1 R50 5K RES POT 5.0K 1/4W 20% SMT Bourns 3314J-1-502E 39 1 R51 3.3K RES MF 3.3K 1/16W 5% 0402 Vishay Intertechnology CRCW04023K30JNED 40 1 SL1 4PDT SWITCH SW 4PDT SLD TH RA 30V 100MA -- Tyco Electronics 1-1437575-1 41 3 SW30,SW31,SW3 PB switch 2 SW SMT 4.0MM FMS 0.1A MAX 16V MAX ROHS COMPLIANT Bourns 7914J-1-000E 42 19 TP13,TP14,TP15, TP16,TP17,TP19, TP20,TP21,TP22, TP23,TP24,TP25, TP26,TP27,TP28, TP29,TP30,TP31, TP32 TPAD_040 TEST POINT PAD 40MIL DIA SMT, NO PART TO ORDER Notacomponent NOTACOMPONENT 43 1 U4 FT232RQ IC XCVR USB TO UART CTLR Future 3.3-5.25V QFN32 Technology Devices International Ltd. FT232RQ 44 1 U5 MMA7660F C IC SENSOR ACCELEROMETER 2.4-3.6V DFN10 MMA7660FC 45 1 U6 74AHCT164 IC REG SHIFT SER/PAR 8BIT 4.5-5.5V TSSOP14 Nxp 74AHCT164PW,112 Semiconductors 46 1 U7 SN74AHC T1G08 IC GATE AND SGL 2-INPUT POSITIVE 4.5-5.5V SOT23-5 Texas Instruments SN74AHCT1G08DBVR 47 1 U8 TPS63001 IC LIN DCDC SYNC 3.3V OUTPUT 1250-1800KHZ 1.8-5.5V QFN-10 Texas Instruments TPS63001DRCT Vishay Intertechnology Freescale Semiconductor 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 4-23 1323x Remote Control Motherboard Table 4-4. Bill of Materials Item Qty. 48 1 Reference U9 Value FAN5665 Description IC LIN DCDC SWT 5V 2.9-5.5V WLCSP-8 Mfg. Name Fairchild Mfg. Part Number FAN5665UCX 1323x Development Hardware Reference Manual, Rev. 1.1 4-24 Freescale Semiconductor Chapter 5 1323x Remote Extender Motherboard 5.1 1323x-REM Overview The 1323x-Remote Extender Motherboard (1323x-REM) is a motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB) plug-in module (daughtercard) and supplies a power supply and set of interface peripherals. The two boards in combination provide a simple platform to evaluate the MC1323x, develop software, and demonstrate IEEE 802.15.4 based networking capabilities. 5.1.1 Features The 1323x-REM provides the following features: • Small form factor (3.1 x 3.1 inches) • 2-Layer metal, 0.034 inch thick FR4 board • Two connectors provide daughter card mounting — 20-Pin primary connector — 18-Pin secondary connector — Provide main supply voltage to board — Provide access to all MC13233 GPIO • Flexible power supply — Sources include USB port, two AA batteries, or DC source — Power-On LED — On-Off switch • USB UART serial port • 2x4 Switch matrix • IR receiver • Four application controlled blue indicator LEDs • Secondary set of pin headers uses jumpers to enable/disable IO connections and allows user application connection to MC13233 GPIO 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 5-1 1323x Remote Extender Motherboard 5.1.2 Form Factor Figure 5-1 shows a photo of the 1323x-REM showing the locations of connectors and headers. Primary 20-Pin IO Connector (J8) 1323x-MRB Outline (When mounted) Secondary 18-Pin IO Connector (J9) Power-On LED GPIO Enable Pin Header P1 IR Receiver External Supply J14 GPIO Enable Pin Header P2 4 Blue LEDs 2x4 Switch Matrix On / Off Switch SL1 3.1 Inches 79 mm USB Connector J15 3.1 Inches 79 mm Figure 5-1. 1323x-REM The1323x-MRB mounts on the 1323x-REM via receptacles J8 and J9. Figure 5-1 shows an outline of the 1323x-MRB placement when mounted. 1323x Development Hardware Reference Manual, Rev. 1.1 5-2 Freescale Semiconductor 1323x Remote Extender Motherboard 5.1.3 Board Level Specifications NOTE Temperature range specifications apply to REM used in combination with MRB. Table 5-1. 