ASL4501SHNY

ASL4501SHN Four-phase boost converter Rev. 2 — 10 January 2018 Product data sheet 1. Introduction The ASL4501SHN is a highly integrated and flexible four-phase DC-to-DC boost converter IC. It has a serial peripheral interface (SPI) allowing control and diagnostic communication with an external microcontroller. It is designed primarily for use in automotive LED lighting applications and provides an optimized supply voltage for ASLx41xSHN multichannel LED buck driver. 2. General description The ASL4501SHN has a fixed frequency peak current mode control with parabolic/non-linear slope compensation. It can operate with input voltages from 5.5 V to 40 V. It can be configured via SPI for output voltages of up to 80 V, to power the LED buck driver IC. The ASL4501SHN is a four-phase converter which can have two independent outputs. The driver has the flexibility to be configured, via the SPI, as a single output converter, or with multiple combinations of number of outputs and phases. The ASL4501SHN boost converter can drive up to four external low-side N channel metal-oxide-semiconductor field-effect transistors (MOSFETs) from an internally regulated adjustable supply. It can be used to drive either logic or standard level MOSFETs. The integrated SPI also allows for programming the supply under/overvoltage range, output voltage range and DC-to-DC switching frequency. It enables the optimization of external components and flexibility for electromagnetic compatibility (EMC) design. This interface can also be used to provide diagnostic information such as the driver temperature. Additional features include protection against load dump transient voltages of up to 60 V and thermal shutdown when the junction temperature of the ASL4501SHN exceeds +175 C. The device is housed in a very small HVQFN32 pin package and is designed to meet the stringent requirements of automotive applications. It is fully AEC-Q100 grade 1 qualified. It operates over the 40 C to +125 C ambient automotive temperature range. ASL4501SHN NXP Semiconductors Four-phase boost converter 3. Features and benefits                         The ASL4501SHN is an automotive grade product that is AEC-Q100 grade 1 qualified Operating ambient temperature range of 40 C to +125 C Wide operating input voltage range from 5.5 V to 40 V Output voltage programmable via SPI Multi-phase operation for higher power Up to four phases per output Up to two flexible output voltages with 3 % accuracy programmable via SPI Both output voltages can be controlled independently Fixed frequency operation via built-in oscillator Slope compensation tracks the frequency and output voltage Programmable control loop compensation Fast high efficiency field-effect transistor (FET) switching Programmable internal gate driver voltage regulator Gate switching is halted when overvoltage on output is detected Supports both logic level and standard level FETs Low electromagnetic emission (EME) and high electromagnetic immunity (EMI) Output voltage monitoring Supply voltage measurement Control signal to enable the device Read back programmed voltage and frequency range via SPI Junction temperature monitoring via SPI Small package outline HVQFN32 Low quiescent current < 5 A at 25 C when EN = 0 Accurate power dissipation in phases assigned to one output 4. Applications  Automotive LED lighting  Low beam  High beam  Daytime running lights  Turn indicator  Position or park light  Front fog light  Cornering light  Advanced front lighting ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 2 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 5. Ordering information Table 1. Ordering information Type number ASL4501SHN Package Name Description Version HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5  5  0.85 mm SOT617-12 6. Block diagram VDDA VDDD VGG UVOV PHASE 1 GATE DRIVER Phase 1 Signal DIFF AMP, COMPARATOR AND FEEDBACK CONTROL SCHEME PHASE 1 POR PHASE 2 GATE DRIVER VBAT Phase 2 Signal DIFF AMP, COMPARATOR AND FEEDBACK CONTROL SCHEME PHASE 2 VGG1 OSCILLATOR VGG2 FB1 PHASE 3 GATE DRIVER FB2 Phase 3 Signal VCC SDO EN SCLK DIFF AMP, COMPARATOR AND FEEDBACK CONTROL SCHEME PHASE 3 SPI INTERFACE DIGITAL CONTROL LOGIC PHASE CONTROL LOGIC PHASE 4 GATE DRIVER CSB SDI MISC, MTP Phase 4 Signal DIFF AMP, COMPARATOR AND FEEDBACK CONTROL SCHEME PHASE 4 GND aaa-015300 Fig 1. Block diagram ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 3 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 7. Pinning information SDO VCC EN CSB SCLK SDI SNL4 terminal 1 index area GND 7.1 Pinning 32 31 30 29 28 27 26 25 SNL1 1 24 SNH4 SNH1 2 23 GND GND 3 22 G4 G1 4 21 VGG2 ASL4501SHN VGG1 5 G2 6 20 G3 19 GND GND 11 12 13 14 15 16 n.c. 10 FB2 9 n.c. 17 SNL3 VBAT 8 n.c. SNH2 FB1 18 SNH3 n.c. 7 SNL2 GND aaa-024029 Transparent top view Fig 2. Pin configuration 7.2 Pin description ASL4501SHN Product data sheet Table 2. Pin description[1] Symbol Pin Description SNL1 1 phase 1 sense low SNH1 2 phase 1 sense high GND 3 ground G1 4 phase 1 gate driver VGG1 5 gate driver supply 1[2] G2 6 phase 2 gate driver GND 7 ground SNH2 8 phase 2 sense high SNL2 9 phase 2 sense low n.c. 10 not connected FB1 11 feedback; to be connected to Vout1[3] n.c. 12 not connected VBAT 13 battery supply n.c. 14 not connected All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 4 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 2. ASL4501SHN Product data sheet Pin description[1] …continued Symbol Pin Description FB2 15 feedback; to be connected to Vout2[3] n.c. 16 not connected SNL3 17 phase 3 sense low SNH3 18 phase 3 sense high GND 19 ground G3 20 phase 3 gate driver VGG2 21 gate driver supply 2[2] G4 22 phase 4 gate driver GND 23 ground SNH4 24 phase 4 sense high SNL4 25 ph3ase 4 sense low SDI 26 SPI data input SCLK 27 SPI clock CSB 28 SPI chip select EN 29 enable signal VCC 30 external 5 V supply SDO 31 SPI data output GND 32 chip ground [1] For enhanced thermal and electrical performance, the exposed center pad of the package should be soldered to board ground (and not to any other voltage level). [2] VGG1 and VGG2 are connected internally. [3] Refer to Figure 4 and Figure 14 for the recommended connections for pin FB1 and pin FB2. All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 5 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8. Functional description VBAT < Vth(det)on or EN = low Calibration VBAT < Vth(det)on or EN = low Initial state Transition possible but it must not be used Calib = 0 Calib = 1 VBAT > Vth(det)on and EN = high VBAT < Vth(det)on or EN = low Off Cfg_dn = 1 Configuration VBAT < Vth(det)on or EN = low VBAT < Vth(det)on or EN = low VBAT > V_VIN_OV or VBAT < V_VIN_UV or Tj > Tsd(otp) or VGG_err = 1 Operation Cfg_dn = 0 VBAT > V_VIN_OV or VBAT < V_VIN_UV or Tj > Tsd(otp) or VGG_err = 1 VBAT > V_VIN_OV or VBAT < V_VIN_UV or Tj > Tsd(otp) or VGG_err = 1 Fail silent aaa-024048 Fig 3. ASL4501SHN Product data sheet State diagram All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 6 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.1 Operating modes Table 3. Operating modes Mode Control registers Configuration Diagnostic VGG registers registers Vout1 Vout2 Remarks Off n.a. n.a. Configuration read/write read/write n.a. off off device is off, no communication possible read off off VGG is off if no outputs were previously enabled read according off to register VGG is on as soon as one of the outputs has been enabled Operation read/write read read locked according to register configuration registers are locked Fail silent read/write read read[1] off off communication possible, but all outputs off; restart via EN possible Calibration read/write read/write read must be turned on must be turned off for successful calibration, the device has to be correctly configured, VGG has to be on and the outputs off; it is achieved by putting cfg_dn HIGH and LOW after the configuration of the device [1] Setting the bit cfg_dn to logic 0 also grants write access to the configuration registers. 8.1.1 Off mode The ASL4501SHN switches to off mode, if the input voltage drops below the power-on detection threshold voltage (Vth(det)pon) or the EN pin is LOW. In off mode, the SPI and all outputs are turned off. 8.1.2 Configuration mode The ASL4501SHN switches immediately from off mode to configuration mode, when the input voltage rises above the power-on detection threshold voltage (Vth(det)pon) and pin EN is HIGH. The configuration registers can be set when the ASL4501SHN is in the configuration mode. 8.1.3 Operation mode The ASL4501SHN switches from configuration mode to operation mode, as soon as the configuration done bit is set. Once the bit is set, the configuration registers are locked and cannot be changed. In operation mode, the output is available as configured via the SPI. Setting bits Vout1en or Vout2en, initiates the gate driver. Once the gate driver is in regulation, signaled by bit VGG_ok, the respective programmed target voltages are turned on. When the converters are on, the battery monitoring functionality is available. