74ABT540N,602

INTEGRATED CIRCUITS 74ABT540 Octal buffer, inverting (3-State) Product specification Supersedes data of 1996 Oct 08 IC23 Data Handbook
     1998 Jan 16 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 FEATURES DESCRIPTION • Octal bus interface • 3-State buffers • Live insertion/extraction permitted • Efficient pinout to facilitate PC board layout • Output capability: +64mA/–32mA • Latch-up protection exceeds 500mA per Jedec JC40.2 Std 17 • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 The 74ABT540 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT540 device is an octal inverting buffer that is ideal for driving bus lines. The device features input and outputs on opposite sides of the package to facilitate printed circuit board layout. and 200 V per Machine Model • Power-up 3-State QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25°C; GND = 0V PARAMETER TYPICAL UNIT 3.1 ns tPLH tPHL Propagation delay An to Yn CL = 50pF; VCC = 5V CIN Input capacitance VI = 0V or VCC 3 pF COUT Output capacitance Outputs disabled; VO = 0V or VCC 7 pF ICCZ Total supply current Outputs disabled; VCC = 5.5V 50 µA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 20-Pin Plastic DIP –40°C to +85°C 74ABT540 N 74ABT540 N SOT146-1 20-Pin plastic SO –40°C to +85°C 74ABT540 D 74ABT540 D SOT163-1 20-Pin Plastic SSOP Type II –40°C to +85°C 74ABT540 DB 74ABT540 DB SOT339-1 20-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT540 PW 74ABT540PW DH SOT360-1 PIN CONFIGURATION LOGIC SYMBOL OE0 OE0 1 20 VCC A0 2 19 OE1 A1 3 18 Y0 A2 4 17 Y1 A3 5 16 Y2 A4 6 15 Y3 A5 7 14 Y4 A6 8 13 Y5 A7 9 12 Y6 11 Y7 OE1 1 19 2 18 3 17 4 16 5 15 6 14 Y0 A0 A1 GND 10 Y2 A2 Y3 A3 A4 Y4 7 13 8 12 9 11 A5 Y5 A6 A7 SA00197 1998 Jan 16 Y1 Y6 Y7 SA00198 2 853–1609 18864 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 LOGIC SYMBOL (IEEE/IEC) 1 PIN DESCRIPTION PIN NUMBER SYMBOL 2, 3, 4, 5, 6, 7, 8, 9 A0 – A7 Data inputs 18, 17, 16, 15, 14, 13, 12, 11 Y0 – Y7 Data outputs 1, 19 OE0, OE1 10 GND Ground (0V) 20 VCC Positive supply voltage & EN 19 2 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 NAME AND FUNCTION Output enables FUNCTION TABLE INPUTS SA00199 H L X Z OUTPUTS OE0 OE1 An Yn L L X H L L H X L H X X H L Z Z = High voltage level = Low voltage level = Don’t care = High impedance ”off” state ABSOLUTE MAXIMUM RATINGS1, 2 SYMBOL VCC PARAMETER CONDITIONS RATING UNIT –0.5 to +7.0 V –18 mA –1.2 to +7.0 V VO < 0 –50 mA DC supply voltage IIK DC input diode current VI DC input voltage3 IOK DC output diode current VI < 0 VOUT DC output voltage3 output in Off or High state –0.5 to +5.5 V IOUT DC output current output in Low state 128 mA Tstg Storage temperature range –65 to 150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Jan 16 3 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER LIMITS DC supply voltage UNIT Min Max 4.5 5.5 V 0 VCC V VI Input voltage VIH High-level input voltage VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA 0 10 ns/V –40 +85 °C 2.0 ∆t/∆v Input transition rise or fall rate Tamb Operating free-air temperature range V DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Min VIK VOH VOL Input clamp voltage High-level output voltage Tamb = –40°C to +85°C Tamb = +25°C VCC = 4.5V; IIK = –18mA Typ Max –0.9 –1.2 Min UNIT Max –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 µA Power-off leakage current VCC = 0.0V; VI or VO ≤ 4.5V ±5.0 ±100 ±100 µA Power-up/down 3-State output current3 VCC = 2.1V; VO = 0.5V; VI = GND or VCC; VOE = Don’t care ±5.0 ±50 ±50 µA IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA ICEX Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 mA Output current1 VCC = 5.5V; VO = 2.5V –100 –180 –180 mA VCC = 5.5V; Outputs High, VI = GND or VCC 50 250 250 µA VCC = 5.5V; Outputs Low, VI = GND or VCC 24 30 30 mA VCC = 5.5V; Outputs 3-State; VI = GND or VCC 50 250 250 µA Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA Outputs 3-State, one data input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 50 50 µA Outputs 3-State, one enable input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA II IOFF IPU/IPD IO ICCH ICCL Quiescent supply current ICCZ ∆ICC Additional supply current per input pin2 –50 –50 NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This parameter is valid for any VCC between 0V and 2.1V, with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a transition time of up to 100µsec is permitted. 1998 Jan 16 4 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 AC CHARACTERISTICS GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER Tamb = +25°C VCC = +5.0V WAVEFORM Tamb = –40°C to +85°C VCC = +5.0V ±0.5V Min Typ Max Min Max UNIT tPLH tPHL Propagation delay An to Yn 1 1.0 1.0 2.9 3.1 4.1 4.3 1.0 1.0 4.8 4.8 ns tPZH tPZL Output enable time to High and Low level 2 1.1 1.1 4.1 4.6 4.9 5.8 1.1 1.1 5.9 6.4 ns tPHZ tPLZ Output disable time from High and Low level 2 1.5 1.2 3.6 2.9 6.8 5.7 1.5 1.2 7.3 6.2 ns AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V OEn INPUT An INPUT tPHL VM tPLZ tPZL VM VM VM Yn OUTPUT tPLH VM VM VM Yn OUTPUT VOL + 0.3V tPHZ tPZH 3.5V VOL VOH Yn OUTPUT VOH – 0.3V VM 0V SA00200 SA00201 Waveform 1. Waveforms Showing the Input (An) to Output (Yn) Propagation Delays Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORMS 7V 500 Ω From Output Under Test S1 Open GND 500 Ω CL = 50 pF Load Circuit TEST S1 tpd open tPLZ/tPZL 7V tPHZ/tPZH open DEFINITIONS Load capacitance includes jig and probe capacitance; CL = see AC CHARACTERISTICS for value. SA00012 1998 Jan 16 5 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 DIP20: plastic dual in-line package; 20 leads (300 mil) 1998 Jan 16 6 SOT146-1 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 SO20: plastic small outline package; 20 leads; body width 7.5 mm 1998 Jan 16 7 SOT163-1 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm 1998 Jan 16 8 SOT339-1 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm 1998 Jan 16 9 SOT360-1 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.  Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. 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     yyyy mmm dd 10 Date of release: 05-96 9397-750-03471