ADC0804S040TS/C1:1

ADC0804S030/040/050 Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz Rev. 02 — 14 August 2008 Product data sheet 1. General description The ADC0806030/040/050 are a family of 8-bit high-speed, low-power Analog-to-Digital Converters (ADC) for professional video and other applications. It converts the analog input signal into 8-bit binary coded digital signals at a maximum sampling rate of 50 MHz. All digital inputs and outputs are Transistor-Transistor Logic (TTL) and CMOS compatible, although a low-level sine wave clock input signal can also be used. The device requires an external source to drive its reference ladder. If the application requires that the reference is driven via internal sources, NXP recommends you use one of the ADC1003S030/040/050 family. 2. Features n n n n n n n n n n n n n n 8-bit resolution Sampling rate up to 50 MHz DC sampling allowed One clock cycle conversion only High signal-to-noise ratio over a large analog input frequency range (7.8 effective bits at 4.43 MHz full-scale input at fclk = 40 MHz) No missing codes guaranteed In-Range (IR) CMOS output TTL and CMOS levels compatible digital inputs 3 V to 5 V CMOS digital outputs Low-level AC clock input signal allowed External reference voltage regulator Power dissipation only 175 mW (typical) Low analog input capacitance, no buffer amplifier required No sample-and-hold circuit required 3. Applications n n n n n n n Video data digitizing Radar Transient signal analysis Σ∆ modulators Medical imaging Barcode scanner Global Positioning System (GPS) receiver ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz n Cellular base stations 4. Quick reference data Table 1. Quick reference data VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V; VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to 70 °C; typical values measured at VCCA = VCCD = 5 V and VCCO = 3.3 V, Vi(a)(p-p) = 2.0 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified. Symbol Parameter VCCA Min Typ Max Unit analog supply voltage 4.75 5.0 5.25 V VCCD digital supply voltage 4.75 5.0 5.25 V VCCO output supply voltage 3.0 3.3 5.25 V ICCA analog supply current - 18 24 mA ICCD digital supply current - 16 21 mA ICCO output supply current fclk = 40 MHz; ramp input - 1 2 mA INL integral non-linearity fclk = 40 MHz ramp input - ±0.2 ±0.5 LSB DNL differential non-linearity fclk = 40 MHz ramp input - ±0.12 ±0.22 LSB fclk(max) maximum clock frequency ADC0804S030TS 30 - - MHz ADC0804S040TS 40 - - MHz ADC0804S050TS 50 - - MHz fclk = 40 MHz; ramp input - 175 247 mW Ptot Conditions total power dissipation 5. Ordering information Table 2. Ordering information Type number Package Sampling frequency (MHz) Name Description Version ADC0804S030TS SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 30 ADC0804S040TS SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 40 ADC0804S050TS SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1 50 ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 2 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 6. Block diagram VCCA CLK VCCD2 OE 3 1 11 10 2 CLOCK DRIVER RT TC 9 25 D7 MSB 24 D6 23 D5 Rlad VI analog voltage input 22 D4 8 ANALOG - TO - DIGITAL CONVERTER CMOS OUTPUTS LATCHES 21 D3 data outputs 20 D2 RM 7 19 D1 18 D0 RB 13 6 ADC0804S030 CMOS OUTPUT IN-RANGE LATCH 26 28 4 12 14 27 AGND DGND2 OGND DGND1 analog ground digital ground output ground digital ground LSB VCCO IR output VCCD1 014aaa550 Fig 1. Block diagram ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 3 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 7. Pinning information 7.1 Pinning CLK 1 TC 2 28 VCCD1 27 DGND1 VCCA 3 26 IR AGND 4 25 D7 n.c. 5 24 D6 RB 6 23 D5 RM 7 VI 8 RT 9 20 D2 OE 10 19 D1 VCCD2 11 18 D0 DGND2 12 17 n.c. VCCO 13 16 n.c. OGND 14 15 n.c. ADC0804S 030TS 22 D4 21 D3 014aaa551 Fig 2. Pin configuration 7.2 Pin description Table 3. Pin description Symbol Pin Description CLK 1 clock input TC 2 two’s complement input (active LOW) VCCA 3 analog supply voltage (5 V) AGND 4 analog ground n.c. 5 not connected RB 6 reference voltage BOTTOM input RM 7 reference voltage MIDDLE VI 8 analog input voltage