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 7 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.1.4 Fail silent mode The ASL4501SHN switches from operation mode to fail silent mode, when the junction temperature exceeds the over temperature shutdown threshold or a gate driver error is detected. It also switches modes when the input voltage is below the undervoltage detection threshold or above the overvoltage detection threshold. In fail silent mode, all outputs are turned off and only the SPI remains operational. 8.2 Boost converter configuration The ASL4501SHN is an automatic boost converter IC delivering constant DC-to-DC voltage to a load. It has a fixed frequency current mode control for an enhanced stable operation. The ASL4501SHN offers four phases. Each phase consists of a coil, a resistor, a MOSFET and a diode as shown in Figure 4. Lx Dx Voutx Mx Gx FBx SNHx Rx SNLx aaa-018173 Fig 4. Boost converter phase circuit To allow flexible use of the ASL4501SHN, the configuration is based on virtual phases. The virtual phases are then mapped to a real physical phase according to the physical connections and conditions of the circuitry around the ASL4501SHN as shown in Figure 5. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 8 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter V1_1 V1_2 CONTROL LOOP 1 V1_3 G1 FLEXIBLE MAPPING VIA REGISTER SETTINGS V1_4 V2_1 G2 G3 G4 V2_2 CONTROL LOOP 2 V2_3 V2_4 aaa-015305 Fig 5. Mapping of virtual phases (V1_1 to V2_4) to physical phases (G1 to G4) 8.2.1 Virtual phase configuration The ASL4501SHN can generate up to four internal phases at up to two virtual outputs. With the internal phase control enable registers, it can be selected, how many virtual phases are generated for the individual virtual outputs. Table 4. Bit Internal phase control enable for phase logic 1 (address 0Bh) Symbol 7 to 4 3 Function reserved 0000 reserved for future use: keep clear 0 phase 4 is off 1 phase 4 is enabled phase 3 is off EN_P4_1 phase 4 enabled EN_P3_1 phase 3 enabled 0 1 phase 3 is enabled 1 EN_P2_1 phase 2 enabled 0 phase 2 is off 1 phase 2 is enabled 0 phase 1 is off 1 phase 1 is enabled EN_P1_1 phase 1 enabled Table 5. Bit 3 2 1 0 Internal phase control enable for phase logic 2 (address 0Ch) Symbol 7 to 4 - Product data sheet Value 2 0 ASL4501SHN Description Description Value Function reserved 0000 reserved for future use: keep clear 0 phase 4 is off 1 phase 4 is enabled 0 phase 3 is off 1 phase 3 is enabled 0 phase 2 is off 1 phase 2 is enabled 0 phase 1 is off 1 phase 1 is enabled EN_P4_2 phase 4 enabled EN_P3_2 phase 3 enabled EN_P2_2 phase 2 enabled EN_P1_2 phase 1 enabled All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 9 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.2.2 Association of physical phases to the output voltages The phase that the ASL4501SHN offers, must be associated to the output. Table 6. Bit Gate driver output (address 02h) Description Value Function 7 to 4 - reserved 0000 reserved for future use: keep clear 3 association phase 4 0 phase 4 is connected to Vout1 1 phase 4 is connected to Vout2 0 phase 3 is connected to Vout1 1 phase 3 is connected to Vout2 0 phase 2 is connected to Vout1 1 phase 2 is connected to Vout2 0 phase 1 is connected to Vout1 1 phase 1 is connected to Vout2 2 1 0 Symbol O_G4 O_G3 association phase 3 O_G2 association phase 2 O_G1 association phase 1 8.2.3 Association of connected phases to the internal phase generation Each physical phase that the ASL4501SHN offers, must be associated to one of the virtual phases of the output. It is established with the gate driver phase and phase select configuration registers. Table 7. Gate driver phase (address 0Fh) Bit Symbol Description Value Function 7 to 4 - reserved 0000 reserved for future use: keep clear 3 O_GP4 association phase 4 0 phase 4 is connected to phase logic 1 1 phase 4 is connected to phase logic 2 0 phase 3 is connected to phase logic 1 1 phase 3 is connected to phase logic 2 0 phase 2 is connected to phase logic 1 1 phase 2 is connected to phase logic 2 0 phase 1 is connected to phase logic 1 1 phase 1 is connected to phase logic 2 2 1 0 Table 8. Bit O_GP3 association phase 3 O_GP2 association phase 2 O_GP1 association phase 1 Phase selection configuration (address 10h) Symbol Description 7 and 6 Phsel4[1:0] phase select gate driver 4 5 and 4 Phsel3[1:0] phase select gate driver 3 ASL4501SHN Product data sheet Value Function 0h routing from phase 1 1h routing from phase 2 2h routing from phase 3 3h routing from phase 4 0h routing from phase 1 1h routing from phase 2 2h routing from phase 3 3h routing from phase 4 All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 10 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 8. Bit Phase selection configuration (address 10h) …continued Symbol Description 3 and 2 Phsel2[1:0] phase select gate driver 2 1 and 0 Phsel1[1:0] phase select gate driver 1 ASL4501SHN Product data sheet Value Function 0h routing from phase 1 1h routing from phase 2 2h routing from phase 3 3h routing from phase 4 0h routing from phase 1 1h routing from phase 2 2h routing from phase 3 3h routing from phase 4 All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 11 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.2.4 Enabling of connected phases The gate driver enable register is used to configure which of the phases is active. Table 9. Gate driver enable (address 01h) Bit Symbol Description Value Function 7 to 4 - reserved 0000 reserved for future use: keep clear 3 EN_G4 phase 4 enabled 0 phase 4 is off 1 phase 4 is enabled 2 EN_G3 1 EN_G2 0 EN_G1 phase 3 enabled phase 2 enabled phase 1 enabled 0 phase 3 is off 1 phase 3 is enabled 0 phase 2 is off 1 phase 2 is enabled 0 phase 1 is off 1 phase 1 is enabled 8.2.5 Boost converter frequencies configuration The operation frequency of the boost converters can be set with via several SPI registers. To ensure a stable phase delay between the different phases, all timings are derived from the same oscillator. An integer number downscales the internal oscillator frequency for each regulation loop. This slower clock is then used to control the off time of a phase. It also controls the delay from one phase of the regulation loop to the next internal phase. The number of phases determinates finally when the phase is turned on again and defines so the operation frequency of the boost converter. switching frequency clk phase delay and phase off parameters phase active Ph0 COUNTER (DIV N) COUNTER PHASE GATING Ph1 Ph2 Ph3 rst_n combined reset phase_gen_rst config change slope comp clk PHASE CONTROL GENERATOR aaa-017533 Fig 6. ASL4501SHN Product data sheet Phase control generator All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 12 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 10. Bit Clock divider for Vout1 (address 09h) Symbol 7 to 0 Clkdiv1[7:0] Table 11. Bit 7 to 0 Clkdiv2[7:0] Bit Value Function clock divider for phase logic 1 00h clock is not divided ... clock is divided by Clkdiv1[7:0] + 1 FFh clock is divided by 256 Clock divider for Vout2 (address 0Ah) Symbol Table 12. Description Description Value clock divider for phase logic 2 00h clock is not divided ... clock is divided by Clkdiv2[7:0] + 1 FFh clock is divided by 256 Phase-off time and phase delay of output 1 (address 0Dh) Symbol Description 7 to 3 Phdel1[4:0] delay to next phase of phase logic 1 Value Function 0h phase delay is 1 clock period of the divided clock ... phase delay is Phdel1[4:0] + 1 clock period of the divided clock 1Fh phase delay is 32 clock periods of the divided clock 2 to 0 Phoff1[2:0] phase-off time 0h of phase logic 1 ... 7h Table 13. Bit Function phase-off time is 1 clock period of the divided clock phase-off time is Phoff1[2:0] clock period of the divided clock phase-off time is 7 clock periods of the divided clock Phase-off time and phase delay of output 2 (address 0Eh) Symbol Description 7 to 3 Phdel2[4:0] delay to next phase of phase logic 2 Value Function 0h phase delay is 1 clock period of the divided clock ... phase delay is Phdel2[4:0] + 1 clock period of the divided clock 1Fh phase delay is 32 clock periods of the divided clock 2 to 0 Phoff2[2:0] phase-off time 0h of phase logic 2 ... 