74AHC1G125GW

74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state Rev. 09 — 22 June 2009 Product data sheet 1. General description 74AHC1G125 and 74AHCT1G125 are high-speed Si-gate CMOS devices. They provide one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A HIGH at OE causes the output to assume a high-impedance OFF-state. The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V. The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V. 2. Features I I I I I I Symmetrical output impedance High noise immunity Low power dissipation Balanced propagation delays Multiple package options ESD protection: N HBM JESD22-A114E: exceeds 2000 V N MM JESD22-A115-A: exceeds 200 V N CDM JESD22-C101C: exceeds 1000 V I Specified from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Package Temperature range 74AHC1G125GW 74AHCT1G125GW 74AHC1G125GV 74AHCT1G125GV 74AHC1G125GM 74AHCT1G125GM 74AHC1G125GF 74AHCT1G125GF −40 °C to +125 °C XSON6 −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no SOT886 leads; 6 terminals; body 1 × 1.45 × 0.5 mm plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1 × 0.5 mm SOT891 −40 °C to +125 °C SC-74A −40 °C to +125 °C Name TSSOP5 Description plastic thin shrink small outline package; 5 leads; body width 1.25 mm plastic surface-mounted package; 5 leads Version SOT353-1 SOT753 Type number NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state 4. Marking Table 2. Marking codes Marking[1] AM CM A25 C25 AM CM AM CM Type number 74AHC1G125GW 74AHCT1G125GW 74AHC1G125GV 74AHCT1G125GV 74AHC1G125GM 74AHCT1G125GM 74AHC1G125GF 74AHCT1G125GF [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 2 A Y 4 2 4 A 1 Y 1 OE mna118 EN mna119 OE mna120 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74AHC1G125 74AHCT1G125 74AHC1G125 74AHCT1G125 OE A 1 2 GND GND 3 001aaf101 OE 5 VCC 1 6 VCC OE A 74AHC1G125 74AHCT1G125 1 2 3 6 5 4 VCC n.c. Y A 2 5 n.c. 3 4 Y GND 4 Y 001aaj971 001aaj972 Transparent top view Transparent top view Fig 4. Pin configuration SOT353-1 and SOT753 Fig 5. Pin configuration SOT886 Fig 6. Pin configuration SOT891 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 2 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state 6.2 Pin description Table 3. Symbol OE A GND Y n.c. VCC Pin description Pin SOT353-1/SOT753 1 2 3 4 5 SOT886/SOT891 1 2 3 4 5 6 output enable input data input ground (0 V) data output not connected supply voltage Description 7. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state Inputs OE L L H A L H X Output Y L H Z 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC VI IIK IOK IO ICC IGND Tstg Ptot [1] [2] Parameter supply voltage input voltage input clamping current output clamping current output current supply current ground current storage temperature total power dissipation Conditions Min −0.5 −0.5 Max +7.0 +7.0 ±20 ±25 75 +150 250 Unit V V mA mA mA mA mA °C mW VI < −0.5 V VO < −0.5 V or VO > VCC + 0.5 V −0.5 V < VO < VCC + 0.5 V [1] [1] −20 −75 −65 Tamb = −40 °C to +125 °C [2] - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K. 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 3 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC VI VO Tamb ∆t/∆V supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Conditions Min 2.0 0 0 −40 74AHC1G125 Typ 5.0 +25 Max 5.5 5.5 VCC +125 100 20 74AHCT1G125 Min 4.5 0 0 −40 Typ 5.0 +25 Max 5.5 5.5 VCC +125 20 V V V °C ns/V ns/V Unit 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 74AHC1G125 VIH HIGH-level input voltage VCC = 2.0 V VCC = 3.0 V VCC = 5.5 V VIL LOW-level input voltage VCC = 2.0 V VCC = 3.0 V VCC = 5.5 V VOH HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V IO = −50 µA; VCC = 3.0 V IO = −50 µA; VCC = 4.5 V IO = −4.0 mA; VCC = 3.0 V IO = −8.0 mA; VCC = 4.5 V VOL LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V IO = 50 µA; VCC = 3.0 V IO = 50 µA; VCC = 4.5 V IO = 4.0 mA; VCC = 3.0 V IO = 8.0 mA; VCC = 4.5 V IOZ II ICC OFF-state VI = VCC or GND; output current VCC = 5.5 V input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V 1.5 2.1 3.85 1.9 2.9 4.4 