1323x-REM Specifications Parameter Units MIN TYP Notes/Conditions MAX General Size (PCB: X, Y) 79 x 79 3.1 x 3.1 Layer build (PCB) 0.8 0.034 mm inches mm 2-Layer inches Dielectric material (PCB) FR4 Power Voltage supply (DC) 2.3 5 6 V Voltage supply (USB) 4.4 5 5.25 V 2.8 3.2 V 100 mA Voltage supply (Batteries) Current consumption USB 2.0/1.1 standard specification Temperature Operating temperature; non-battery operation (see note) Operating temperature; battery operation (see note) Storage temperature -20 +25 +70 °C Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C. 0 +25 +50 °C Operating temperature is limited by battery temperature range -30 +25 +70 °C USB interface USB 2.0 and 1.1 full-speed compatible IR Receiver Carrier frequency 38 Angle of half transmission distance +/-50 kHz degrees Regulatory Approval CE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standard CE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards Safety 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 5-3 1323x Remote Extender Motherboard Table 5-1. 1323x-REM Specifications (continued) Parameter Units UL Notes/Conditions Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards Environment RoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003 WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003 5.2 Functional Description The 1323x-REM is a simple host motherboard for the 1323x-MRB. The two-board combination provides a simple evaluation and development platform for the MC13233. Figure 5-2 shows a simple block diagram. The 2-layer board provides a flexible power supply, eight pushbutton matrix, four indicator LEDs, IR receiver, and a USB UART serial port. As the board name implies this platform is useful to develop the host side (such as a DTV or entertainment console) of an RF remote control application. The MC13233 provides the RF node and an IR receiver is available to support legacy IR protocol remotes. Connection to a host is available through the USB port or any of the other generic MC13233 communications ports. The 1323x-REM is also recommended for target development of applications where there is little periphery circuitry. There are switches and indicator LEDs onboard for user interface, and if necessary, custom circuitry can be connected via the two pin headers that allow access to the MC13233 GPIO. In the following sections, refer to: • Figure 5-1 for location of connectors and features • Figure 5-2 for the functional blocks • Figure 5-8 and Figure 5-9 for the board schematic 1323x Development Hardware Reference Manual, Rev. 1.1 5-4 Freescale Semiconductor 1323x Remote Extender Motherboard 1323x-MRB GPIO Header Receptacles On/Off Switch External DC 4 Blue Indicator LEDs Power Management 2 AA Battery GPIO Pin Headers VCC USB Type-B Conn USB 2.0 IR IR Receiver (38 kHz) On LED USB UART Serial IC 8 Switch Matrix Figure 5-2. 1323x-REM Block Diagram 5.2.1 Power Management The 1323x-REM can be powered from two AA batteries, the USB connector 5 V supply, or an external DC supply and is also intended to power the 1323x-MRB. Figure 5-3 shows the power management circuit. TP19 3.3uH D9 D10 5 MBR0520LT1G MBR0520LT1G D11 MBR0520LT1G C32 10UF R45 0 8 6 7 3 9 D8 R38 R41 10K 2 1 4.7K V_LED L2 VIN VOUT VINA EN PS/SYNC GND FB PGND PPAD 2 10 V_LED D13 1 R35 R36 Q4 SI2305 C33 0.1UF TP21 LED V_3V6 R47 0 C42 10UF C43 10UF 0 MBR0520LT1G LED5 RED 0 V_I RX TP25 3 11 R40 TP24 INFRARRED RX 0 R46 200K DNP POWER ON VCC TP20 L1 TPS63001 V_DC MBR0520LT1G 2 U8 4 2 V_MAIN D12 MBR0520LT1G V_MRB R43 TP23 1 L3 1 V_USB R39 330 TP27 0 MODULAR REFERENCE BOARD V_BAT Figure 5-3. 1323x-REM Power Management Circuit A boost-buck voltage regulator U8 is used in this design to allow operation over a relatively wide, low voltage input range, i.e., the TPS63001 regulator has input voltage range from 1.8 V to 5.5V. This allows a broad range of power supply sources. The regulated output voltage of the TPS63001 is 3.3 V which delivers about 3.05 V to the board due to the drop across the isolation Schottky diodes. Attributes of the power management circuit include: • Switch SL1 provides an ON/OFF function for all input voltage sources • Red LED5 provides a POWER-ON indicator for all sources • The 1323x-REM can derive power from three different sources 1. USB port Type-B connector J15 - power can be supplied from an actual USB port connection or from an AC to DC converter that uses the USB connector to supply power. 