74LVT126
3.3 V quad buffer; 3-state
Rev. 04 — 11 February 2005
Product data sheet
1. General description
The LVT126 is a high-performance BiCMOS product designed for VCC operation at 3.3 V.
This device combines low static and dynamic power dissipation with high speed and high
output drive. The 74LVT126 device is a quad buffer that is ideal for driving bus lines. The
device features four output enable inputs (1OE, 2OE, 3OE and 4OE), each controlling one
of the 3-state outputs.
2. Features
■
■
■
■
■
■
■
■
■
■
■
Quad bus interface
3-state buffers
Output capability: +64 mA and −32 mA
TTL input and output switching levels
Input and output interface capability to systems at 5 V supply
Bus-hold data inputs eliminate the need for external pull-up resistors to hold unused
inputs
Live insertion and extraction permitted
No bus current loading when output is tied to 5 V bus
Power-up 3-state
Latch-up protection:
◆ JESD78: exceeds 500 mA
ESD protection:
◆ MIL STD 883 method 3015: exceeds 2000 V
◆ Machine model: exceeds 200 V
3. Quick reference data
Table 1:
Quick reference data
GND = 0 V; Tamb = 25 °C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
tPLH
propagation delay nA to nY CL = 50 pF; VCC = 3.3 V
-
2.3
-
ns
tPHL
propagation delay nA to nY CL = 50 pF; VCC = 3.3 V
-
2.4
-
ns
CI
input capacitance
VI = 0 V or VCC
-
4
-
pF
CO
output capacitance
outputs disabled;
VO = 0 V or 3.0 V
-
8
-
pF
ICC
quiescent supply current
outputs disabled;
VCC = 3.6 V
-
0.13
-
mA
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
4. Ordering information
Table 2:
Ordering information
Type number Package
Temperature range Name
Description
Version
74LVT126D
−40 °C to +85 °C
SO14
plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
74LVT126DB
−40 °C to +85 °C
SSOP14
plastic shrink small outline package; 14 leads; body width
5.3 mm
SOT337-1
74LVT126PW −40 °C to +85 °C
TSSOP14
plastic thin shrink small outline package; 14 leads; body
width 4.4 mm
SOT402-1
74LVT126BQ −40 °C to +85 °C
DHVQFN14 plastic dual in-line compatible thermal enhanced very thin
quad flat package; no leads; 14 terminals;
body 2.5 × 3 × 0.85 mm
SOT762-1
5. Functional diagram
2
1Y
1A
3
1
1 1OE
5
2Y
2A
6
3Y
3A
8
4Y
4A
11
5
6
9
8
12
11
13
13 4OE
001aac482
Fig 1. Logic symbol
9397 750 14553
Product data sheet
3
EN1
10
10 3OE
12
1
4
4 2OE
9
2
001aac483
Fig 2. IEC logic symbol
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
2 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
6. Pinning information
1OE
1
terminal 1
index area
2
13 4OE
12 4A
1Y
3
2OE
4
2A
5
2Y
6
9
3A
GND
7
8
3Y
126
11 4Y
10 3OE
13 4OE
1Y
3
2OE
4
126
12 4A
2A
5
GND(1)
2Y
6
11 4Y
10 3OE
9
3A
001aac485
Transparent top view
(1) The die substrate is attached to the
exposed die pad using conductive die
attach material. It can not be used as
a supply pin or input.
001aac484
Fig 3. Pin configuration SO14, SSOP14
and TSSOP14
2
8
1A
1A
3Y
14 VCC
7
1
GND
1OE
14 VCC
6.1 Pinning
Fig 4. Pin configuration DHVQFN14
6.2 Pin description
Table 3:
Pin description
Symbol
Pin
Description
1OE
1
1 output enable input
1A
2
1 data input
1Y
3
1 data output
2OE
4
2 output enable input
2A
5
2 data input
2Y
6
2 data output
GND
7
ground (0 V)
3Y
8
3 data output
3A
9
3 data input
3OE
10
3 output enable input
4Y
11
4 data output
4A
12
4 data input
4OE
13
4 output enable input
VCC
14
supply voltage
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
3 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
7. Functional description
7.1 Function table
Table 4:
Function table [1]
Input
Output
nOE
nA
nY
H
L
L
H
H
H
L
X
Z
[1]
H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
8. Limiting values
Table 5:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Max
Unit
−0.5
+4.6
V
[1]
−0.5
+7.0
V
[1]
−0.5
+7.0
V
mA
VI
input voltage
VO
output voltage
output in OFF-state or
HIGH-state
IIK
input diode current
VI < 0 V
-
−50
IOK
output diode current
VO < 0 V
-
−50
mA
IO
output current
output in LOW-state
-
128
mA
output in HIGH-state
-
−64
mA
−65
+150
°C
-
150
°C
Tstg
Tj
storage temperature
junction temperature
[2]
[1]
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings
are observed.
