74AUP1G373

74AUP1G373 Low-power D-type transparent latch; 3-state Rev. 03 — 9 January 2008 Product data sheet 1. General description The 74AUP1G373 provides the single D-type transparent latch with 3-state output. While the latch-enable (LE) input is high, the Q output follows the data (D) input. When pin LE is LOW, the latch stores the information that was present at the D-input one set-up time preceding the HIGH-to-LOW transition of pin LE. When pin OE is LOW, the contents of the latch is available at the (Q) output. When pin OE is HIGH, the output goes to the high-impedance OFF-state. Operation of input pin OE does not affect the state of the latch. Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features s Wide supply voltage range from 0.8 V to 3.6 V s High noise immunity s Complies with JEDEC standards: x JESD8-12 (0.8 V to 1.3 V) x JESD8-11 (0.9 V to 1.65 V) x JESD8-7 (1.2 V to 1.95 V) x JESD8-5 (1.8 V to 2.7 V) x JESD8-B (2.7 V to 3.6 V) s ESD protection: x HBM JESD22-A114E Class 3A exceeds 5000 V x MM JESD22-A115-A exceeds 200 V x CDM JESD22-C101-C exceeds 1000 V s Low static power consumption; ICC = 0.9 µA (maximum) s Latch-up performance exceeds 100 mA per JESD 78 Class II s Inputs accept voltages up to 3.6 V s Low noise overshoot and undershoot < 10 % of VCC s IOFF circuitry provides partial Power-down mode operation s Multiple package options s Specified from −40 °C to +85 °C and −40 °C to +125 °C NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state 3. Ordering information Table 1. Ordering information Package Temperature range Name 74AUP1G373GW 74AUP1G373GM 74AUP1G373GF −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C SC-88 XSON6 XSON6 Description plastic surface-mounted package; 6 leads Version SOT363 Type number plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 × 1.45 × 0.5 mm plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 × 1 × 0.5 mm 4. Marking Table 2. Marking Marking code aW aW aW Type number 74AUP1G373GW 74AUP1G373GM 74AUP1G373GF 5. Functional diagram D D Q Q 3 D Q 4 1 C1 4 EN 001aae248 LE LE 1 LE OE 001aae247 3 6 LE 6 OE 001aae249 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 2 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state 6. Pinning information 6.1 Pinning 74AUP1G373 74AUP1G373 LE GND 1 2 6 5 OE GND VCC D D 3 001aae250 LE 1 6 OE LE GND 74AUP1G373 1 2 3 6 5 4 OE VCC Q 2 5 VCC 3 4 Q D 4 Q 001aae251 001aae252 Transparent top view Transparent top view Fig 4. Pin configuration SOT363 (SC-88) Fig 5. Pin configuration SOT886 (XSON6) Fig 6. Pin configuration SOT891 (XSON6) 6.2 Pin description Table 3. Symbol LE GND D Q VCC OE Pin description Pin 1 2 3 4 5 6 Description latch enable input (active HIGH) ground (0 V) data input latch output supply voltage output enable input (active LOW) 7. Functional description Table 4. Function table[1] Input OE Enable and read register (transparent mode) Latch and read register Latch register and disable outputs [1] Operating modes Internal latch LE H H L L X D L H l h X L H L H X Output Q L H L H Z L L L L H H = HIGH voltage level; h = HIGH voltage level one setup time prior to the HIGH-to-LOW LE transition; L = LOW voltage level; l = LOW voltage level one setup time prior to the HIGH-to-LOW LE transition; X = Don’t care; Z = high-impedance OFF-state. 