74LVT373
3.3 V octal D-type transparent latch; 3-state
Rev. 3 — 21 November 2011
Product data sheet
1. General description
The 74LVT373 is a high-performance BiCMOS product designed for VCC operation at
3.3 V. This device is an octal transparent latch coupled to eight 3-state output buffers. The
two sections of the device are controlled independently by latch enable (LE) and output
enable (OE) control gates. The data on the Dn inputs are transferred to the latch outputs
when the latch enable (LE) input is HIGH. The latch remains transparent to the data inputs
while LE is HIGH, and stores the data that is present one setup time before the
HIGH-to-LOW enable transition.
The 3-state output buffers are designed to drive heavily loaded 3-state buses, MOS
memories, or MOS microprocessors. The active-low output enable (OE) controls all eight
3-state buffers independent of the latch operation.
When OE is LOW, the latched or transparent data appears at the outputs. When OE is
HIGH, the outputs are in the high-impedance OFF-state, which means they will neither
drive nor load the bus.
The 74LVT373 is functionally identical to the 74LVT573, but has a different pin
arrangement.
2. Features and benefits
Inputs and outputs arranged for easy interfacing to microprocessors
3-state outputs for bus interfacing
Common output enable control
TTL input and output switching levels
Input and output interface capability to systems at 5 V supply
Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
Live insertion and extraction permitted
No bus current loading when output is tied to 5 V bus
Power-up reset
Power-up 3-state
Latch-up protection
JESD78 class II exceeds 500 mA
ESD protection:
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Specified from 40 C to +85 C
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVT373D
40 C to +85 C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
74LVT373PW
40 C to +85 C
TSSOP20
plastic thin shrink small outline package; 20 leads;
SOT360-1
body width 4.4 mm
4. Functional diagram
1
OE
LE
EN
11
C1
11
3
4
7
8
13
14
17
18
D0
Q0
D1
Q1
D2
Q2
D3
Q3
D4
Q4
D5
Q5
D6
Q6
D7
Q7
2
6
D4
15
D5
16
D6
19
D7
1
Q
8
9
13
12
14
15
17
16
18
19
D2
D
Q
Q1
Q2
Q3
Q4
Q5
Q6
Q7
001aae049
Fig 2.
D1
D
6
001aae048
Logic symbol
D0
7
D3
12
Q0
5
D2
9
2
1D
4
D1
5
OE
Fig 1.
3
D0
LE
D3
D
Q
IEC logic symbol
D4
D
Q
D5
D
Q
D6
D
Q
D7
D
Q
D
Q
LATCH
1
LATCH
2
LATCH
3
LATCH
4
LATCH
5
LATCH
6
LATCH
7
LATCH
8
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE LE
LE
OE
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
001aae052
Fig 3.
Logic diagram
74LVT373
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
2 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
5. Pinning information
5.1 Pinning
74LVT373
OE
1
20 VCC
Q0
2
19 Q7
D0
3
18 D7
D1
4
17 D6
Q1
5
16 Q6
Q2
6
15 Q5
D2
7
14 D5
D3
8
13 D4
Q3
9
12 Q4
GND 10
11 LE
aaa-000410
Fig 4.
Pin configuration for SO20 and TSSOP20
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
OE
1
output enable input (active LOW)
D0 to D7
3, 4, 7, 8, 13, 14, 17, 18
data input
GND
10
ground (0 V)
LE
11
latch enable (active HIGH)
Q0 to Q7
2, 5, 6, 9, 12, 15, 16, 19
data output
VCC
20
supply voltage
6. Functional description
6.1 Function table
Table 3.