RT 9 reference voltage TOP input OE 10 output enable input (CMOS level input, active LOW) VCCD2 11 digital supply voltage 2 (5 V) DGND2 12 digital ground 2 VCCO 13 supply voltage for output stages (3 V to 5 V) OGND 14 output ground n.c. 15 not connected n.c. 16 not connected n.c. 17 not connected D0 18 data output; bit 0 (Least Significant Bit (LSB)) D1 19 data output; bit 1 ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 4 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz Table 3. Pin description …continued Symbol Pin Description D2 20 data output; bit 2 D3 21 data output; bit 3 D4 22 data output; bit 4 D5 23 data output; bit 5 D6 24 data output; bit 6 D7 25 data output; bit 7 (Most Significant Bit (MSB)) IR 26 in-range data output DGND1 27 digital ground 1 VCCD1 28 digital supply voltage 1 (5 V) 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCCA analog supply voltage [1] −0.3 +7.0 V VCCD digital supply voltage [1] −0.3 +7.0 V VCCO output supply voltage [1] −0.3 +7.0 V ∆VCC supply voltage difference VCCA − VCCD −1.0 +1.0 V VCCD − VCCO −1.0 +4.0 V VCCA − VCCO −1.0 +4.0 V VI input voltage referenced to AGND −0.3 +7.0 V Vi(clk)(p-p) peak-to-peak clock input voltage referenced to DGND - VCCD V IO output current - 10 mA Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +85 °C Tj junction temperature - 150 °C [1] The supply voltages VCCA, VCCD and VCCO may have any value between −0.3 V and +7.0 V provided that the supply voltage differences ∆VCC are respected. 9. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 110 K/W ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 5 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 10. Characteristics Table 6. Characteristics VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V; VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to 70 °C; typical values measured at VCCA = VCCD = 5 V and VCCO = 3.3 V, Vi(a)(p-p) = 2.0 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VCCA analog supply voltage 4.75 5.0 5.25 V VCCD digital supply voltage 4.75 5.0 5.25 V VCCO output supply voltage ∆VCC supply voltage difference 3.0 3.3 5.25 V VCCA − VCCD −0.20 - +0.20 V VCCA − VCCO −0.20 - +2.25 V VCCD − VCCO −0.20 - +2.25 V ICCA analog supply current - 18 24 mA ICCD digital supply current - 16 21 mA ICCO output supply current fclk = 40 MHz; ramp input - 1 2 mA Ptot total power dissipation fclk = 40 MHz; ramp input - 175 247 mW Inputs Clock input CLK (referenced to DGND)[1] VIL LOW-level input voltage 0 - 0.8 V VIH HIGH-level input voltage 2 - VCCD V IIL LOW-level input current Vclk = 0.8 V −1 - +1 µA IIH HIGH-level input current Vclk = 2 V - 2 10 µA Zi input impedance - 2 - kΩ Ci input capacitance - 2 - pF fclk = 40 MHz OE and TC (referenced to DGND); see Table 8 VIL LOW-level input voltage 0 - 0.8 V VIH HIGH-level input voltage 2 - VCCD V IIL LOW-level input current VIL = 0.8 V −1 - - µA IIH HIGH-level input current VIH = 2.0 V - - 1 µA VI (analog input voltage referenced to AGND) IIL LOW-level input current VI = VRB = 1.3 V - 0 - µA IIH HIGH-level input current VI = VRT = 3.67 V - 35 - µA Zi input impedance - 8 - kΩ Ci input capacitance - 5 - pF V fi = 4.43 MHz Reference voltages for the resistor ladder; see Table 7 VRB voltage on pin RB 1.2 1.3 2.45 VRT voltage on pin RT 3.2 3.67 VCCA − 0.8 V ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 6 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz Table 6. Characteristics VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V; VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to 70 °C; typical values measured at VCCA = VCCD = 5 V and VCCO = 3.3 V, Vi(a)(p-p) = 2.0 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Vref(dif) differential reference voltage VRT − VRB 2.0 2.37 3.0 V Iref reference current VRT − VRB = 2.37 V - 9.7 - mA Rlad ladder resistance - 245 - Ω TCRlad ladder resistor temperature coefficient - 456 - mΩ/K Voffset offset voltage Vi(a)(p-p) BOTTOM; VRT − VRB = 2.37 V [2] - 175 - mV TOP; VRT − VRB = 2.37 V [2] - 175 - mV [3] 1.7 2.02 2.55 V peak-to-peak analog input voltage Digital outputs D7 to D0 and IR (referenced to OGND) VOL LOW-level output voltage