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 3 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IO ICC IGND Tstg Ptot [1] [2] Parameter supply voltage input clamping current input voltage output clamping current output voltage output current supply current ground current storage temperature total power dissipation Conditions VI < 0 V [1] Min −0.5 −50 −0.5 [1] Max +4.6 +4.6 ±50 +4.6 ±20 50 +150 250 Unit V mA V mA V mA mA mA °C mW VO > VCC or VO < 0 V Active mode and Power-down mode VO = 0 V to VCC −0.5 −50 −65 Tamb = −40 °C to +125 °C [2] - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For SC-88 packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K. 9. Recommended operating conditions Table 6. Symbol VCC VI VO Tamb ∆t/∆V Recommended operating conditions Parameter supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 0.8 V to 3.6 V Active mode Power-down mode; VCC = 0 V Conditions Min 0.8 0 0 0 −40 Max 3.6 3.6 VCC 3.6 +125 200 Unit V V V V °C ns/V 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = 25 °C VIH HIGH-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VIL LOW-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V 74AUP1G373_3 Conditions Min Typ Max - Unit V V V V 0.70 × VCC 0.65 × VCC 1.6 2.0 - 0.30 × VCC V 0.35 × VCC V 0.7 0.9 V V 4 of 22 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOH HIGH-level output voltage Conditions VI = VIH or VIL IO = −20 µA; VCC = 0.8 V to 3.6 V IO = −1.1 mA; VCC = 1.1 V IO = −1.7 mA; VCC = 1.4 V IO = −1.9 mA; VCC = 1.65 V IO = −2.3 mA; VCC = 2.3 V IO = −3.1 mA; VCC = 2.3 V IO = −2.7 mA; VCC = 3.0 V IO = −4.0 mA; VCC = 3.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V II IOZ IOFF ∆IOFF ICC ∆ICC CI CO input leakage current OFF-state output current power-off leakage current additional power-off leakage current supply current additional supply current input capacitance output capacitance VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI = VIH or VIL; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V VCC = 0 V to 3.6 V; VI = GND or VCC output enabled; VO = GND; VCC = 0 V output disabled; VCC = 0 V to 3.6 V; VO = GND or VCC Tamb = −40 °C to +85 °C VIH HIGH-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VIL LOW-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V 74AUP1G373_3 Min VCC − 0.1 1.11 1.32 2.05 1.9 2.72 2.6 [1] Typ 0.8 1.7 1.5 Max 0.1 0.3 × VCC 0.31 0.31 0.31 0.44 0.31 0.44 ±0.1 ±0.1 ±0.2 ±0.2 0.5 40 - Unit V V V V V V V V V V V V V V V V µA µA µA µA µA µA pF pF pF 0.75 × VCC - - 0.70 × VCC 0.65 × VCC 1.6 2.0 - - V V V V 0.30 × VCC V 0.35 × VCC V 0.7 0.9 V V © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 5 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOH HIGH-level output voltage Conditions VI = VIH or VIL IO = −20 µA; VCC = 0.8 V to 3.6 V IO = −1.1 mA; VCC = 1.1 V IO = −1.7 mA; VCC = 1.4 V IO = −1.9 mA; VCC = 1.65 V IO = −2.3 mA; VCC = 2.3 V IO = −3.1 mA; VCC = 2.3 V IO = −2.7 mA; VCC = 3.0 V IO = −4.0 mA; VCC = 3.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V II IOZ IOFF ∆IOFF ICC ∆ICC input leakage current OFF-state output current power-off leakage current additional power-off leakage current supply current additional supply current VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI = VIH or VIL; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VIL LOW-level input voltage VCC = 0.8 V VCC = 0.9 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [1] Min VCC − 0.1 0.7 × VCC 1.03 1.30 1.97 1.85 2.67 2.55 - Typ - Max 0.1 0.3 × VCC 0.37 0.35 0.33 0.45 0.33 0.45 ±0.5 ±0.5 ±0.5 ±0.6 0.9 50 Unit V V V V V V V V V V V V V V V V µA µA µA µA µA µA Tamb = −40 °C to +125 °C VIH HIGH-level input voltage 0.75 × VCC 0.70 × VCC 1.6 2.0 V V V V 0.25 × VCC V 0.30 × VCC V 0.7 0.9 V V 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 6 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VOH HIGH-level output voltage Conditions VI = VIH or VIL IO = −20 µA; VCC = 0.8 V to 3.6 V IO = −1.1 mA; VCC = 1.1 V IO = −1.7 mA; VCC = 1.4 V IO = −1.9 mA; VCC = 1.65 V IO = −2.3 mA; VCC = 2.3 V IO = −3.1 mA; VCC = 2.3 V IO = −2.7 mA; VCC = 3.0 V IO = −4.0 mA; VCC = 3.