74HCT1G32GW

74HC1G32; 74HCT1G32 2-input OR gate Rev. 05 — 14 March 2008 Product data sheet 1. General description 74HC1G32 and 74HCT1G32 are high-speed Si-gate CMOS devices. They provide a 2-input OR function. The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V. The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V. The standard output currents are half those of the 74HC32 and 74HCT32. 2. Features I I I I I Symmetrical output impedance High noise immunity Low power dissipation Balanced propagation delays SOT353-1 and SOT753 package options 3. Ordering information Table 1. Ordering information Package Temperature range Name 74HC1G32GW 74HCT1G32GW 74HC1G32GV 74HCT1G32GV −40 °C to +125 °C SC-74A −40 °C to +125 °C TSSOP5 Description plastic thin shrink small outline package; 5 leads; body width 1.25 mm plastic surface-mounted package; 5 leads Version SOT353-1 SOT753 Type number 4. Marking Table 2. Marking codes Marking code HG TG H32 T32 Type number 74HC1G32GW 74HCT1G32GW 74HC1G32GV 74HCT1G32GV NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate 5. Functional diagram 1 2 mna164 mna165 1 2 B A Y 4 ≥1 4 Fig 1. Logic symbol Fig 2. IEC logic symbol B Y A mna166 Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74HC1G32 74HCT1G32 B A 1 2 5 VCC GND 3 001aaf104 4 Y Fig 4. Pin configuration 6.2 Pin description Table 3. Symbol B A GND Y VCC Pin description Pin 1 2 3 4 5 Description data input B data input A ground (0 V) data output Y supply voltage 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 2 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate 7. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Inputs A L L H H B L H L H Output Y L H H H 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). [1] Symbol VCC IIK IOK IO ICC IGND Tstg Ptot [1] [2] Parameter supply voltage input clamping current output clamping current output current supply current ground current storage temperature total power dissipation Conditions VI < −0.5 V or VI > VCC + 0.5 V VO < −0.5 V or VO > VCC + 0.5 V −0.5 V < VO < VCC + 0.5 V Min −0.5 −25 −65 Max +7.0 ±20 ±20 ±12.5 25 +150 200 Unit V mA mA mA mA mA °C mW Tamb = −40 °C to +125 °C [2] - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. Above 55 °C the value of Ptot derates linearly with 2.5 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC VI VO Tamb ∆t/∆V supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Conditions Min 2.0 0 0 −40 74HC1G32 Typ 5.0 +25 Max 6.0 VCC VCC +125 625 139 83 Min 4.5 0 0 −40 74HCT1G32 Typ 5.0 +25 Max 5.5 VCC VCC +125 139 V V V °C ns/V ns/V ns/V Unit 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 3 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 °C. Symbol 74HC1G32 VIH HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = −20 µA; VCC = 2.0 V IO = −20 µA; VCC = 4.5 V IO = −20 µA; VCC = 6.0 V IO = −2.0 mA; VCC = 4.5 V IO = −2.6 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA; VCC = 2.0 V IO = 20 µA; VCC = 4.5 V IO = 20 µA; VCC = 6.0 V IO = 2.0 mA; VCC = 4.5 V IO = 2.6 mA; VCC = 6.0 V II ICC CI VIH VIL VOH input leakage current supply current input capacitance HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = −20 µA IO = −2.0 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 µA IO = 2.0 mA II input leakage current VI = VCC or GND; VCC = 5.5 V 0 0.15 0.1 0.33 1.0 0.1 0.4 1.0 V V µA 4.4 4.13 4.5 4.32 4.4 3.7 V V VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 2.0 0 0 0 0.15 0.16 1.5 1.6 1.2 0.1 0.1 0.1 0.33 0.33 1.0 10 0.8 2.0 0.1 0.1 0.1 0.4 0.4 1.0 20 0.8 V V V V V µA µA pF V V 1.9 4.4 5.9 4.13 5.63 2.0 4.5 6.0 4.32 5.81 1.9 4.4 5.9 3.7 5.2 V V V V V 1.5 3.15 4.2 1.2 2.4 3.2 0.8 2.1 2.8 0.5 1.35 1.8 1.5 3.15 4.2 0.5 1.35 1.8 V V V V V V Parameter Conditions −40 °C to +85 °C Min Typ Max −40 °C to +125 °C Min Max Unit 74HCT1G32 