ADC1213S series
Single 12-bit ADC; 65 Msps, 80 Msps, 105 Msps or 125 Msps; serial JESD204A interface
Rev. 2 — 9 June 2011 Product data sheet
1. General description
The ADC1213S is a single channel 12-bit Analog-to-Digital Converter (ADC) optimized for high dynamic performance and low power at sample rates up to 125 Msps. Pipelined architecture and output error correction ensure the ADC1213S is accurate enough to guarantee zero missing codes over the entire operating range. Supplied from a 3 V source for analog and a 1.8 V source for the output driver, it outputs data in serial mode via a single differential lane, which complies with the JESD204A standard. The integration of Serial Peripheral Interface (SPI) allows the user to easily configure the ADCs and the serial output modes. The device also includes a programmable full-scale SPI to allow a flexible input voltage range from 1 V (p-p) to 2 V (p-p). Excellent dynamic performance is maintained from the baseband to input frequencies of 170 MHz or more, making the ADC1213S ideal for use in communications, imaging, and medical applications.
2. Features and benefits
SNR, 70 dBFS; SFDR, 86 dBc Sample rates up to 125 Msps Single channel, 12-bit pipelined ADC core 3 V, 1.8 V power supplies Flexible input voltage range: 1 V (p-p) to 2 V (p-p) Serial output Compliant with JESD204A serial transmission standard Pin compatible with ADC1613S series, ADC1413S series, and ADC1113S125 Input bandwidth, 600 MHz Power dissipation, 550 mW at 80 Msps SPI register programming Duty cycle stabilizer High Intermediate Frequency (IF) capability Offset binary, two’s complement, gray code Power-down mode and Sleep mode HVQFN32 package
3. Applications
Wireless and wired broadband communications Spectral analysis Ultrasound equipment Portable instrumentation Imaging systems
NXP Semiconductors
ADC1213S series
Single 12-bit ADC; serial JESD204A interface
4. Ordering information
Table 1. Ordering information Sampling frequency (Msps) 125 Package Name Description Version Type number
ADC1213S125HN/C1
HVQFN32R plastic thermal enhanced very thin quad flat package; SOT1152-1 no leads; 32 terminals; resin based; body 7 7 0.8 mm HVQFN32R plastic thermal enhanced very thin quad flat package; SOT1152-1 no leads; 32 terminals; resin based; body 7 7 0.8 mm HVQFN32R plastic thermal enhanced very thin quad flat package; SOT1152-1 no leads; 32 terminals; resin based; body 7 7 0.8 mm HVQFN32R plastic thermal enhanced very thin quad flat package; SOT1152-1 no leads; 32 terminals; resin based; body 7 7 0.8 mm
ADC1213S105HN/C1
105
ADC1213S080HN/C1
80
ADC1213S065HN/C1
65
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
5. Block diagram
SDIO SCLK CS
SPI
SYNCP SYNCN
CLKP DLL PLL CLKM
ERROR CORRECTION AND DIGITAL PROCESSING ENCODER 8-bit/10-bit A FRAME ASSEMBLY
INP T/H INPUT STAGE INM ADC CORE 12-BIT PIPELINED
OTR D11 to D0
SCRAMBLER A
SERIALIZER A 10-bit OUTPUT BUFFER A
CMLP
8-bit
8-bit
CMLN
CLOCK INPUT STAGE AND DUTY CYCLE CONTROL
ADC1213S
SYSTEM REFERENCE AND POWER MANAGEMENT
OTR SENSE VDDD AGND DGND VDDA
001aam776
Fig 1.
Block diagram
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
6. Pinning information
6.1 Pinning
26 SYNCN 25 SYNCP 31 SENSE 28 DGND 30 AGND 27 VDDD 29 VDDA
terminal 1 index area
32 VREF
CLKP CLKM AGND REFB REFT VCM INM INP
1 2 3 4
24 n.c. 23 DGND 22 DGND 21 VDDD
ADC1213S
5 6 7 8 20 CMLN 19 CMLP 18 VDDD 17 DGND
VDDA 10
SDIO 12
CS 13
OTR 14
VDDD 15
DGND 16
VDDA
SCLK
11
9
001aam778
Transparent top view
Fig 2.
Pinning diagram
6.2 Pin description
Table 2. Symbol CLKP CLKM AGND REFB REFT VCM INM INP VDDA VDDA SCLK SDIO Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 Type [1] I I G O O O I I P P I I/O Description clock input complementary clock input analog ground ADC bottom reference ADC top reference ADC output common voltage ADC complementary analog input ADC analog input analog power supply 3 V analog power supply 3 V SPI clock SPI data input/output
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
Pin description …continued Pin 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Type [1] I O P G G P O O P G G I I P G P G I I/O Description chip select out-of-range information digital power supply 1.8 V digital ground digital ground digital power supply 1.8 V serial output serial complementary output digital power supply 1.8 V digital ground digital ground not connected positive synchronization signal from the receiver negative synchronization signal from the receiver digital power supply 1.8 V digital ground analog power supply 3 V analog ground reference programming pin voltage reference input/output
Table 2. Symbol CS OTR VDDD DGND DGND VDDD CMLP CMLN VDDD DGND DGND n.c. SYNCP SYNCN VDDD DGND VDDA AGND SENSE VREF
[1]
P: power supply; G: ground; I: input; O: output; I/O: input/output.
7. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDDA VDDD(1V8) Tstg Tamb Tj Parameter analog supply voltage digital supply voltage (1.8 V) storage temperature ambient temperature junction temperature Conditions Min 0.4 0.4 55 40 Max +4.6 +2.5 +125 +85 125 Unit V V C C C
8. Thermal characteristics
Table 4. Symbol Rth(j-a) Rth(j-c)
[1]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to case Conditions
[1] [1]
Typ 25.6 8.6
Unit K/W K/W
Value for six layers board in still air with a minimum of 25 thermal vias.