7h phase-off time is 1 clock period of the divided clock phase-off time is Phoff2[2:0] clock period of the divided clock phase-off time is 7 clock periods of the divided clock Note: To obtain the best performance of the internal slope compensation, keep the settings of the delay between the phases as close to 32 as possible. 8.2.6 Control loop parameter settings The ASL4501SHN is able to operate with a wide range of external components and offers a wide range of operating frequencies. To achieve maximum performance for each set of operation conditions, set the control loop parameters in accordance with the external components and operating frequency. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 13 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 14. Bit Loop filter proportional configuration (address 11h) Symbol 7 to 4 Prop2[3:0] 3 to 0 Prop1[3:0] Table 15. Bit Symbol 3 to 0 Integ1[3:0] Bit Value Function proportional factor output 2 0h proportional factor output 2 is 0.05 ... proportional factor output 2 is Prop2[3:0]  0.05 + 0.05 Fh proportional factor output 2 is 0.8 0h proportional factor output 1 is 0.05 ... proportional factor output 1 is Prop1[3:0]  0.05 + 0.05 Fh proportional factor output 1 is 0.8 proportional factor output 1 Loop filter integral configuration (address 12h) 7 to 4 Integ2[3:0] Table 16. Description Description Value Function integral factor output 2 0h integral factor output 2 is 0.005 ... integral factor output 2 is Integ2[3:0]  0.005 + 0.005 Fh integral factor output 2 is 0.08 integral factor output 1 Symbol Description 3 to 0 Slpcmp1[3:0] slope compensation factor output 1 Product data sheet integral factor output 1 is 0.005 ... integral factor output 1 is Integ1[3:0]  0.005 + 0.005 Fh integral factor output 1 is 0.08 Slope compensation configuration (address 13h) 7 to 4 Slpcmp2[3:0] slope compensation factor output 2 ASL4501SHN 0h Value Function 0h slope compensation factor output 2 = 112 k 1h slope compensation factor output 2 = 84 k 2h slope compensation factor output 2 = 70 k 4h slope compensation factor output 2 = 56 k 8h slope compensation factor output 2 = 28 k 0h slope compensation factor output 1 = 112 k 1h slope compensation factor output 1 = 84 k 2h slope compensation factor output 1 = 70 k 4h slope compensation factor output 1 = 56 k 8h slope compensation factor output 1 = 28 k All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 14 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 17. Bit Current sense slope resistor configuration (address 14h) Symbol 7 and 6 Slpr4[1:0] 5 and 4 Slpr3[1:0] 3 and 2 Slpr2[1:0] 1 and 0 Slpr1[1:0] Description Value Function slope resistor configuration for gate driver 4 0h 250  1h 500  2h 1000  3h 1500  0h 250  1h 500  2h 1000  3h 1500  00h 250  1h 500  2h 1000  3h 1500  0h 250  1h 500  2h 1000  3h 1500  slope resistor configuration for gate driver 3 slope resistor configuration for gate driver 2 slope resistor configuration for gate driver 1 8.3 Output voltage programmability The ASL4501SHN provides the possibility to program the output voltage and output overvoltage protection of the output via the SPI. 8.3.1 Output voltage target programmability The target output voltage can be programmed via the output voltage registers. As the ASL4501SHN is a boost converter, the output voltage cannot be lower than the supply voltage minus the drop of the converter diode (Dx in Figure 4). Table 18. Bit Output voltage 1 register (address 03h) Symbol Description Value Function 7 to 0 V_Vout_1[7:0] target voltage output 1 00h Table 19. Bit output 1 is turned off ... target voltage output 1 = 0.3555  V_Vout_1[7:0]  (1 + (333  106)  (T_junction[7:0]  38)) FFh maximum target output voltage = 90 V Output voltage 2 register (address 04h) Symbol Description Value Function 7 to 0 V_Vout_2[7:0] target voltage output 2 00h ASL4501SHN Product data sheet output 2 is turned off ... target voltage output 2 = 0.3555  V_Vout_2[7:0]  (1 + (333  106)  (T_junction[7:0]  38)) FFh maximum target output voltage = 90 V All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 15 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.3.2 Output overvoltage protection programming Due to fast changes in the supply or the output, it is possible that the output voltage is disturbed. To avoid high voltages that may result into damage of attached components, the ASL4501SHN offers a programmable overvoltage protection threshold. Once the output voltage is above this threshold, the gate pin of the output stops toggling. It results in a halt of the energy delivery to the output. Once the output voltage recovers and is below the threshold again, the gate pin starts toggling again. The regulation loop regulates the output back to the target value. For stable operation of the device, the limit voltage output register should be programmed around 5 V higher than the output voltage registers. Table 20. Bit Limit voltage output 1 register (address 05h) Symbol Description 7 to 0 Vmax_Vout_1[7:0] Table 21. Bit Value Function limit output 1 00h output 1 is turned off ... output overvoltage protection output 1 = 0.3555  V_Vout_1[7:0]  (1 + (333  106)  (T_junction[7:0]  38)) FFh maximum output overvoltage protection output 1 = 90 V Limit voltage output 2 register (address 06h) Symbol Description 7 to 0 Vmax_Vout_2[7:0] Value Function limit output 2 00h output 2 is turned off ... output overvoltage protection output 2 = 0.3555  V_Vout_2[7:0]  (1 + (333  106)  (T_junction[7:0]  38)) FFh maximum output over voltage protection output 2 = 90 V 8.4 Coil peak current limitation The ASL4501SHN offers a function to limit peak current inside the coil and therefore to limit the input current for the system. Furthermore, this functionality can be used to avoid magnetic saturation of the coils and allow some soft start feature to be realized. With the maximum phase current Voutx registers, the maximum peak current for the individual phases assigned to the output can be configured. Once the voltage drop between pins SNLx and SNHx reaches this level, the gate will be turned off until the next switching cycle. To avoid sub harmonic oscillations when the coil peak current limitation is becoming active, the slope compensation is still active. It reduces the coil peak current toward the end of the switching cycle to ensure stable operation of the system. To avoid that this function interferes with the normal regulation, the limit should be placed well above the maximum expected currents. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 16 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 22. Bit Maximum phase current Vout1 register (address 07h) Symbol Description Value Function 7 to 0 I_max_per_phase_Vout1[7:0] Table 23. Bit coil current 00h limitation for ... phases assigned to 64h Vout1 no current allowed maximum peak current = (I_max_per_phase_Vout1[7:0]  1.8 V / 256  0.24 V) / Rsense maximum allowed setting = (128 / 256  1.8 V  0.24 V) / Rsense ... not allowed FFh not allowed Maximum phase current Vout2 register (address 08h) Symbol Description Value Function 7 to 0 I_max_per_phase_Vout2[7:0] coil current 00h limitation for ... phases assigned to 64h Vout2 no current allowed maximum peak current = (I_max_per_phase_Vout2[7:0]  1.8 V / 256  0.24 V) / Rsense maximum allowed setting = (128 / 256  1.8 V  0.24 V) / Rsense ... not allowed FFh not allowed 8.5 Enabling output voltage The ASL4501SHN provides two independent output voltages. In operation mode, the output voltages are turned on with the bits Vout1en and Vout2en. As soon as one of the outputs is turned on, the gate driver voltage regulator is turned on. After the gate driver start-up time, the gate drivers start switching if the bit VGG_ok is set. Table 24. Function control register (address 00h) Bit Symbol Description Value Function 7 to 4 - reserved 0000 reserved: keep clear for future use 3 Cnt_CSB count chip select time 0 chip select LOW count feature is disabled 1 chip select LOW count feature is enabled 0 output 2 is turned off 1 output 2 is turned on, when the device is in operation mode 0 output 1 is turned off 1 output 1 is turned on, when the device is in operation mode 0 device is in configuration mode - no configuration lock 1 device is in configuration mode - configuration lock is active 2 1 0 Vout2en Vout1en Cfg_dn enable output 2 enable output 1 configuration done 8.6 Trimming and calibration The ASL4501SHN offers an option to trim the oscillator frequency and calibrate the output phases. The trimming allows highly accurate switching frequency. The calibration ensures matching of the power delivered by the individual phases toward an output. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 17 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.6.1 Frequency trimming It is mandatory to adjust the internal oscillator frequency of the device to ensure the ASL4501SHN is operating within the specified oscillator frequency range. To measure the actual internal frequency, the device measures the time that the CSB pin is LOW during an SPI transfer. This time information is used to adjust the oscillator frequency of the device. The recommended procedure for the time adjustment is shown in Figure 7. Frequency trimming start Enable CSB low count feature (CNT_CSB = 1) Disable CSB low count feature (CNT_CSB = 0) With defined, CSB LOW TIME Adjust frequency trimming register Read CSB count registers no COUNT as expected? remark: count = CSB LOW TIME 1 yes fosc_trimmed End frequency trimming Fig 7. (± 1 %) aaa-017534 Frequency trimming flow At the start of the sequence, the CSB LOW count feature is activated. It is done by setting the Cnt_CSB bit HIGH in the frequency trimming control register (bit 3; register 00h). The device now measures the time with its internal time domain each time the CSB pin is LOW. It makes this information available in the CSB count registers. To allow an exact stable reading, set the Cnt_CSB bit LOW again with an accurately known CSB LOW time. Setting the bit LOW freezes the count registers. These registers store the last value, which in this case is the command that sets the Cnt_CSB bit LOW. The CSB count registers contain the count of the CSB LOW time of the last SPI command the CSB LOW count feature was enabled. CSB count register 1 contains the bits 7 to 0 of the counter, while the CSB count register 2 contains the bits 15 to 8. ASL4501SHN Product data sheet Table 25. CSB count register 1 (address 41h) Bit Symbol Description Value Function 7 to 0 CSB_cnt[7:0] CSB count LOW ... count value (bits 7 to 0) All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 18 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 26. CSB count register 2 (address 42h) Bit Symbol Description Value Function 15 to 8 CSB_cnt[15:8] CSB count HIGH ... count value (bits 15 to 8) The count, the CSB count register returns, should correspond to the real time of the CSB LOW time. 1 count should correspond with 1/fosc_trimmed (see Table 46). When the CSB count register count, deviates from the applied CSB LOW time, adjust the device internal timing by modifying the frequency trimming register. To ensure that the adjustment had the desired effect, restart the procedure and check the count with the new settings in the frequency trimming register. When the device internal time matches the applied CSB LOW time, no further adjustment is needed and the trimming procedure is finished. 8.6.2 Calibration A calibration of the IC can be initiated at power-up. The calibration ensures the individual activated phases connected to one output of the ASL4501SHN conduct the same amount of power. The calibration of the device takes care that any spread coming from the IC is minimized. Any effect from external components is not taken care of by the calibration. As a pre-condition for the calibration, device has to be configured with the target configuration with the integral and proportional factors set to max value. The VGG regulator has to signal VGG_ok. When the Calib bit [bit 0 in frequency trimming register (address 1Ch)] is set LOW, the calibration starts. After t_calib, the calibration is completed and the calibration done bit will be set. The result of the calibration can be read in the calibration result register (address 4Ch). Note: While the device is in calibration mode, the device operates with the default oscillator frequency. To ensure that the device is operating with a valid calibration, it is recommended to execute the calibration multiple times. Valid calibrations give similar calibration values. Invalid calibrations, e.g. because of external disturbances, give outliers. A restart of the calibration is only allowed once the running calibration is completed or the device was in off mode. 8.6.3 Trimming and calibration registers The frequency trimming register contains the trim bits for the oscillator, but is also used to allow access to the calibration values. Table 27. Bit Calibration/frequency trimming register (address 1Ch) Symbol 7 and 6 5 to 1 0 ASL4501SHN Product data sheet Description Value Function reserved - Calib/Ftrim[4:0] frequency trim bits 4 to 0 .... Calib n.a. Calib = 1: frequency trim setting calibration bits 4 to 0 .... calibration/frequency trimming 1 frequency trimming - normal operation 0 calibration mode All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 Calib = 0: pointer to calibration data © NXP Semiconductors N.V. 2018. All rights reserved. 19 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 28. Calib/Ftrim settings Bit Symbol Description 4 to 0 Calib/Ftrim[4:0] frequency trimming bits content of calibration result register (4Ch); Calib/Ftrim[4:0] select the content available in register 4Ch Value Function 01000 default frequency  33.33 % 01001 default frequency  30.56 % 01010 default frequency  27.78 % 01011 default frequency  25.00 % 01100 default frequency  22.22 % 01101 default frequency  19.44 % 01110 default frequency  16.67 % 01111 default frequency  13.89 % 00000 default frequency  11.11 % 00001 default frequency  8.33 % 00010 default frequency  5.56 % 00011 default frequency  2.78 % 00100 default frequency 00101 default frequency + 2.78 % 00110 default frequency + 5.56 % 00111 default frequency + 8.33 % 11000 default frequency + 11.11 % 11001 default frequency + 13.89 % 11010 default frequency + 16.67 % 11011 default frequency + 19.44 % 11100 default frequency + 22.22 % 11101 default frequency + 25.00 % 11110 default frequency + 27.78 % 11111 default frequency + 30.56 % 10000 default frequency + 33.33 % 10001 default frequency + 36.11 % others not allowed bit 0 - calibration complete bit: 1 = calibration complete; 0 = calibration ongoing 4h bits 4 to 0 calibration value REF2 6h bits 4 to 0 calibration value CAL2 8h bits 4 to 0 calibration value REF3 Ah bits 4 to 0 calibration value CAL3 Ch bits 4 to 0 calibration value REF4 Eh bits 4 to 0 calibration value CAL4 The calibration result register contains the calibration results based on the selection of the Calib/Ftrim[4:0] setting in Table 27. Table 29. ASL4501SHN Product data sheet Calibration result register (address 4Ch) Bit Symbol Description Value Function 7 to 0 Calib_value[7:0] calibration value as selected per Calib/Ftrim[4:0] setting read only calibration info per Calib/Ftrim[4:0] setting All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 20 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.7 Gate supply voltage The ASL4501SHN has an integrated linear regulator to generate the supply voltage of the gate drivers. The integrated linear regulator is internally connected to the pins VGG1 and VGG2. The voltage generated by the linear regulator can be set via the VGG control register. Table 30. Bit VGG control register (address 15h) Symbol Description 7 to 0 VGG[7:0] supply voltage for gate drivers Value Function 00h not allowed ... not allowed 5Dh maximum output voltage = 10.3 V ... 16.25 V  64 mV  VGG[7:0] B7h minimum output voltage = 4.54 V ... not allowed FFh not allowed If a setting between 00h and 5Dh is used, a gate driver voltage is targeted that exceeds the limiting values of the IC. Do not program these settings. To ensure that only values in the allowed range are set inside the IC, read back the programmed value immediately after setting it. If a setting between FFh and B7h is used, the device may not start up VGG. If the device operates, parameters of VGG are not guaranteed. 8.7.1 Gate voltage supply diagnostics The diagnostic options for the gate voltage supply are: • Gate driver available; details can be found in Section 8.10 • Gate driver protection active; details can be found in Section 8.10 8.8 Supply voltage monitoring When at least one of the outputs is enabled and bit VGG_ok is set, the ASL4501SHN continuously measures the voltage at pin VBAT. It allows the system to monitor the supply voltage without additional external components. It also offers the option to put an automatic undervoltage or overvoltage protection in place. Note: The VIN_UV and VIN_OV bits in the status register use the battery voltage measurement. As a result, the VIN_UV and VIN_OV bits are only reliable when at least one output is enabled. 8.8.1 Battery voltage measurement The ASL4501SHN continuously measures the voltage at pin VBAT. The measurement result is available in the battery voltage register when at least one output is enabled. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 21 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 31. Battery voltage register (address 45h) Bit Symbol Description Value Function 7 to 0 V_VBAT[7:0] battery voltage 00h battery voltage = 0 V ... battery voltage = 0.3555  V_VBAT[7:0]  (1 + (333  106)  (T_junction[7:0]  38)) FFh maximum measurable battery voltage = 90 V 8.8.2 Undervoltage detection The ASL4501SHN offers a variable undervoltage detection threshold. When the supply voltage drops below this threshold, the undervoltage detect bit is set, and fail silent mode is entered. All gate pins stop toggling and power is no longer delivered to the output. Table 32. Undervoltage threshold register (address 1Bh) Bit Symbol Description 7 to 0 V_VIN_UV[7:0] undervoltage detection threshold Value Function 00h undervoltage detection threshold = 0 V ... undervoltage detection threshold = 0.3555  V_VIN_UV[7:0]  (1 + (333  106)  (T_junction[7:0]  38)) FFh maximum undervoltage detection threshold = 90 V 8.8.3 Overvoltage detection The ASL4501SHN offers a variable overvoltage detection threshold. When the supply voltage rises above this threshold, the overvoltage detect bit is set, and fail silent mode is entered. All gate pins stop toggling and power is no longer delivered to the output. Table 33. Overvoltage threshold register (address 1Ah) Bit Symbol Description 7 to 0 V_VIN_OV[7:0] overvoltage detection threshold Value Function 00h overvoltage detection threshold = 0 V ... overvoltage detection threshold = 0.3555  V_VIN_OV[7:0]  (1 + (333  106)  (T_junction[7:0]  38)) FFh maximum overvoltage detection threshold = 90 V 8.9 Junction temperature information The ASL4501SHN provides a measurement of the IC junction temperature. The measurement information is available in the junction temperature register. Table 34. Bit Junction temperature register (address 46h) Symbol Description Value 7 to 0 T_junction[7:0] junction temperature Function 0h to 17h device junction temperature below 40 C 18h device junction temperature = 40 C ... device junction temperature = T_junction[7:0]  (215 / 106) C  88 C 82h device junction temperature = 175 C 83h to FFh device junction temperature above 175 C ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 22 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.10 Diagnostic information The diagnostic register contains useful information for diagnostic purposes. Details for each bit can be found in the following subchapters. Table 35. Diagnostic register (address 5Fh) Bit Symbol 7 6 5 4 3 2 1 0 Description Vout1_ok Vout1 regulated Vout2_ok Vout2 regulated VGG_ok Tj_err VIN_UV VIN_OV SPI_err Value Function 0 Vout1 is deviating from the target value 1 Vout1 is regulated to the target value 0 Vout2 is deviating from the target value 1 Vout2 is regulated to the target value gate driver regulation 0 is ok 1 gate driver is not available device temperature is too high 0 device temperature below 175 C 1 device temperature above 175 C VIN undervoltage VIN overvoltage SPI error VGG_err VGG error gate driver is available 0 undervoltage not detected at VIN 1 undervoltage detected at VIN 0 overvoltage not detected at VIN 1 overvoltage detected at VIN 0 last SPI command was executed correctly 1 last SPI command was erroneous and has been discarded 0 VGG overload protection not active 1 VGG overload protection has turned on and VGG is deactivated 8.10.1 Bit VIN_OV The bit VIN_OV depends on the battery monitoring functionality as described in Section 8.8. It indicates that the device has detected an overvoltage condition and entered the fail silent mode. A write access to the diagnostic register, or once the off mode is entered, clears the bit. The device stays in fail silent mode irrespective of the clearing of the bit. 8.10.2 Bit VIN_UV The bit VIN_UV depends on the battery monitoring functionality as described in Section 8.8. It indicates that the device has detected an undervoltage condition and entered the fail silent mode. A write access to the diagnostic register, or once the off mode is entered, clears the bit. The device stays in fail silent mode irrespective of the clearing of the bit. 8.10.3 Bit SPI_err The device evaluates all SPI accesses to the device for the correctness of the commands. When the command is not allowed, the SPI_err bit is set. A write access to the diagnostic register, or once off mode has been entered, clears the bit. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 23 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.10.4 Bit Tj_err The bit Tj_err indicates that the junction temperature has exceeded the maximum allowable temperature, and the device has entered fail silent mode. A write access to the diagnostic register, or once off mode has been entered, clears the bit. The device stays in fail silent mode irrespective of the clearing of the bit. After leaving the off mode (at IC start-up), it is possible that bit Tj_err is set. To avoid wrong diagnostics, clear the diagnostic register before it is evaluated. 8.10.5 Bit VGG_err Bit VGG_err is set when the gate driver does not reach the VGG_ok _window (when VVGG is within range) within the regulator voltage start-up error time. Once bit VGG_err is set, it indicates that an error on the gate driver has been detected and the device has entered fail silent mode. A write access to the diagnostic register, or once off mode has been entered, clears the bit. The device stays in fail silent mode irrespective of the clearing of the bit. 8.10.6 Bit VGG_ok The bit VGG_ok indicates that the gate driver is regulated to the target voltage and allows the gate drivers to drive the gate driver pins. If the gate driver is outside the VGG_ok window after tstartup, and VVGG is within range, the device clears VGG_ok bit and enters fail silent mode. 8.10.7 Bits Vout1_ok and Vout2_ok The bits Vout1_ok and Vout2_ok indicate whether the output voltage is regulated to the target value or deviating from the target value. The bits are set as soon as the corresponding output is within the Vout_ok window (when VO is within the range) for more than tfltr(ov). The bits are cleared when the corresponding output is outside the Vout_ok window for more than tfltr(ov). 8.11 SPI The ASL4501SHN uses an SPI to communicate with an external microcontroller. The SPI can be used for setting the LEDs current, reading and writing the control register. 8.11.1 SPI introduction The SPI provides the communication link with the microcontroller, supporting multi-slave operations. The SPI is configured for full duplex data transfer, so status information is returned when new control data is shifted in. The interface also offers a read-only access option, allowing the application to read back the registers without changing the register content. The SPI uses four interface signals for synchronization and data transfer: • • • • CSB - SPI chip select; active LOW SCLK - SPI clock - default level is LOW due to low-power concept SDI - SPI data input SDO - SPI data output - floating when pin CSB is HIGH Bit sampling is performed on the falling clock edge and data is shifted on the rising clock edge as illustrated in Figure 8. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 24 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter SCLK CSB SDI b15 MSB b14 b13 b12 b11 b10 b9 b3 b2 b1 b0 SDO b15 MSB b14 b13 b12 b11 b10 b9 b3 b2 b1 b0 sampling edge driving edge aaa-015308 Format: Steady state SCLK = 0 Data driving edge = positive edge Data sampling edge = negative edge Fig 8. SPI timing protocol The data bits of the ASL4501SHN are arranged in registers of one-byte length. Each register is assigned to a 7-bit address. For writing into a register, 2 bytes must be sent to the LED driver. The first byte is an identifier byte that consists of the 7-bit address and one read-only bit. For writing, the read-only bit must be set to logic 0. The second byte is the data that is written into the register, so an SPI access consists of at least 16 bits. The SPI frame format is shown in Figure 9, Table 36 and Table 37. data R/W address b15 b14 b13 b12 b11 R/W Fig 9. Table 36. b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 aaa-015309 b15 = MSB = first transmitted bit SPI frame format SPI frame format for a transition to the device Bit Symbol Description Value Function 15 b15 R/W bit 0 write access 1 read access 14 to 8 b14:8 address bits XXX XXXX address that is selected 7 to 0 b7:0 data bits XXXX XXXX data that is transmitted ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 25 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 37. Bit SPI frame format for a transition from the device Symbol Description Value Function[1] 15 to 8 b8:15 diagnostic register XXXX XXXX content of diagnostic register 7 to 0 data bits b7:0 XXXX XXXX when previous command was a valid read command, content of