74AHC74; 74AHCT74
Dual D-type flip-flop with set and reset; positive-edge trigger
Rev. 7 — 21 April 2015
Product data sheet
1. General description
The 74AHC74; 74AHCT74 is a high-speed Si-gate CMOS device and is pin compatible
with Low-Power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard
No. 7-A.
The 74AHC74; 74AHCT74 is a dual positive-edge triggered, D-type flip-flop with individual
data inputs (D), clock inputs (CP), set inputs (SD) and reset inputs (RD). It also has
complementary outputs (Q and Q).
The set and reset are asynchronous active LOW inputs that operate independent of the
clock input. Information on the data input is transferred to the Q output on the LOW to
HIGH transition of the clock pulse. The data inputs must be stable one set-up time prior to
the LOW to HIGH clock transition for predictable operation.
Schmitt-trigger action in the clock input makes the circuit highly tolerant to slower clock
rise and fall times.
2. Features and benefits
Balanced propagation delays
All inputs have Schmitt-trigger actions
Inputs accept voltages higher than VCC
Input levels:
For 74AHC74: CMOS level
For 74AHCT74: TTL level
ESD protection:
HBM EIA/JESD22-A114E exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V
CDM EIA/JESD22-C101C exceeds 1000 V
Multiple package options
Specified from 40 C to +85 C and from 40 C to +125 C
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74AHC74D
40 C to +125 C
SO14
plastic small outline package; 14 leads; body width
3.9 mm
SOT108-1
74AHC74PW
40 C to +125 C
TSSOP14
plastic thin shrink small outline package; 14 leads; body
width 4.4 mm
SOT402-1
74AHC74BQ
40 C to +125 C
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5 3 0.85 mm
SOT762-1
74AHCT74D
40 C to +125 C
SO14
plastic small outline package; 14 leads; body width
3.9 mm
SOT108-1
74AHCT74PW
40 C to +125 C
TSSOP14
plastic thin shrink small outline package; 14 leads; body
width 4.4 mm
SOT402-1
74AHCT74BQ
40 C to +125 C
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5 3 0.85 mm
74AHC74
74AHCT74
SOT762-1
4. Functional diagram
4 10
1SD 2SD
2
12
3
11
SD
1Q
1D
Q
D
2D
2Q
1CP
CP
2CP
FF
1Q
Q
2Q
RD
5
9
6
8
1RD 2RD
1 13
Fig 1.
mna418
Functional diagram
74AHC_AHCT74
Product data sheet
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Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
4
2
3
1SD
1D
1CP
SD
Q
D
1Q
5
CP
FF
Q
1Q
6
RD
1
10
12
11
4
1RD
3
2SD
2
1
2D
2CP
SD
Q
D
2Q
9
10
CP
11
FF
Q
2Q
12
8
13
RD
13
Fig 2.
2RD
S
5
C1
1D
6
R
S
9
C1
1D
8
R
mna420
mna419
Logic symbol
Fig 3.
IEC logic symbol
Q
C
C
C
C
C
C
D
Q
C
C
RD
SD
CP
mna421
C
C
Fig 4.
Logic diagram (one flip-flop)
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
5. Pinning information
1
terminal 1
index area
14 VDD
1RD
5.1 Pinning
1D
2
13 2RD
1RD
1
14 VCC
1CP
3
12 2D
1D
2
13 2RD
1SD
4
74
11 2CP
1CP
3
12 2D
1Q
5
4
GND(1)
10 2SD
1SD
1Q
6
10 2SD
1Q
6
9
2Q
GND
7
8
2Q
9
8
5
2Q
1Q
7
11 2CP
GND
74
2Q
001aac450
Transparent top view
001aac449
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 5.
Pin configuration SO14 and TSSOP14
Fig 6.
Pin configuration DHVQFN14
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
1RD
1
asynchronous reset direct input (active LOW)
1D
2
data input
1CP
3
clock input (LOW to HIGH, edge-triggered)
1SD
4
asynchronous set direct input (active LOW)
1Q
5
true flip-flop output
1Q
6
complement flip-flop output
GND
7
ground (0 V)
2Q
8
complement flip-flop output
2Q
9
true flip-flop output
2SD
10
asynchronous set direct input (active LOW)
2CP
11
clock input (LOW to HIGH, edge-triggered)
2D
12
data input
2RD
13
asynchronous reset direct input (active LOW)
VCC
14
supply voltage
74AHC_AHCT74
Product data sheet
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Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
4 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
6. Functional description
Table 3.
Function table[1]
Control
Input
Output
nSD
nRD
nCP
nD
nQ
nQ
nQn+1
nQn+1
L
H
X
X
H
L
-
-
H
L
X
X
L
H
-
-
L
L
X
X
H
H
-
-
H
H
L
-
-
L
H
H
H
H
-
-
H
L
[1]
H = HIGH voltage level;
L = LOW voltage level;
= LOW to HIGH transition;
Qn+1 = state after the next LOW to HIGH CP transition;
X = don’t care.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
Conditions
input clamping current
VI < 0.5 V
[1]
IOK
output clamping current
VO < 0.5 V or VO > VCC + 0.5 V
[1]
IO
output current
VO = 0.5 V to (VCC + 0.5 V)
ICC
IIK
Min
Max
Unit
0.5
+7.0
V
0.5
+7.0
V
20
-
mA
20
+20
mA
25
+25
mA
supply current
-
+75
mA
IGND
ground current
75
-
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
500
mW
Tamb = 40 C to +125 C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For SO14 packages: above 70 C the value of Ptot derates linearly at 8 mW/K.