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
9. Static characteristics
Table 5. Symbol Supplies VDDA VDDD(1V8) IDDA IDDD(1V8) Ptot analog supply voltage digital supply voltage (1.8 V) analog supply current digital supply current (1.8 V) total power dissipation fclk = 125 Msps; fi = 70 MHz fclk = 125 Msps; fi = 70 MHz fclk = 125 Msps fclk = 105 Msps fclk = 80 Msps fclk = 65 Msps P power dissipation Power-down mode Standby mode Clock inputs: pins CLKP and CLKM (AC-coupled) Low-Voltage Positive Emitter-Coupled Logic (LVPECL) Vi(clk)dif SINE Vi(clk)dif differential clock input voltage LOW-level input voltage HIGH-level input voltage LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current input capacitance input current input resistance input capacitance common-mode input voltage input bandwidth differential input voltage peak-to-peak track mode track mode track mode track mode peak 0.8 3.0 V differential clock input voltage peak-to-peak 1.6 V 2.85 1.65 3.0 1.8 185 75 690 625 550 495 30 150 3.4 1.95 V V mA mA mW mW mW mW mW mW Static characteristics [1] Parameter Conditions Min Typ Max Unit
Low Voltage Complementary Metal Oxide Semiconductor (LVCMOS) VIL VIH VIL VIH IIL IIH CI II RI CI VI(cm) Bi VI(dif) 0.7VDDA 0 0.7VDDA 10 50 5 1.1 1 4 15 5 1.5 600 0.3VDDA 0.3VDDA VDDA +10 +50 +5 2 2 V V V V A A pF A pF V MHz V
SPI: pins CS, SDIO, and SCLK
Analog inputs: pins INP and INM
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
Table 5. Symbol VO(cm) IO(cm)
Static characteristics …continued[1] Parameter common-mode output voltage common-mode output current voltage on pin VREF output input Conditions Min Typ 0.5VDDA 4 Max Unit V mA
Voltage controlled regulator output: pin VCM
Reference voltage input/output: pin VREF VVREF 0.5 0.5 1 1 V V
Data outputs: pins CMLP, CMLN Output levels, VDDD(1V8) = 1.8 V; SWING_SEL[2:0] = 000 VOL VOH LOW-level output voltage HIGH-level output voltage DC-coupled; output AC-coupled DC-coupled; output AC-coupled DC-coupled; output AC-coupled DC-coupled; output AC-coupled DC-coupled; output AC-coupled DC-coupled; output AC-coupled DC-coupled; output AC-coupled DC-coupled; output AC-coupled DC-coupled; output AC-coupled DC-coupled; output AC-coupled differential; input 5 guaranteed no missing codes 0.95 All information provided in this document is subject to legal disclaimers.
1.5 1.35 1.8 1.65 1.45 1.275 1.8 1.625 1.4 1.2 1.8 1.6 1.35 1.125 1.8 1.575 1.3 1.05 1.8 1.55 0.95 1.47 0.5 2
+5 +0.95 -
V V V V V V V V V V V V V V V V V V V V V V LSB LSB mV
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Output levels, VDDD(1V8) = 1.8 V; SWING_SEL[2:0] = 001 VOL VOH LOW-level output voltage HIGH-level output voltage
Output levels, VDDD(1V8) = 1.8 V; SWING_SEL[2:0] = 010 VOL VOH LOW-level output voltage HIGH-level output voltage
Output levels, VDDD(1V8) = 1.8 V; SWING_SEL[2:0] = 011 VOL VOH LOW-level output voltage HIGH-level output voltage
Output levels, VDDD(1V8) = 1.8 V; SWING_SEL[2:0] = 100 VOL VOH LOW-level output voltage HIGH-level output voltage
Serial configuration: pins SYNCP, SYNCN VIL VIH Accuracy INL DNL Eoffset
ADC1213S_SER
LOW-level input voltage
HIGH-level input voltage differential; input integral non-linearity differential non-linearity offset error
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
Table 5. Symbol EG Supply PSRR
Static characteristics …continued[1] Parameter gain error power supply rejection ratio Conditions full-scale 200 mV (p-p) on pin VDDA; fi = DC Min Typ 0.5 54 Max Unit % dB
[1]
Typical values measured at VDDA = 3 V, VDDD(1V8) = 1.8 V, Tamb = 25 C. Minimum and maximum values are across the full temperature range Tamb = 40 C to +85 C at VDDA = 3 V, VDDD(1V8) = 1.8 V; Vi(INP) Vi(INM) = 1 dBFS; internal reference mode; 100 differential applied to serial outputs; unless otherwise specified.
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10. Dynamic characteristics
10.1 Dynamic characteristics
Table 6. Symbol 2H Dynamic characteristics [1] Parameter second harmonic level Conditions fi = 3 MHz fi = 30 MHz fi = 70 MHz fi = 170 MHz 3H third harmonic level fi = 3 MHz fi = 30 MHz fi = 70 MHz fi = 170 MHz THD total harmonic distortion fi = 3 MHz fi = 30 MHz fi = 70 MHz fi = 170 MHz ENOB effective number of bits fi = 3 MHz fi = 30 MHz fi = 70 MHz fi = 170 MHz SNR signal-to-noise ratio fi = 3 MHz fi = 30 MHz fi = 70 MHz fi = 170 MHz SFDR spurious-free dynamic range fi = 3 MHz fi = 30 MHz fi = 70 MHz fi = 170 MHz ADC1213S065 Min Typ 87 86 85 82 86 85 84 81 83 82 81 78 11.3 11.3 11.2 11.1 70.0 69.5 69.2 68.8 86 85 84 81 Max ADC1213S080 Min Typ 87 86 85 82 86 85 84 81 83 82 81 78 11.3 11.3 11.2 11.1 69.9 69.5 69.2 68.8 86 85 84 81 Max ADC1213S105 Min Typ 86 86 84 81 85 85 83 80 82 82 80 77 11.3 11.3 11.2 11.1 69.8 69.5 69.1 68.7 85 85 83 80 Max ADC1213S125 Min Typ 88 87 85 83 87 86 84 82 84 83 81 79 11.3 11.2 11.2 11.1 69.6 69.4 60.0 68.6 87 86 84 82 Max dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc Unit
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Single 12-bit ADC; serial JESD204A interface
bits bits bits bits dBFS dBFS dBFS dBFS dBc dBc dBc dBc
ADC1213S series
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Table 6. Symbol IMD Dynamic characteristics …continued[1] Parameter intermodulation distortion Conditions fi = 3 MHz fi = 30 MHz fi = 70 MHz fi = 170 MHz ct(ch)
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ADC1213S065 Min Typ 89 88 87 84 100 Max -
ADC1213S080 Min Typ 89 88 87 85 100 Max -
ADC1213S105 Min Typ 88 88 86 83 100 Max -
ADC1213S125 Min Typ 89 88 86 84 100 Max -
Unit dBc dBc dBc dBc dBc
channel crosstalk
fi = 70 MHz
Typical values measured at VDDA = 3 V, VDDD(1V8) = 1.8 V, Tamb = 25 C. Minimum and maximum values are across the full temperature range Tamb = 40 C to +85 C at VDDA = 3 V, VDDD(1V8) = 1.8 V; Vi(INP) Vi(INM) = 1 dBFS; internal reference mode; 100 differential applied to serial outputs; unless otherwise specified.