IOL = 1 mA 0 - 0.5 V VOH HIGH-level output voltage IOH = − 1 mA VCCO − 0.5 - VCCO V Io output current in 3-state mode; 0.5 V < VO < VCCO −20 - +20 µA ADC0804S030TS 30 - - MHz ADC0804S040TS 40 - - MHz ADC0804S050TS 50 - - MHz Switching characteristics; Clock input CLK; see Figure 4[1] fclk(max) maximum clock frequency tw(clk)H HIGH clock pulse width full effective bandwidth 8.5 - - ns tw(clk)L LOW clock pulse width full effective bandwidth 5.5 - - ns Analog signal processing Linearity INL integral non-linearity fclk = 40 MHz; ramp input - ±0.2 ±0.5 LSB DNL differential non-linearity fclk = 40 MHz; ramp input - ±0.12 ±0.22 LSB Eoffset offset error middle code; VRB = 1.3 V; VRT = 3.67 V - ±0.25 - LSB EG gain error from device to device; VRB = 1.3 V; VRT = 3.67 V [4] - ±0.1 - % full-scale sine wave [5] - 15 - MHz 75 % full-scale sine wave - 20 - MHz small signal at mid-scale; VI = ±10 LSB at code 512 - 350 - MHz - 1.5 3.0 ns - 1.5 3.0 ns Bandwidth (fclk = 40 MHz) B bandwidth ts(LH) LOW to HIGH settling time ts(HL) HIGH to LOW settling time full-scale square wave; see Figure 6 [6] ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 7 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz Table 6. Characteristics VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V; VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to 70 °C; typical values measured at VCCA = VCCD = 5 V and VCCO = 3.3 V, Vi(a)(p-p) = 2.0 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Harmonics (fclk = 40 MHz); see Figure 7 and 8 α1H first harmonic level fi = 4.43 MHz - - 0 dB α2H second harmonic level fi = 4.43 MHz - −75 −65 dB α3H third harmonic level fi = 4.43 MHz - −72 −65 dB THD total harmonic distortion fi = 4.43 MHz - −65 - dB 46 49 - dB fi = 4.43 MHz - 7.8 - bits fi = 7.5 MHz - 7.8 - bits fi = 4.43 MHz - 7.8 - bits fi = 7.5 MHz - 7.8 - bits fi = 10 MHz - 7.8 - bits fi = 15 MHz - 7.4 - bits fi = 4.43 MHz - 7.8 - bits fi = 7.5 MHz - 7.8 - bits fi = 10 MHz - 7.8 - bits fi = 15 MHz - 7.3 - bits intermodulation suppression fclk = 40 MHz - −69 - dB bit error rate fclk = 40 MHz; fi = 4.43 MHz; VI = ±16 LSB at code 512 - 10−13 - times/ samples fclk = 40 MHz; PAL modulated ramp - 0.8 - % Signal-to-noise ratio; see Figure 7 and 8[7] S/N signal-to-noise ratio full scale; without harmonics; fclk = 40 MHz; fi = 4.43 MHz Effective number of bits[7] ENOB effective number of bits ADC0804S030TS (fclk = 30 MHz) ADC0804S040TS (fclk = 40 MHz) ADC0804S050TS (fclk = 50 MHz) Two-tone intermodulation[8] αIM Bit error rate BER Differential gain[9] Gdif differential gain ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 8 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz Table 6. Characteristics VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V; VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to 70 °C; typical values measured at VCCA = VCCD = 5 V and VCCO = 3.3 V, Vi(a)(p-p) = 2.0 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified. Symbol Differential Parameter Conditions Min Typ Max Unit fclk = 40 MHz; PAL modulated ramp - 0.4 - deg phase[9] ϕdif differential phase Timing (fclk = 40 MHz; Ci = 15 pF); see Figure 4[10] td(s) sampling delay time - 3 - ns th(o) output hold time 4 - - ns td(o) output delay time VCCO = 4.75 V - 10 13 ns VCCO = 3.15 V - 12 15 ns - - 15 pF load capacitance CL 3-state output delay times; see Figure 5 tdZH float to active HIGH delay time - 5.5 8.5 ns tdZL float to active LOW delay time - 12 15 ns tdHZ active HIGH to float delay time - 19 24 ns tdLZ active LOW to float delay time - 12 15 ns [1] In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less than 0.5 ns. [2] Analog input voltages producing code 0 up to and including code 255: a) Voffset BOTTOM is the difference between the analog input which produces data equal to 00 and the reference voltage on pin RB (VRB) at Tamb = 25 °C. b) Voffset TOP is the difference between the reference voltage on pin RT (VRT) and the analog input which produces data outputs equal to code 255 at Tamb = 25 °C. [3] To ensure the optimum linearity performance of such a converter architecture the lower and upper extremities of the converter