[2]
The performance capability of a high-performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability.
9397 750 14553
Product data sheet
Min
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
4 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
9. Recommended operating conditions
Table 6:
Recommended operating conditions
Symbol
Parameter
VCC
Conditions
Min
Typ
Max
Unit
supply voltage
2.7
-
3.6
V
VI
input voltage
0
-
5.5
V
VIH
HIGH-level input voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
IOH
HIGH-level output current
-
-
−32
mA
IOL
LOW-level output current
none
-
-
32
mA
current duty cycle
≤ 50 %; f ≥ 1 kHz
-
-
64
mA
∆t/∆V
input transition rise or fall
rate
outputs enabled
-
-
10
ns/V
Tamb
ambient temperature
in free air
−40
-
+85
°C
10. Static characteristics
Table 7:
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Tamb = −40 °C to +85
Conditions
Min
Typ
Max
−0.9
−1.2
Unit
°C [1]
VIK
input diode voltage
IIK = −18 mA; VCC = 2.7 V
-
VOH
HIGH-level output voltage
IOH = −100 µA;
VCC = 2.7 V to 3.6 V;
VCC − 0.2 VCC − 0.1 -
V
IOH = −8 mA; VCC = 2.7 V
2.4
2.5
-
V
IOH = −32 mA; VCC = 3.0 V
2.0
2.2
-
V
IOL = 100 µA
-
0.1
0.2
V
IOL = 24 mA
-
0.3
0.5
V
IOL = 16 mA
-
0.25
0.4
V
IOL = 32 mA
-
0.3
0.5
V
IOL = 64 mA
-
0.4
0.55
V
-
1
10
µA
-
±0.1
±1
µA
-
0.1
1
µA
VOL
LOW-level output voltage
V
VCC = 2.7 V
VCC = 3.0 V
ILI
input leakage current
all input pins
VCC = 0 V or 3.6 V; VI = 5.5 V
control pins
VCC = 3.6 V; VCC or GND
data pins
IOFF
IHOLD
VCC = 3.6 V; VI = VCC
[2]
VCC = 3.6 V; VI = 0 V
[2]
-
−1
−5
µA
-
1
±100
µA
75
150
-
µA
VCC = 3 V; VI = 2.0 V
−75
−150
-
µA
VCC = 0 V to 3.6 V; VI = 3.6 V
±500
-
-
µA
power-down output current VCC = 0 V; VI or VO = 0 V to 4.5 V
bus hold current A input
VCC = 3 V; VI = 0.8 V
9397 750 14553
Product data sheet
[3]
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
5 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
Table 7:
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
IEX
external current into output output in HIGH-state when
VO > VCC; VO = 5.5 V and
VCC = 3.0 V
IPU, IPD
power-up or power-down
3-state output current
VCC ≤ 1.2 V; VO = 0.5 V to VCC;
VI = GND or VCC; nOE = don’t care
IOZ
3-state output current
VCC = 3.6 V
quiescent supply current
ICC
[4]
Min
Typ
Max
Unit
-
60
125
µA
-
±1
±100
µA
output HIGH: VO = 3.0 V
-
1
5
µA
output LOW: VO = 0.5 V
-
−1
−5
µA
VCC = 3.6 V; VI = GND or VCC;
IO = 0 A
outputs HIGH
-
0.13
0.19
mA
outputs LOW
-
2
7
mA
[5]
-
0.13
0.19
mA
[6]
-
0.1
0.2
mA
outputs disabled
∆ICC
additional supply current
per input pin
VCC = 3 V to 3.6 V; one input at
VCC − 0.6 V and other inputs at
VCC or GND
CI
input capacitance
VI = 0 V or VCC
-
4
-
pF
CO
output capacitance
outputs disabled; VO = 0 V or 3.0 V
-
8
-
pF
[1]
Typical values are measured at nominal VCC and Tamb = 25 °C.
[2]
Unused pins at VCC or GND.
[3]
This is the bus hold overdrive current required to force the input to the opposite logic state.
[4]
This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 ms. From VCC = 1.2 V to VCC = 3.3 V ± 0.3 V
a transition time of 100 µs is permitted. This parameter is valid for Tamb = 25 °C only.
[5]
Measured with outputs pulled up to VCC or GND.
[6]
This is the increase in supply current for each input at the specified voltage level other than VCC or GND.
