74LVC3GU04
Triple unbuffered inverter
Rev. 11 — 9 April 2013
Product data sheet
1. General description
The 74LVC3GU04 is a triple unbuffered inverter.
Inputs can be driven from either 3.3 V or 5 V devices. These features allow the use of
these devices in a mixed 3.3 V and 5 V environment.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
24 mA output drive at VCC = 3.0 V
CMOS low power consumption
Latch-up performance exceeds 250 mA
Multiple package options
Specified from 40 C to +85 C and from 40 C to +125 C.
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC3GU04DP
40 C to +125 C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74LVC3GU04DC
40 C to +125 C
VSSOP8
plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
SOT765-1
74LVC3GU04GT
40 C to +125 C
XSON8
plastic extremely thin small outline package; no leads;
8 terminals; body 1 1.95 0.5 mm
SOT833-1
74LVC3GU04GF
40 C to +125 C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.35 1 0.5 mm
SOT1089
74LVC3GU04GD 40 C to +125 C
XSON8
plastic extremely thin small outline package; no leads;
8 terminals; body 3 2 0.5 mm
SOT996-2
74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
Table 1.
Ordering information …continued
Type number
Package
Temperature range
Name
Description
Version
74LVC3GU04GM 40 C to +125 C
XQFN8
plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 1.6 0.5 mm
SOT902-2
74LVC3GU04GN 40 C to +125 C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.2 1.0 0.35 mm
SOT1116
40 C to +125 C
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.35 1.0 0.35 mm
SOT1203
74LVC3GU04GS
4. Marking
Table 2.
Marking codes
Type number
Marking code[1]
74LVC3GU04DP
VU04
74LVC3GU04DC
VU4
74LVC3GU04GT
VU4
74LVC3GU04GF
YD
74LVC3GU04GD
VU4
74LVC3GU04GM
VU4
74LVC3GU04GN
YD
74LVC3GU04GS
YD
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
1
1A
1Y
1
2A
2Y
3A
3Y
1
001aah794
001aah793
Fig 1.
Logic symbol
74LVC3GU04
Product data sheet
Fig 2.
IEC logic symbol
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
VCC
VCC
100 Ω
A
Y
mna636
Fig 3.
Logic diagram (one gate)
6. Pinning information
6.1 Pinning
74LVC3GU04
1A
1
8
VCC
3Y
2
7
1Y
2A
3
6
3A
GND
4
5
2Y
74LVC3GU04
1A
1
8
VCC
3Y
2
7
1Y
2A
3
6
3A
GND
4
5
2Y
001aac021
Transparent top view
mnb120
Fig 4.
Pin configuration SOT505-2 and SOT765-1
Fig 5.
Pin configuration SOT833-1, SOT1089,
SOT1116 and SOT1203
74LVC3GU04
1
8
VCC
3Y
2
7
1Y
2A
3
6
3A
GND
4
5
2Y
3A
2Y
001aal098
Pin configuration SOT996-2
74LVC3GU04
Product data sheet
7
1A
2
6
3Y
3
5
2A
001aag056
Transparent top view
Transparent top view
Fig 6.
8
1
GND
1A
1Y
4
74LVC3GU04
VCC
terminal 1
index area
Fig 7.
Pin configuration SOT902-2
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
6.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SOT505-2, SOT765-1, SOT833-1, SOT1089,
SOT996-2, SOT1116 and SOT1203
SOT902-2
1A, 2A, 3A
1, 3, 6
7, 5, 2
data input
GND
4
4
ground (0 V)
1Y, 2Y, 3Y
7, 5, 2
1, 3, 6
data output
VCC
8
8
supply voltage
7. Functional description
Table 4.
Function table[1]
Input nA
Output nY
L
H
H
L
[1]
H = HIGH voltage level; L = LOW voltage level.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+6.5
V
[1]
0.5
+6.5
V
[1]
0.5
VCC + 0.5
V
VI
input voltage
VO
output voltage
Active mode
IIK
input clamping current
VI < 0 V
50
-
mA
IOK
output clamping current
VO > VCC or VO < 0 V
-
50
mA
IO
output current
VO = 0 V to VCC
ICC
supply current
IGND
ground current
Ptot
total power dissipation
Tstg
storage temperature
[1]
[2]
Tamb = 40 C to +125 C
[2]
-
50
mA
-
100
mA
100
-
mA
-
250
mW
65
+150
C
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For TSSOP8 packages: above 55 C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 packages: above 110 C the value of Ptot derates linearly with 8.0 mW/K.
For XSON8 and XQFN8 packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
74LVC3GU04
Product data sheet
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
9. Recommended operating conditions
Table 6.
