74HC132; 74HCT132
Quad 2-input NAND Schmitt trigger
Rev. 3 — 30 August 2012
Product data sheet
1. General description
The 74HC132; 74HCT132 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard
No. 7A
The 74HC132; 74HCT132 is a quad 2-input NAND gate with Schmitt trigger inputs. This
device features reduced input threshold levels to allow interfacing to TTL logic levels.
Inputs also include clamp diodes that enable the use of current limiting resistors to
interface inputs to voltages in excess of VCC. Schmitt trigger inputs transform slowly
changing input signals into sharply defined jitter-free output signals.
The inputs switch at different points for positive and negative-going signals. The difference
between the positive voltage VT+ and the negative voltage VT is defined as the input
hysteresis voltage VH.
2. Features and benefits
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from 40 C to +85 C and from 40 C to +125 C
3. Applications
Wave and pulse shapers
Astable multivibrators
Monostable multivibrators
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
4. Ordering information
Table 1.
Ordering information
Type number
74HC132N
Package
Temperature range
Name
Description
Version
40 C to +125 C
DIP14
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
40 C to +125 C
SO14
plastic small outline package; 14 leads; body width
3.9 mm
SOT108-1
40 C to +125 C
SSOP14
plastic shrink small outline package; 14 leads; body
width 5.3 mm
SOT337-1
40 C to +125 C
TSSOP14
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT402-1
74HCT132N
74HC132D
74HCT132D
74HC132DB
74HCT132DB
74HC132PW
74HCT132PW
5. Functional diagram
1
1A
1Y
2
4
2A
2Y
5
3
1B
1
6
2B
4
9
3A
3Y
10
&
3
&
6
&
8
&
11
2
5
8
3B
9
10
12
4A
4Y
13
12
11
Logic symbol
74HC_HCT132
Product data sheet
Y
13
4B
B
mna407
Fig 1.
A
mna408
Fig 2.
IEC logic symbol
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
mna409
Fig 3.
Logic diagram (one
Schmitt trigger)
© NXP B.V. 2012. All rights reserved.
2 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
6. Pinning information
6.1 Pinning
1A
1
14 VCC
1B
2
13 4B
1Y
3
2A
4
2B
5
10 3B
2Y
6
9
3A
GND
7
8
3Y
12 4A
132
11 4Y
mna406
Fig 4.
Pin configuration DIP14, SO14 and (T)SSOP14
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
1A to 4A
1, 4, 9, 12
data input
1B to 4B
2, 5, 10, 13
data input
1Y to 4Y
3, 6, 8, 11
data output
GND
7
ground (0 V)
VCC
14
supply voltage
7. Functional description
Table 3.
Function table[1]
Input
Output
nA
nB
nY
L
L
H
L
H
H
H
L
H
H
H
L
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
3 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+7
V
-
20
mA
-
20
mA
-
25
mA
50
mA
IIK
input clamping current
VI < 0.5 V or VI > VCC + 0.5 V
[1]
IOK
output clamping current
VO < 0.5 V or VO > VCC + 0.5 V
[1]
IO
output current
0.5 V < VO < VCC + 0.5 V
ICC
supply current
-
IGND
ground current
50
-
mA
Tstg
storage temperature
65
+150
C
DIP14 package
-
750
mW
SO14, and (T)SSOP14
packages
-
500
mW
total power dissipation
Ptot
[1]
[2]
[2]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For DIP14 package: Ptot derates linearly with 12 mW/K above 70 C.
For SO14 package: Ptot derates linearly with 8 mW/K above 70 C.
For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter
Conditions
74HC132
74HCT132
Unit
Min
Typ
Max
Min
Typ
Max
VCC
supply voltage
2.0
5.0
6.0
4.5
5.0
5.5
V
VI
input voltage
0
-
VCC
0
-
VCC
V
VO
output voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
40
+25
+125
40
+25
+125
C
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
4 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
10. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
Min
Typ
IO = 20 A; VCC = 2.0 V
1.9
IO = 20 A; VCC = 4.5 V
4.4
40 C to +85 C 40 C to +125 C Unit
Max
Min
Max
Min
Max
2.0
-
1.9
-
1.9
-
V
4.5
-
4.4
-
4.4
-
V
74HC132
VOH
VOL
HIGH-level
output voltage
LOW-level
output voltage
VI = VT+ or VT
IO = 20 A; VCC = 6.0 V
5.9
6.0
-
5.9
-
5.9
-
V
IO = 4.0 mA; VCC = 4.5 V
3.98
4.32
-
3.84
-
3.7
-
V
IO = 5.2 mA; VCC = 6.0 V
5.48
5.81
-
5.34
-
5.2
-
V
IO = 20 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 A; VCC = 6.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 4.5 V
-
0.15
0.26
-
0.33
-
0.4
V
IO = 5.2 mA; VCC = 6.0 V
VI = VT+ or VT
-
0.16
0.26
-
0.33
-
0.4
V
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
-
0.1
-
1.0
-
1.0
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
2.0
-
20
-
40
A
CI
input
capacitance
-
3.5
-
-
-
-
-
pF
74HCT132
VOH
VOL
HIGH-level
output voltage
LOW-level
output voltage
VI = VT+ or VT; VCC = 4.5 V
IO = 20 A
4.4
4.5
-
4.4
-
4.4
-
V
IO = 4.0 mA
3.98
4.32
-
3.84
-
3.7
-
V
VI = VT+ or VT; VCC = 4.5 V
IO = 20 A;
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA;
-
0.15
0.26
-
0.33
-
0.4
V
II
input leakage
current
VI = VCC or GND;
VCC = 5.5 V
-
-
0.1
-
1.0
-
1.0
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
2.0
-
20
-
40
A
ICC
additional
supply current
per input pin;
VI = VCC 2.1 V; IO = 0 A;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V
-
30
108
-
135
-
147
A
CI
input
capacitance
74HC_HCT132
Product data sheet
-
3.5
-
-
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
-
-
-
pF
© NXP B.V. 2012. All rights reserved.