2. External DC source via header J14 - a standard 0.1 in. spacing 1x2 pin header allows for connection of an external DC supply. 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 5-5 1323x Remote Extender Motherboard 3. Battery Operation - a battery holder that accommodates two AA batteries is mounted on the non-component (back) side of the board and provides for battery operation. – If either the USB or external DC source is present, the battery source is disabled by MOSFET transistor Q3 – The sources are all isolated and protected by Schottky diodes – The minimum effective battery operating voltage is controlled by the use the FTDI FT232RQ USB UART device - leakage current back through the FT232RQ UART connections to the MC13233 on the MRB can cause the Q3 MOSFET to partially turnoff at battery voltage below approximately 2.7-2.8 Vdc. NOTE To avoid current leakage through the USB device and lower minimum battery operating voltage for battery-only operation, remove the following jumpers: • • • • P1, Pins 7-8 P1, Pins 11-12 P1, Pins 17-18 P1, Pins 21-22 NOTE When battery operation is used, the temperature range of the two board system should be limited to within the specified temperature range of the battery technology. Table 5-1 limits temperature range from 0 °C to +50 °C when battery operation is applied. Table 5-2 lists the voltage source attributes. Table 5-2. 1323x-REM Voltage Sources 1 Source Connector Input Voltage Range USB Port USB Type-B J15 4.4 V - 5.25 V External DC Supply 1x2 Pin Hdr J14 2.3 V - 6 V Two AA Batteries Battery Holder 2.0 V - 3.1 V1 Description • The input voltage range is set to the USB specification value • The voltage can be supplied by either a standard USB cable connection or an AC to DC power adaptor that uses the USB connector J15 • If a power adaptor is in use, the USB serial port cannot be used The input voltage range is determined by the U8 regulator and the diode isolation circuit • The input voltage range reflects the usable range of alkaline cells and the voltage drop incurred by the diode isolation circuit. • The battery source is disabled if another source is connected The minimum operating battery voltage is determined by use model, see Note, Section 5.2.1, “Power Management” 1323x Development Hardware Reference Manual, Rev. 1.1 5-6 Freescale Semiconductor 1323x Remote Extender Motherboard Again referring to Figure 5-3, a number of zero-ohm resistors are provided to isolate different circuits and to allow current measurement: • VCC (main 1323x-REM supply) - resistor R35 • V_LED (all LEDs supply) - resistor R36 • V_IRX (IR receiver supply) - resistor R40 • V_MRB (1323x-MRB supply) - resistor R43 Figure 5-4. 1323x-MRB Mounted on 1323x-REM 5.2.2 GPIO Connection to 1323x-MRB IO Connectors J8 and J9 (see Figure 5-1) are receptacles that accept the 1323x-MRB pin headers to mount the daughtercard. Figure 5-4 shows the 1323x-REM with the 1323x-MRB mounted. Receptacles J8 and J9 connect to the MC13233 GPIO. To provide better access and versatility to the GPIO, a secondary set of pin headers P1 and P2 is connected in series with the IO signals: • Jumpers must be installed on P1 and P2 to connect 1323x-REM peripherals and functions • The pin headers provide direct access for connecting custom circuitry to the GPIO • Power and ground to primary connectors J8 and J9 are not enabled though the pin headers Figure 5-5 shows IO Header P1 andP2 pin mapping. 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 5-7 1323x Remote Extender Motherboard Figure 5-5. 1323x-REM IO Connector J8 and J9 Pin Mapping Table 5-3 list the P1 and P2 pin header function as it relates to the MC13233. Table 5-3. 