74LVC1G80GM

74LVC1G80 Single D-type flip-flop; positive-edge trigger Rev. 08 — 29 August 2007 Product data sheet 1. General description The 74LVC1G80 provides a single positive-edge triggered D-type flip-flop. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The input pin D must be stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features s Wide supply voltage range from 1.65 V to 5.5 V s High noise immunity s Complies with JEDEC standard: x JESD8-7 (1.65 V to 1.95 V) x JESD8-5 (2.3 V to 2.7 V) x JESD8B/JESD36 (2.7 V to 3.6 V) s ±24 mA output drive (VCC = 3.0 V) s CMOS low power consumption s Latch-up performance exceeds 250 mA s Direct interface with TTL levels s Inputs accept voltages up to 5 V s Multiple package options s ESD protection: x HBM JESD22-A114E exceeds 2000 V x MM JESD22-A115-A exceeds 200 V s Specified from −40 °C to +125 °C NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger 3. Ordering information Table 1. Ordering information Package Temperature range 74LVC1G80GW 74LVC1G80GV 74LVC1G80GM 74LVC1G80GF −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C Name TSSOP5 SC-74A XSON6 XSON6 Description plastic thin shrink small outline package; 5 leads; body width 1.25 mm plastic surface-mounted package; 5 leads plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1.45 × 0.5 mm plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1 × 0.5 mm Version SOT353-1 SOT753 SOT886 SOT891 Type number 4. Marking Table 2. Marking codes Marking VT V80 VT VT Type number 74LVC1G80GW 74LVC1G80GV 74LVC1G80GM 74LVC1G80GF 5. Functional diagram 1 D Q 4 1 2 CP mna649 D CP 001aac523 4 2 Fig 1. Logic symbol Fig 2. IEC logic symbol 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 2 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger CP C C C C D TG C TG C Q C C TG TG C C mna651 Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74LVC1G80 74LVC1G80 D CP 1 2 GND GND 3 001aab662 D 5 VCC 1 6 VCC D CP 74LVC1G80 1 2 3 6 5 4 VCC n.c. Q CP 2 5 n.c. 3 4 Q GND 4 Q 001aab663 001aaf535 Transparent top view Transparent top view Fig 4. Pin configuration SOT353-1 and SOT753 Fig 5. Pin configuration SOT886 Fig 6. Pin configuration SOT891 6.2 Pin description Table 3. Symbol D CP GND Q n.c. VCC Pin description Pin SOT353-1/SOT753 1 2 3 4 5 SOT886/SOT891 1 2 3 4 5 6 data input data pulse input ground (0 V) data output not connected supply voltage Description 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 3 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger 7. Functional description Table 4. Input CP ↑ ↑ L [1] Function table[1] Output D L H X Q H L q H = HIGH voltage level; L = LOW voltage level. ↑ = LOW-to-HIGH CP transition; X = don’t care; q = lower case letter indicates the state of referenced input, one set-up time prior to the LOW-to-HIGH CP transition. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IO ICC IGND Ptot Tstg [1] [2] [3] Parameter supply voltage input clamping current input voltage output clamping current output voltage output current supply current ground current total power dissipation storage temperature Conditions VI < 0 V [1] Min −0.5 −50 −0.5 [1][2] [1][2] Max +6.5 +6.5 ±50 VCC + 0.5 +6.5 ±50 100 250 +150 Unit V mA V mA V V mA mA mA mW °C VO > VCC or VO < 0 V Active mode Power-down mode VO = 0 V to VCC −0.5 −0.5 −100 Tamb = −40 °C to +125 °C [3] −65 The input and output voltage ratings may be exceeded if the input and output current ratings are observed. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. For TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K. 