Operating conditions
Symbol
Parameter
VCC
Conditions
Min
Max
Unit
supply voltage
1.65
5.5
V
VI
input voltage
0
5.5
V
VO
output voltage
Active mode
0
VCC
V
Power-down mode; VCC = 0 V
0
5.5
V
40
+125
C
VCC = 1.65 V to 2.7 V
-
20
ns/V
VCC = 2.7 V to 5.5 V
-
10
ns/V
Max
Unit
V
Tamb
ambient temperature
t/V
input transition rise and fall rate
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Typ[1]
Conditions
Min
VCC = 1.65 V to 5.5 V
0.75 VCC -
-
-
-
0.25 VCC V
IO = 100 A;
VCC = 1.65 V to 5.5 V
VCC 0.1
-
-
V
Tamb = 40 C to +85 C
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
VCC = 1.65 V to 5.5 V
VOH
HIGH-level output voltage
VI = VIH or VIL
VOL
LOW-level output voltage
IO = 4 mA; VCC = 1.65 V
1.2
-
-
V
IO = 8 mA; VCC = 2.3 V
1.9
-
-
V
IO = 12 mA; VCC = 2.7 V
2.2
-
-
V
IO = 24 mA; VCC = 3.0 V
2.3
-
-
V
IO = 32 mA; VCC = 4.5 V
3.8
-
-
V
IO = 100 A;
VCC = 1.65 V to 5.5 V
-
-
0.1
V
VI = VIH or VIL
IO = 4 mA; VCC = 1.65 V
-
-
0.45
V
IO = 8 mA; VCC = 2.3 V
-
-
0.3
V
IO = 12 mA; VCC = 2.7 V
-
-
0.4
V
IO = 24 mA; VCC = 3.0 V
-
-
0.55
V
-
-
0.55
V
II
input leakage current
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
IO = 32 mA; VCC = 4.5 V
-
0.1
5
A
ICC
supply current
VI = 5.5 V or GND;
VCC = 1.65 V to 5.5 V; IO = 0 A
-
0.1
10
A
CI
input capacitance
-
5
-
pF
74LVC3GU04
Product data sheet
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VCC = 1.65 V to 5.5 V
0.8 VCC
-
-
V
-
-
0.2 VCC
V
IO = 100 A;
VCC = 1.65 V to 5.5 V
VCC 0.1
-
-
V
Tamb = 40 C to +125 C
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
VCC = 1.65 V to 5.5 V
VOH
HIGH-level output voltage
VI = VIH or VIL
LOW-level output voltage
VOL
IO = 4 mA; VCC = 1.65 V
0.95
-
-
V
IO = 8 mA; VCC = 2.3 V
1.7
-
-
V
IO = 12 mA; VCC = 2.7 V
1.9
-
-
V
IO = 24 mA; VCC = 3.0 V
2.0
-
-
V
IO = 32 mA; VCC = 4.5 V
3.4
-
-
V
IO = 100 A;
VCC = 1.65 V to 5.5 V
-
-
0.1
V
VI = VIH or VIL
IO = 4 mA; VCC = 1.65 V
-
-
0.70
V
IO = 8 mA; VCC = 2.3 V
-
-
0.45
V
IO = 12 mA; VCC = 2.7 V
-
-
0.60
V
IO = 24 mA; VCC = 3.0 V
-
-
0.80
V
IO = 32 mA; VCC = 4.5 V
-
-
0.80
V
II
input leakage current
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
-
-
20
A
ICC
supply current
VI = 5.5 V or GND;
VCC = 1.65 V to 5.5 V; IO = 0 A
-
-
40
A
[1]
All typical values are measured at Tamb = 25 C.
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9.
Symbol Parameter
tpd
40 C to +85 C
Conditions
propagation delay nA to nY; see Figure 8
74LVC3GU04
Product data sheet
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
[2]
VCC = 1.65 V to 1.95 V
0.5
2.3
5.0
0.5
6.3
ns
VCC = 2.3 V to 2.7 V
0.3
1.8
4.0
0.3
4.0
ns
VCC = 2.7 V
0.3
2.6
4.5
0.3
5.6
ns
VCC = 3.0 V to 3.6 V
0.3
2.3
3.7
0.3
4.5
ns
VCC = 4.5 V to 5.5 V
0.3
1.7
3.0
0.3
3.8
ns
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
Table 8.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9.
Symbol Parameter
CPD
power dissipation
capacitance
40 C to +85 C
Conditions
[3]
VI = GND to VCC; VCC = 3.3 V
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
-
7
-
-
-
[1]
Typical values are measured at Tamb = 25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.
[2]
tpd is the same as tPLH and tPHL.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
pF
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
12. Waveforms
VI
VM
nA input
VM
GND
t PHL
t PLH
VOH
VM
nY output
VOL
VM
mna344
Measurement points are given in Table 9.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8.