1323x-REM P1 and P2 Pin Header Function Description 1323x-REM Header Pins MC13233 Signal Name P1-27, P1-28 PTA0/XTAL_32K Port A Bit 2 / 32.768 kHz oscillator output • Drives LED1; jumper required • 32.768 kHz oscillator can be enabled on MRB P1-26 PTA1/EXTAL_32K Port A Bit 3 / 32.768 kHz oscillator input • Unused • 32.768 kHz oscillator can be enabled on MRB P1-14 RESET Device asynchronous hardware reset. Active low. Onboard Pullup • Unused • Reset signal driven from MRB P1-30 PTA2 Port A Bit 2. Onboard pullup for TM • Unused • TM enable; leave unconnected P2-14 PTA3/IRQ Port A Bit 3 / IRQ. • Unused • Provides interrupt request input IRQ (active low) PTA4/ XTAL_32KOUT Port A Bit 4 / Buffered 32.768 kHz clock output • Drives LED2; jumper required • Optional 32.768 kHz output clock for measuring reference oscillator accuracy (ppm) P1-20 PTA5/SDA Port A Bit 5 / IIC Bus data • Unused • Defaults to open drain for IIC • Pullup on MRB P1-24 PTA6/SCL Port A Bit 6 / IIC Bus clock • Unused • Defaults to open drain for IIC • Pullup on MRB P2-1, P2-2 PTB0/KBI1P0 Port B Bit 0 / KBI1 Input Bit 0 REM switch matrix; jumper required P2-3, P2-4 PTB1/KBI1P1 Port B Bit 1 / KBI1 Input Bit 1 REM switch matrix; jumper required P2-5, P2-6 PTB2//KBI1P2 Port B Bit 2 / KBI1 Input Bit 2 REM switch matrix; jumper required P2-7, P2-8 PTB3//KBI1P3 Port B Bit 3 / KBI1 Input Bit 3 REM switch matrix; jumper required P2-10 PTB4//KBI1P4 Port B Bit 4 / KBI1 Input Bit 4 Unused P2-17, P2-18 Description Comments 1323x Development Hardware Reference Manual, Rev. 1.1 5-8 Freescale Semiconductor 1323x Remote Extender Motherboard Table 5-3. 1323x-REM P1 and P2 Pin Header Function Description (continued) 1323x-REM Header Pins MC13233 Signal Name Description Comments P2-12 PTB5//KBI1P5 Port B Bit 5 / KBI1 Input Bit 5 Unused P2-22 PTB6//KBI1P6 Port B Bit 6 / KBI1 Input Bit 6 Unused P1-17, P1-18 PTB7//KBI1P7 Port B Bit 7 / KBI1 Input Bit 7 • UART flow control RTS input to MCU; jumper required • Connects to REM USB UART device P2-15, P2-16 PTC0/KBI2P0 Port C Bit 0 / KBI2 Input Bit 0 REM switch matrix; jumper required P2-23, P2-24 PTC1/KBI2P1 Port C Bit 1 / KBI2 Input Bit 1 REM switch matrix; jumper required P2-20 PTC2/KBI2P2 Port C Bit 2 / KBI2 Input Bit 2 Unused P2-26 PTC3/KBI2P3 Port C Bit 3 / KBI2 Input Bit 3 Unused P1-10 PTC4/SPICLK Port C Bit 4 / SPI clock • Unused on REM • Connected to serial FLASH on MRB P1-2 PTC5/SS Port C Bit 5 / SPI slave select • Unused on REM • Connected to serial FLASH on MRB P1-6 PTC6/MISO Port C Bit 6 / SPI MISO • Unused on REM • Connected to serial FLASH on MRB P1-4 PTC7/MOSI Port C Bit 7 / SPI MOSI • Unused on REM • Connected to serial FLASH on MRB P1- 15, P1-16 PTD0/TPM0 Port D Bit 0 / TPM0 signal Unused P2-27, P2-28 PTD1/TPM1 Port D Bit 1/ TPM1 signal Drives LED4; jumper required P1-21, P1-22 PTD2/TPM2 Port D Bit 2 / TPM2 signal • UART flow control CTS output from MCU; jumper required • Connects to REM USB UART device P2-29, P2-30 PTD3/TPM3 Port D Bit 3 / TPM3 signal • REM IR receiver input; jumper required • Drives timer input P2-32 PTD4/CMT Port D Bit 4/ CMT output • Not used on REM • Connected to IR blaster on MRB P1-7, P1-8 PTD6/RXD Port D Bit 6 / UART RXD input • UART RXD input to MCU; jumper required • Connects to REM USB UART device P1-11, P1-12 PTD5/TXD Port D Bit 5 / UART TXD output • UART TXD output from MCU; jumper required • Connects to REM USB UART device PTD7/32MOUT Port D Bit 7 Unused P1-32 5.2.3 1323x-REM Onboard Peripheral Functions The 1323x-REM has a simple set of peripheral functions useful to evaluate the MC13233 and to implement simple node applications, especially a remote control receiver; i.e., interface to host platform. 