10.2 Clock and digital output timing
Table 7. Symbol Clock and digital output characteristics [1] Parameter Conditions ADC1213S065 Min pins CLKP and CLKM fclk tlat(data) clk td(s) twake
[1]
ADC1213S080 Min 60 250 30 Typ 50 0.8 76 Max 80 283 70 -
ADC1213S105 Min 75 190 30 Typ 50 0.8 76 Max 105 226 70 -
ADC1213S125 Min 100 160 30 Typ 50 0.8 76 Max 125 170 70 -
Unit
Typ 50 0.8 76
Max 65 850 70 -
clock frequency data latency time clock duty cycle sampling delay time wake-up time clock cycles DCS_EN = logic 1
45 307 30 -
Msps ns % ns s
Single 12-bit ADC; serial JESD204A interface
Typical values measured at VDDA = 3 V, VDDD(1V8) = 1.8 V, Tamb = 25 C. Minimum and maximum values are across the full temperature range Tamb = 40 C to +85 C at VDDA = 3 V, VDDD(1V8) = 1.8 V; Vi(INP) Vi(INM) = 1 dBFS; internal reference mode; 100 differential applied to serial outputs; unless otherwise specified.
ADC1213S series
NXP Semiconductors
ADC1213S series
Single 12-bit ADC; serial JESD204A interface
10.3 Serial output timing
The eye diagram of the serial output is shown in Figure 3 and Figure 4. Test conditions are:
• 3.125 Gbps data rate • Tamb = 25 °C • DC-coupling with two different receiver common-mode voltages
005aaa088
Fig 3.
Eye diagram at 1 V receiver common-mode
005aaa089
Fig 4.
Eye diagram at 2 V receiver common-mode
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
10.4 SPI timing
Table 8. Symbol tw(SCLK) tw(SCLKH) tw(SCLKL) tsu SPI timing characteristics [1] Parameter SCLK pulse width SCLK HIGH pulse width SCLK LOW pulse width set-up time data to SCLK HIGH CS to SCLK HIGH th hold time data to SCLK HIGH CS to SCLK HIGH fclk(max)
[1]
Conditions
Min -
Typ 40 16 16 5 5 2 2 25
Max -
Unit ns ns ns ns ns ns ns MHz
maximum clock frequency
Typical values measured at VDDA = 3 V, VDDD(1V8) = 1.8 V, Tamb = 25 C. Minimum and maximum values are across the full temperature range Tamb = 40 C to +85 C at VDDA = 3 V, VDDD(1V8) = 1.8 V; Vi(INP) Vi(INM) = 1 dBFS; internal reference mode; 100 differential applied to serial outputs; unless otherwise specified.
tsu CS
th
tsu
tw(SCLKL) tw(SCLK) tw(SCLKH)
th
SCLK
SDIO
R/W
W1
W0
A12
A11
D2
D1
D0
005aaa065
Fig 5.
SPI timing
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
11. Application information
11.1 Analog inputs
11.1.1 Input stage description
The analog input of the ADC1213S supports a differential or a single-ended input drive. Optimal performance is achieved using differential inputs with the common-mode input voltage (VI(cm)) on pins INP and INM set to 0.5VDDA. The full-scale analog input voltage range is configurable between 1 V (p-p) and 2 V (p-p) via a programmable internal reference (see Section 11.2 and Table 21). Figure 6 shows the equivalent circuit of the sample-and-hold input stage, including ElectroStatic Discharge (ESD) protection and circuit and package parasitics.
package
ESD
parasitics
switch INP 8
Ron = 15 Ω Cs
internal clock
switch
Ron = 15 Ω
INM
7
Cs
internal clock
005aaa185
Fig 6.
Input sampling circuit
The sample phase occurs when the internal clock (derived from the clock signal on pin CLKP/CLKM) is HIGH. The voltage is then held on the sampling capacitors. When the clock signal goes LOW, the stage enters the hold phase and the voltage information is transmitted to the ADC core.
11.1.2 Anti-kickback circuitry
Anti-kickback circuitry (RC filter in Figure 7) is needed to counteract the effects of a charge injection generated by the sampling capacitance. The RC filter is also used to filter noise from the signal before it reaches the sampling stage. The value of the capacitor should be chosen to maximize noise attenuation without degrading the settling time excessively.
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
R
INP
C
R
INM
005aaa073
Fig 7.
Anti-kickback circuit
The component values are determined by the input frequency and should be selected so as not to affect the input bandwidth.
Table 9. RC-coupling versus input frequency, typical values Resistance () 25 12 12 Capacitance (pF) 12 8 8 3 70 170
Input frequency (MHz)
11.1.3 Transformer
The configuration of the transformer circuit is determined by the input frequency. The configuration shown in Figure 8 would be suitable for a baseband application.
ADT1-1WT
100 nF
analog input
100 nF 25 Ω
25 Ω
INP
12 pF 100 nF 25 Ω 25 Ω
100 nF
INM VCM
100 nF
100 nF
005aaa044
Fig 8.
Single transformer configuration
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
The configuration shown in Figure 9 is recommended for high frequency applications. In both cases, the choice of transformer is a compromise between cost and performance.
ADT1-1WT
100 nF 50 Ω
ADT1-1WT
50 Ω
12 Ω
INP
analog input
8.2 pF 50 Ω 50 Ω 12 Ω
INM VCM
100 nF
100 nF
100 nF
005aaa045
Fig 9.