Function table [1]
Operating mode
Control OE
Control LE
Input Dn
Internal register Output Qn
Load and read register
enable
L
H
L
L
L
H
H
H
Latch and read register
L
l
L
L
h
H
H
Hold
L
L
X
NC
NC
Disable outputs
H
L
X
NC
Z
H
Dn
Dn
Z
[1]
H = HIGH voltage level;
L = LOW voltage level;
74LVT373
Product data sheet
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Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
3 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
= HIGH-to-LOW latch enable transition;
h = HIGH voltage level one setup time prior to the LOW-to-HIGH clock transition;
l = LOW voltage level one setup time prior to the LOW-to-HIGH clock transition;
Z = high-impedance OFF-state;
NC = no change;
X = don’t care.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+4.6
V
0.5
+7.0
V
input voltage
[1]
VO
output voltage
output in OFF-state or HIGH-state
[1]
0.5
+7.0
V
IIK
input clamping current
VI < 0 V
-
50
mA
IOK
output clamping current
VO < 0 V
-
50
mA
IO
output current
output in LOW-state
-
128
mA
output in HIGH-state
-
64
mA
Tstg
storage temperature
65
+150
C
Tj
junction temperature
[2]
-
150
C
[3]
-
500
mW
VI
Tamb = 40 C to +85 C
total power dissipation
Ptot
[1]
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
[2]
The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability.
[3]
For SO20 packages: above 70 C derate linearly with 8 mW/K.
For TSSOP20 packages: above 60 C derate linearly with 5.5 mW/K.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VCC
Min
Typ
Max
Unit
supply voltage
2.7
-
3.6
V
VI
input voltage
0
-
5.5
V
VIH
HIGH-level input voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
IOH
HIGH-level output current
-
-
32
mA
IOL
LOW-level output current
-
-
32
mA
current duty cycle 50 %; fi 1 kHz
-
-
64
mA
Tamb
ambient temperature
in free air
40
-
+85
C
t/V
input transition rise and fall rate
outputs enabled
-
-
10
ns/V
74LVT373
Product data sheet
Conditions
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Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
4 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIK
input clamping voltage
VCC = 2.7 V; IIK = 18 mA
VOH
HIGH-level output voltage
VCC = 2.7 V to 3.6 V;
IOH = 100 A
VOL
Tamb = 40 C to +85 C
Conditions
LOW-level output voltage
Min
Typ[1]
1.2
0.9
VCC 0.2 VCC 0.1
VCC = 2.7 V; IOH = 8 mA
2.4
2.5
Unit
Max
-
V
-
V
-
V
VCC = 3.0 V; IOH = 32 mA
2.0
2.2
-
V
VCC = 2.7 V; IOL = 100 A
-
0.1
0.2
V
VCC = 2.7 V; IOL = 24 mA
-
0.3
0.5
V
VCC = 3.0 V IOL = 16 mA
-
0.25
0.4
V
VCC = 3.0 V IOL = 32 mA
-
0.3
0.5
V
VCC = 3.0 V IOL = 64 mA
-
0.4
0.55
V
-
0.13
0.55
V
-
1
10
A
-
0.1
1
A
-
0.1
1
A
5
1
-
A
-
1
100
A
VOL(pu)
power-up LOW-level
output voltage
VCC = 3.6 V; IO = 1 mA;
VI = GND or VCC
II
input leakage current
all input pins;
[2]
VCC = 0 V or 3.6 V; VI = 5.5 V
control pins;
VCC = 3.6 V; VCC or GND
data pins
VCC = 3.6 V; VI = VCC
[3]
VCC = 3.6 V; VI = 0 V
IOFF
power-off leakage current
VCC = 0 V; VI or VO = 0 V to 4.5 V
75
150
-
A
-
150
75
A
-
-
500
A
500
-
-
A
-
60
125
A
-
1
100
A
output HIGH: VO = 3.0 V
-
1
5
A
output LOW: VO = 0.5 V
5
1
-
A
-
0.13
0.19
mA
IBHL
bus hold LOW current
Dn input; VCC = 3 V; VI = 0.8 V
IBHH
bus hold HIGH current
Dn input; VCC = 3 V; VI = 2.0 V
IBHHO
bus hold HIGH overdrive current
Dn input; VCC = 3.6 V; VI = 0 V to
3.6 V
IBHLO
bus hold LOW overdrive current
Dn input; VCC = 3.6 V; VI = 0 V to
3.6 V
ILO
output leakage current
Qn output HIGH when
VO = 5.5 V and VCC = 3.0 V
IO(pu/pd)
power-up/power-down
output current
VCC 1.2 V; VO = 0.5 V to VCC;
VI = GND or VCC; OE = don’t care
IOZ
OFF-state output current
VCC = 3.6 V; VI = VIH or VIL
ICC
supply current
[4]
[4]
[5]
VCC = 3.6 V; VI = GND or VCC;
IO = 0 A
outputs HIGH
outputs LOW
outputs disabled
74LVT373
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 November 2011
[6]
-
3
12
mA
-
0.13
0.19
mA
© NXP B.V. 2011. All rights reserved.