the register that is supposed to be read XXXX XXXX when previous command was a valid write command, new content of the register that was supposed to be written [1] The first SPI command after leaving the off mode, will return 00h. The master initiates the command sequence. The sequence begins with CSB pin pulled LOW and lasts until it is asserted HIGH. The ASL4501SHN also tolerates SPI accesses with a multiple of 16 bits. It allows a daisy chain configuration of the SPI. MOSI SDI CSB CSB SCLK SCLK ASL4501SHN SDO SOMI µC SDI CSB ASLxxxxSHN SDO SCLK SDI CSB ASLxxxxSHN SDO SCLK aaa-024030 Fig 10. Daisy chain configuration ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 26 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter MOSI SDI CSB1 CSB SCLK SCLK ASL4501SHN SDO SOMI µC CSB2 CSB3 SDI CSB ASLxxxxSHN SDO SCLK SDI CSB ASLxxxxSHN SDO SCLK aaa-024031 Fig 11. Physical parallel slave connection During the SPI data transfer, the identifier byte and the actual content of the addressed registers is returned via the SDO pin. The same happens for pure read accesses. Here the read-only bit must be set on logic 1. The content of the data bytes that are transmitted to the ASL4501SHN is ignored. The ASL4501SHN monitors the number of data bits that are transmitted. If the number is not 16, or a multiple of 16, then a write access is ignored and the SPI error indication bit is set. 8.11.2 Typical use case illustration (write/read) Consider a daisy chain scheme with one master connected to four slaves in daisy chain fashion. The following commands are performed during one sequence (first sequence): • • • • ASL4501SHN Product data sheet Write data FFh to the register 1Ah slave 1 Read from register 02h of slave 2 Write data AFh to the register 2Fh of slave 3 Read from register 44h of slave 4 All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 27 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 1st Sequence 2nd Sequence CSB SCLK 1 x 16 SCLK’s 2 x 16 SCLK’s 3 x 16 SCLK’s 4 x 16 SCLK’s 1 x 16 SCLK’s 2 x 16 SCLK’s 3 x 16 SCLK’s Next command for Slave4 Next command for Slave3 Next command for Slave2 Next command for Slave1 4 x 16 SCLK’s Master SDO/ Slave1 SDI b15 = 1 b14-b8 = 0x44 b7-b0 = xx b15 = 0 b14-b8 = 0x2F b7-b0 = 0xAF b15 = 1 b14-b8 = 0x2 b7-b0 = xx Slave 1 b15 = 0 b14-b8 = 0x1A b7-b0 = 0xFF Slave1 SDO/ Slave2 SDI XXX b15 = 1 b14-b8 = 0x44 b7-b0 = xx b15 = 0 b14-b8 = 0x2F b7-b0 = 0xAF Slave 2 b15 = 1 b14-b8 = 0x2 b7-b0 = xx b15-b8 = Default read reg of slave1 b7-b0 = xx Next command for Slave4 Next command for Slave3 Next command for Slave2 Slave2 SDO/ Slave3 SDI XXX XXX b15 = 1 b14-b8 = 0x44 b7-b0 = xx Slave 3 b15 = 0 b14-b8 = 0x2F b7-b0 = 0xAF b15-b8 = Default read reg of slave2 b7-b0 = Data from 0x2 of Slave2 b15-b8 = Default read reg of slave1 b7-b0 = xx Next command for Slave4 Next command for Slave3 Slave3 SDO/ Slave4 SDI XXX XXX XXX Slave 4 b15 = 1 b14-b8 = 0x44 b7-b0 = xx b15-b8 = Default read reg of slave3 b7-b0 = xx b15-b8 = Default read reg of slave2 b7-b0 = Data from 0x2 of Slave2 b15-b8 = Default read reg of slave1 b7-b0 = xx Next command for Slave4 Slave4 SDO/ Master SDI XXX XXX XXX XXX b15-b8 = Default read reg of slave4 b7-b0 = Data from 0x44 of Slave4 b15-b8 = Default read reg of slave3 b7-b0 = xx b15-b8 = Default read reg of slave2 b7-b0 = Data from 0x2 of Slave4 b15-b8 = Default read reg of slave1 b7-b0 = xx Current sequence Command decoded by Slave Response from previous sequence aaa-016627 Fig 12. SPI frame format 8.11.3 Diagnostics for the SPI The device is evaluating all SPI access to the device for the correctness of the commands. When the command is not allowed, the SPI_err bit is set. The conditions that are considered as erratic accesses are: • • • • SPI write is attempted to a read-only location or reserved location SPI write is attempted during operation to a configuration register SPI read is attempted from a reserved location SPI command does not consist of a multiple of 16 clock counts If an SPI access is considered to be erratic, no modifications to a SPI register are made. The access after the erratic SPI command returns the diagnostic register and zero in the data field. For details concerning the SPI_err bit, see Section 8.10. 8.11.4 Register map The addressable register space amounts to 128 registers from 00h to 7Fh. They are separated into two groups as shown in Table 38. The register mapping is shown in Table 39 and Table 42. The functional description of each bit can be found in the dedicated chapter. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 28 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 38. Grouping of the register space Address range Description Content 00h to 1Fh control registers control registers 20h to 7Fh diagnostic registers diagnostic information 8.11.4.1 Table 39. Control registers Control register group overview Address Name Reset value 7 6 5 4 3 2 1 0 00h function control 00h - - - - Cnt_CSB Vout2en[1] 01h gate driver enable 00h - - - - EN_G4[2] EN_G3[2] 03h target voltage output 1 00h V_Vout_1[7:0] 04h target voltage output 2 00h V_Vout_2[7:0] 05h limit voltage output 1 00h Vmax_Vout_1[7:0] 06h limit voltage output 2 00h Vmax_Vout_2[7:0] 07h maximum phase current Vout1 46h I_max_per_phase_Vout_1[7:0] 08h maximum phase current Vout2 46h I_max_per_phase_Vout_2[7:0] 1Ch frequency trimming register 09h - - Vout1en[1] Cfg_dn EN_G2[2] EN_G1[2] Calib/Ftrim[4:0] - [1] Bits are locked with bit Cfg_dn is HIGH. When bit Cfg_dn is LOW, bits can be changed. Read is always possible. [2] Individual gate drivers that are enabled when Cfg_dn and VGG_ok are set HIGH, can be turned on and off during operation of the system. Gate drivers, disabled when bits Cfg_dn and VGG_ok are set HIGH, remain off, even when the gate enable bits are set HIGH later. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 29 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.11.4.2 Configuration registers The configuration registers inside the control block can only be written in configuration mode. In the other modes, this register can only be read. Table 40. Configuration register group overview Address Name Reset value 7 6 5 4 3 2 1 0 02h gate driver output 00h - - - - O_G4 O_G3 O_G2 O_G1 09h clock divider for output 1 0Fh Clkdiv1[7:0] 0Ah clock divider for output 2 0Fh Clkdiv2[7:0] 0Bh internal phases output 1 0Fh - - - - EN_P4_1 EN_P3_1 EN_P2_1 EN_P1_1 0Ch internal phases output 2 0Fh - - - - EN_P4_2 EN_P3_2 EN_P2_2 EN_P1_2 0Dh phase off and delay output 1 39h Phdel1[4:0] Phoff1[2:0] 0Eh phase off and delay output 2 39h Phdel2[4:0] Phoff2[2:0] 0Fh gate driver phase 00h - 10h phase selection configuration E4h Phsel4[1:0] 11h loop filter proportional configuration 00h Prop2[3:0] Prop1[3:0] 12h loop filter integral configuration 00h Integ2[3:0] Integ1[3:0] 13h slope compensation 88h configuration Slpcmp2[3:0] Slpcmp1[3:0] 14h current sense slope resistor configuration 00h 15h gate driver control FFh VGG[7:0] 1Ah overvoltage detection threshold FFh V_VIN_OV[7:0] 1Bh undervoltage detection threshold 00h V_VIN_UV[7:0] ASL4501SHN Product data sheet - Slpr4[1:0] - - O_GP4 Phsel3[1:0] Slpr3[1:0] Slpr2[1:0] All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 O_GP3 O_GP2 Phsel2[1:0] O_GP1 Phsel1[1:0] Slpr1[1:0] © NXP Semiconductors N.V. 2018. All rights reserved. 30 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 8.11.4.3 Internal registers The ASL4501SHN uses the SPI registers to control some internal functions. In order to avoid any unintended behavior of the device, do not modify these registers but leave them all at their default value. Table 41. Internal register group Address Name Reset value 7 6 5 4 3 2 1 0 19h internal 1 82h - - - - - - - - 25h internal 2 27h - - - - - - - - 26h internal 3 3Bh - - - - - - - - 2Fh internal 4 E8h - - - - - - - - 30h internal 5 09h - - - - - - - - 8.11.4.4 Diagnostic registers The ASL4501SHN provides diagnostic data via some SPI registers. These registers are read only, but error bits can be cleared via a write access to the register. Table 42. Diagnostic register group overview Address Name 7 6 5 4 3 41h CSB count low CSB_cnt[7:0] 42h CSB count high CSB_cnt[15:8] 45h battery voltage V_VBAT[7:0] 46h junction temperature 4Ch calibration result register 5Fh diagnostic register ASL4501SHN Product data sheet 2 1 0 VIN_OV SPI_err VGG_err T_junction[7:0] Calib_value[7:0] Vout1_ok Vout2_ok VGG_ok Tj_err All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 VIN_UV © NXP Semiconductors N.V. 2018. All rights reserved. 31 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 9. Limiting values Table 43. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VBAT battery supply voltage VVCC voltage on pin VCC VGND ground supply voltage VFBx Conditions Min Max Unit EN = LOW 0.3 +60 V 0.3 +40 V 0.3 +5.5 V voltage between ground pins 0.6 +0.6 V voltage on feedback pins FB1 and FB2 0.3 +90 V VO output voltage programmed target voltage according to registers 0x03h and 0x04h 10 80 V VI(dig) digital input voltage voltage on digital pins SDO, SDI, CSB, SCLK and EN 0.3 +5.5 V VVGG voltage on pin VGG VGG1 [1] 0.3 +20 V VGG2 [1] 0.3 +20 V EN = HIGH Vsense sense voltage voltage on sense pins SNH1, SNH2, SNH3, SNH4, SNL1, SNL2, SNL3 and SNL4 0.3 +1.8 V VGx voltage on gate pins voltage on gate pins G1, G2, G3 and G4 0.3 +10 V Tj junction temperature 40 +175 C Tstg storage temperature VESD electrostatic discharge voltage [1] VGG1 and VGG2 are IC internally connected (shorted). [2] HBM according to AEC-Q100-002 (100 pF, 1.5 k). [3] CDM according to AEC-Q100-011 (field induced charge; 4 pF). 55 +175 C [2] 2 +2 kV [3] 500 +500 V 10. Thermal characteristics Table 44. Thermal characteristics Symbol Parameter Rth(tot) total thermal resistance [1] Conditions [1] Typ Unit 37 K/W In accordance with JEDEC, JESD51-2, JESD51-5 and JESD51-7 with natural convection on 2s2p board. Board with two inner copper layers (thickness: 35 m) and thermal via array, under the exposed pad connected to the first inner copper layer. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 32 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 11. Static characteristics Table 45. Static characteristics Minimum and maximum values are specified for the following conditions: VBAT = 5.5 V to 40 V, VEN = 4.5 V to 5.5 V, VVCC = 4.5 V to 5.5 V and Tj = 40 C to +175 C[1]. All voltages are defined with respect to ground, positive currents flow into the IC. Typical values are given at VVIN = 40 V, VEN = 5 V, VVCC = 5 V and Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit operating; no load on VGG; gate pins LOW; one phase; one output 5 13 - mA operating; no load on VGG; gate pins low; four phases; two outputs - 20 - mA EN = LOW - - 5 A - - 4.5 V - - 250 A - - 225 A Vout1: operating accuracy 1 0.03  Vout1  0.711 - +0.03  Vout1 + 0.711 V Vout2: operating accuracy 2 0.03  Vout2 0.711 - +0.03  Vout2 + 0.711 V bit Vout1_ok/Vout2_ok is set when VO is within the range regarding the target value 5.4 - +2.4 V Supply pin VBAT IDD supply current Ioff off-state current Vth(det)pon power-on detection threshold voltage Supply pin VCC IVCC supply current on pin VCC EN = HIGH; CSB = LOW Supply pin EN IEN supply current on pin EN EN = HIGH Output voltage VO(acc) VO output voltage accuracy output voltage Regulated voltage output VVGG Vdo(reg)VGG voltage on pin VGG V [2] 4.46 - 10.04 V bit VGG_ok is set when VVGG is within the range regarding the target value [2] 2.4 - +2.4 V - 0.5 1.0 V IVGG  160 mA; regulator in saturation - 1.6 3.2 V 25 C to Tj(max) 5 - +5 % 40 C to +25 C 7 - +5 % - 1 - F 2.5 - +2.5 % regulator dropout voltage IVGG  50 mA; regulator in on pin VGG saturation Vreg(acc)VGG regulator voltage accuracy on pin VGG CVGG VBAT  VVGG + Vdo(reg)VGG capacitor on pin VGG voltage variation ASL4501SHN Product data sheet ESR  0.1  deviation from average peak current value at sense pins; before subtracting slope compensation 160 mV, corresponding to a peak set value of 16 A at 10 mRsense [3] All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 33 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter Table 45. Static characteristics …continued Minimum and maximum values are specified for the following conditions: VBAT = 5.5 V to 40 V, VEN = 4.5 V to 5.5 V, VVCC = 4.5 V to 5.5 V and Tj = 40 C to +175 C[1]. All voltages are defined with respect to ground, positive currents flow into the IC. Typical values are given at VVIN = 40 V, VEN = 5 V, VVCC = 5 V and Tj = 25 C unless otherwise specified. Symbol Vslope Parameter slope voltage difference Conditions deviation from average slope voltage value at sense pins; subtraction of slope compensation is 10.9 mV, equal to 10.9 A at 10 mRsense and Rslope setting of 1 k [3] Min Typ Max Unit 8 - +8 % Serial peripheral interface inputs; pins SDI, SCLK and CSB Vth(sw) switching threshold voltage 0.3VCC - 0.7VCC V Rpd(int)SCLK internal pull-down resistance on pin SCLK 40 - 80 k Rpd(int)CSB internal pull-down resistance on pin CSB 40 - 80 k Rpd(int)SDI internal pull-down resistance on pin SDI 40 - 80 k VCC  0.4 - - V Serial peripheral interface data output; pin SDO IOH = 4 mA; VCC = 4.5 V to 5.5 V VOH HIGH-level output voltage VOL LOW-level output voltage IOL = 4 mA; VCC = 4.5 V to 5.5 V - - 0.4 V ILOZ OFF-state output leakage current VCSB = VCC; VO = 0 V to VCC; VCC = 4.5 V to 5.5 V 5 - +5 A measurement provided via register 46h; Tj = 130 C 20 - +20 C 150 175 200 C +0.035  VBAT + 0.3555 V Temperature protection Tj junction temperature variation Tsd(otp) overtemperature protection shutdown temperature [4] VBAT monitoring VVBAT 0.035  VBAT  0.3555 accuracy of voltage measurement on pin VBAT [1] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range. [2] VGG refers to both VGG1 and VGG2. [3] For a given system with VBAT = 13.5 V, Voutx = 50 V, L = 15 H, Rsense = 10 m, fsw = 400 kHz, optimized device configuration and 30 W output power per phase, the maximum current deviation will be less than 225 mA from the average value. [4] Additional features include protection against load dump transient voltages of up to 60 V and thermal shutdown when the junction temperature of the ASL4501SHN exceeds 175 C. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 34 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 12. Dynamic characteristics Table 46. Dynamic characteristics Minimum and maximum values are specified for the following conditions: VBAT = 5.5 V to 40 V, VEN = 4.5 V to 5.5 V, fosc = 130 MHz to 200 MHz, VCC = 4.5 V to 5.5 V and Tj = 40 C to +175 C[1]. All voltages are defined with respect to ground. Positive currents flow into the IC. Typical values are given at VBAT = 12 V, VEN = 5 V, VCC = 5 V and Tj = 25 C unless otherwise specified. Symbol Parameter fDCDC Min Typ Max Unit DC-to-DC converter frequency 125 - 700 kHz fDCDC(acc) DC-to-DC converter frequency operating; trimmed accuracy 5 - +5 % fosc oscillator frequency internal oscillator; untrimmed 130 - 250 MHz target frequency for trimmed operation - 180 - MHz EN = HIGH until SPI write access - - 150 s EN = HIGH until SPI read access - - 2000 s - 20 : 1 - 1 tstartup Conditions start-up time Serial peripheral interface timing; pins CSB, SCLK, SDI and SDO fclk(int)/fSPI_CLK internal clock frequency to SPI clock frequency ratio tcy(clk) clock cycle time 250 - - ns tSPILEAD SPI enable lead time 50 - - ns tSPILAG SPI enable lag time 50 - - ns tclk(H) clock HIGH time 125 - - ns tclk(L) clock LOW time 125 - - ns tsu(D) data input set-up time 50 - - ns th(D) data input hold time 50 - - ns tv(Q) data output valid time - - 130 ns tWH(S) chip select pulse width HIGH 250 - - ns pin SDO; CL = 20 pF Gate driver tch(g) gate charge time 20 % to 80 %; VVGG = 7.5 V; Cgate = 2000 pF - - 30 ns tdch(g) gate discharge time 80 % to 20 %; VVGG = 7.5 V; Cgate = 2000 pF - - 14 ns Regulated voltage terr(startup) start-up error time of VGG; fosc = 180 MHz - 2.5 - ms tdet(err) error detection time for VGG during operation; fosc = 180 MHz - 31.5 - s tfltr(Vo) output voltage filter time for bit Vout1_ok and Vout2_ok; fosc = 180 MHz - 31.5 - s tcal calibration time bit VGG_ok = HIGH - - 10 ms [1] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 35 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter CSB tSPILEAD tSPILAG tclk tWH(S) SCLK tclk(H) tclk(L) tSU(D) th(D) b15 MSB SDI b0 LSB tv(Q) SDO FLOATING b15 MSB b0 LSB FLOATING aaa-015313 Fig 13. SPI timing diagram ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 36 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 13. Application information Figure 14 provides an application example for the ASL4501SHN in a typical four-phase boost converter IC with one output voltage. D8 battery C1 C2 L1 D1 G1 VGG1 C16 M1 VGG2 BS1 VGG R1 L2 D2 SNL1 C17 G1 VIN C8 SNH1 M5 L5 R5 LED1 C5 C12 D9 LX1 C15 D10 RH1 G2 M2 VBAT EN CSB D5 PWM2 R2 SNL2 VCC RL1 PWM1 SNH2 C18 D11 C9 PWM3 FB1 G2 FB2 BS2 ASL4501SHN L6 ASLxxxxSHN SDI VCC C10 SDO EN SNH3 SCLK R3 SNL3 G4 LED2 L4 D4 D12 LX2 D13 RH2 D14 RL2 CSB GND R6 C13 L3 D3 G3 M3 M6 C6 D6 SDI C11 M4 SDO SCLK SNH4 G3 BS3 M7 L7 R7 LED3 C7 C14 R4 D15 LX3 SNL4 D16 RH3 D17 GND RL3 D7 C20 VCC VBAT RSTN C19 GND LIN LIN TJA1028 EN VCC EN_1 RSTN EN_2 CSB 1 EN TXD TXD RXD RXD GND CSB 2 SDI µC SDO SCLK PWM1 PWM2 PWM3 aaa-024032 Fig 14. ASL4501SHN, configured as four-phase, single output boost converter 14. Test information 14.