Dual transformer configuration
11.2 System reference and power management
11.2.1 Internal/external reference
The ADC1213S has a stable and accurate built-in internal reference voltage to adjust the ADC full-scale. This reference voltage can be set internally via SPI or with pins VREF and SENSE (see Figure 11 to Figure 14), in 1 dB steps between 0 dB and 6 dB, via SPI control bits INTREF[2:0] (when bit INTREF_EN = logic 1; see Table 21). The equivalent reference circuit is shown in Figure 10. An external reference is also possible by providing a voltage on pin VREF as described in Figure 14.
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
REFT REFERENCE AMP REFB
VREF
EXT_ref
BUFFER
EXT_ref
BANDGAP REFERENCE
ADC CORE SENSE SELECTION LOGIC
005aaa164
Fig 10. Reference equivalent schematic
If bit INTREF_EN is set to logic 0, the reference voltage is determined either internally or externally as detailed in Table 10.
Table 10. Mode Internal (Figure 11) Internal (Figure 12) Internal, SPI mode (Figure 13) External (Figure 14) Reference modes SPI bit, “Internal reference” 0 0 1 0 SENSE pin GND VREF pin Full-scale, (V (p-p))
330 pF capacitor 2 to GND 1 1 to 2
VREF pin = SENSE pin and 330 pF capacitor to GND VREF pin = SENSE pin and 330 pF capacitor to GND VDDA
external voltage 1 to 2 from 0.5 V to 1 V
Figure 11 to Figure 14 illustrate how to connect the SENSE and VREF pins to select the required reference voltage source.
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
VREF
330 pF
VREF
330 pF
REFERENCE EQUIVALENT SCHEMATIC
REFERENCE EQUIVALENT SCHEMATIC SENSE
SENSE
005aaa116
005aaa117
Fig 11. Internal reference, 2 V (p-p) full-scale
Fig 12. Internal reference, 1 V (p-p) full-scale
VREF
VREF
0.1 μF
330 pF
REFERENCE EQUIVALENT SCHEMATIC SENSE
V
REFERENCE EQUIVALENT SCHEMATIC
SENSE
005aaa118
VDDA
005aaa119
Fig 13. Internal reference via SPI, 1 V (p-p) to 2 V (p-p) full-scale
Fig 14. External reference, 1 V (p-p) to 2 V (p-p) full-scale
11.2.2 Programmable full-scale
The full-scale is programmable between 1 V (p-p) to 2 V (p-p) (see Table 11).
Table 11. 000 001 010 011 100 101 110 111 Reference SPI gain control Level (dB) 0 1 2 3 4 5 6 not used Full-scale (V (p-p)) 2 1.78 1.59 1.42 1.26 1.12 1 x
INTREF[2:0]
11.2.3 Common-mode output voltage (VO(cm))
An 0.1 F filter capacitor should be connected between pin VCM and ground to ensure a low-noise common-mode output voltage. When AC-coupled, this pin can be used to set the common-mode reference for the analog inputs, for instance via a transformer middle point.
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
package
ESD
parasitics COMMON-MODE REFERENCE
1.5 V VCM
0.1 μF
ADC core
005aaa051
Fig 15. Reference equivalent schematic
11.2.4 Biasing
The common-mode input voltage (VI(cm)) on pins INP and INM should be set externally to 0.5VDDA for optimal performance and should always be between 0.9 V and 2 V.
11.3 Clock input
11.3.1 Drive modes
The ADC1213S can be driven differentially (LVPECL). It can also be driven by a single-ended LVCMOS signal connected to pin CLKP (CLKM should be connected to ground via a capacitor).
LVCMOS clock input
CLKP CLKP CLKM LVCMOS clock input CLKM
005aaa174
005aaa053
a. Rising edge LVCMOS Fig 16. LVCMOS single-ended clock input
b. Falling edge LVCMOS
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
CLKP Sine clock input
Sine clock input
CLKP
CLKM
CLKM
005aaa173
005aaa054
a. Sine clock input
b. Sine clock input (with transformer)
CLKP LVPECL clock input
CLKM
005aaa172
c. LVPECL clock input Fig 17. Differential clock input
11.3.2 Equivalent input circuit
The equivalent circuit of the input clock buffer is shown in Figure 18. The common-mode voltage of the differential input stage is set via internal 5 k resistors.
package
ESD
parasitics
CLKP
Vcm(clk) SE_SEL SE_SEL
5 kΩ
5 kΩ
CLKM
005aaa081
Vcm(clk) = common-mode voltage of the differential input stage.
Fig 18. Equivalent input circuit
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
Single-ended or differential clock inputs can be selected via the SPI (see Table 20). If single-ended is selected, the input pin (CLKM or CLKP) is selected via control bit SE_SEL. If single-ended is implemented without setting bit SE_SEL accordingly, the unused pin should be connected to ground via a capacitor.
11.3.3 Duty cycle stabilizer
The duty cycle stabilizer can improve the overall performance of the ADC by compensating the input clock signal duty cycle. When the duty cycle stabilizer is active (bit DCS_EN = logic 1; see Table 20), the circuit can handle signals with duty cycles of between 30 % and 70 % (typical). When the duty cycle stabilizer is disabled (DCS_EN = logic 0), the input clock signal should have a duty cycle of between 45 % and 55 %.
Table 12. 0 1 Duty cycle stabilizer Description duty cycle stabilizer disable duty cycle stabilizer enable
bit DCS_EN
11.3.4 Clock input divider
The ADC1213S contains an input clock divider that divides the incoming clock by a factor of 2 (when bit CLKDIV2_SEL = logic 1; see Table 20). This feature allows the user to deliver a higher clock frequency with better jitter performance, leading to a better SNR result once acquisition has been performed.
11.4 Digital outputs
11.4.1 Serial output equivalent circuit
The JESD204A standard specifies that if the receiver and the transmitter are DC-coupled, both must be fed from the same supply.
VDDD VDDD
50 Ω 50 Ω
CMLP
100 Ω
RECEIVER
CMLN + 12 mA to 26 mA
AGND
005aaa197
Fig 19. CML output connection to the receiver (DC-coupling)
The output should be terminated when 100 (typical) is reached at the receiver side.
