74LVT241BQ,115

74LVT241 3.3 V octal buffer/line driver; 3-state Rev. 03 — 7 May 2008 Product data sheet 1. General description The 74LVT241 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. This device is an octal buffer that is ideal for driving bus lines. The device features two output enables (1OE, 2OE), each controlling four of the 3-state outputs. 2. Features n n n n n n n n n n n 3-state buffers Octal bus interface Input and output interface capability to systems at 5 V supply TTL input and output switching levels Output capability: +64 mA/−32 mA Latch-up protection exceeds 500 mA per JESD78 class II level A ESD protection: u HBM JESD22-A114E exceeds 2000 V u MM JESD22-A115-A exceeds 200 V Bus-hold data inputs eliminate the need for external pull-up resistors for unused inputs Live insertion/extraction permitted Power-up 3-state No bus current loading when output is tied to 5 V bus 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVT241D −40 °C to +85 °C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 74LVT241DB −40 °C to +85 °C SSOP20 plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 74LVT241PW −40 °C to +85 °C TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 74LVT241BQ −40 °C to +85 °C DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 × 4.5 × 0.85 mm SOT764-1 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state 4. Functional diagram 2 4 6 8 1 17 15 13 11 19 1A0 1Y0 1A1 1Y1 1A2 1Y2 1A3 1Y3 18 16 14 12 1 EN 1OE 2A0 2Y0 2A1 2Y1 2A2 2Y2 2A3 2Y3 3 2 18 4 16 6 14 8 12 5 19 7 9 2OE EN 11 9 13 7 15 5 17 3 mna773 mna772 Fig 1. Logic symbol Fig 2. 74LVT241_3 Product data sheet IEC logic symbol © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 2 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state 5. Pinning information 5.1 Pinning 1 terminal 1 index area 20 VCC 1OE 74LVT241 1A0 2 19 2OE 2Y0 3 18 1Y0 1A1 4 17 2A0 1OE 1 20 VCC 1A0 2 19 2OE 2Y0 3 18 1Y0 2Y1 5 16 1Y1 17 2A0 1A2 6 15 2A1 16 1Y1 2Y2 7 4 2Y1 5 1A2 6 2Y2 7 14 1Y2 1A3 8 13 2A2 2Y3 9 12 1Y3 GND 10 11 2A3 15 2A1 1A3 8 2Y3 9 14 1Y2 GND(1) 13 2A2 12 1Y3 GND 10 74LVT241 2A3 11 1A1 001aah735 Transparent top view 001aah734 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 3. Pin configuration for SO20 and (T)SSOP20 Fig 4. Pin configuration for DHVQFN20 5.2 Pin description Table 2. Pin description Symbol Pin Description 1OE 1 output enable input (active LOW) 1A0 to 1A3 2, 4, 6, 8 data input 2A0 to 2A3 17, 15, 13, 11 data input GND 10 ground (0 V) 1Y0 to 1Y3 18, 16, 14, 12 data output 2Y0 to 2Y3 3, 5, 7, 9 data output 2OE 19 output enable input (active HIGH) VCC 20 supply voltage 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 3 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state 6. Functional description Table 3. Function table Inputs Outputs 1OE 2OE 1An 2An 1Yn 2Yn L H L L L L L H H H H H H L X X Z Z [1] H = HIGH voltage level; L = LOW voltage level; X = Don’t care; Z = High impedance “OFF” state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).[1] Symbol Parameter VCC supply voltage Conditions Min Max Unit −0.5 +4.6 V [2] −0.5 +7.0 V [2] −0.5 +7.0 V VI input voltage VO output voltage output in OFF or HIGH state IIK input clamping current VI < 0 V −50 - mA IOK output clamping current VO < 0 V −50 - mA IO output current output in LOW state - 128 mA output in HIGH state −64 - mA −65 +150 °C - +150 °C - 500 mW Tstg storage temperature Tj junction temperature total power dissipation Ptot Tamb = −40 °C to +85 °C [3] [1] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. [2] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [3] For SO20 packages: above 70 °C derate linearly with 8 mW/K. For SSOP20 and TSSOP20 packages: above 60 °C derate linearly with 5.5 mW/K. For DHVQFN20 packages: above 60 °C derate linearly with 4.5 mW/K. 