2PA1576S

2PA1576 PNP general-purpose transistor Rev. 06 — 17 November 2009 Product data sheet 1. Product profile 1.1 General description PNP transistor in a SOT323 (SC-70) plastic package. The NPN complement is 2PC4081. 1.2 Features Low current (max. 150 mA) Low voltage (max. 50 V) Low collector capacitance (typ. 2.5 pF) 1.3 Applications General-purpose switching and amplification 2. Pinning information Table 1. Pin 1 2 3 Pinning Description base emitter collector 1 2 3 1 2 sym013 Simplified outline Symbol 3 3. Ordering information Table 2. Ordering information Package Name 2PA1576Q 2PA1576R 2PA1576S SC-70 Description plastic surface mounted package; 3 leads Version SOT323 Type number NXP Semiconductors 2PA1576 PNP general-purpose transistor 4. Marking Table 3. 2PA1576Q 2PA1576R 2PA1576S [1] * = -: made in Hong Kong * = t: made in Malaysia Marking codes Marking code[1] F*Q F*R F*S Type number 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCBO VCEO VEBO IC ICM IBM Ptot Tstg Tj Tamb [1] Conditions open emitter open base open collector Min - Max −60 −50 −6 −150 −200 −200 200 +150 150 +150 Unit V V V mA mA mA mW °C °C °C collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) peak collector current peak base current total power dissipation storage temperature junction temperature ambient temperature Tamb ≤ 25 °C [1] −65 −65 Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 5. Symbol Rth(j-a) [1] Thermal characteristics Parameter thermal resistance from junction to ambient Conditions [1] Min - Typ - Max 625 Unit K/W Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. 2PA1576_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 2 of 7 NXP Semiconductors 2PA1576 PNP general-purpose transistor 7. Characteristics Table 6. Characteristics Tamb = 25 °C unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current emitter-base cut-off current DC current gain 2PA1576Q 2PA1576R 2PA1576S VCEsat collector-emitter saturation voltage collector capacitance transition frequency IC = −50 mA; IB = −5 mA IE = ie = 0 A; VCB = −12 V; f = 1 MHz IC = −2 mA; VCE = −12 V; f = 100 MHz [1] Conditions IE = 0 A; VCB = −30 V IE = 0 A; VCB = −30 V; Tj = 150 °C IC = 0 A; VEB = −4 V IC = −1 mA; VCE = −6 V Min - Typ - Max −100 −5 −100 Unit nA μA nA IEBO hFE 120 180 270 - - 270 390 560 −500 mV Cc fT 100 2.5 - 3.5 - pF MHz [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. 2PA1576_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 3 of 7 NXP Semiconductors 2PA1576 PNP general-purpose transistor 8. Package outline Plastic surface-mounted package; 3 leads SOT323 D B E A X y HE vMA 3 Q A A1 c 1 e1 e bp 2 wM B Lp detail X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.4 0.3 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.23 0.13 v 0.2 w 0.2 OUTLINE VERSION SOT323 REFERENCES IEC JEDEC JEITA SC-70 EUROPEAN PROJECTION ISSUE DATE 04-11-04 06-03-16 Fig 1. 2PA1576_6 Package outline SOT323 (SC-70) © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 4 of 7 NXP Semiconductors 2PA1576 PNP general-purpose transistor 9. Revision history Table 7. Revision history Release date 20091117 Data sheet status Product data sheet Change notice Supersedes 2PA1576_5 Document ID 2PA1576_6 Modifications: • • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Figure 1 “Package outline SOT323 (SC-70)”: updated Product data sheet Product specification Objective specification n.a. 2PA1576_4 2PA1576_3 2PA1576_2 n.a. 2PA1576_5 2PA1576_4 2PA1576_3 2PA1576_2 20041124 19990531 19970328 19931213 2PA1576_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 5 of 7 NXP Semiconductors 2PA1576 PNP general-purpose transistor 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 2PA1576_6 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 06 — 17 November 2009 6 of 7 NXP Semiconductors 2PA1576 PNP general-purpose transistor 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 3 4 5 6 6 6 6 6 6 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 November 2009 Document identifier: 2PA1576_6