11. Dynamic characteristics
Table 8:
Dynamic characteristics
GND = 0 V; tr = tf = 2.5 ns; CL = 50 pF; RL = 500 Ω; for test circuit see Figure 7.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VCC = 2.7 V
-
-
4.5
ns
VCC = 3.3 V ± 0.3 V
1.0
2.3
3.8
ns
Tamb = −40 °C to +85 °C [1]
tPLH
tPHL
tPZH
tPZL
propagation delay nA to nY
propagation delay nA to nY
output enable time nOE to nY
output enable time nOE to nY
VCC = 2.7 V
-
-
4.4
ns
VCC = 3.3 V ± 0.3 V
1.0
2.4
3.9
ns
VCC = 2.7 V
-
-
6.1
ns
VCC = 3.3 V ± 0.3 V
1.0
3.6
5.4
ns
VCC = 2.7 V
-
-
5.8
ns
VCC = 3.3 V ± 0.3 V
1.1
3.6
5.2
ns
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
6 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
Table 8:
Dynamic characteristics …continued
GND = 0 V; tr = tf = 2.5 ns; CL = 50 pF; RL = 500 Ω; for test circuit see Figure 7.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
tPHZ
VCC = 2.7 V
-
-
4.3
ns
VCC = 3.3 V ± 0.3 V
1.0
2.2
3.8
ns
VCC = 2.7 V
-
-
6.1
ns
VCC = 3.3 V ± 0.3 V
1.3
3.6
5.5
ns
output disable time nOE to nY
output disable time nOE to nY
tPLZ
[1]
Typical values are at VCC = 3.3 V and Tamb = 25 °C.
12. Waveforms
VI
nA input
VM
VM
GND
tPLH
tPHL
VOH
VM
nY output
VM
VOL
mnb072
VM = 1.5 V.
VOL and VOH are typical voltage output drop that occur with the output load.
Fig 5. Propagation delay input (nA) to output (nY)
VI
nOE input
VM
GND
t PZL
t PLZ
3.5 V
VM
nY output
VOL + 0.3 V
VOL
t PZH
t PHZ
VOH
nY output
VM
VOH − 0.3 V
0V
001aac486
VM = 1.5 V.
VOL and VOH are typical voltage output drop that occur with the output load.
Fig 6. Enable and disable times of 3-state outputs
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
7 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
VI
tW
90 %
90 %
negative
pulse
VM
0V
VI
tTHL(tf)
tTLH(tr)
tTLH(tr)
tTHL(tf)
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
10 %
tW
001aac221
VM = 1.5 V.
a. Input pulse definition
VEXT
VCC
PULSE
GENERATOR
VI
RL
VO
D.U.T.
CL
RT
RL
mna616
Test data is given in Table 9.
Definitions test circuit:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = Test voltage for switching times.
b. Test circuit
Fig 7. Load circuitry for switching times
Table 9:
Test data
Input
Load
VI
fi
tW
tr, tf
CL
RL
tPHZ, tPZH
tPLZ, tPZL
tPLH, tPHL
2.7 V
≤ 10 MHz
500 ns
≤ 2.5 ns
50 pF
500 Ω
GND
6V
open
9397 750 14553
Product data sheet
VEXT
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
8 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
13. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 8. Package outline SO14 (SOT108-1)
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
9 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
D
SOT337-1
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
7
1
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.4
0.9
8
o
0
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT337-1
REFERENCES
IEC
JEDEC
JEITA
MO-150
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SSOP14 (SOT337-1)
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
10 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 10. Package outline TSSOP14 (SOT402-1)
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
11 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT762-1
14 terminals; body 2.5 x 3 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
6
y
y1 C
v M C A B
w M C
b
L
1
7
Eh
e
14
8
13
9
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
c
D (1)
Dh
E (1)
Eh
0.2
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
2
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT762-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 11. Package outline DHVQFN14 (SOT762-1)
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
12 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
14. Revision history
Table 10:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
74LVT126_4
20050211
Product data sheet
-
9397 750 14553
74LVT126_3
•
Modifications:
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•
Figure 4: added Figure note 1.
74LVT126_3
20040624
Product data sheet
-
9397 750 13542
74LVT126_2
74LVT126_2
19980219
Product specification
-
9397 750 03515
74LVT126_1
74LVT126_1
-
-
-
-
-
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
13 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
15. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16. Definitions
17. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
18. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 14553
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 04 — 11 February 2005
14 of 15
74LVT126
Philips Semiconductors
3.3 V quad buffer; 3-state
19. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
12
13
14
15
16
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information . . . . . . . . . . . . . . . . . . . . 14
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 11 February 2005
Document number: 9397 750 14553
Published in The Netherlands
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