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter VCC Conditions Min Max Unit supply voltage 2.7 3.6 V VI input voltage 0 5.5 V IOH HIGH-level output current −32 - mA 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 4 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state Table 5. Recommended operating conditions …continued Symbol Parameter IOL LOW-level output current Conditions Min Max Unit - 32 mA current duty cycle ≤ 50 %; fi ≥ 1 kHz - 64 mA Tamb ambient temperature in free air −40 +85 °C ∆t/∆V input transition rise and fall rate output enabled 0 10 ns/V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V); Tamb = −40 °C to +85 °C. Symbol Parameter VIK input clamping voltage VIH HIGH-level input voltage VIL LOW-level input voltage VOH HIGH-level output voltage VOL II Conditions VCC = 2.7 V; IIK = –18 mA Max Unit −1.2 −0.9 - V 2.0 - - V - - 0.8 V VCC = 2.7 V to 3.6 V; IOH = −100 µA VCC − 0.2 VCC − 0.1 - V VCC = 2.7 V; IOH = −8 mA 2.4 2.5 - V VCC = 3.0 V; IOH = −32 mA 2.0 2.2 - V 0.1 0.2 V VCC = 2.7 V; IOL = 24 mA - 0.3 0.5 V VCC = 3.0 V; IOL = 16 mA - 0.25 0.4 V VCC = 3.0 V; IOL = 32 mA - 0.3 0.5 V VCC = 3.0 V; IOL = 64 mA - 0.4 0.55 V - 1 10 µA - 0.1 ±1 µA VCC = 3.6 V; VI = VCC - 0.1 1 µA VCC = 3.6 V; VI = 0 V −5 −1 - µA LOW-level output voltage VCC = 2.7 V; IOL = 100 µA input leakage current Typ[1] Min control and data pins VCC = 0 V or 3.6 V; VI = 5.5 V control pins VCC = 3.6 V; VI = VCC or GND [2] data pins IOFF power-off leakage current VCC = 0 V; VI or VO = 0 V to 4.5 V - 1 ±100 µA IBHL bus hold LOW current VCC = 3.0 V; VI = 0.8 V 75 150 - µA IBHH bus hold HIGH current VCC = 3.0 V; VI = 2.0 V - −150 −75 µA 500 - - µA - - −500 µA - 60 125 µA - ±1 ±100 µA IBHLO bus hold LOW overdrive current VCC = 3.6 V; VI = 0 V to 3.6 V [3] IBHHO bus hold HIGH overdrive current VCC = 3.6 V; VI = 0 V to 3.6 V [3] ILO output leakage current VO = 5.5 V; VCC = 3.0 V; output HIGH IO(pu/pd) power-up/power-down output current VCC ≤ 1.2 V; VO = 0.5 V to VCC; VI = GND or VCC; 1OE, 2OE = don’t care IOZ OFF-state output current VCC = 3.6 V; VO = 3.0 V - 1 5 µA VCC = 3.6 V; VO = 0.5 V −5 −1 - µA 74LVT241_3 Product data sheet [4] © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 5 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state Table 6. Static characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V); Tamb = −40 °C to +85 °C. Symbol Parameter Conditions ICC VCC = 3.6 V; VI = VCC or GND; IO = 0 A supply current Typ[1] Min outputs HIGH outputs LOW outputs disabled Max Unit - 0.12 0.19 mA - 3 12 mA [5] - 0.12 0.19 mA [6] - 0.1 0.25 mA ∆ICC additional supply current per input pin; VCC = 3.0 V to 3.6 V; one input = VCC − 0.6 V other inputs at VCC or GND CI input capacitance 1OE and 2OE inputs; outputs disabled; VI = 0 V or 3.0 V - 4 - pF CI/O input/output capacitance at input/output data pins, outputs disabled; VI/O = 0 V or 3.0 V - 8 - pF [1] All typical values are measured at Tamb = 25 °C. [2] Unused pins at VCC or GND. [3] This is the bus hold overdrive current required to force the input to the opposite logic state. [4] This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 ms. From VCC = 1.2 V to VCC = 3.3 V ± 0.3 V a transition time of 100 ms is permitted. This parameter is valid for Tamb = +25 °C only. [5] ICC with the outputs disabled is measured with outputs pulled to VCC or GND. [6] This is the increase in supply current for each input at the specified voltage level other than VCC or GND. 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8; Tamb = −40 °C to +85 °C. Symbol Parameter tPLH LOW to HIGH propagation delay Conditions VCC = 2.7 V HIGH to LOW propagation delay Unit - - 4.0 ns 1.0 2.8 3.8 ns 1An to 1Yn, 2An to 2Yn; see Figure 5 VCC = 2.7 V VCC = 3.3 V ± 0.3 V tPZH Max 1An to 1Yn, 2An to 2Yn; see Figure 5 VCC = 3.3 V ± 0.3 V tPHL Typ[1] Min - - 4.0 ns 1.0 2.8 3.8 ns - - 5.0 ns 1.0 3.2 4.4 ns - - 5.6 ns 1.0 3.8 5.1 ns OFF-state to HIGH propagation delay 1OE to 1Yn; see Figure 6 VCC = 2.7 V VCC = 3.3 V ± 0.3 V 2OE to 2Yn; see Figure 7 VCC = 2.7 V VCC = 3.3 V ± 0.3 V 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 6 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8; Tamb = −40 °C to +85 °C. Symbol Parameter tPZL Conditions Min Typ[1] Max Unit - - 4.9 ns 1.0 3.1 4.3 ns - - 5.4 ns 1.0 3.8 5.0 ns - - 5.4 ns 2.0 3.6 5.2 ns OFF-state to LOW propagation delay 1OE to 1Yn; see Figure 6 VCC = 2.7 V