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA; VCC = 0.8 V to 3.6 V IO = 1.1 mA; VCC = 1.1 V IO = 1.7 mA; VCC = 1.4 V IO = 1.9 mA; VCC = 1.65 V IO = 2.3 mA; VCC = 2.3 V IO = 3.1 mA; VCC = 2.3 V IO = 2.7 mA; VCC = 3.0 V IO = 4.0 mA; VCC = 3.0 V II IOZ IOFF ∆IOFF ICC ∆ICC input leakage current OFF-state output current power-off leakage current additional power-off leakage current supply current additional supply current VI = GND to 3.6 V; VCC = 0 V to 3.6 V VI = VIH or VIL; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V VI or VO = 0 V to 3.6 V; VCC = 0 V VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V [1] Min Typ Max 0.11 0.41 0.39 0.36 0.50 0.36 0.50 ±0.75 ±0.75 ±0.75 ±0.75 1.4 75 Unit V V V V V V V V V V V V V V V µA µA µA µA µA µA VCC − 0.11 0.6 × VCC 0.93 1.17 1.77 1.67 2.40 2.30 - 0.33 × VCC V [1] One input at VCC − 0.6 V, other input at VCC or GND. 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 7 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter Conditions Min CL = 5 pF tpd propagation D to Q; see Figure 7 delay VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V LE to Q; see Figure 8 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V ten enable time OE to Q; see Figure 10 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V tdis disable time OE to Q; see Figure 10 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [4] [3] [2] [2] 25 °C Typ[1] Max −40 °C to +125 °C Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) Unit 2.8 2.4 1.9 1.8 1.5 2.7 2.3 1.8 1.5 1.3 3.2 2.6 2.2 2.0 1.9 2.9 2.2 2.2 1.6 1.9 21.4 6.6 4.6 3.7 2.9 2.5 20.3 6.2 4.4 3.5 2.6 2.2 17.9 5.1 3.8 3.3 2.7 2.5 9.4 4.2 3.2 3.0 2.2 2.6 13.5 7.8 6.2 4.1 3.5 13.6 7.6 5.8 4.0 3.3 9.2 5.8 4.8 3.8 3.4 7.5 4.9 4.4 3.1 3.3 2.6 2.1 1.6 1.5 1.2 2.5 2.0 1.5 1.3 1.1 3.0 2.4 2.0 1.8 1.8 2.8 2.1 2.1 1.5 1.8 13.8 8.3 6.7 4.5 4.0 14.0 8.5 6.7 4.4 3.8 9.2 6.1 5.0 4.0 3.6 7.9 5.3 4.9 3.4 3.6 2.6 2.1 1.6 1.5 1.2 2.5 2.0 1.5 1.3 1.1 3.0 2.4 2.0 1.8 1.8 2.8 2.1 2.1 1.5 1.8 15.2 9.1 7.3 4.9 4.5 15.4 9.3 7.3 4.8 4.2 10.1 6.7 5.5 4.4 4.0 8.7 5.8 5.4 3.7 4.0 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 8 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter Conditions Min CL = 10 pF tpd propagation D to Q; see Figure 7 delay VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V LE to Q; see Figure 8 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V ten enable time OE to Q; see Figure 10 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V tdis disable time OE to Q; see Figure 10 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [4] [3] [2] [2] 25 °C Typ[1] Max −40 °C to +125 °C Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) Unit 3.0 2.6 2.5 2.0 1.8 2.9 2.5 2.3 1.9 1.7 3.7 3.1 2.7 2.4 2.3 3.9 3.0 3.2 2.3 3.0 24.4 7.5 5.3 4.3 3.5 3.1 23.3 7.1 5.0 4.1 3.1 2.8 21.2 6.0 4.5 3.9 3.3 3.1 11.3 5.3 4.1 4.2 3.0 3.8 15.3 9.0 6.9 4.8 4.2 15.4 8.8 6.6 4.7 4.0 10.6 6.7 5.5 4.5 4.1 8.7 5.8 5.7 4.0 4.7 2.7 2.2 2.1 1.8 1.7 2.7 2.1 2.0 1.6 1.4 3.4 2.8 2.5 2.2 2.2 3.8 2.9 3.1 2.2 2.9 15.9 9.4 7.3 5.3 4.6 16.1 9.5 7.3 5.2 4.4 10.6 7.0 5.8 4.7 4.3 9.2 6.2 6.0 4.3 5.0 2.7 2.2 2.1 1.8 1.7 2.7 2.1 2.0 1.6 1.4 3.4 2.8 2.5 2.2 2.2 3.8 2.9 3.1 2.2 2.9 17.4 10.3 8.0 5.9 5.1 17.7 10.4 8.1 5.8 4.9 11.7 7.7 6.4 5.2 4.7 10.1 6.8 6.6 4.7 5.5 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 9 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter Conditions Min CL = 15 pF tpd propagation D to Q; see Figure 7 delay VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V LE to Q; see Figure 8 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V ten enable time OE to Q; see Figure 10 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V tdis disable time OE to Q; see Figure 10 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [4] [3] [2] [2] 25 °C Typ[1] Max −40 °C to +125 °C Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) Unit 3.5 3.1 2.6 2.5 2.2 3.3 3.0 