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 5-9 1323x Remote Extender Motherboard 5.2.4 USB Interface For many applications or demonstrations it is desirable to connect the 1323x-REM to a PC or other device. A USB port is provided with a USB “B” receptacle plug. The port is connected to a FTDI FT232RQ USB UART device that appears as a Virtual COM port (VCP) to the PC. PC drivers are available with the module. The USB interface is configured as a "Bus Powered" device and can draw all required power from the USB interface. The device is USB 2.0 full speed compatible. The USB connector is designated as J15. Figure 5-6 shows the connector pinout. V_BUS 4 3 2 -D +D G V 1 USB_TY PE_B S1 1 4 3 2 S2 DATA_P DATA_M J15 Figure 5-6. USB Connector Pinout 5.2.5 IR Receiver The 1323x-REM provides an IR receiver that accepts IR signals from the RCM or from any IR based remote control devices. • The IR receiver is the TSOP85238TR device (Q3) • 38 kHz carrier frequency • +/- 50 Degree angle of half tranmission distance • Drives the PTD3/TPM3 signal. Figure 5-7 shows the IR receiver schematic. 1323x Development Hardware Reference Manual, Rev. 1.1 5-10 Freescale Semiconductor 1323x Remote Extender Motherboard Figure 5-7. IR Receiver Circuit 5.2.6 Pushbutton 2x4 Switch Matrix The1323x-REM provides an 8 pushbutton 2x4 switch matrix for user application input interface. • The matrix utilizes MC13233 KBI inputs • All switches have interrupt and device wake up capability 5.2.7 Blue Indicator LEDs The1323x-REM provides 4 blue LEDs for user application indicator outputs. Refer to Table 5-3 for listings of the MC13233 outputs that drive the LEDs. 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 5-11 Schematic, Board Layout, and Bill of Material 5 4 3 2 1 D D L3 3.3uH TP19 D9 D10 MBR0520LT1G C32 10UF R45 0 L2 VIN VOUT 8 6 7 VINA EN PS/SYNC 9 GND 3 D11 MBR0520LT1G D8 2 1 FB 10 PGND PPAD 3 11 R47 0 C33 0.1UF 2 1 R41 10K R35 R36 Q4 SI2305 V_BAT TP21 LED 0 MBR0520LT1G C43 10UF LED5 RED 0 V_IRX TP25 R40 TP24 TP23 INFRARRED RX 0 R38 4.7K C42 10UF POWER ON V_LED D13 V_3V6 TPS63001 V_DC MBR0520LT1G V_LED VCC TP20 L1 3.3V BUCK/BOOST REGULATOR TO USE TPS63000, REPLACE RESISTORS WITH THE FOLLOWING VALUES: R45 = 100 OHM, R47 = 1.24M AND POPULATE R46. OUTPUT VOLTAGE WILL BE 3.6V R46 200K DNP D12 V_MRB R43 TP27 0 MBR0520LT1G R39 330 MODULAR REFERENCE BOARD 3.3V POWER NETWORK C V_BUS V_USB V_BUS 12 2 11 3 10 4 9 5 8 6 7 V_BHL V_SER F1 L4 1 2 0.5A DATA_P DATA_M 1 TP29 2 60OHM C41 0.01UF C39 0.1UF C40 4.7uF J15 B V_BUS BT1 BATTERY HOLDER V_JACK 2 V_SER B SL1 1 4 1 V_JACK 3 2 V_BAT S1 1 4 3 2 S2 1 V_DC C V_SER USB_TYPE_B -D +D G V 1323x Development Hardware Reference Manual, Rev. 1.1 5 MBR0520LT1G 2 U8 4 2 V_MAIN 1 1 V_USB J14 1 2 4P2T SWITCH EXTERNAL SUPPLY. NEVER SHUNT!!! HDR 1X2 BH1 BH2 BH3 125 125 125 FID1 FID2 FID3 FID FID FID BH4 125 TL1 TL2 TL3 TL4 TL5 Freescale Semiconductor A A ICAP Classification: Drawing Title: FCP: FIUO: ___ X PUBI: ___ 1323X REMOTE EXTENDER MOTHERBOARD Page Title: POWER MANAGEMENT 5 4 3 Figure 5-8. 1323x-REM Schematic (1 of 2) 2 Size C Document Number Date: Friday, October 02, 2009 Rev B SCH-26117 PDF: SPF-26117 Sheet 1 4 of 4 1323x Remote Extender Motherboard 5-12 5.3 Freescale Semiconductor 5 4 3 2 1 D D V_USB U4 FT232RQ V_LED C30 C23 15PF C24 15PF RESET# NC6 OSCI OSCO 3V3OUT 30 2 32 8 31 6 7 3 22 21 10 11 9 R20 1K R21 1K LED1 BLUE UART_RXD UART_RTS TP30 R22 1K R23 390 TP32 LED1 LED2 BLUE TP14 LED3 BLUE LED4 BLUE TP15 R24 390 LED2 R25 390 V_MRB TP16 LED3 V_MRB J8 R26 390 MRB-UART_TXD MRB-UART_RXD MRB-TPM0 MRB-I2C_SDA MRB-I2C_SCL MRB-KBI1P0 MRB-KBI1P2 LED4 J9 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 MRB-SPI_SS MRB-SPI_MOSI MRB-SPI_MISO MRB-SPI_CLK MRB-RSTb MRB-UART_RTS/KBI1P7 MRB-UART_CTS/TPM2 MRB-PTD7/32M_OUT MRB-KBI1P1 MRB-KBI1P3 1 3 5 7 9 11 13 15 17 MRB-PTA0 MRB-PTA2/LCD_CTL0 MRB-PTA4/32K_OUT MRB-KBI1P5 MRB-KBI2P0 MRB-KBI2P2 MRB-PTD1/TPM1 MRB-PTD4/CMT 2 4 6 8 10 12 14 16 