74LVC2G125DP

74LVC2G125 Dual bus buffer/line driver; 3-state Rev. 08 — 7 September 2007 Product data sheet 1. General description The 74LVC2G125 provides a dual non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (pin nOE). A HIGH-level at pin nOE causes the output to assume a high-impedance OFF-state. Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features s s s s Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input/output for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: x JESD8-7 (1.65 V to 1.95 V) x JESD8-5 (2.3 V to 2.7 V) x JESD8-B/JESD36 (2.7 V to 3.6 V) ESD protection: x HBM EIA/JESD22-A114E exceeds 2000 V x MM EIA/JESD22-A115-A exceeds 200 V ±24 mA output drive (VCC = 3.0 V) CMOS low-power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options Specified from −40 °C to +85 °C and −40 °C to +125 °C s s s s s s s s NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 3. Ordering information Table 1: Ordering information Package Temperature range Name 74LVC2G125DP 74LVC2G125DC 74LVC2G125GT 74LVC2G125GM −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C TSSOP8 VSSOP8 XSON8 XQFN8 Description plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm Version SOT505-2 Type number plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm plastic extremely thin small outline package; no leads; SOT833-1 8 terminals; body 1 × 1.95 × 0.5 mm plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 × 1.6 × 0.5 mm SOT902-1 4. Marking Table 2: Marking codes Marking code V25 V25 V25 V25 Type number 74LVC2G125DP 74LVC2G125DC 74LVC2G125GT 74LVC2G125GM 5. Functional diagram 74LVC2G125 1A 1OE 2A 2OE EN2 mna941 001aae009 74LVC2G125 1Y EN1 2Y 2 1 Fig 1. Logic symbol Fig 2. IEC logic symbol 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 2 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 6. Pinning information 6.1 Pinning 74LVC2G125 1OE 1A 2Y GND 1 2 3 4 001aab738 8 7 6 5 VCC 2OE 1Y 2A Fig 3. Pin configuration TSSOP8 and VSSOP8 74LVC2G125 74LVC2G125 1OE 1 8 VCC terminal 1 index area 2OE 1 VCC 8 7 1OE 1A 2 7 2OE 1Y 2 6 1A 2Y 3 6 1Y 2A 3 4 5 2Y GND GND 4 5 2A 001aae010 001aab739 Transparent top view Transparent top view Fig 4. Pin configuration XSON8 Fig 5. Pin configuration XQFN8 6.2 Pin description Table 3: Symbol 1OE 1A 2Y GND 2A 1Y 2OE VCC Pin description Pin TSSOP8; VSSOP8 XSON8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 XQFN8 7 6 5 4 3 2 1 8 output enable input (active LOW) data input data output ground (0 V) data input data output output enable input (active LOW) supply voltage Description 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 3 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 7. Functional description Table 4: Control nOE L H [1] Function table[1] Input nA L H X Output nY L H Z H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state 8. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground 0 V). Symbol VCC IIK VI IOK VO Parameter supply voltage input clamping current input voltage output clamping current output voltage VO > VCC or VO < 0 V Enable mode Disable mode Power-down mode IO ICC IGND Tstg Ptot [1] [2] [1][2] [1][2] [1][2] Conditions VI < 0 V [1] Min −0.5 −50 −0.5 −0.5 −0.5 −0.5 −100 −65 Max +6.5 +6.5 ±50 VCC + 0.5 +6.5 +6.5 ±50 100 +150 300 Unit V mA V mA V V V mA mA mA °C mW output current supply current ground current storage temperature total power dissipation VO = 0 V to VCC Tamb = −40 °C to +125 °C - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. 