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
VDDD
50 Ω
50 Ω
CMLP
10 nF
100 Ω
RECEIVER
CMLN + 12 mA to 26 mA
10 nF
005aaa187
Fig 20. CML output connection to the receiver (AC-coupling)
11.5 JESD204A serializer
For more information about the JESD204A standard refer to the JEDEC web site.
11.5.1 Digital JESD204A formatter
The block placed after the ADC core is used to implement all functions of the JESD204A standard. This ensures signal integrity and guarantees the clock and the data recovery at the receiver side. The block is highly parameterized and can be configured in various ways depending on the sampling frequency and the number of lanes used.
M CONVERTERS N bits from Cr0 + CS bits for control
L LANES
F octets TX transport layer
FRAME TO OCTETS
SCRAMBLER
ALIGNMENT CHARACTER GENERATOR
8-bit/ 10-bit
SER
LANE 0
SYNC~
TX CONTROLLER
N' = N + CS S samples per frame cycle
CF: position of controls bits HD: frame boundary break Padding with Tails bits (TT) L × (F) octets L octets
005aaa198
M × (N' × S) bits
Fig 21. General overview of the JESD204A serializer
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
ADC_MODE[1:0] SCR_IN_MODE N AND CS LANE_MODE[1:0] N + CS 8 00 SCR PRBS FSM (frame assembly, character replication, ILA, test mode) 01 8-bit/ 10-bit '0' 10 00
PRBS
11
DUMMY
12 + 1
10
12 + 1
ADC_PD
LANE_POL SER
01
ADC
12 + 1
00
FRAME ASSEMBLY
'0/1' PRBS
10
11
×1
PLL AND DLL
frame CLK character CLK bit CLK SWING_SEL[2:0]
×F × 10F
sync_request
001aam777
Fig 22. Detailed view of the JESD204A serializer with debug functionality
11.5.2 ADC core output codes versus input voltage
Table 13 shows the data output codes for a given analog input voltage.
Table 13. < 1 1.0000000 0.9995117 0.9990234 0.9985352 0.9980469 .... 0.0009766 0.0004883 0.0000000 +0.0004883 +0.0009766 .... +0.9980469 +0.9985352 +0.9990234 +0.9995117 +1.0000000 > +1 Output codes versus input voltage Offset binary 0000 0000 0000 0000 0000 0000 0000 0000 0001 0000 0000 0010 0000 0000 0011 0000 0000 0100 .... 0111 1111 1110 0111 1111 1111 1000 0000 0000 1000 0000 0001 1000 0000 0010 .... 1111 1111 1011 1111 1111 1100 1111 1111 1101 1111 1111 1110 1111 1111 1111 1111 1111 1111 Two’s complement 1000 0000 0000 1000 0000 0000 1000 0000 0001 1000 0000 0010 1000 0000 0011 1000 0000 0100 .... 1111 1111 1110 1111 1111 1111 0000 0000 0000 0000 0000 0001 0000 0000 0010 .... 0111 1111 1011 0111 1111 1100 0111 1111 1101 0111 1111 1110 0111 1111 1111 0111 1111 1111 OTR 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1
INP-INM (V)
ADC1213S_SER
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
11.6 Serial Peripheral Interface (SPI)
11.6.1 Register description
The ADC1213S serial interface is a synchronous serial communications port allowing for easy interfacing with many industry microprocessors. It provides access to the registers that control the operation of the chip in both read and write modes. This interface is configured as a 3-wire type (SDIO as bidirectional pin). Pin SCLK acts as the serial clock and pin CS acts as the serial chip select. Each read/write operation is sequenced by the CS signal and enabled by a LOW level to to drive the chip with N bytes, depending on the content of the instruction byte (see Table 14).
Table 14. Bit Description Instruction bytes for the SPI MSB 7 R/W[1] A7
[1]
LSB 6 W1 A6 5 W0 A5 4 A12 A4 3 A11 A3 2 A10 A2 1 A9 A1 0 A8 A0
R/W indicates whether a read (logic 1) or write (logic 0) transfer occurs after the instruction byte.
Table 15. R/W[1] 0 1
[1]
Read or Write mode access description Description Write mode operation Read mode operation
Bits W1 and W0 indicate the number of bytes transferred.
Table 16. W1 0 0 1 1
Number of bytes to be transferred W0 0 1 0 1 Number of bytes transferred 1 byte 2 bytes 3 bytes 4 or more bytes
Bits A12 to A0 indicate the address of the register being accessed. In the case of a multiple byte transfer, this address is the first register to be accessed. An address counter is incremented to access subsequent addresses. The steps involved in a data transfer are as follows: 1. The falling edge on pin CS in combination with a rising edge on pin SCLK determine the start of communications. 2. The first phase is the transfer of the 2-byte instruction. 3. The second phase is the transfer of the data which can be vary in length but is always a multiple of 8 bits. The MSB is always sent first (for instruction and data bytes). 4. A rising edge on pin CS indicates the end of data transmission.