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 4 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 °C. Symbol ICC ∆ICC CI Parameter supply current additional supply current input capacitance Conditions VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input; VCC = 4.5 V to 5.5 V; VI = VCC − 2.1 V; IO = 0 A −40 °C to +85 °C Min Typ 1.5 Max 10 500 −40 °C to +125 °C Min Max 20 850 µA µA pF Unit 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; tr = tf ≤ 6.0 ns. All typical values are measured at Tamb = 25 °C. For test circuit see Figure 6 Symbol Parameter 74HC1G32 tpd propagation delay A and B to Y; see Figure 5 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 5.0 V; CL = 15 pF VCC = 6.0 V; CL = 50 pF CPD power dissipation VI = GND to VCC capacitance propagation delay A and B to Y; see Figure 5 VCC = 4.5 V; CL = 50 pF VCC = 5.0 V; CL = 15 pF CPD power dissipation VI = GND to VCC − 1.5 V capacitance tpd is the same as tPLH and tPHL. CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz fo = output frequency in MHz CL = output load capacitance in pF VCC = supply voltage in V ∑ (CL × VCC2 × fo) = sum of outputs [2] [2] [1] Conditions −40 °C to +85 °C Min Typ Max −40 °C to +125 °C Unit Min Max - 18 8 8 7 19 115 23 20 - - 135 27 23 - ns ns ns ns pF 74HCT1G32 tpd [1] - 10 10 20 24 - - 27 - ns ns pF [1] [2] 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 5 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate 12. Waveforms A, B input VM tPHL tPLH Y output VM mna167 Fig 5. The input (A and B) to output (Y) propagation delays VCC PULSE GENERATOR VI DUT RT CL VO mna101 Measurement points are given in Table 8. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. Load circuitry for switching times 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 6 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 D E A X c y HE vMA Z 5 4 A2 A1 (A3) θ A 1 e e1 bp 3 wM detail X Lp L 0 1.5 scale 3 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.1 0 A2 1.0 0.8 A3 0.15 bp 0.30 0.15 c 0.25 0.08 D(1) 2.25 1.85 E(1) 1.35 1.15 e 0.65 e1 1.3 HE 2.25 2.0 L 0.425 Lp 0.46 0.21 v 0.3 w 0.1 y 0.1 Z(1) 0.60 0.15 θ 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC MO-203 JEITA SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 7. Package outline SOT353-1 (TSSOP5) 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 7 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate Plastic surface-mounted package; 5 leads SOT753 D B E A X y HE vMA 5 4 Q A A1 c 1 2 3 detail X Lp e bp wM B 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.100 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT753 REFERENCES IEC JEDEC JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 8. Package outline SOT753 (SC-74A) 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 8 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate 14. Abbreviations Table 9. Acronym DUT TTL Abbreviations Description Device Under Test Transistor-Transistor Logic 15. Revision history Table 10. Revision history Release date 20080314 Data sheet status Product data sheet Product data sheet Product specification Product specification Preliminary specification Change notice Supersedes 74HC_HCT1G32_4 74HC_HCT1G32_3 74HC_HCT1G32_2 74HC_HCT1G32 Document ID 74HC_HCT1G32_5 Modifications: 74HC_HCT1G32_4 74HC_HCT1G32_3 74HC_HCT1G32_2 74HC_HCT1G32 • Pin description of Pin 4 changed from input to output in Table 3. 20070514 20020515 20010406 19971216 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 9 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74HC_HCT1G32_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 14 March 2008 10 of 11 NXP Semiconductors 74HC1G32; 74HCT1G32 2-input OR gate 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 March 2008 Document identifier: 74HC_HCT1G32_5