VCC = 3.3 V ± 0.3 V 2OE to 2Yn; see Figure 7 VCC = 2.7 V VCC = 3.3 V ± 0.3 V HIGH to OFF-state propagation delay 1OE to 1Yn; see Figure 6 tPHZ VCC = 2.7 V VCC = 3.3 V ± 0.3 V 2OE to 2Yn; see Figure 7 VCC = 2.7 V VCC = 3.3 V ± 0.3 V - - 5.0 ns 1.0 3.1 4.5 ns - - 4.3 ns 1.6 2.9 4.2 ns - - 4.3 ns 1.0 2.8 4.0 ns LOW to OFF-state propagation delay 1OE to 1Yn; see Figure 6 tPLZ VCC = 2.7 V VCC = 3.3 V ± 0.3 V 2OE to 2Yn; see Figure 7 VCC = 2.7 V VCC = 3.3 V ± 0.3 V [1] Typical values are measured at Tamb = 25 °C and VCC = 3.3 V. 11. Waveforms VI VM 1An, 2An input GND tPHL tPLH VOH 1Yn, 2Yn output VM VOL mna774 See Table 8 for measurement points. VOL and VOH are typical output voltage levels that occur with the output load. Fig 5. Input (1An, 2An) to output (1Yn, 2Yn) propagation delays and output transition times 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 7 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state VI 1OE input VM GND tPLZ tPZL 3.0 V output LOW-to-OFF OFF-to-LOW VM VX VOL tPZH tPHZ VOH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled 001aah813 See Table 8 for measurement points. VOL and VOH are typical output voltage levels that occur with the output load. Fig 6. 3-state output enable and disable times VI 2OE input VM GND tPLZ tPZL 3.0 V output LOW-to-OFF OFF-to-LOW VM VX VOL tPZH tPHZ output HIGH-to-OFF OFF-to-HIGH VOH VY VM GND outputs enabled outputs disabled outputs enabled 001aah814 See Table 8 for measurement points. VOL and VOH are typical output voltage levels that occur with the output load. Fig 7. Table 8. 3-state output enable and disable times Measurement points VCC 2.7 V to 3.6 V Input Output VM VX VY VM 1.5 V VOL + 0.3 V VOH − 0.3 V 1.5 V 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 8 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state tW VI 90 % negative pulse VM VM 10 % 0V VI tf tr tr tf 90 % positive pulse VM VM 10 % 0V tW VEXT VCC PULSE GENERATOR VI RL VO DUT RT CL RL 001aae235 Test data is given in Table 9. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 8. Table 9. Test circuit for switching times Test data Input Load VEXT VI fi tW tr, tf RL CL tPHZ, tPZH tPLZ, tPZL tPLH, tPHL 2.7 V ≤ 10 MHz 500 ns ≤ 2.5 ns 500 Ω 50 pF GND 6V open 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 9 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state 12. Package outline SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 9. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT163-1 (SO20) 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 10 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm D SOT339-1 E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.9 0.5 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 10. Package outline SOT339-1 (SSOP20) 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 11 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 11. Package outline SOT360-1 (TSSOP20) 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 12 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. A1 b 1 0.05 0.00 0.30 0.18 c D (1) Dh E (1) Eh 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 12. Package outline SOT764-1 (DHVQFN20) 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 13 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state 13. Abbreviations Table 10. Abbreviations Acronym Description BiCMOS Bipolar Complementary Metal Oxide Semiconductor CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74LVT241_3 20080507 Product data sheet ECN07_046 74LVT241_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. DHVQFN20 package added Section 3 “Ordering information” and Section 12 “Package outline”. 74LVT241_2 19980219 Product specification - 74LVT241_1 74LVT241_1 19960529 Product specification - - 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 14 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74LVT241_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 7 May 2008 15 of 16 74LVT241 NXP Semiconductors 3.3 V octal buffer/line driver; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 May 2008 Document identifier: 74LVT241_3