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ADC1213S series
Single 12-bit ADC; serial JESD204A interface
CS
SCLK
SDIO
R/W
W1
W0
A12 A11 A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
Instruction bytes
Register N (data)
Register N + 1 (data)
005aaa086
Fig 23. Transfer diagram for two data bytes (3-wire type)
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
11.6.2 Channel control
Table 17. Register allocation map Access[1] Bit 7 R/W SW_RST Bit 6 TESTPAT_2[11:4] TESTPAT_3[3:0] Bit 5 Bit 4 SE_SEL Bit definition Bit 3 DIFF_SE INTREF_EN DIG_OFFSET[5:0] TESTPAT_1[2:0] Bit 2 Bit 1 ENABLE PD[1:0] CLKDIV2_SEL INTREF[2:0] DCS_EN Bit 0 Default[2] (bin) Address Register name (hex) ADC control register 0003 0005 0006 0008 SPI control 1111 1111 0000 0000 0000 000* 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 Reset and R/W Operating modes Clock Vref Offset Test pattern 1 Test pattern 2 Test pattern 3 R/W R/W R/W R/W R/W R/W
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0013 0014 0015 0016
JESD204A control 0801 0802 0805 Ser_Status Ser_Reset Ser_Control1 R R/W R/W RXSYNC _ERROR SW_RST 0 0 RESERVED RESERVED[2:0] 0 SYNC_ POL 0 0 SYNC_ SINGLE_ ENDED 0 0 FSM_SW_ RST 1 0 0 REV_ SCR POR_TST 0 REV_ ENCODER SWING_SEL[2:0] RESERVED 0010 0000 0 REV_ SERIAL 0000 0000 0100 1001 0000 0011 0000 0000
Single 12-bit ADC; serial JESD204A interface
ADC1213S series
0808 0809
Ser_Analog_Ctrl Ser_ScramblerA
R/W R/W
0 0
0
0 LSB_INIT[6:0]
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Table 17. Register allocation map …continued Access[1] Bit 7 R/W R/W R R/W* R/W* R/W* R/W* R/W* R/W* R/W* R/W* R/W* R/W* 0 SCR 0 0 0 0 0 0 HD 0 0 0 0 0 0 CS[0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 FCHK[7:0] 0 0 SCR_IN_ MODE 0 LANE_MODE[1:0] ADC_MODE[1:0] 0 0 LANE_ POL 0 0 0 LANE_PD ADC_PD 0 0 0 0 0 0 0 0 0 0 0 0 K[4:0] 0 N[3:0] NP[4:0] 0 0 LID[4:0] 0 CF[1:0] S 0 M 0 0 0 0 0 Bit 6 Bit 5 Bit 4 Bit definition Bit 3 MSB_INIT[7:0] 0 DID[7:0] BID[3:0] 0 F[2:0] L 0 PRBS_TYPE[1:0] Bit 2 Bit 1 Bit 0 Default[2] (bin) 1111 1111 0000 0000 1110 1101 0000 1010 0000 0000 0000 0*** 000* **** 0000 000* 0100 0010 0000 1111 0000 0000 *000 0000 0001 1100 **** **** 0000 0000 0000 0000
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Address Register name (hex) 080A 080B 0820 0821 0822 0823 0824 0825 0826 0827 0828 0829 082D 084D 0871 0891 Ser_ScramblerB Ser_PRBS_Ctrl Cfg_0_DID Cfg_1_BID Cfg_3_SCR_L Cfg_4_F Cfg_5_K Cfg_6_M Cfg_7_CS_N Cfg_8_Np Cfg_9_S Cfg_10_HD_CF Cfg_02_2_LID
Single 12-bit ADC; serial JESD204A interface
Cfg02_13_FCHK R Lane_0_Ctrl ADC_0_Ctrl R/W R/W
ADC1213S series
[1] [2]
An "*" in the Access column means that this register is subject to control access conditions in Write mode. An "*" in the Default column replaces a bit of which the value depends on the binary level of external pins (e.g. CFG[3:0], Swing[1:0], Scrambler).
NXP Semiconductors
ADC1213S series
Single 12-bit ADC; serial JESD204A interface
11.6.3 Register description
11.6.3.1 ADC control registers
Table 18. Register SPI control (address 0003h) Default values are highlighted. Bit 7 to 2 1 Symbol ENABLE Access R/W 0 1 0 1 Value 111111 Description not used ADC SPI control enable: ADC does not get the next SPI command ADC gets the next SPI command not used
Table 19. Register Reset and Power-down mode (address 0005h) Default values are highlighted. Bit 7 Symbol SW_RST Access R/W 0 1 6 to 2 1 to 0 PD[1-0] R/W 00 01 10 11 Table 20. Register Clock (address 0006h) Default values are highlighted. Bit 7 to 5 4 Symbol SE_SEL Access R/W 0 1 3 DIFF_SE R/W 0 1 2 1 CLKDIV2_SEL R/W 0 1 0 DCS_EN R/W 0 1 0 Value 000 Description not used select SE clock input pin: select CLKM input select CLKP input differential/single-ended clock input select: fully differential single-ended not used select clock input divider by 2: disable enable duty cycle stabilizer enable: disable enable 00000 Value Description reset digital part: no reset performs a reset of the digital part not used Power-down mode: normal (power-up) full power-down sleep normal (power-up)
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Table 21. Register Vref (address 0008h) Default values are highlighted. Bit 7 to 4 3 Symbol INTREF_EN Access R/W 0 1 2 to 0 INTREF[2:0] R/W 000 001 010 011 100 101 110 111 Value 0000 Description not used enable internal programmable VREF mode: disable enable programmable internal reference: 0 dB (FS = 2 V) 1 dB (FS = 1.78 V) 2 dB (FS = 1.59 V) 3 dB (FS = 1.42 V) 4 dB (FS = 1.26 V) 5 dB (FS = 1.12 V) 6 dB (FS = 1 V) not used
Table 22. Digital offset adjustment (address 0013h) Default values are highlighted. Register offset Decimal +31 ... 0 ... 32 DIG_OFFSET[5:0] 011111 ... 000000 ... 100000 +31 LSB ... 0 ... 32 LSB
Table 23. Register Test pattern 1 (address 0014h) Default values are highlighted. Bit 7 to 3 2 to 0 Symbol TESTPAT_1[2:0] Access R/W 000 001 010 011 100 101 110 111 Value 00000 Description not used digital test pattern: off mid-scale FS + FS toggle ‘1111..1111’/’0000..0000’ custom test pattern, to be written in register 0015h and 0016h ‘010101...’ ‘101010...’