5 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Tamb = 40 C to +85 C
Conditions
Unit
Min
Typ[1]
Max
-
0.1
0.2
mA
ICC
additional supply current
per input pin; VCC = 3 V to 3.6 V;
one input at VCC 0.6 V and other
inputs at VCC or GND
CI
input capacitance
VI = 0 V or 3.0 V
-
4
-
pF
CO
output capacitance
outputs disabled; VO = 0 V or 3.0 V
-
8
-
pF
[7]
[1]
Typical values are measured at VCC = 3.3 V and Tamb = 25 C.
[2]
For valid test results, data must not be loaded into the flip-flops (or latches) after applying power.
[3]
Unused pins at VCC or GND.
[4]
This is the bus hold overdrive current required to force the input to the opposite logic state.
[5]
This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 ms. From VCC = 1.2 V to VCC = 3.3 V 0.3 V
a transition time of 100 s is permitted. This parameter is valid for Tamb = 25 C only.
[6]
ICC is measured with outputs pulled to VCC or GND.
[7]
This is the increase in supply current for each input at the specified voltage level other than VCC or GND.
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to ground (GND = 0 V); for test circuit see Figure 10.
Symbol Parameter
tPLH
LOW to HIGH
propagation delay
Conditions
Tamb = 40 C to +85 C
Unit
Min
Typ[1]
Max
VCC = 3.0 V to 3.6 V
1.9
3.1
4.9
ns
VCC = 2.7 V
2.6
3.7
5.3
ns
LE to Qn; see Figure 5
Dn to Qn; see Figure 6
tPHL
HIGH to LOW
propagation delay
VCC = 3.0 V to 3.6 V
1.9
3.0
4.8
ns
VCC = 2.7 V
2.6
3.4
5.2
ns
VCC = 3.0 V to 3.6 V
1.9
3.3
4.7
ns
VCC = 2.7 V
1.9
3.4
5.0
ns
VCC = 3.0 V to 3.6 V
1.8
3.0
4.8
ns
VCC = 2.7 V
2.4
3.6
5.0
ns
VCC = 3.0 V to 3.6 V
1.8
3.4
5.7
ns
VCC = 2.7 V
3.0
4.5
6.0
ns
LE to Qn; see Figure 5
Dn to Qn; see Figure 6
tPZH
tPZL
OFF-state to HIGH
propagation delay
OFF-state to LOW
propagation delay
74LVT373
Product data sheet
OE to Qn; see Figure 7
OE to Qn; see Figure 8
VCC = 3.0 V to 3.6 V
1.9
3.3
5.3
ns
VCC = 2.7 V
2.7
4.0
5.6
ns
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
6 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
Table 7.
Dynamic characteristics …continued
Voltages are referenced to ground (GND = 0 V); for test circuit see Figure 10.