9. Recommended operating conditions Table 6. Symbol VCC VI VO Recommended operating conditions Parameter supply voltage input voltage output voltage VCC = 1.65 V to 5.5 V; Enable mode VCC = 1.65 V to 5.5 V; Disable mode VCC = 0 V; Power-down mode Tamb ∆t/∆V ambient temperature input transition rise and fall rate VCC = 1.65 V to 2.7 V VCC = 2.7 V to 5.5 V Conditions Min 1.65 0 0 0 0 −40 Typ Max 5.5 5.5 VCC 5.5 5.5 +125 20 10 Unit V V V V V °C ns/V ns/V 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 4 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 10. Static characteristics Table 7: Static characteristics At recommended operating conditions; voltages are referenced to GND (ground 0 V). Symbol Parameter Tamb = −40 °C to +85 VIH °C[1] VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V VOH HIGH-level output voltage VI = VIH or VIL IO = −100 µA; VCC = 1.65 V to 5.5 V IO = −4 mA; VCC = 1.65 V IO = −8 mA; VCC = 2.3 V IO = −12 mA; VCC = 2.7 V IO = −24 mA; VCC = 3.0 V IO = −32 mA; VCC = 4.5 V II IOZ IOFF ICC ∆ICC Ci input leakage current OFF-state output current power-off leakage current supply current additional supply current input capacitance VI = 5.5 V or GND; VCC = 0 V to 5.5 V VI = VIH or VIL; VO = 5.5 V or GND; VCC = 3.6 V VI or VO = 5.5 V; VCC = 0 V VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A per pin; VI = VCC − 0.6 V; IO = 0 A; VCC = 2.3 V to 5.5 V VCC − 0.1 1.2 1.9 2.2 2.3 3.8 ±0.1 ±0.1 ±0.1 0.1 5 2 ±5 ±10 ±10 10 500 V V V V V V µA µA µA µA µA pF 0.1 0.45 0.3 0.4 0.55 0.55 V V V V V V 0.65VCC 1.7 2.0 0.7VCC 0.35VCC 0.7 0.8 0.3VCC V V V V V V V V HIGH-level input voltage Conditions Min Typ Max Unit 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 5 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state Table 7: Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground 0 V). Symbol Parameter Tamb = −40 °C to +125 °C VIH HIGH-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V VOH HIGH-level output voltage VI = VIH or VIL IO = −100 µA; VCC = 1.65 V to 5.5 V IO = −4 mA; VCC = 1.65 V IO = −8 mA; VCC = 2.3 V IO = −12 mA; VCC = 2.7 V IO = −24 mA; VCC = 3.0 V IO = −32 mA; VCC = 4.5 V II IOZ IOFF ICC ∆ICC input leakage current OFF-state output current power-off leakage current supply current additional supply current VI = 5.5 V or GND; VCC = 0 V to 5.5 V VI = VIH or VIL; VO = 5.5 V or GND; VCC = 3.6 V VI or VO = 5.5 V; VCC = 0 V VI = 5.5 V or GND; VCC = 1.65 V to 5.5 V; IO = 0 A per pin; VI = VCC − 0.6 V; IO = 0 A; VCC = 2.3 V to 5.5 V VCC − 0.1 0.95 1.7 1.9 2.0 3.4 ±20 ±20 ±20 40 5 V V V V V V µA µA µA µA mA 0.1 0.70 0.45 0.60 0.80 0.80 V V V V V V 0.65VCC 1.7 2.0 0.7VCC 0.35VCC 0.7 0.8 0.3VCC V V V V V V V V Conditions Min Typ Max Unit [1] Typical values are measured at VCC = 3.3 V and Tamb = 25 °C. 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 6 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground 0 V); for test circuit see Figure 8. Symbol Parameter tpd Conditions [2] −40 °C to +85 °C Min Typ[1] 3.7 2.5 2.7 2.3 1.9 4.3 2.8 3.3 2.4 2.0 3.5 1.8 2.7 2.7 1.8 18 5 Max 9.1 4.8 4.8 4.3 3.7 9.9 5.6 5.7 4.7 3.8 11.6 5.8 4.8 4.6 3.4 - −40 °C to +125 °C Unit Min 1.0 0.5 1.0 0.5 0.5 1.5 1.0 1.5 0.5 0.5 1.0 0.5 1.0 1.0 0.5 Max 11.4 6.0 6.0 5.5 4.6 12.4 7.0 7.1 5.9 4.8 14.1 7.6 6.2 5.9 4.6 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns pF pF propagation delay nA to nY; see Figure 6 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 1.0 0.5 1.0 0.5 0.5 [3] ten enable time nOE to nY; see Figure 7 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 1.5 1.0 1.5 0.5 0.5 [4] tdis disable time nOE to nY; see Figure 7 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 1.0 0.5 1.0 1.0 0.5 [5] CPD power dissipation capacitance per buffer; VI = GND to VCC output enabled output disabled - [1] [2] [3] [4] [5] Typical values are measured at nominal VCC and at Tamb = 25 °C. tpd is the same as tPLH and tPHL ten is the same as tPZH and tPZL tdis is the same as tPLZ and tPHZ CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 7 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 12. Waveforms VI nA input GND VM tPHL VOH nY output VOL tPLH VM mna230 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 6. Propagation delay input (nA) to output (nY) VI nOE input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VX tPZH tPZL VM outputs disabled outputs enabled mna362 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 7. 