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Table 24. Register Test pattern 2 (address 0015h) Default values are highlighted. Bit 7 to 0 Symbol TESTPAT_2[11:4] Access R/W Value Description 00000000 custom digital test pattern (bit 11 to 4)
Table 25. Register Test pattern 3 (address 0016h) Default values are highlighted. Bit 7 to 4 3 to 0 Symbol TESTPAT_3[3:0] Access R/W Value 0000 0000 Description custom digital test pattern (bit 3 to 0) not used
11.6.4 JESD204A digital control registers
Table 26. SER_Status (address 0801h) Default values are highlighted. Bit 7 6 to 4 3 to 2 1 0 Symbol RXSYNC_ERROR RESERVED[2:0] POR_TST RESERVED Access R R Value 0 010 00 0 0 Description set to 1 when a synchronization error occurs reserved not used power-on-reset reserved
Table 27. SER_Reset (address 0802h) Default values are highlighted. Bit 7 6 to 4 3 2 to 0 Symbol SW_RST FSM_SW_RST Access R/W R/W Value 0 000 0 000 Description initiates a software reset of the JESD204A unit not used initiates a software reset of the internal state machine of JESD204A unit not used
Table 28. SER_Control1 (address 0805h) Default values are highlighted. Bit 7 6 5 Symbol RESERVED SYNC_POL Access R/W 0 1 4 SYNC_SINGLE_ENDED R/W 0 1 3 2 REV_SCR 0 1
ADC1213S_SER
Value 0 0
Description not used reserved defines the synchronization signal polarity: synchronization signal is active LOW synchronization signal is active HIGH defines the input mode of the synchronization signal: synchronization input mode is set in Differential mode synchronization input mode is set in Single-ended mode not used LSB are swapped to MSB at the scrambler input: disable enable
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1
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Single 12-bit ADC; serial JESD204A interface
Table 28. SER_Control1 (address 0805h) …continued Default values are highlighted. Bit 1 Symbol REV_ENCODER Access 0 1 0 REV_SERIAL 0 1 Table 29. SER_Analog_Ctrl (address 0808h) Default values are highlighted. Bit 7 to 3 2 to 0 Symbol SWING_SEL[2:0] Access R/W Value 00000 011 Description not used defines the swing output for the lane pads Value Description LSB are swapped to MSB at the 8-bit/10-bit encoder input: disable enable LSB are swapped to MSB at the lane input: disable enable
Table 30. SER_ScramblerA (address 0809h) Default values are highlighted. Bit 7 6 to 0 Symbol LSB_INIT[6:0] Access R/W Value 0 0000000 Description not used defines the initialization vector for the scrambler polynomial (lower)
Table 31. SER_ScramblerB (address 080Ah) Default values are highlighted. Bit 7 to 0 Symbol MSB_INIT[7:0] Access R/W Value 11111111 Description defines the initialization vector for the scrambler polynomial (upper)
Table 32. SER_PRBS_Ctrl (address 080Bh) Default values are highlighted. Bit 7 to 2 1 to 0 Symbol PRBS_TYPE[1:0] Access R/W 00 (reset) 01 10 11 Table 33. Cfg_0_DID (address 0820h) Default values are highlighted. Bit 7 to 0 Symbol DID[7:0] Access R Value Description 11101101 defines the device (= link) identification number Value 000000 Description not used defines the type of Pseudo-Random Binary Sequence (PRBS) generator to be used: PRBS-7 PRBS-7 PRBS-23 PRBS-31
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Table 34. Cfg_1_BID (address 0821h) Default values are highlighted. Bit 7 to 4 3 to 0 Symbol BID[3:0] Access R/W Value 0000 1010 Description not used defines the bank ID – extension to DID
Table 35. Cfg_3_SCR_L (address 0822h) Default values are highlighted. Bit 7 6 to 1 0 Symbol SCR L Access R/W R/W Value 0 000000 0 Description scrambling enabled not used defines the number of lanes per converter device, minus 1
Table 36. Cfg_4_F (address 0823h) Default values are highlighted. Bit 7 to 3 2 to 0 Symbol F[2:0] Access R/W Value 00000 *** Description not used defines the number of octets per frame, minus 1
Table 37. Cfg_5_K (address 0824h) Default values are highlighted. Bit 7 to 5 4 to 0 Symbol K[4:0] Access R/W Value 000 ***** Description not used defines the number of frames per multiframe, minus 1
Table 38. Cfg_6_M (address 0825h) Default values are highlighted. Bit 7 to 1 0 Symbol M Access R/W Value 0000000 * Description not used defines the number of converters per device, minus 1
Table 39. Cfg_7_CS_N (address 0826h) Default values are highlighted. Bit 7 6 5 to 4 3 to 0 Symbol CS[0] N[3:0] Access R/W R/W Value 0 1 00 0010 Description not used defines the number of control bits per sample, minus 1 not used defines the converter resolution
Table 40. Cfg_8_Np (address 0827h) Default values are highlighted. Bit 7 to 5 4 to 0 Symbol NP[4:0] Access R/W Value 000 01111 Description not used defines the total number of bits per sample, minus 1
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Single 12-bit ADC; serial JESD204A interface
Table 41. Cfg_9_S (address 0828h) Default values are highlighted. Bit 7 to 1 0 Symbol S Access R/W Value 0000000 0 Description not used defines number of samples per converter per frame cycle
Table 42. Cfg_10_HD_CF (address 0829h) Default values are highlighted. Bit 7 6 to 2 1 to 0 Symbol HD CF[1:0] Access R/W R/W Value * 00000 00 Description defines high density format not used defines number of control words per frame clock cycle per link.