2.58 3.94 2.0 3.0 4.5 0 0 0 0.5 0.9 1.65 0.1 0.1 0.1 0.36 0.36 0.25 0.1 1.0 1.5 2.1 3.85 1.9 2.9 4.4 2.48 3.8 0.5 0.9 1.65 0.1 0.1 0.1 0.44 0.44 2.5 1.0 10 1.5 2.1 3.85 1.9 2.9 4.4 2.40 3.70 0.5 0.9 1.65 0.1 0.1 0.1 0.55 0.55 10 2.0 40 V V V V V V V V V V V V V V V V µA µA µA Conditions Min 25 °C Typ Max −40 °C to +85 °C −40 °C to +125 °C Unit Min Max Min Max supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 4 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol Parameter CI input capacitance HIGH-level input voltage LOW-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V Conditions Min 25 °C Typ 1.5 Max 10 −40 °C to +85 °C −40 °C to +125 °C Unit Min Max 10 Min Max 10 pF 74AHCT1G125 VIH VIL VOH 2.0 0.8 2.0 0.8 2.0 0.8 V V HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −50 µA IO = −8.0 mA LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 µA IO = 8.0 mA OFF-state VI = VCC or GND; output current VCC = 5.5 V input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V 4.4 3.94 - 4.5 0 - 0.1 0.36 0.25 0.1 1.0 1.35 4.4 3.8 - 0.1 0.44 2.5 1.0 10 1.5 4.4 3.70 - 0.1 0.55 10 2.0 40 1.5 V V V V µA µA µA mA VOL IOZ II ICC ∆ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V input capacitance CI - 1.5 10 - 10 - 10 pF 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; For test circuit see Figure 9. Symbol Parameter 74AHC1G125 tpd propagation delay A to Y; see Figure 7 VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF [3] [1] [2] Conditions Min 25 °C Typ Max −40 °C to +85 °C −40 °C to +125 °C Unit Min Max Min Max - 4.7 6.6 3.4 4.8 8.0 11.5 5.5 7.5 1.0 1.0 1.0 1.0 9.5 13.0 6.5 8.5 1.0 1.0 1.0 1.0 11.5 14.5 7.0 9.5 ns ns ns ns 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 5 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state Table 8. Dynamic characteristics …continued GND = 0 V; For test circuit see Figure 9. Symbol Parameter ten enable time Conditions Min OE to Y; see Figure 8 VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF tdis disable time OE to Y; see Figure 8 VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF CPD power per buffer; dissipation CL = 50 pF; f = 1 MHz; capacitance VI = GND to VCC propagation delay A to Y; see Figure 7 VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF ten enable time OE to Y; see Figure 8 VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF tdis disable time OE to Y; see Figure 8 VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF [1] [3] [1] [3] [4] [3] [1] [2] [3] [1] [2] 25 °C Typ Max −40 °C to +85 °C −40 °C to +125 °C Unit Min Max Min Max - 5.0 6.9 3.6 4.9 8.0 11.5 5.1 7.5 1.0 1.0 1.0 1.0 9.5 13.0 6.0 8.5 1.0 1.0 1.0 1.0 11.5 14.5 6.5 9.5 ns ns ns ns - 6.0 8.3 4.1 5.7 9 9.7 13.2 6.8 8.8 - 1.0 1.0 1.0 1.0 - 11.5 15.0 8.0 10.0 - 1.0 1.0 1.0 1.0 - 12.5 16.5 8.5 11.0 - ns ns ns ns pF 74AHCT1G125 tpd [1] [3] - 3.4 4.8 5.5 7.5 1.0 1.0 6.5 8.5 1.0 1.0 7.0 9.5 ns ns - 3.9 5.1 5.1 7.5 1.0 1.0 6.0 8.5 1.0 1.0 6.5 9.5 ns ns - 4.5 6.1 6.8 8.8 1.0 1.0 8.0 10.0 1.0 1.0 8.5 11.0 ns ns 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 6 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state Table 8. Dynamic characteristics …continued GND = 0 V; For test circuit see Figure 9. Symbol Parameter CPD Conditions Min per buffer; power CL = 50 pF; f = 1 MHz; dissipation capacitance VI = GND to VCC tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. Typical values are measured at VCC = 3.3 V. Typical values are measured at VCC = 5.0 V. CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. [4] 25 °C Typ 11 Max - −40 °C to +85 °C −40 °C to +125 °C Unit Min Max Min Max pF [1] [2] [3] [4] 12. Waveforms VI A input GND t PHL VOH Y output VOL VM mnb153 VM t PLH Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig 7. Input (A) to output (Y) propagation delays 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 7 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state VI OE input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled mna644 VM tPZL VM VX tPZH VY VM Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output load. Fig 8. Table 9. Type Enable and disable times Measurement point Inputs VI VM 0.5VCC 1.5 V GND to VCC GND to 3.0 V Output VM 0.5VCC 0.5VCC VX VOL + 0.3 V VOL + 0.3 V VY VOH − 0.3 V VOH − 0.3 V 74AHC1G125 74AHCT1G125 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 8 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state VI negative pulse 0V tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VM VM VI positive pulse 0V VCC VCC G VI VO RL S1 DUT RT CL open 001aad983 Test data is given in Table 10. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 9. Table 10. Type Test circuit for measuring switching times Test data Input VI tr, tf ≤ 3 ns ≤ 3 ns VCC 3V Load CL 15 pF, 50 pF 15 pF, 50 pF RL 1 kΩ 1 kΩ S1 position tPHL, tPLH open open tPZH, tPHZ GND GND tPZL, tPLZ VCC VCC 74AHC1G125 74AHCT1G125 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 9 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 D E A X c y HE vMA Z 5 4 A2 A1 (A3) θ A 1 e e1 bp 3 wM detail X Lp L 0 1.5 scale 3 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.1 0 A2 1.0 0.8 A3 0.15 bp 0.30 0.15 c 0.25 0.08 D(1) 2.25 1.85 E(1) 1.35 1.15 e 0.65 e1 1.3 HE 2.25 2.0 L 0.425 Lp 0.46 0.21 v 0.3 w 0.1 y 0.1 Z(1) 0.60 0.15 θ 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC MO-203 JEITA SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 10. Package outline SOT353-1 (TSSOP5) 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 10 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state Plastic surface-mounted package; 5 leads SOT753 D B E A X y HE vMA 5 4 Q A A1 c 1 2 3 detail X Lp e bp wM B 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.100 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT753 REFERENCES IEC JEDEC JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 11. Package outline SOT753 (SC-74A) 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 11 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× L1 L (2) e 6 e1 5 e1 4 6× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Fig 12. Package outline SOT886 (XSON6) 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 12 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm SOT891 1 2 b 3 4× (1) L1 e L 6 e1 5 e1 4 6× (1) A A1 D E terminal 1 index area 0 1 scale DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 max 0.04 b 0.20 0.12 D 1.05 0.95 E 1.05 0.95 e 0.55 e1 0.35 L 0.35 0.27 L1 0.40 0.32 2 mm Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION SOT891 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 Fig 13. Package outline SOT891 (XSON6) 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 13 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state 14. Abbreviations Table 11. Acronym CMOS CDM DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Charged Device Model Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 15. Revision history Table 12. Revision history Release date 20090622 Data sheet status Product data sheet Product data sheet Product data sheet Product specification Product specification Product specification Product specification Preliminary specification Preliminary specification Change notice Supersedes 74AHC_AHCT1G125_8 74AHC_AHCT1G125_7 74AHC_AHCT1G125_6 74AHC_AHCT1G125_5 74AHC_AHCT1G125_4 74AHC_AHCT1G125_3 74AHC_AHCT1G125_N_2 74AHC_AHCT1G125_N_1 Document ID 74AHC_AHCT1G125_9 Modifications: 74AHC_AHCT1G125_8 Modifications: 74AHC_AHCT1G125_7 74AHC_AHCT1G125_6 74AHC_AHCT1G125_5 74AHC_AHCT1G125_4 74AHC_AHCT1G125_3 74AHC_AHCT1G125_N_2 74AHC_AHCT1G125_N_1 • • Updated features with multiple package option in Section 2. Package SOT886 and SOT891 added in Section 3, Section 4 and Section 13. 20090409 20070707 20020606 20020322 20010222 19990615 19981207 19981125 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 14 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74AHC_AHCT1G125_9 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 09 — 22 June 2009 15 of 16 NXP Semiconductors 74AHC1G125; 74AHCT1G125 Bus buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 June 2009 Document identifier: 74AHC_AHCT1G125_9