reference resistor ladder are connected to pins RB and RT via offset resistors ROB and ROT as shown in Figure 3. V RT – V RB R OB + R L + R OT a) The current flowing into the resistor ladder is I = ---------------------------------------- and the full-scale input range at the converter, to cover code 0 RL to 255 is V I = R L × I L = ---------------------------------------- × ( V RT + V RB ) = 0.852 × ( V RT – V RB ) R OB + R L + R OT RL R OB + R L + R OT b) Since RL, ROB and ROT have similar behavior with respect to process and temperature variation, the ratio ---------------------------------------will be kept reasonably constant from device to device. Consequently, the variation of the output codes at a given input voltage depends mainly on the difference VRT − VRB and its variation with temperature and supply voltage. When several ADCs are connected in parallel and fed with the same reference source, the matching between each of them is optimized. [4] ( V 1023 – V 0 ) – V i ( p – p ) E G = --------------------------------------------------------- × 100 V i( p – p) [5] The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No glitches greater than 0.5 LSB, neither any significant attenuation are observed in the reconstructed signal. [6] The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square wave signal) in order to sample the signal and obtain correct output data. ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 9 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz [7] Effective bits are obtained via a Fast Fourier transform (FFT) treatment taking 8000 acquisition points per equivalent fundamental period. The calculation takes into account all harmonics and noise up to half the clock frequency (Nyquist frequency). Conversion to SIgnal-to-Noise-And-Distortion (SINAD) ratio: SINAD = ENOB × 6.02 + 1.76 dB. [8] Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two input signals have the same amplitude and the total amplitude of both signals provides full-scale to the converter. [9] Measurement carried out using video analyzer VM700A, where the video analog signal is reconstructed through a digital-to-analog converter. [10] Output data acquisition: the output data is available after the maximum delay time of td(0). For 50 MHz version NXP recommend the lowest possible output load. RT ROT code 255 RL RL RM IL RL Rlad RL code 0 ROB RB 014aaa555 Fig 3. Explanation of Table 6 Table note 3 11. Additional information relating to Table 6 Table 7. Output coding and input voltage (typical values; referenced to AGND, VRB = 1.3 V, VRT = 3.67 V) Code Vi(a)(p-p) (V) IR Binary outputs D7 to D0 Two’s complement outputs D7 to D0 Underflow < 1.475 0 0000 0000 10 0000 00 0 1.475 1 0000 0000 10 0000 00 1 - 1 0000 0001 10 0000 01 ↓ - ↓ ↓ ↓ 254 - 1 1111 1110 01 1111 10 255 3.495 1 1111 1111 01 1111 11 Overflow > 3.495 0 1111 1111 01 1111 11 ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 10 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz Table 8. Mode selection TC OE D7 to D0 IR X 1 high impedance high impedance 0 0 active; two’s complement active 1 0 active; binary active sample N + 1 sample N sample N + 2 tw(clk)L tw(clk)H VCCO CLK 50 % 0V sample N sample N + 1 sample N + 2 VI td(s) th(o) VCCO DATA D0 to D7 DATA N−2 DATA N−1 DATA N DATA N+1 50 % 0V td(o) Fig 4. Timing diagram ADC0804S030_040_050_2 Product data sheet 014aaa556 © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 11 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz VCCD 50 % OE tdHZ tdZH HIGH 90 % output data 50 % LOW tdZL tdLZ HIGH output data 50 % LOW 10 % VCCD TEST S1 tdLZ VCCD tdZL VCCD tdHZ DGND tdZH DGND 3.3 kΩ ADC0804S030 S1 15 pF OE 014aaa552 frequency on pin OE = 100 kHz Fig 5. Timing diagram and test conditions of 3-state output delay time ts(LH) ts(HL) code 255 VI 50 % 50 % code 0 2 ns CLK 2 ns 50 % 50 % 0.5 ns 0.5 ns 014aaa400 Fig 6. Analog input settling time diagram ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 12 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 014aaa328 +20 amplitude (dB) −20 −60 −100 −140 0 5.00 10.0 15.0 20.0 f (MHz) Effective bits: 7.84; THD = −71.8 