Table 43. Cfg_02_2_LID (address 082Dh) Default values are highlighted. Bit 7 to 5 4 to 0 Symbol LID[4:0] Access R/W Value 000 11100 Description not used defines lane identification number
Table 44. Cfg02_13_FCHK (address 084Dh) Default values are highlighted. Bit 7 to 0 Symbol FCHK[7:0] Access R Value ******** Description defines the checksum value for lane checksum corresponds to the sum of all the link configuration parameters module 256 (as defined in JEDEC Standard No.204A) Table 45. Lane_0_Ctrl (address 0871h) Default values are highlighted. Bit 7 6 Symbol SCR_IN_MODE Access R/W 0 (reset) 1 Value 0 Description not used defines the input type for scrambler and 8-bit/10-bit units: (normal mode) = input of the scrambler and 8-bit/10-bit units is the output of the frame assembly unit. input of the scrambler and 8-bit/10-bit units is the PRBS generator (PRBS type is defined with “PRBS_TYPE[1:0]” (Ser_PRBS_Ctrl register) defines output type of lane output unit: 00 (reset) 01 10 11 3 0 normal mode: lane output is the 8-bit/10-bit output unit constant mode: lane output is set to a constant (0 0) toggle mode: lane output is toggling between 0 0 and 0 1 PRBS mode: lane output is the PRBS generator (PRBS type is defined with “PRBS_TYPE[1:0]” (Ser_PRBS_Ctrl register) not used
5 to 4
LANE_MODE[1:0]
R/W
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Single 12-bit ADC; serial JESD204A interface
Table 45. Lane_0_Ctrl (address 0871h) …continued Default values are highlighted. Bit 2 Symbol LANE_POL Access R/W 0 1 1 0 RESERVED LANE_PD R/W R/W 0 1 Table 46. ADC_0_Ctrl (address 0891h) Default values are highlighted. Bit 7 to 6 5 to 4 Symbol ADC_MODE[1:0] Access R/W 00 (reset) 01 10 11 3 to 1 0 ADC_PD R/W 0 1 000 Value 00 Description not used defines input type of JESD204A unit ADC output is connected to the JESD204A input not used JESD204A input is fed with a dummy constant, set to: OTR = 0 and ADC[13:0] = “10011011101010” JESD204A is fed with a PRBS generator (PRBS type is defined with “PRBS_TYPE[1:0]” (Ser_PRBS_Ctrl register) not used ADC power-down control: ADC is operational ADC is in Power-down mode 0 Value Description defines lane polarity: lane polarity is normal lane polarity is inverted reserved lane power-down control: lane is operational lane is in Power-down mode
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12. Package outline
HVQFN32R: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based; body 7 x 7 x 0.8 mm
SOT1152-1
D
B
A
terminal 1 index area
E
A
detail X
e1 e L1 9 L 8 17 b 1/2 e 16 ∅v ∅w CAB C y1 C C y
Eh 1/2 e 1 terminal 1 index area 32 Dh 0 Dimensions Unit mm A b D 7.1 7.0 6.9 Dh 4.05 4.00 3.95 E 7.1 7.0 6.9 Eh e e1 e2 L 2.5 scale 25 24
e
e2
X
5 mm
L1
v 0.1
w
y
y1 0.1
max 0.90 0.28 nom 0.80 0.23 min 0.75 0.18
4.05 0.55 0.10 4.00 0.65 4.55 4.55 0.50 0.05 3.95 0.45 0.00
0.05 0.08
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included Outline version SOT1152-1 References IEC --JEDEC --JEITA --European projection
sot1152-1_po
Issue date 09-10-13 09-11-16
Fig 24. Package outline SOT1152-1 (HVQFN32)
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13. Abbreviations
Table 47. Acronym ADC DCS ESD IF IMD LSB LVCMOS LVPECL MSB OTR PRBS SFDR SNR SPI TX Abbreviations Description Analog-to-Digital Converter Duty Cycle Stabilizer ElectroStatic Discharge Intermediate Frequency InterModulation Distortion Least Significant Bit Low-Voltage Complementary Metal-Oxide Semiconductor Low-Voltage Positive Emitter-Coupled Logic Most Significant Bit OuT-of-Range Pseudo-Random Binary Sequence Spurious-Free Dynamic Range Signal-to-Noise Ratio Serial Peripheral Interface Transmitter
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14. Revision history
Table 48. Revision history Release date 20110609 Data sheet status Product data sheet Product data sheet Change notice Supersedes ADC1213S_SER v.1 Document ID ADC1213S_SER v.2 Modifications: ADC1213S_SER v.1
•
Section 10.2 “Clock and digital output timing”has been updated.
20110314
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15. Legal information
15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
© NXP B.V. 2011. All rights reserved.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
ADC1213S_SER
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 2 — 9 June 2011
37 of 39
NXP Semiconductors
ADC1213S series
Single 12-bit ADC; serial JESD204A interface
NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
ADC1213S_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 June 2011
38 of 39
NXP Semiconductors
ADC1213S series
Single 12-bit ADC; serial JESD204A interface
17. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 10.1 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 10.2 Clock and digital output timing . . . . . . . . . . . . 10 10.3 Serial output timing . . . . . . . . . . . . . . . . . . . . . 11 10.4 SPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Application information. . . . . . . . . . . . . . . . . . 13 11.1 Analog inputs . . . . . . . . . . . . . . . . . . . . . . . . . 13 11.1.1 Input stage description . . . . . . . . . . . . . . . . . . 13 11.1.2 Anti-kickback circuitry . . . . . . . . . . . . . . . . . . . 13 11.1.3 Transformer . . . . . . . . . . . . . . . . . . . . . . . . . . 14 11.2 System reference and power management . . 15 11.2.1 Internal/external reference . . . . . . . . . . . . . . . 15 11.2.2 Programmable full-scale . . . . . . . . . . . . . . . . . 17 11.2.3 Common-mode output voltage (VO(cm)) . . . . . 17 11.2.4 Biasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.3 Clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.3.1 Drive modes . . . . . . . . . . . . . . . . . . . . . . . . . . 18 11.3.2 Equivalent input circuit . . . . . . . . . . . . . . . . . . 19 11.3.3 Duty cycle stabilizer . . . . . . . . . . . . . . . . . . . . 20 11.3.4 Clock input divider . . . . . . . . . . . . . . . . . . . . . 20 11.4 Digital outputs . . . . . . . . . . . . . . . . . . . . . . . . . 20 11.4.1 Serial output equivalent circuit . . . . . . . . . . . . 20 11.5 JESD204A serializer. . . . . . . . . . . . . . . . . . . . 21 11.5.1 Digital JESD204A formatter . . . . . . . . . . . . . . 21 11.5.2 ADC core output codes versus input voltage . 22 11.6 Serial Peripheral Interface (SPI) . . . . . . . . . . . 23 11.6.1 Register description . . . . . . . . . . . . . . . . . . . . 23 11.6.2 Channel control . . . . . . . . . . . . . . . . . . . . . . . 25 11.6.3 Register description . . . . . . . . . . . . . . . . . . . . 27 11.6.3.1 ADC control registers . . . . . . . . . . . . . . . . . . . 27 11.6.4 JESD204A digital control registers . . . . . . . . . 29 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 34 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 35 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 36 15 15.1 15.2 15.3 15.4 16 17 Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 37 37 37 38 38 39
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 June 2011 Document identifier: ADC1213S_SER