3-state output enable and disable times Table 9: VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V Measurement points Input VM 0.5VCC 0.5VCC 1.5 V 1.5 V 0.5VCC Output VM 0.5VCC 0.5VCC 1.5 V 1.5 V 0.5VCC VX VOL + 0.15 V VOL + 0.15 V VOL + 0.3 V VOL + 0.3 V VOL + 0.3 V VY VOH − 0.15 V VOH − 0.15 V VOH − 0.3 V VOH − 0.3 V VOH − 0.3 V Supply voltage 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 8 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state VEXT VCC VI VO DUT RT CL RL RL G mna616 Test data is given in Table 10. Definitions for test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. VEXT = Test voltage for switching times. Fig 8. Load circuitry for switching times Table 10: VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V Test data Input VI VCC VCC 2.7 V 2.7 V VCC tr, tf ≤ 2.0 ns ≤ 2.0 ns ≤ 2.5 ns ≤ 2.5 ns ≤ 2.5 ns Load CL 30 pF 30 pF 50 pF 50 pF 50 pF RL 1 kΩ 500 Ω 500 Ω 500 Ω 500 Ω VEXT tPLH, tPHL open open open open open tPZH, tPHZ GND GND GND GND GND tPZL, tPLZ 2VCC 2VCC 6V 6V 2VCC Supply voltage 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 9 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 D E A X c y HE vMA Z 8 5 A pin 1 index A2 A1 (A3) Lp L θ 1 e bp 4 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.00 A2 0.95 0.75 A3 0.25 bp 0.38 0.22 c 0.18 0.08 D(1) 3.1 2.9 E(1) 3.1 2.9 e 0.65 HE 4.1 3.9 L 0.5 Lp 0.47 0.33 v 0.2 w 0.13 y 0.1 Z(1) 0.70 0.35 θ 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC --JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 Fig 9. Package outline SOT502-2 (TSSOP8) 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 10 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 D E A X c y HE vMA Z 8 5 Q A pin 1 index A2 A1 (A3) θ Lp L 1 e bp 4 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.15 0.00 A2 0.85 0.60 A3 0.12 bp 0.27 0.17 c 0.23 0.08 D(1) 2.1 1.9 E(2) 2.4 2.2 e 0.5 HE 3.2 3.0 L 0.4 Lp 0.40 0.15 Q 0.21 0.19 v 0.2 w 0.13 y 0.1 Z(1) 0.4 0.1 θ 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC MO-187 JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 Fig 10. Package outline SOT765-1 (VSSOP8) 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 11 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm SOT833-1 1 2 3 b 4 4× L (2) L1 e 8 e1 7 e1 6 e1 5 8× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 2.0 1.9 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT833-1 REFERENCES IEC --JEDEC MO-252 JEITA --EUROPEAN PROJECTION ISSUE DATE 04-07-22 04-11-09 Fig 11. Package outline SOT833-1 (XSON8) 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 12 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT902-1 D terminal 1 index area B A E A A1 detail X L1 L e 4 e ∅v M C A B ∅w M C 5 C y1 C y 3 metal area not for soldering 2 6 b e1 e1 7 1 terminal 1 index area 8 X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 1.65 1.55 E 1.65 1.55 e 0.55 e1 0.5 L 0.35 0.25 L1 0.15 0.05 v 0.1 w 0.05 y 0.05 y1 0.05 OUTLINE VERSION SOT902-1 REFERENCES IEC --JEDEC MO-255 JEITA --- EUROPEAN PROJECTION ISSUE DATE 05-11-16 05-11-25 Fig 12. Package outline SOT902-1 (XQFN8) 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 13 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 14. Abbreviations Table 11: Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 15. Revision history Table 12: Revision history Release date 20070907 Data sheet status Product data sheet Change notice Supersedes 74LVC2G125_7 Document ID 74LVC2G125_8 Modifications: • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. In Section 10 “Static characteristics”, changed conditions for input leakage and supply current. Product data sheet Product data sheet Product specification Product specification Product specification Product specification Product specification 74LVC2G125_6 74LVC2G125_5 74LVC2G125_4 74LVC2G125_3 74LVC2G125_2 74LVC2G125_1 - 74LVC2G125_7 74LVC2G125_6 74LVC2G125_5 74LVC2G125_4 74LVC2G125_3 74LVC2G125_2 74LVC2G125_1 20060523 20051223 20050201 20040922 20040109 20030901 20030310 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 14 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com 74LVC2G125_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 7 September 2007 15 of 16 NXP Semiconductors 74LVC2G125 Dual bus buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 September 2007 Document identifier: 74LVC2G125_8