Table 9.
The input (nA) to output (nY) propagation delays
Measurement points
Supply voltage
Input
Output
VCC
VM
VM
1.65 V to 1.95 V
0.5 VCC
0.5 VCC
2.3 V to 2.7 V
0.5 VCC
0.5 VCC
2.7 V
1.5 V
1.5 V
3.0 V to 3.6 V
1.5 V
1.5 V
4.5 V to 5.5 V
0.5 VCC
0.5 VCC
74LVC3GU04
Product data sheet
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
VEXT
VCC
VI
RL
VO
G
DUT
RT
CL
RL
mna616
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 9.
Table 10.
Test circuit for measuring switching times
Test data
Supply voltage
Input
VCC
VI
tr = tf
CL
RL
tPLH, tPHL
1.65 V to 1.95 V
VCC
2.0 ns
30 pF
1 k
open
2.3 V to 2.7 V
VCC
2.0 ns
30 pF
500
open
2.7 V
2.7 V
2.5 ns
50 pF
500
open
3.0 V to 3.6 V
2.7 V
2.5 ns
50 pF
500
open
4.5 V to 5.5 V
VCC
2.5 ns
50 pF
500
open
74LVC3GU04
Product data sheet
Load
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Rev. 11 — 9 April 2013
VEXT
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
13. Additional characteristics
mnb108
160
gfs
(mA/V)
120
Rbias = 560 kΩ
80
VCC
0.47 μF
input
output
40
100 μF
VI
(f = 1 kHz)
A IO
0
GND
0
1
2
3
5
6
VCC (V)
4
mna050
Tamb = 25 C.
I O
g fs = -------V I
Fig 10. Test set-up for measuring forward
transconductance
Fig 11. Typical forward transconductance as
a function of supply voltage
14. Application information
R2
R1
VCC
1 μF
R2
R1
U04
U04
C1
ZL
C2
out
mna053
mna052
ZL > 10 k
C1 = 47 pF
R1 3 k
C2 = 22 pF
R2 1 M
R1 = 1 M to 10 M
Open loop gain: Gol = 20
R2 optimum value depends on the frequency and
required stability against changes in VCC or average
minimum ICC (ICC = 2 mA at VCC = 3.3 V and
f = 10 MHz).
G ol
R1
1 + ------- 1 + G ol
R2
Voltage gain: G v = – ---------------------------------------
Vo(p-p) = VCC 1.5 V centered at 0.5 VCC
Unity gain bandwidth product is 5 MHz.
Fig 12. Linear amplifier application
Fig 13. Crystal oscillator application
Remark: All values given are typical values unless otherwise specified.
74LVC3GU04
Product data sheet
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
15. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
D
E
A
SOT505-2
X
c
HE
y
v M A
Z
5
8
A
A2
(A3)
A1
pin 1 index
θ
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.00
0.95
0.75
0.25
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.5
0.47
0.33
0.2
0.13
0.1
0.70
0.35
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-2
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-01-16
---
Fig 14. Package outline SOT505-2 (TSSOP8)
74LVC3GU04
Product data sheet
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
D
E
SOT765-1
A
X
c
y
HE
v M A
Z
5
8
Q
A
A2
A1
pin 1 index
(A3)
θ
Lp
1
4
e
L
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
Q
v
w
y
Z(1)
θ
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.40
0.15
0.21
0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT765-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
MO-187
Fig 15. Package outline SOT765-1 (VSSOP8)
74LVC3GU04
Product data sheet
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
1
2
SOT833-1
b
4
3
4×
(2)
L
L1
e
8
7
6
e1
5
e1
e1
8×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
2.0
1.9
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT833-1
---
MO-252
---
EUROPEAN
PROJECTION
ISSUE DATE
07-11-14
07-12-07
Fig 16. Package outline SOT833-1 (XSON8)
74LVC3GU04
Product data sheet
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1 x 0.5 mm
SOT1089
E
terminal 1
index area
D
A
A1
detail X
(4×)(2)
e
L
(8×)(2)
b 4
5
e1
1
terminal 1
index area
8
L1
X
0
0.5
scale
Dimensions
Unit
mm
max
nom
min
1 mm
A(1)
0.5
A1
b
D
E
e
e1
L
L1
0.35 0.40
0.04 0.20 1.40 1.05
0.15 1.35 1.00 0.55 0.35 0.30 0.35
0.27 0.32
0.12 1.30 0.95
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
SOT1089
sot1089_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-09
10-04-12
MO-252
Fig 17. Package outline SOT1089 (XSON8)
74LVC3GU04
Product data sheet
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
13 of 21
74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
XSON8: plastic extremely thin small outline package; no leads;
8 terminals; body 3 x 2 x 0.5 mm
B
D
SOT996-2
A
E
A
A1
detail X
terminal 1