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 4 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger 9. Recommended operating conditions Table 6. Symbol VCC VI VO Tamb ∆t/∆V Recommended operating conditions Parameter supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 1.65 V to 2.7 V VCC = 2.7 V to 5.5 V Active mode VCC = 0 V; Power-down mode Conditions Min 1.65 0 0 0 −40 Typ Max 5.5 5.5 VCC 5.5 +125 20 10 Unit V V V V °C ns/V ns/V 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = −40 °C to +85 °C VIH HIGH-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOH HIGH-level output voltage VI = VIH or VIL IO = −100 µA; VCC = 1.65 V to 5.5 V IO = −4 mA; VCC = 1.65 V IO = −8 mA; VCC = 2.3 V IO = −12 mA; VCC = 2.7 V IO = −24 mA; VCC = 3.0 V IO = −32 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V II IOFF input leakage current power-off leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V VCC = 0 V; VI or VO = 5.5 V ±0.1 ±0.1 0.1 0.45 0.3 0.4 0.55 0.55 ±5 ±10 V V V V V V µA µA VCC − 0.1 1.2 1.9 2.2 2.3 3.8 V V V V V V 0.65 × VCC 1.7 2.0 0.7 × VCC 0.35 × VCC 0.7 0.8 0.3 × VCC V V V V V V V V Conditions Min Typ[1] Max Unit 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 5 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger Table 7. Static characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter ICC ∆ICC CI VIH supply current additional supply current input capacitance HIGH-level input voltage Conditions VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A per pin; VCC = 2.3 V to 5.5 V; VI = VCC − 0.6 V; IO = 0 A VCC = 3.3 V; VI = GND to VCC VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOH HIGH-level output voltage VI = VIH or VIL IO = −100 µA; VCC = 1.65 V to 5.5 V IO = −4 mA; VCC = 1.65 V IO = −8 mA; VCC = 2.3 V IO = −12 mA; VCC = 2.7 V IO = −24 mA; VCC = 3.0 V IO = −32 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V II IOFF ICC ∆ICC input leakage current power-off leakage current supply current additional supply current VI = 5.5 V or GND; VCC = 0 V to 5.5 V VCC = 0 V; VI or VO = 5.5 V VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A per pin; VCC = 2.3 V to 5.5 V; VI = VCC − 0.6 V; IO = 0 A 0.1 0.70 0.45 0.60 0.80 0.80 ±100 ±200 200 5000 V V V V V V µA µA µA µA VCC − 0.1 0.95 1.7 1.9 2.0 3.4 V V V V V V Min 0.65 × VCC 1.7 2.0 0.7 × VCC Typ[1] Max 0.1 5 5 10 500 0.35 × VCC 0.7 0.8 0.3 × VCC Unit µA µA pF V V V V V V V V Tamb = −40 °C to +125 °C [1] All typical values are measured at VCC = 3.3 V and Tamb = 25 °C. 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 6 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9. Symbol Parameter tpd Conditions [2] −40 °C to +85 °C Min Typ[1] 3.4 2.3 2.5 2.4 1.8 Max 9.9 7.0 6.0 5.0 4.5 −40 °C to +125 °C Unit Min 1.0 0.5 0.5 0.9 0.5 Max 13.0 9.0 8.0 6.5 6.0 ns ns ns ns ns propagation delay CP to Q; see Figure 7 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 1.0 0.5 0.5 0.9 0.5 [3] tsu set-up time HIGH or LOW; D to CP; see Figure 8 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 2.3 1.5 1.5 1.3 1.1 0 0 +0.5 0.9 +0.5 0.8 0.6 0.5 0.4 0.5 −0.6 −0.4 −0.2 0.2 −0.1 - 2.3 1.5 1.5 1.3 1.1 0 0 0.5 0.9 0.5 - ns ns ns ns ns ns ns ns ns ns th hold time D to CP; see Figure 8 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V tW pulse width CP HIGH or LOW; see Figure 8 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 3.0 2.5 2.5 2.5 2.0 160 160 160 160 200 [4] 1.1 0.7 0.6 0.6 0.5 300 350 350 350 400 17 - 3.0 2.5 2.5 2.5 2.0 160 160 160 160 200 - - ns ns ns ns ns MHz MHz MHz MHz MHz pF fmax maximum frequency CP; see Figure 8 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V CPD power dissipation capacitance VI = GND to VCC; VCC = 3.3 V - [1] [2] [3] [4] Typical values are measured at Tamb = 25 °C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively. tpd is the same as tPLH and tPHL. tsu is the same as tsu(H) and tsu(L). CPD is used to determine the dynamic power dissipation (PD in µW). © NXP B.V. 2007. All rights reserved. 