18 MRB-PTA1 MRB-PTA3/IRQb MRB-KBI1P4 MRB-KBI1P6 MRB-KBI2P1 MRB-KBI2P3 MRB-PTD3/TPM3 CON_2X9 CON_2X10 LED'S 33 24 4 17 20 26 C25 0.1UF TP13 UART_CTS TP31 EP AGND GND1 GND2 GND4 TEST 18 23 27 28 16 TXD RXD RTS# CTS# DTR# DSR# DCD# RI# CBUS0 CBUS1 CBUS2 CBUS3 CBUS4 2 USBDP NC1 NC2 NC3 NC4 NC5 2 USBDM 14 5 12 13 25 29 V_LED GPIO 20-PIN GPIO STANDARD HEADER C C SOCKETS FOR 1323X-MRB ASSEMBLY USB/UART TRANSCEIVER KEYBOARD MATRIX V_IRX P1 KBI1P0 KBI1P1 KBI1P2 KBI1P3 R33 330 UART_TXD KMD0 2 SW3 PB switch 1 3 4 2 3 4 2 UART_RXD SW4 PB switch 1 1 3 LED3 UART_RTS 4 2 Q3 3 2 SW2 PB switch 4 UART_CTS C53 2.2UF VCC SW1 PB switch 1 2 3 4 2 3 1 4 2 1 3 4 2 GND2 1 5 4 SW8 PB switch 1 1 SW7 PB switch 4 SW6 PB switch GND1 SW5 PB switch 3 LED1 IRRx GND3 OUT KMD1 P2 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 MRB-SPI_SS MRB-SPI_MOSI MRB-SPI_MISO MRB-UART_TXD MRB-SPI_CLK MRB-UART_RXD MRB-RSTb MRB-TPM0 MRB-UART_RTS/KBI1P7 MRB-I2C_SDA MRB-UART_CTS/TPM2 MRB-I2C_SCL MRB-PTA1 MRB-PTA0 MRB-PTA2/LCD_CTL0 MRB-PTD7/32M_OUT 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 KBI1P0 KBI1P1 KBI1P2 KBI1P3 KMD0 LED2 KMD1 LED4 IRRx HDR_2X16 TSOP85238TR 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 MRB-KBI1P0 MRB-KBI1P1 MRB-KBI1P2 MRB-KBI1P3 MRB-KBI1P4 MRB-KBI1P5 MRB-PTA3/IRQb MRB-KBI2P0 MRB-PTA4/32K_OUT MRB-KBI2P2 MRB-KBI1P6 MRB-KBI2P1 MRB-KBI2P3 MRB-PTD1/TPM1 MRB-PTD3/TPM3 MRB-PTD4/CMT HDR_2X16 P1 & P2: IO PIN MAPPING MUST USE SHUNTS TO ENABLE BOARD FUNCTIONALLITY. 3 B B INFRARED RECEIVER A A ICAP Classification: Drawing Title: FCP: X FIUO: ___ PUBI: ___ 1323X REMOTE EXTENDER MOTHERBOARD Page Title: INTERFACE 5 4 3 Figure 5-9. 1323x-REM Schematic (2 of 2) 2 Size C Document Number Date: Friday, October 02, 2009 Rev B SCH-26117 PDF: SPF-26117 Sheet 1 4 of 4 5-13 1323x Remote Extender Motherboard 1323x Development Hardware Reference Manual, Rev. 1.1 15 V_LED UART_TXD 1 DATA_P V_LED 1K 1 DATA_M R19 2 0 VCCIO VCC 1 R49 1 19 0.1UF 2 0 1 R48 1323x Remote Extender Motherboard Figure 5-10. 1323x-REM PCB Component Location (Top View) Figure 5-11. 1323x-REM PCB Test Points 1323x Development Hardware Reference Manual, Rev. 1.1 5-14 Freescale Semiconductor 1323x Remote Extender Motherboard Figure 5-12. 1323x-REM PCB Layout (Top View) Figure 5-13. 1323x-REM PCB Layout (Bottom View) 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 5-15 1323x Remote Extender Motherboard 5.3.1 1323x-REM Bill of Materials Table 5-4. Bill of Materials Item Qty. Reference Value Description Mfg. Name Part Number 1 4 BH1, BH2, BH3, 125 BH4 NON-PLATED MOUNTING HOLE 125 DRILL / 160 KEEPOUT NO PART TO ORDER 2 1 BT1 BATTERY HOLDER BATTERY HOLDER 2XAA TH KEYSTONE ELECTRONICS 2462 3 2 C23,C24 15PF CAP CER 15PF 50V 5% C0G KEMET 0402 C0402C150J5GAC 4 4 C25,C30,C33, C39 0.1UF CAP CER 0.1UF 16V 10% X7R 0402 GRM155R71C104KA88D 5 3 C32,C42,C43 10UF CAP CER 10UF 10V 10% X7R Murata 0805 GRM21BR71A106KE51L 6 1 C40 4.7uF CAP CER 4.7UF 10V 10% X5R 0603 TAIYO YUDEN LMK107BJ475KA-T 7 1 C41 0.01UF CAP CER 0.01UF 10V 20% X7R 0402 AVX 0402ZC103MAT2A 8 1 C53 2.2UF CAP CER 2.2UF 6.3V 20% X5R 0402 MURATA GRM155R60J225ME15D 9 6 D8,D9,D10,D11 MBR0520L DIODE SCH 0.5A 20V ,D12,D13 T1G SOD-123 10 3 FID1,FID2,FID3 FID FIDUCIAL 060 MIL PAD GENERIC W/120 SOLDERMASK AND 040 MIL PAD W/90 MIL SOLDERMASK NO PART TO ORDER FID-040 11 1 F1 0.5A FUSE FAST 0.5A 63V SMT 1206 LITTELFUSE 0437.500WR 12 1 J8 CON_2X1 0 CON 2X10 SKT TH 100MIL CTR 335H AU 104L SAMTEC SSW-110-01-G-D 13 1 J9 CON_2X9 CON 2X9 SKT TH 100MIL SP SAMTEC 335H AU 194L SSW-109-02-G-D 14 1 J14 HDR_1X2 HDR 1X2 TH 100MIL SP 375H TYCO AU ELECTRONICS 826629-2 15 1 J15 USB_TYP E_B CON 2X2 USB_TYPE_B SKT TYCO RA SHLD TH 2.5MM SP 453H ELECTRONICS AU 292304-2 16 4 LED1,LED2,LE D3,LED4 BLUE LED BLUE SGL 20MA SMT 0805 LITE ON LTST-C171TBKT-5A 17 1 LED5 RED LED RED CLEAR SGL 30MA SMT 0805 LITE ON LTST-C171KRKT