index area
e1
1
4
8
5
C
C A B
C
v
w
b
e
L1
y
y1 C
L2
L
X
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit(1)
mm
max
nom
min
A
A1
b
0.05 0.35
D
E
2.1
3.1
0.5
0.00 0.15
1.9
e
e1
0.5
1.5
2.9
L
L1
L2
0.5
0.15
0.6
0.3
0.05
0.4
v
0.1
w
y
0.05 0.05
y1
0.1
sot996-2_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
07-12-21
12-11-20
SOT996-2
Fig 18. Package outline SOT996-2 (XSON8)
74LVC3GU04
Product data sheet
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
14 of 21
74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-2
X
A
B
D
terminal 1
index area
E
A
A1
detail X
e
v
w
b
4
3
C
C A B
C
y
y1 C
5
e1
2
6
1
7
terminal 1
index area
8
L
metal area
not for soldering
L1
0
1
Dimensions
Unit(1)
mm
max
nom
min
2 mm
scale
A
0.5
A1
b
D
E
e
e1
0.05 0.25 1.65 1.65
0.20 1.60 1.60 0.55
0.00 0.15 1.55 1.55
0.5
L
L1
v
0.35 0.15
0.30 0.10
0.25 0.05
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT902-2
---
MO-255
---
sot902-2_po
European
projection
Issue date
10-11-02
11-03-31
Fig 19. Package outline SOT902-2 (XQFN8)
74LVC3GU04
Product data sheet
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Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
15 of 21
74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.2 x 1.0 x 0.35 mm
1
2
SOT1116
b
4
3
(4×)(2)
L
L1
e
8
7
e1
6
e1
5
e1
(8×)(2)
A1
A
D
E
terminal 1
index area
0
0.5
scale
Dimensions
Unit
mm
1 mm
A(1)
A1
b
D
E
e
e1
max 0.35 0.04 0.20 1.25 1.05
nom
0.15 1.20 1.00 0.55
min
0.12 1.15 0.95
0.3
L
L1
0.35 0.40
0.30 0.35
0.27 0.32
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
sot1116_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-02
10-04-07
SOT1116
Fig 20. Package outline SOT1116 (XSON8)
74LVC3GU04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
16 of 21
74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1.0 x 0.35 mm
SOT1203
b
2
1
3
(4×)(2)
4
L
L1
e
8
7
6
e1
e1
5
e1
(8×)(2)
A1
A
D
E
terminal 1
index area
0
0.5
scale
Dimensions
Unit
mm
1 mm
A(1)
A1
b
D
E
e
e1
L
L1
max 0.35 0.04 0.20 1.40 1.05
0.35 0.40
nom
0.15 1.35 1.00 0.55 0.35 0.30 0.35
min
0.12 1.30 0.95
0.27 0.32
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
Outline
version
sot1203_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
10-04-02
10-04-06
SOT1203
Fig 21. Package outline SOT1203 (XSON8)
74LVC3GU04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
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74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
16. Abbreviations
Table 11.
Abbreviations
Acronym
Description
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
17. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC3GU04 v.11
20130409
Product data sheet
-
74LVC3GU04 v.10
Modifications:
74LVC3GU04 v.10
Modifications:
74LVC3GU04 v.9
Modifications:
•
For type number 74LVC3GU04GD XSON8U has changed to XSON8.
20120706
•
20111123
•
Product data sheet
-
74LVC3GU04 v.9
For type number 74LVC3GU04GM the SOT code has changed to SOT902-2.
Product data sheet
-
74LVC3GU04 v.8
Legal pages updated.
74LVC3GU04 v.8
20101110
Product data sheet
-
74LVC3GU04 v.7
74LVC3GU04 v.7
20091111
Product data sheet
-
74LVC3GU04 v.6
74LVC3GU04 v.6
20080304
Product data sheet
-
74LVC3GU04 v.5
74LVC3GU04 v.5
20071005
Product data sheet
-
74LVC3GU04 v.4
74LVC3GU04 v.4
20070315
Product data sheet
-
74LVC3GU04 v.3
74LVC3GU04 v.3
20050201
Product data sheet
-
74LVC3GU04 v.2
74LVC3GU04 v.2
20041027
Product data sheet
-
74LVC3GU04 v.1
74LVC3GU04 v.1
20040512
Product data sheet
-
-
74LVC3GU04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
18 of 21
74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVC3GU04
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
19 of 21
74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC3GU04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 9 April 2013
© NXP B.V. 2013. All rights reserved.
20 of 21
74LVC3GU04
NXP Semiconductors
Triple unbuffered inverter
20. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Additional characteristics . . . . . . . . . . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 April 2013
Document identifier: 74LVC3GU04