For TSSOP14 packages: above 60 C the value of Ptot derates linearly at 5.5 mW/K.
For DHVQFN14 packages: above 60 C the value of Ptot derates linearly at 4.5 mW/K.
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
5 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
8. Recommended operating conditions
Table 5.
Operating conditions
Symbol Parameter
Conditions
Min
Typ
Max
Unit
2.0
5.0
5.5
V
74AHC74
VCC
supply voltage
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
40
+25
+125
C
t/V
input transition rise and fall rate
VCC = 3.0 V to 3.6 V
-
-
100
ns/V
VCC = 4.5 V to 5.5 V
-
-
20
ns/V
74AHCT74
VCC
supply voltage
4.5
5.0
5.5
V
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
40
+25
+125
C
t/V
input transition rise and fall rate
-
-
20
ns/V
VCC = 4.5 V to 5.5 V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
74AHC74
VIH
VIL
VOH
VOL
HIGH-level
input voltage
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 5.5 V
3.85
-
-
3.85
-
3.85
-
V
LOW-level
input voltage
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 5.5 V
-
-
1.65
-
1.65
-
1.65
V
HIGH-level
VI = VIH or VIL
output voltage
IO = 50 A; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = 50 A; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = 50 A; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = 4.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = 8.0 mA; VCC = 4.5 V
3.94
-
-
3.80
-
3.70
-
V
LOW-level
VI = VIH or VIL
output voltage
IO = 50 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
6 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
-
-
0.1
-
1.0
-
2.0
A
II
input leakage
current
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
2.0
-
20
-
40
A
CI
input
capacitance
-
3
10
-
10
-
10
pF
VI = VCC or GND
74AHCT74
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 50 A
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.80
-
3.70
-
V
-
0
0.1
-
0.1
-
0.1
V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
A
IO = 8.0 mA
VOL
LOW-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 50 A
IO = 8.0 mA
II
input leakage
current
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
2.0
-
20
-
40
A
ICC
additional
per input pin;
supply current VI = VCC 2.1 V; other pins
at VCC or GND; IO = 0 A;
VCC = 4.5 V to 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
3
10
-
10
-
10
pF
74AHC_AHCT74
Product data sheet
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
VI = VCC or GND
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
7 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 9.
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
Min
Max
CL = 15 pF
-
5.2
11.9
1.0
14.0
1.0
15.0
ns
CL = 50 pF
-
7.4
15.4
1.0
17.5
1.0
19.5
ns
CL = 15 pF
-
3.7
7.3
1.0
8.5
1.0
9.5
ns
CL = 50 pF
-
5.2
9.3
1.0
10.5
1.0
12.0
ns
CL = 15 pF
-
5.4
12.3
1.0
14.5
1.0
15.5
ns
CL = 50 pF
-
7.7
15.8
1.0
18.0
1.0
20.0
ns
CL = 15 pF
-
3.7
7.7
1.0
9.0
1.0
10.0
ns
CL = 50 pF
-
5.3
9.7
1.0
11.0
1.0
12.5
ns
CL = 15 pF
80
125
-
70
-
70
-
MHz
CL = 50 pF
50
75
-
45
-
45
-
MHz
CL = 15 pF
130
170
-
110
-
110
-
MHz
CL = 50 pF
90
115
-
75
-
75
-
MHz
VCC = 3.0 V to 3.6 V
6.0
-
-
7.0
-
7.0
-
ns
VCC = 4.5 V to 5.5 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 3.0 V to 3.6 V
6.0
-
-
7.0
-
7.0
-
ns
VCC = 4.5 V to 5.5 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 3.0 V to 3.6 V
0.5
-
-
0.5
-
0.5
-
ns
VCC = 4.5 V to 5.5 V
0.5
-
-
0.5
-
0.5
-
ns
VCC = 3.0 V to 3.6 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 4.5 V to 5.5 V
3.0
-
-
3.0
-
3.0
-
ns
74AHC74
tpd
propagation nCP to nQ, nQ; see Figure 7
delay
VCC = 3.0 V to 3.6 V
[2]
VCC = 4.5 V to 5.5 V
nSD, nRD to nQ, nQ;
see Figure 8
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
fmax
maximum
frequency
see Figure 7
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
tW
tsu
th
trec
pulse width
set-up time
hold time
recovery
time
74AHC_AHCT74
Product data sheet
CP HIGH or LOW;
nSD, nRD LOW;
see Figure 7 and 8
nD to nCP; see Figure 7
nD to nCP; see Figure 7
nRD to nCP; see Figure 8
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
8 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 9.