2.5 2.3 2.1 4.1 3.5 3.1 2.8 2.6 4.9 3.9 4.2 3.0 4.1 27.3 8.3 5.9 4.8 3.9 3.6 26.1 7.9 5.6 4.6 3.6 3.2 24.6 6.8 5.1 4.4 3.7 3.5 13.1 6.5 5.0 5.3 3.8 5.0 16.9 9.6 7.6 5.5 4.9 17.3 9.7 7.4 5.3 4.6 12.1 7.5 6.1 5.0 4.7 9.8 6.8 6.9 4.8 6.1 3.2 2.7 2.2 2.2 1.8 3.0 2.5 2.2 2.0 1.8 3.8 3.2 2.8 2.5 2.5 4.8 3.8 4.1 2.9 4.0 17.5 10.5 8.5 5.9 5.5 18.0 10.7 8.3 5.9 5.1 12.1 7.9 6.5 5.3 4.9 10.4 7.3 7.3 5.1 6.4 3.2 2.7 2.2 2.2 1.8 3.0 2.5 2.2 2.0 1.8 3.8 3.2 2.8 2.5 2.5 4.8 3.8 4.1 2.9 4.0 19.2 11.6 9.3 6.5 6.0 19.8 11.8 9.1 6.4 5.6 13.3 8.7 7.2 5.8 5.4 11.4 8.0 8.0 5.6 7.0 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 10 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter Conditions Min CL = 30 pF tpd propagation D to Q; see Figure 7 delay VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V LE to Q; see Figure 8 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V ten enable time OE to Q; see Figure 10 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V tdis disable time OE to Q; see Figure 10 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V CL = 5 pF, 10 pF, 15 pF and 30 pF tW pulse width LE HIGH; see Figure 8 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V 4.0 0.7 0.5 0.4 0.3 0.2 2.1 1.3 1.0 0.8 0.8 2.1 1.3 1.0 0.8 0.8 ns ns ns ns ns ns [4] [3] [2] [2] 25 °C Typ[1] Max −40 °C to +125 °C Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) Unit 4.0 3.6 3.5 3.3 3.0 3.9 3.5 3.3 3.1 2.9 5.5 4.6 4.2 3.6 3.4 8.0 6.3 7.3 5.2 7.5 35.9 10.6 7.5 6.2 5.1 4.7 34.8 10.2 7.2 5.9 4.8 4.4 34.5 9.1 6.7 5.7 4.9 4.7 19.2 9.9 7.7 8.7 6.2 8.8 22.1 12.3 9.5 6.9 6.4 22.2 12.4 9.5 6.8 6.1 16.2 9.9 7.9 6.4 6.1 13.7 9.7 10.6 7.5 10.2 3.7 3.5 3.2 2.9 2.9 3.7 3.4 3.0 2.7 2.6 4.9 4.2 3.7 3.4 3.3 7.9 6.2 7.2 5.1 7.4 23.3 13.6 10.5 7.6 7.2 23.5 13.7 10.5 7.5 7.0 16.2 10.5 8.6 6.9 6.5 14.5 10.5 11.3 7.8 10.5 3.7 3.5 3.2 2.9 2.9 3.7 3.4 3.0 2.7 2.6 4.9 4.2 3.7 3.4 3.3 7.9 6.2 7.2 5.1 7.4 25.6 15.0 11.5 8.3 7.9 25.9 15.1 11.6 8.2 7.7 17.8 11.6 9.5 7.6 7.2 16.0 11.6 12.4 8.6 11.6 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 11 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter Conditions Min tsu(H) set-up time HIGH D to LE; see Figure 9 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V tsu(L) set-up time LOW D to LE; see Figure 9 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V th hold time D to LE HIGH or LOW; see Figure 9 VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V −4.6 −0.9 −0.6 −0.4 −0.2 −0.1 −0.1 −0.1 0 0.2 0.3 −0.1 −0.1 0 0.2 0.3 ns ns ns ns ns ns 4.0 1.2 0.7 0.6 0.4 0.3 2.7 1.5 1.2 0.9 0.7 2.7 1.5 1.2 0.9 0.7 ns ns ns ns ns ns 4.6 0.9 0.6 0.4 0 −0.1 2.2 1.4 1.0 0.6 0.4 2.2 1.4 1.0 0.6 0.4 ns ns ns ns ns ns 25 °C Typ[1] Max −40 °C to +125 °C Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) Unit 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 12 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter Conditions Min CPD power fi = 1 MHz; VI = GND to VCC dissipation output enabled capacitance VCC = 0.8 V VCC = 1.1 V to 1.3 V VCC = 1.4 V to 1.6 V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V [1] [2] [3] [4] [5] [6] All typical values are measured at nominal VCC. tpd is the same as tPLH and tPHL. ten is the same as tPZH and tPZL. tdis is the same as tPHZ and tPLZ. All specified values are the average typical values over all stated loads. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; Σ(CL × VCC2 × fo) = sum of the outputs; N = number of inputs switching. [5][6] 25 °C Typ[1] Max −40 °C to +125 °C Min Max Min Max (85 °C) (85 °C) (125 °C) (125 °C) Unit - 2.0 2.0 2.0 2.1 2.4 2.8 - - - - - pF pF pF pF pF pF 12. Waveforms VI D input GND t PHL VOH Q output VOL VM t PLH VM 001aae253 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 7. The data input (D) to output (Q) propagation delays 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 13 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state VI LE input GND tW tPHL VOH Q output VOL VM 001aae254 VM tPLH Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 8. The latch enable input (LE) to output (Q) propagation delays, the latch enable input (LE) pulse width VI D input GND tsu VI LE input GND VM 001aae255 VM th th tsu Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 9. Data set-up and hold times for the D input to the LE input Table 9. VCC 0.8 V to 3.6 V Measurement points Output VM 0.5 × VCC Input VM 0.5 × VCC VI VCC tr = tf ≤ 3.0 ns Supply voltage 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 14 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state VI OE input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled mna644 VM tPZL VM VX tPZH VY VM Measurement points are given in Table 10. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 10. Turn-on and turn-off times Table 10. VCC 0.8 V to 1.6 V 1.65 V to 2.7 V 3.0 V to 3.6 V Measurement points Input VM 0.5 × VCC 0.5 × VCC 0.5 × VCC Output VM 0.5 × VCC 0.5 × VCC 0.5 × VCC VX VOL + 0.1 V VOL + 0.15 V VOL + 0.3 V VY VOH − 0.1 V VOH − 0.15 V VOH − 0.3 V Supply voltage 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 15 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state VCC VEXT 5 kΩ G VI VO DUT RT CL RL 001aac521 Test data is given in Table 11. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 11. Load circuitry for switching times Table 11. VCC 0.8 V to 3.6 V [1] Test data Load CL RL[1] 5 pF, 10 pF, 15 pF and 30 pF 5 kΩ or 1 MΩ VEXT tPLH, tPHL open tPZH, tPHZ GND tPZL, tPLZ 2 × VCC Supply voltage For measuring enable and disable times RL = 5 kΩ, for measuring propagation delays, setup and hold times and pulse width RL = 1 MΩ. 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 16 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state 13. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 12. Package outline SOT363 (SC-88) 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 17 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× L1 L (2) e 6 e1 5 e1 4 6× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Fig 13. Package outline SOT886 (XSON6) 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 18 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm SOT891 1 2 b 3 4× (1) L1 e L 6 e1 5 e1 4 6× (1) A A1 D E terminal 1 index area 0 1 scale DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 max 0.04 b 0.20 0.12 D 1.05 0.95 E 1.05 0.95 e 0.55 e1 0.35 L 0.35 0.27 L1 0.40 0.32 2 mm Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION SOT891 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 Fig 14. Package outline SOT891 (XSON6) 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 19 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state 14. Abbreviations Table 12. Acronym CDM CMOS DUT ESD HBM MM Abbreviations Description Charged Device Model Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model 15. Revision history Table 13. Revision history Release date 20080109 Data sheet status Product data sheet Change notice Supersedes 74AUP1G373_2 Document ID 74AUP1G373_3 Modifications: 74AUP1G373_2 74AUP1G373_1 • Section 11: Propagation delay, set-up and hold and power dissipation capacitance values have changed. Product data sheet Product data sheet 74AUP1G373_1 - 20070720 20061129 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 20 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com 74AUP1G373_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 9 January 2008 21 of 22 NXP Semiconductors 74AUP1G373 Low-power D-type transparent latch; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 January 2008 Document identifier: 74AUP1G373_3