MURATA ON MBR0520LT1G SEMICONDUCTOR 1323x Development Hardware Reference Manual, Rev. 1.1 5-16 Freescale Semiconductor 1323x Remote Extender Motherboard Table 5-4. Bill of Materials Item Qty. Reference Value Description Mfg. Name Part Number 18 1 L3 3.3uH IND PWR 3.3UH@100KHZ 3.3A 20% SMT VISHAY INTERTECHNOLO GY IHLP2020BZER3R3M01 19 1 L4 60OHM IND FER BEAD 60OHM@100MHZ 500MA -0603 MURATA BLM18PG600SN1_ 20 2 P1,P2 HDR_2X1 6 HDR 2X16 TH 100MIL CTR 330H AU 100L SAMTEC TSW-116-07-S-D 21 1 Q3 TSOP8523 TRAN PHOTO 0.45MA 5.5V 8TR 950NM SMT VISHAY INTERTECHNOLO GY TSOP85238TR 22 1 Q4 SI2305 VISHAY INTERTECHNOLO GY SI2305ADS-T1-GE3 23 4 R19,R20,R21,R 1K 22 RES MF 1.0K 1/16W 5% 0402 VISHAY INTERTECHNOLO GY CRCW04021K00JNED 24 4 R23,R24,R25,R 390 26 RES MF 390 OHM 1/16W 5% BOURNS 0402 CR0402-JW-391GLF 25 2 R33,R39 RES MF 330 OHM 1/16W 5% VISHAY 0402 INTERTECHNOLO GY CRCW0402330RJNED 26 6 R35,R36,R40,R 0 43,R48,R49 RES TF ZERO OHM 1/16W RC0402 CRCW04020000ZS 27 1 R38 4.7K RES MF 4.7K 1/16W 5% 0402 SMEC RC73L2Z472JTF 28 1 R41 10K RES MF 10K 1/16W 5% 0402 VISHAY INTERTECHNOLO GY CRCW040210K0JNED 29 1 R45 100 RES MF 100 OHM 1/16W 5% VISHAY 0402 INTERTECHNOLO GY CRCW0402100RJNED 30 1 R46 200K RES MF 200K 1/16W 5% 0402 YAGEO AMERICA RC0402JR-07200KL 31 1 R47 1.24M RES MF 1.24M 1/16W 1% 0402 VISHAY INTERTECHNOLO GY CRCW04021M24FKED 32 1 SL1 4PDT SWITCH SW 4PDT SLD TH RA 30V 100MA -- TYCO ELECTRONICS 1-1437575-1 33 8 SW1,SW2,SW3 PB switch ,SW4,SW5,SW 6,SW7,SW8 SW SMT 4.0MM FMS 0.1A MAX 16V MAX ROHS COMPLIANT BOURNS 7914J-1-000E 330 TRAN PMOS PWR 4.1A 8V SOT23 VISHAY INTERTECHNOLO GY 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 5-17 1323x Remote Extender Motherboard Table 5-4. Bill of Materials Item Qty. 34 15 Reference Value Description TP13,TP14,TP1 TPAD_040 TEST POINT PAD 40MIL DIA 5,TP16,TP19,T SMT, NO PART TO ORDER P20,TP21,TP23 ,TP24,TP25,TP 27,TP29,TP30, TP31,TP32 Mfg. Name NOTACOMPONEN T Part Number NOTACOMPONENT 35 1 U4 FT232RQ IC XCVR USB TO UART CTLR 3.3-5.25V QFN32 FUTURE TECH- FT232RQ NOLOGY DEVICES INTERNATIONAL LTD. 36 1 U8 TPS6300 IC LIN DCDC SYNC 3.3V 1 OUTPUT 1250-1800KHZ 1.8-5.5V QFN-10 TEXAS INSTRUMENTS TPS63001DRCT 1323x Development Hardware Reference Manual, Rev. 1.1 5-18 Freescale Semiconductor Chapter 6 PCB Manufacturing Specifications This chapter provides the specifications used to manufacture the 1323x Development hardware printed circuit boards (PCB) described in this manual. The 1323x Development hardware PCBs must comply with the following: • The PCB must comply with Perfag10/3C (http://www.perfag.dk/Uk/ukindex.htm) • The PCB manufacturer’s logo is required • The PCB production week and year code is required — The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder mask — The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without written permission from Freescale Semiconductor, Inc. • The required Underwriter’s Laboratory (UL) Flammability Rating — The level is 94V-0 (http://www.ul.com/plastics/flame.html) — The UL information must be stamped on the back of the PCB solder mask • • 6.1 NOTE A complete set of design files is available for the 1323x Development hardware at the Freescale web site (http:www.freescale.com/802154) under reference designs. It is recommended that this design or one of a number of other reference designs be used as a starting point for a custom application. The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual, (ZHDCRM) is also available at the same web site to provide additional design guidance. Single PCB Construction This section describes individual PCB construction details. • The MRB and RCM PCBs are four-layer, multi layer designs • The REM PCB is a two layer design • The PCBs contains no blind, buried, or micro vias • PCB data: — MRB Size: Approximately 51 x 51mm (2.01 x 2.01 inches) — RCM Size: Approximately 86 x 178 mm (3.4 x 7.0 inches) — REM Size: Approximately 79 x 79 mm (3.1 x 3.1 inches) 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 6-1 PCB Manufacturing Specifications — MRB, RCM and REM Final thickness (Cu/Cu): 0.34 mm (0.8 inches) +/- 10% (excluding solder mask) The following table defines some of the layers of the completed PCB. The artwork identification refers to the name of the layer in commonly used terms. Table 6-1. MRB Layer by Layer Overview Layer Artwork Identification File Name 1 Silkscreen Top SILK_TOP.art 2 Top Layer Metal TOP.art 3 Ground Layer GND.art 4 Power Layer PWR.art 5 Bottom Layer Metal BOTTOM.art 6 Silkscreen Bottom SILK_BOTTOM.art Table 6-2. RCM Layer by Layer Overview Layer Artwork Identification File Name 1 Silkscreen Top SILK_TOP.art 2 Top Layer Metal TOP.art 3 Ground Layer GND.art 4 Power Layer PWR.art 5 Bottom Layer Metal BOTTOM.art 6 Silkscreen Bottom SILK_BOTTOM.art Table 6-3. REM Layer by Layer Overview Layer Artwork Identification File Name 1 Silkscreen Top SILK_TOP.art 2 Top Layer Metal TOP.art 3 Bottom Layer Metal BOTTOM.art 4 Silkscreen Bottom SILK_BOTTOM.art The 1323x MRB contains high frequency 2.4 GHz RF circuitry. As a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical parameters. As a result, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing must not be changed; follow the stackup (see Figure 6-1) information is provided with the reference design. 1323x Development Hardware Reference Manual, Rev. 1.1 6-2 Freescale Semiconductor PCB Manufacturing Specifications Metal 1 Dielectric Metal 2 Dielectric Metal 3 Dielectric Metal 4 Figure 6-1. MRB PCB Stackup Cross-Section (Four Layer) • • 6.2 Solder mask is required Silk screen is required Panelization The panel size can be negotiated depending on production volume. 6.3 Materials The PCB composite materials must meet the following requirements: • Laminate - The base laminate material (laminate) must be FR4. If the laminate material were changed the RF electrical characteristics may change and degrade RF performance. • Copper Foil — Top and Bottom copper layers must be 1 oz. copper — Interior layers must be 1/2 oz. copper • Plating - All pad plating must be Hot Air Levelling (HAL) 6.4 Solder Mask The solder mask must meet the following requirements: • Solder mask type: Liquid Film Electra EMP110 or equivalent • Solder mask thickness: 10 – 30 µm 1323x Development Hardware Reference Manual, Rev. 1.1 Freescale Semiconductor 6-3 PCB Manufacturing Specifications 6.5 Silk Screen The silk screen must meet the following requirements: • Silkscreen color: White • Silkscreen must be applied after application of solder mask if solder mask is required • The silkscreen ink must not extend into any plated-thru-holes • The silk screen must be clipped back to the line of resistance 6.6 • • 6.7 Electrical PCB Testing All PCBs must be 100 percent tested for opens and shorts Impedance Measurement - An impedance measurement report is not mandatory Packaging Packaging for the PCBs must be the following requirements: • Finished PCBs must remain in panel • Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials. These materials can degrade solderability. 6.8 Hole Specification/Tool Table See the ncdrill-1-4.tap file included with the Gerber files and the FAB-23451.pdf file. 6.9 File Description Files included with the download include Design, Gerber and PDF files. Gerber files are RS-374x format. Not all files included with the Gerber files are for PCB manufacturing. PDF files included are: • FAB-2611x.pdf — Board fabrication drawing • GRB-2611x.pdf — Metal layers, solder mask, solder paste and silk screen • SPF-2611x.pdf — Schematic Design files are in Allegro format with OrCAD schematic capture. 1323x Development Hardware Reference Manual, Rev. 1.1 6-4 Freescale Semiconductor