74LVC1G80_8 Product data sheet Rev. 08 — 29 August 2007 7 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs. 12. Waveforms VI D input GND VI CP input GND t PLH VOH Q output VOL VM VM mna652 VM VM t PHL Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output. Fig 7. Clock (CP) to output (Q) propagation delay times VI D input GND th t su(L) 1/fmax VI CP input GND tW t PLH VOH Q output VOL VM mna653 VM th t su(H) VM t PHL Measurement points are given in Table 9. VOL and VOH are typical output voltage levels that occur with the output. The shaded areas indicate when the input is permitted to change for predictable output performance. Fig 8. Clock (CP) to output (Q) propagation delay times, clock pulse width, D to set-up times, the CP to D hold times and maximum clock pulse frequency 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 8 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger Table 9. VCC Measurement points Input VM 0.5 × VCC 0.5 × VCC 1.5 V 1.5 V 0.5 × VCC Output VM 0.5 × VCC 0.5 × VCC 1.5 V 1.5 V 0.5 × VCC Supply voltage 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V VEXT VCC VI VO DUT RT CL RL RL G mna616 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 9. Load circuitry for switching times Table 10. VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V Test data Input VI VCC VCC 2.7 V 2.7 V VCC tr = t f ≤ 2.0 ns ≤ 2.0 ns ≤ 2.5 ns ≤ 2.5 ns ≤ 2.5 ns Load CL 30 pF 30 pF 50 pF 50 pF 50 pF RL 1 kΩ 500 Ω 500 Ω 500 Ω 500 Ω VEXT tPLH, tPHL open open open open open Supply voltage 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 9 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 D E A X c y HE vMA Z 5 4 A2 A1 (A3) θ A 1 e e1 bp 3 wM detail X Lp L 0 1.5 scale 3 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.1 0 A2 1.0 0.8 A3 0.15 bp 0.30 0.15 c 0.25 0.08 D(1) 2.25 1.85 E(1) 1.35 1.15 e 0.65 e1 1.3 HE 2.25 2.0 L 0.425 Lp 0.46 0.21 v 0.3 w 0.1 y 0.1 Z(1) 0.60 0.15 θ 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC MO-203 JEITA SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 10. Package outline SOT353-1 (TSSOP5) 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 10 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger Plastic surface-mounted package; 5 leads SOT753 D B E A X y HE vMA 5 4 Q A A1 c 1 2 3 detail X Lp e bp wM B 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.100 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT753 REFERENCES IEC JEDEC JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 11. Package outline SOT753 (SC-74A) 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 11 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× L1 L (2) e 6 e1 5 e1 4 6× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Fig 12. Package outline SOT886 (XSON6) 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 12 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm SOT891 1 2 b 3 4× (1) L1 e L 6 e1 5 e1 4 6× (1) A A1 D E terminal 1 index area 0 1 scale DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 max 0.04 b 0.20 0.12 D 1.05 0.95 E 1.05 0.95 e 0.55 e1 0.35 L 0.35 0.27 L1 0.40 0.32 2 mm Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION SOT891 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 Fig 13. Package outline SOT891 (XSON6) 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 13 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger 14. Abbreviations Table 11. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 15. Revision history Table 12. Revision history Release date 20070829 Data sheet status Product data sheet Change notice Supersedes 74LVC1G80_7 Document ID 74LVC1G80_8 Modifications: • • In Section 10 “Static characteristics”, changed conditions for input leakage and supply current. Figure 13 “Package outline SOT891 (XSON6)” updated. Product data sheet Product specification Product specification Product specification Product specification Product specification Product specification 74LVC1G80_6 74LVC1G80_5 74LVC1G80_4 74LVC1G80_3 74LVC1G80_2 74LVC1G80_1 - 74LVC1G80_7 74LVC1G80_6 74LVC1G80_5 74LVC1G80_4 74LVC1G80_3 74LVC1G80_2 74LVC1G80_1 20061012 20040910 20040629 20040429 20030526 20030130 20010404 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 14 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com 74LVC1G80_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 29 August 2007 15 of 16 NXP Semiconductors 74LVC1G80 Single D-type flip-flop; positive-edge trigger 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 August 2007 Document identifier: 74LVC1G80_8