5 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
11. Dynamic characteristics
Table 7.
Dynamic characteristics
GND = 0 V; CL = 50 pF; for load circuit see Figure 6.
Symbol Parameter
25 C
Conditions
40 C to +125 C Unit
Min
Typ
Max
Max
(85 C)
Max
(125 C)
-
36
125
155
190
VCC = 4.5 V
-
13
25
31
38
ns
VCC = 5.0 V; CL = 15 pF
-
11
-
-
-
ns
-
10
21
26
32
ns
VCC = 2.0 V
-
19
75
95
110
ns
VCC = 4.5 V
-
7
15
19
22
ns
-
6
13
16
19
ns
-
24
-
-
-
pF
-
20
33
41
50
ns
74HC132
propagation delay nA, nB to nY; see Figure 5
tpd
[1]
VCC = 2.0 V
VCC = 6.0 V
transition time
tt
[2]
see Figure 5
VCC = 6.0 V
power dissipation
capacitance
CPD
ns
per package; VI = GND to VCC
[3]
74HCT132
propagation delay nA, nB to nY; see Figure 5
tpd
[1]
VCC = 4.5 V
VCC = 5.0 V; CL = 15 pF
transition time
tt
power dissipation
capacitance
CPD
-
17
-
-
-
ns
VCC = 4.5 V; see Figure 5
[2]
-
7
15
19
22
ns
per package;
VI = GND to VCC 1.5 V
[3]
-
20
-
-
-
pF
[1]
tpd is the same as tPHL and tPLH.
[2]
tt is the same as tTHL and tTLH.
[3]
CPD is used to determine the dynamic power dissipation (PD in W):
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
6 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
12. Waveforms
VI
nA, nB input
VM
GND
tPHL
VOH
tPLH
VY
VM
VX
nY output
VOL
tTHL
tTLH
001aai814
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 5.
Input to output propagation delays
Table 8.
Measurement points
Type
Input
Output
VM
VM
VX
VY
74HC132
0.5VCC
0.5VCC
0.1VCC
0.9VCC
74HCT132
1.3 V
1.3 V
0.1VCC
0.9VCC
VI
negative
pulse
tW
90 %
VM
GND
tf
tr
tr
tf
VI
90 %
positive
pulse
GND
VM
10 %
VM
VM
10 %
tW
VCC
G
VI
VO
DUT
RT
CL
001aah768
Test data is given in Table 9.
Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
Fig 6.
Load circuitry for measuring switching times
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
7 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
Table 9.
Test data
Type
Input
Load
Test
VI
tr, tf
CL
74HC132
VCC
6.0 ns
15 pF, 50 pF
tPLH, tPHL
74HCT132
3.0 V
6.0 ns
15 pF, 50 pF
tPLH, tPHL
13. Transfer characteristics
Table 10. Transfer characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Figure 7 and Figure 8.