Symbol Parameter
Tamb = 40 C to +85 C
Conditions
Min
tPHZ
HIGH to OFF-state
propagation delay
tPLZ
VCC = 3.0 V to 3.6 V
1.8
3.2
5.1
ns
1.9
3.5
5.3
ns
2.1
3.2
4.6
ns
2.0
3.0
4.6
ns
1.1
-
-
ns
1.0
-
-
ns
1.4
-
-
ns
1.4
-
-
ns
LOW to OFF-state
propagation delay
OE to Qn; see Figure 8
set-up time
Dn to LE; see Figure 9
VCC = 3.0 V to 3.6 V
[2]
VCC = 2.7 V
hold time
Dn to LE; see Figure 9
[3]
VCC = 3.0 V to 3.6 V
VCC = 2.7 V
pulse width
tW
[1]
Max
VCC = 2.7 V
VCC = 3.0 V to 3.6 V
th
Unit
OE to Qn; see Figure 7
VCC = 2.7 V
tsu
Typ[1]
LE input HIGH; see Figure 5
[4]
VCC = 3.0 V to 3.6 V
3.0
-
-
ns
VCC = 2.7 V
3.0
-
-
ns
Typical values are measured at Tamb = 25 C and VCC = 3.3 V and 2.7 V respectively.
[2]
tsu is the same as tsu(L) and tsu(H).
[3]
th is the same as th(L) and th(H).
[4]
tW is the same as tWL and tWH.
74LVT373
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
7 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
11. Waveforms
VI
LE input
VI
VM
VM
Dn input
0V
tWH
0V
tWL
tPHL
VOH
VOH
VOL
VOL
001aai743
Measurement points are given in Table 8.
Fig 6.
Propagation delay data input (Dn) to
output (Qn)
VI
VI
VM
VM
VM
VM
OE input
0V
0V
tPZH
tPHZ
VOH
Qn output
001aai742
Measurement points are given in Table 8.
Propagation delays latch enable input (LE) to
output (Qn), and latch enable (LE) pulse width
OE input
VM
Qn output
VM
Qn output
Fig 5.
tPLH
tPHL
tPLH
tPZL
tPLZ
3.0 V
VY
Qn output
VM
VM
VX
VOL
0V
001aai745
001aai746
Measurement points are given in Table 8.
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur
with the output load.
Fig 7.
Output enable time to HIGH-state and output
disable time from HIGH-state
Fig 8.
Output enable time to LOW-state and output
disable time from LOW-state
VI
VM
Dn input
0V
th(L)
th(H)
tsu(H)
tsu(L)
VI
LE input
VM
0V
001aai744
Measurement points are given in Table 8.
Remark: The shaded areas indicate when the input is permitted to change for predictable output performance.
Fig 9.
Table 8.
Data setup and hold times for data (Dn) and latch enable (LE) inputs
Measurement points
Input
Output
VM
VM
VX
VY
1.5 V
1.5 V
VOL + 0.3 V
VOH 0.3 V
74LVT373
Product data sheet
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Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
8 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
VI
tW
90 %
negative
pulse
VM
0V
VI
tf
tr
tr
tf
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VEXT
VCC
PULSE
GENERATOR
VI
RL
VO
DUT
RT
CL
RL
001aae235
Test data is given in Table 9.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = Test voltage for switching times.
Fig 10. Test circuit for measuring switching times
Table 9.
Test data
Input
Load
VEXT
VI
fi
tW
tr, tf
CL
RL
tPHZ, tPZH
tPLZ, tPZL
tPLH, tPHL
2.7 V
10 MHz
500 ns
2.5 ns
50 pF
500
GND
6V
open
74LVT373
Product data sheet
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Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
9 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT163-1 (SO20)
74LVT373
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
10 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 12. Package outline SOT360-1 (TSSOP20)
74LVT373
Product data sheet
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Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
11 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
13. Abbreviations
Table 10.
Abbreviations
Acronym
Description
BiCMOS
Bipolar Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
14. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVT373 v.3
20111121
Product data sheet
-
74LVT373 v.2
Modifications:
•
Legal pages updated.
74LVT373 v.2
20110916
Product data sheet
-
74LVT373 v.1
74LVT373 v.1
19930701
Product data sheet
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74LVT373
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
12 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
74LVT373
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
13 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVT373
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 21 November 2011
© NXP B.V. 2011. All rights reserved.
14 of 15
74LVT373
NXP Semiconductors
3.3 V octal D-type transparent latch; 3-state
17. Contents
1
2
3
4
5
5.1
5.2
6
6.1
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 November 2011
Document identifier: 74LVT373