dB. Harmonic levels (dB): 2nd = −83.19; 3rd = −78.09; 4th = −78.72; 5th = −78.33; 6th = −77.55. Fig 7. Typical fast Fourier transform (fclk = 40 MHz; fi = 4.43 MHz) 014aaa329 +20 amplitude (dB) −20 −60 −100 −140 0 5.0 10.0 15.0 20.0 25.0 f (MHz) Effective bits: 7.79; THD = −62.96 dB. Harmonic levels (dB): 2nd = −71.38; 3rd = −71.54; 4th = −74.14; 5th = −65.15; 6th = −77.16. Fig 8. Typical fast Fourier transform (fclk = 50 MHz; fi = 10 MHz) ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 13 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz VCCA VCCO D7 to D0 IR OGND VI AGND 014aaa526 014aaa557 Fig 9. CMOS data and in-range outputs Fig 10. Analog inputs VCCA VCCO RT RL RL OE TC RM RL RL RB OGND AGND 014aaa553 Fig 11. OE and TC input 014aaa331 Fig 12. RB, RM and RT VCCD CLK 1.5 V DGND 014aaa399 Fig 13. CLK input ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 14 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 12. Application information CLK TC VCCA (3) 100 nF AGND n.c. RB(1) RM(1) 100 nF 100 nF AGND VI RT(1) AGND OE 100 nF VCCD2 AGND (3) 100 nF DGND2 VCCO (3) 100 nF OGND 1 28 2 27 3 26 4 25 5 24 6 23 7 ADC0804S030 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 VCCD1 DGND1 (3) 100 nF IR D7 D6 D5 D4 D3 D2 D1 D0 n.c. n.c. n.c.(2) 014aaa554 The analog and digital supplies should be separated and well decoupled A user manual is available that describes the demonstration board that uses the version ADC0804S030/040/050/ family with an application environment. (1) RB, RM and RT are decoupled to AGND. (2) Pin 15 may be connected to DGND in order to prevent noise influence. (3) Decoupling capacitor for supplies; must be placed close to the device. Fig 14. Application diagram 12.1 Alternative parts The following alternative parts are also available: Table 9. Alternative parts Type number Description Single 10 bits ADC 30 MHz ADC1004S040 Single 10 bits ADC [1] 40 MHz ADC1004S050 Single 10 bits ADC [1] 50 MHz ADC1003S030 Single 10 bits ADC [1] 30 MHz, with internal reference regulator ADC1003S040 Single 10 bits ADC [1] 40 MHz, with internal reference regulator ADC1003S050 Single 10 bits ADC [1] 50 MHz, with internal reference regulator ADC1005S060 Single 10 bits ADC [1] 60 MHz ADC1004S030 [1] Pin to pin compatible ADC0804S030_040_050_2 Product data sheet Sampling frequency [1] © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 15 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 13. Package outline SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm D SOT341-1 E A X c HE y v M A Z 28 15 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 w M bp e detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 10.4 10.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.1 0.7 8 o 0 o Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC SOT341-1 JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 15. SOT341-1 (SSOP28) ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 16 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 14. Revision history Table 10. Revision history Document ID Release date ADC0804S030_040_050_2 20080814 Modifications: • • • • Data sheet status Change notice Supersedes Product data sheet - ADC0804S030_040_050_1 Paragraph added to Section 1. Corrections to descriptions of rows RB and RM in Table 3. Corrections to Table 6. Corrections to Figure 9, 10 and 12. ADC0804S030_040_050_1 20080616 Product data sheet ADC0804S030_040_050_2 Product data sheet - - © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 17 of 19 ADC0804S030/040/050 NXP Semiconductors Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com ADC0804S030_040_050_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 14 August 2008 18 of 19 NXP Semiconductors ADC0804S030/040/050 Single 8 bits ADC, up to 30 MHz, 40 MHz or 50 MHz 17. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 12 12.1 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Additional information relating to Table 6 . . . 10 Application information. . . . . . . . . . . . . . . . . . 15 Alternative parts . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 August 2008 Document identifier: ADC0804S030_040_050_2