Symbol Parameter
Tamb = 25 C
Conditions
Tamb = 40 C
to +85 C
Tamb = 40 C
to +125 C
Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
0.7
1.18
1.5
0.7
1.5
0.7
1.5
V
VCC = 4.5 V
1.7
2.38
3.15
1.7
3.15
1.7
3.15
V
74HC132
VT+
VT
VH
positive-going
threshold
voltage
VCC = 6.0 V
2.1
3.14
4.2
2.1
4.2
2.1
4.2
V
negative-going VCC = 2.0 V
threshold
VCC = 4.5 V
voltage
VCC = 6.0 V
0.3
0.63
1.0
0.3
1.0
0.3
1.0
V
0.9
1.67
2.2
0.9
2.2
0.9
2.2
V
1.2
2.26
3.0
1.2
3.0
1.2
3.0
V
hysteresis
voltage
VCC = 2.0 V
0.2
0.55
1.0
0.2
1.0
0.2
1.0
V
VCC = 4.5 V
0.4
0.71
1.4
0.4
1.4
0.4
1.4
V
VCC = 6.0 V
0.6
0.88
1.6
0.6
1.6
0.6
1.6
V
VCC = 4.5 V
1.2
1.41
1.9
1.2
1.9
1.2
1.9
V
VCC = 5.5 V
1.4
1.59
2.1
1.4
2.1
1.4
2.1
V
negative-going VCC = 4.5 V
threshold
VCC = 5.5 V
voltage
0.5
0.85
1.2
0.5
1.2
0.5
1.2
V
0.6
0.99
1.4
0.6
1.4
0.6
1.4
V
hysteresis
voltage
VCC = 4.5 V
0.4
0.56
-
0.4
-
0.4
-
V
VCC = 5.5 V
0.4
0.60
-
0.4
-
0.4
-
V
74HCT132
VT+
VT
VH
positive-going
threshold
voltage
14. Transfer characteristics waveforms
VO
VT+
VI
VH
VT−
VI
VH
VT−
Fig 7.
VT+
Transfer characteristics
74HC_HCT132
Product data sheet
VO
mna207
mna208
Fig 8.
Transfer characteristics definitions
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
8 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
DDD
DDD
,&&
$
,&&
$
9,19
a. VCC = 2.0 V
9,19
b. VCC = 4.5 V
DDD
,&&
P$
9,19
c. VCC = 6.0 V
Fig 9.
Typical 74HC132 transfer characteristics
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
9 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
DDD
DDD
,&&
P$
,&&
P$
9,19
a. VCC = 4.5 V
9,19
b. VCC = 5.5 V
Fig 10. Typical 74HCT132 transfer characteristics
15. Application information
The slow input rise and fall times cause additional power dissipation, this can be
calculated using the following formula:
Padd = fi (tr ICC(AV) + tf ICC(AV)) VCC where:
Padd = additional power dissipation (W);
fi = input frequency (MHz);
tr = rise time (ns); 10 % to 90 %;
tf = fall time (ns); 90 % to 10 %;
ICC(AV) = average additional supply current (A).
Average ICC(AV) differs with positive or negative input transitions, as shown in Figure 11
and Figure 12.
An example of a relaxation circuit using the 74HC132; 74HCT132 is shown in Figure 13.
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
10 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
DDD
DYHUDJH
,&&
$
SRVLWLYHJRLQJ
HGJH
QHJDWLYHJRLQJ
HGJH
9&&9
(1) Positive-going edge.
(2) Negative-going edge.
Fig 11. Average additional supply current as a function of VCC for 74HC132; linear change of VI between 0.1VCC
to 0.9VCC.
DDD
DYHUDJH
,&&
$
SRVLWLYHJRLQJ
HGJH
QHJDWLYHJRLQJ
HGJH
9&&9
(1) Positive-going edge.
(2) Negative-going edge.
Fig 12. Average additional supply current as a function of VCC for 74HCT132; linear change of VI between 0.1VCC
to 0.9VCC.
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
11 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
VCC
R
VCC
A
Y
B
C
001aac440
For 74HC132 and 74HCT132:
1
1
f = --- -----------------T K RC
For K-factor, see Figure 14
Fig 13. Relaxation oscillator
DDD
.
DDD
.
9&&9
K-factor for 74HC132
9&&9
K-factor for 74HCT132
Fig 14. Typical K-factor for relaxation oscillator
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
12 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
16. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
MH
8
14
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2.2
inches
0.17
0.02
0.13
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT27-1
050G04
MO-001
SC-501-14
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 15. Package outline SOT27-1 (DIP14)
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
13 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 16. Package outline SOT108-1 (SO14)
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
14 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
D
SOT337-1
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
7
1
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.4
0.9
8o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT337-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-150
Fig 17. Package outline SOT337-1 (SSOP14)
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
15 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 18. Package outline SOT402-1 (TSSOP14)
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
16 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
17. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
LSTTL
Low-power Schottky Transistor-Transistor Logic
MM
Machine Model
TTL
Transistor-Transistor Logic
18. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74HC_HCT132 v.3
20120830
Product data sheet
-
74HC_HCT132_CNV v.2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Figure 14 added (typical K-factor for relaxation oscillator).
74HC_HCT132_CNV v.2 19970826
74HC_HCT132
Product data sheet
Product specification
-
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
-
© NXP B.V. 2012. All rights reserved.
17 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74HC_HCT132
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
18 of 20
74HC132; 74HCT132
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2012
© NXP B.V. 2012. All rights reserved.
19 of 20
NXP Semiconductors
74HC132; 74HCT132
Quad 2-input NAND Schmitt trigger
21. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
17
18
19
19.1
19.2
19.3
19.4
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Transfer characteristics . . . . . . . . . . . . . . . . . . 8
Transfer characteristics waveforms. . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 August 2012
Document identifier: 74HC_HCT132