Symbol Parameter
CPD
25 C
Conditions
power
fi = 1 MHz; VI = GND to VCC
dissipation
capacitance
[3]
40 C to +85 C 40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
Min
Max
-
12
-
-
-
-
-
-
3.3
7.8
1.0
9.0
1.0
10.0
ns
-
4.8
8.8
1.0
10.0
1.0
11.0
ns
pF
74AHCT74; VCC = 4.5 V to 5.5 V
propagation nCP to nQ, nQ; see Figure 7
delay
CL = 15 pF
tpd
[2]
CL = 50 pF
nSD, nRD to nQ, nQ;
see Figure 7
CL = 15 pF
-
3.7
10.4
1.0
12.0
1.0
13.0
ns
CL = 50 pF
-
5.3
11.4
1.0
13.0
1.0
14.5
ns
100
160
-
80
-
80
-
MHz
maximum
frequency
see Figure 7
80
140
-
65
-
65
-
MHz
tW
pulse width
CP HIGH or LOW;
nSD, nRD LOW;
see Figure 7 and 8
5.0
-
-
5.0
-
5.0
-
ns
tsu
set-up time
nD to nCP; see Figure 7
5.0
-
-
5.0
-
5.0
-
ns
th
hold time
nD to nCP; see Figure 7
0
-
-
0
-
0
-
ns
trec
recovery
time
nRD to nCP; see Figure 8
3.5
-
-
3.5
-
3.5
-
ns
CPD
power
fi = 1 MHz; VI = GND to VCC
dissipation
capacitance
-
16
-
-
-
-
-
pF
fmax
CL = 15 pF
CL = 50 pF
[3]
[1]
Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).
[2]
tpd is the same as tPLH and tPHL.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of the outputs.
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
9 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
11. Waveforms
VI
VM
nD input
GND
th
th
t su
t su
1/fmax
VI
VM
nCP input
GND
tW
t PHL
t PLH
VOH
VM
nQ output
VOL
VOH
nQ output
VM
VOL
t PLH
t PHL
mna422
Measurement points are given in Table 8.
The shaded areas indicate when the input is permitted to change for predictable output performance.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7.
Clock pulse width, maximum frequency, set-up times, hold times and input to output propagation delays
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
10 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
VI
VM
nCP input
GND
t rec
VI
VM
nSD input
GND
tW
tW
VI
VM
nRD input
GND
t PLH
t PHL
VOH
nQ output
VM
VOL
VOH
VM
nQ output
VOL
t PHL
t PLH
mna423
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8.
Set and reset pulse widths, recovery time and input to output propagation delays
Table 8.
Measurement points
Type
Input
Output
VM
VM
74AHC74
0.5 VCC
0.5 VCC
74AHCT74
1.5 V
0.5 VCC
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
11 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
VI
negative
pulse
tW
90 %
VM
VM
10 %
GND
tr
tf
tr
VI
positive
pulse
GND
tf
90 %
VM
VM
10 %
tW
VCC
G
VI
VO
DUT
RT
CL
001aah768
For test data, see Table 9.
Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
Fig 9.
Load circuitry for switching times
Table 9.
Test data
Type
Input
Load
Test
VI
tr, tf
CL
74AHC74
VCC
3.0 ns
50 pF, 15 pF
tPLH, tPHL
74AHCT74
3.0 V
3.0 ns
50 pF, 15 pF
tPLH, tPHL
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
12 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
12. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT108-1 (SO14)
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
13 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 11. Package outline SOT402-1 (TSSOP14)
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
14 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT762-1
14 terminals; body 2.5 x 3 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
6
y
y1 C
v M C A B
w M C
b
L
1
7
Eh
e
14
8
13
9
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
c
D (1)
Dh
E (1)
Eh
0.2
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
2
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT762-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 12. Package outline SOT762-1 (DHVQFN14)
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
15 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
13. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
LSTTL
Low-power Schottky Transistor-Transistor Logic
MM
Machine Model
14. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74AHC_AHCT74 v.7
20150421
Product data sheet
-
74AHC_AHCT74 v.6
Modifications:
74AHC_AHCT74 v.6
Modifications:
74AHC_AHCT74 v.5
Modifications:
•
Table 7: minimum fmax values at 3.0 V to 3.6 V for 74AHC74 corrected (errata).
20141020
•
Product data sheet
-
74AHC_AHCT74 v.5
-
74AHC_AHCT74 v.4
Table 3 corrected (errata).
20080609
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Table 6: the conditions for input leakage current have been changed.
74AHC_AHCT74 v.4
20050207
Product data sheet
-
74AHC_AHCT74 v.3
74AHC_AHCT74 v.3
20040429
Product specification
-
74AHC_AHCT74 v.2
74AHC_AHCT74 v.2
19990923
Product specification
-
74AHC_AHCT74 v.1
74AHC_AHCT74 v.1
19990805
Product specification
-
-
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
16 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74AHC_AHCT74
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
17 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74AHC_AHCT74
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 21 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
18 of 19
74AHC74; 74AHCT74
NXP Semiconductors
Dual D-type flip-flop with set and reset; positive-edge trigger
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 April 2015
Document identifier: 74AHC_AHCT74