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 Rev-H - Failure mechanism-based stress test qualification for integrated circuits, and is suitable for use in automotive applications. ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 37 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 15. Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-12 terminal 1 index area E A A1 c detail X e1 1/2 e e 9 16 C C A B C v w b y1 C y L 8 17 e e2 Eh 1/2 e 1 24 terminal 1 index area 32 k 25 X Dh 0 5 mm scale Dimensions (mm are the original dimensions) Unit mm A A1 b max 1.00 0.05 0.30 nom 0.85 0.02 0.21 min 0.80 0.00 0.18 c D(1) Dh E(1) Eh e e1 e2 0.2 5.1 5.0 4.9 3.1 3.0 2.9 5.1 5.0 4.9 3.1 3.0 2.9 0.5 3.5 3.5 k L v 0.1 0.5 0.50 0.44 0.30 w y y1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version SOT617-12 References IEC JEDEC JEITA sot617-12_po European projection Issue date 13-10-14 13-11-05 MO-220 Fig 15. Package outline SOT617-12 (HVQFN32) ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 38 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 16. Revision history Table 47. Revision history Document ID Release date Data sheet status Change notice Supersedes ASL4501SHN v.2 20180110 Product data sheet - ASL4501SHN v.1 Modifications: • • Updated formula for VGG setting: Table 30 “VGG control register (address 15h)” Updated formula for output voltage settings and input voltage measurements: – Table 18 “Output voltage 1 register (address 03h)” – Table 19 “Output voltage 2 register (address 04h)” – Table 20 “Limit voltage output 1 register (address 05h)” – Table 21 “Limit voltage output 2 register (address 06h)” – Table 31 “Battery voltage register (address 45h)” – Table 32 “Undervoltage threshold register (address 1Bh)” – Table 33 “Overvoltage threshold register (address 1Ah)” ASL4501SHN v.1 ASL4501SHN Product data sheet 20170629 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 - © NXP Semiconductors N.V. 2018. All rights reserved. 39 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. ASL4501SHN Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 40 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 41 of 43 ASL4501SHN NXP Semiconductors Four-phase boost converter 19. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Ordering information . . . . . . . . . . . . . . . . . . . . .3 Pin description[1] . . . . . . . . . . . . . . . . . . . . . . . .4 Operating modes . . . . . . . . . . . . . . . . . . . . . . . .7 Internal phase control enable for phase logic 1 (address 0Bh) . . . . . . . . . . . . . . . . . . . . . . . . . .9 Internal phase control enable for phase logic 2 (address 0Ch) . . . . . . . . . . . . . . . . . . . . . . . . . .9 Gate driver output (address 02h) . . . . . . . . . . .10 Gate driver phase (address 0Fh) . . . . . . . . . . .10 Phase selection configuration (address 10h) . .10 Gate driver enable (address 01h) . . . . . . . . . .12 Clock divider for Vout1 (address 09h) . . . . . . .13 Clock divider for Vout2 (address 0Ah) . . . . . . .13 Phase-off time and phase delay of output 1 (address 0Dh) . . . . . . . . . . . . . . . . . . . . . . . . .13 Phase-off time and phase delay of output 2 (address 0Eh) . . . . . . . . . . . . . . . . . . . . . . . . .13 Loop filter proportional configuration (address 11h) . . . . . . . . . . . . . . . . . . . . . . . . . .14 Loop filter integral configuration (address 12h) 14 Slope compensation configuration (address 13h) . . . . . . . . . . . . . . . . . . . . . . . . .14 Current sense slope resistor configuration (address 14h) . . . . . . . . . . . . . . . . . . . . . . . . .15 Output voltage 1 register (address 03h) . . . . .15 Output voltage 2 register (address 04h) . . . . .15 Limit voltage output 1 register (address 05h) .16 Limit voltage output 2 register (address 06h) .16 Maximum phase current Vout1 register (address 07h) . . . . . . . . . . . . . . . . . . . . . . . . .17 Table 23. Maximum phase current Vout2 register (address 08h) . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 24. Function control register (address 00h) . . . . . 17 Table 25. CSB count register 1 (address 41h) . . . . . . . . 18 Table 26. CSB count register 2 (address 42h) . . . . . . . . 19 Table 27. Calibration/frequency trimming register (address 1Ch) . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 28. Calib/Ftrim settings . . . . . . . . . . . . . . . . . . . . . 20 Table 29. Calibration result register (address 4Ch) . . . . 20 Table 30. VGG control register (address 15h) . . . . . . . . 21 Table 31. Battery voltage register (address 45h) . . . . . . 22 Table 32. Undervoltage threshold register (address 1Bh) . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 33. Overvoltage threshold register (address 1Ah) 22 Table 34. Junction temperature register (address 46h) . 22 Table 35. Diagnostic register (address 5Fh) . . . . . . . . . . 23 Table 36. SPI frame format for a transition to the device 25 Table 37. SPI frame format for a transition from the device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 38. Grouping of the register space. . . . . . . . . . . . . 29 Table 39. Control register group overview . . . . . . . . . . . . 29 Table 40. Configuration register group overview . . . . . . . 30 Table 41. Internal register group . . . . . . . . . . . . . . . . . . . 31 Table 42. Diagnostic register group overview . . . . . . . . . 31 Table 43. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 44. Thermal characteristics . . . . . . . . . . . . . . . . . . 32 Table 45. Static characteristics . . . . . . . . . . . . . . . . . . . . 33 Table 46. Dynamic characteristics . . . . . . . . . . . . . . . . . 35 Table 47. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 39 20. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .4 State diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Boost converter phase circuit . . . . . . . . . . . . . . . .8 Mapping of virtual phases (V1_1 to V2_4) to physical phases (G1 to G4) . . . . . . . . . . . . . . . . . .9 Phase control generator . . . . . . . . . . . . . . . . . . .12 Frequency trimming flow . . . . . . . . . . . . . . . . . . .18 SPI timing protocol. . . . . . . . . . . . . . . . . . . . . . . .25 SPI frame format . . . . . . . . . . . . . . . . . . . . . . . . .25 Daisy chain configuration. . . . . . . . . . . . . . . . . . .26 Physical parallel slave connection . . . . . . . . . . . .27 SPI frame format . . . . . . . . . . . . . . . . . . . . . . . . .28 SPI timing diagram . . . . . . . . . . . . . . . . . . . . . . .36 ASL4501SHN, configured as four-phase, single output boost converter . . . . . . . . . . . . . . . . . . . . .37 Package outline SOT617-12 (HVQFN32) . . . . . .38 ASL4501SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 10 January 2018 © NXP Semiconductors N.V. 2018. All rights reserved. 42 of 43 NXP Semiconductors ASL4501SHN Four-phase boost converter 21. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.1.1 8.1.2 8.1.3 8.1.4 8.2 8.2.1 8.2.2 8.2.3 8.2.4 8.2.5 8.2.6 8.3 8.3.1 8.3.2 8.4 8.5 8.6 8.6.1 8.6.2 8.6.3 8.7 8.7.1 8.8 8.8.1 8.8.2 8.8.3 8.9 8.10 8.10.1 8.10.2 8.10.3 8.10.4 8.10.5 8.10.6 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 6 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 7 Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Configuration mode . . . . . . . . . . . . . . . . . . . . . 7 Operation mode . . . . . . . . . . . . . . . . . . . . . . . . 7 Fail silent mode . . . . . . . . . . . . . . . . . . . . . . . . 8 Boost converter configuration . . . . . . . . . . . . . . 8 Virtual phase configuration . . . . . . . . . . . . . . . . 9 Association of physical phases to the output voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Association of connected phases to the internal phase generation . . . . . . . . . . . . . . . . . . . . . . 10 Enabling of connected phases . . . . . . . . . . . . 12 Boost converter frequencies configuration . . . 12 Control loop parameter settings . . . . . . . . . . . 13 Output voltage programmability . . . . . . . . . . . 15 Output voltage target programmability . . . . . . 15 Output overvoltage protection programming . 16 Coil peak current limitation . . . . . . . . . . . . . . . 16 Enabling output voltage . . . . . . . . . . . . . . . . . 17 Trimming and calibration . . . . . . . . . . . . . . . . 17 Frequency trimming . . . . . . . . . . . . . . . . . . . . 18 Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trimming and calibration registers . . . . . . . . . 19 Gate supply voltage . . . . . . . . . . . . . . . . . . . . 21 Gate voltage supply diagnostics . . . . . . . . . . . 21 Supply voltage monitoring . . . . . . . . . . . . . . . 21 Battery voltage measurement. . . . . . . . . . . . . 21 Undervoltage detection. . . . . . . . . . . . . . . . . . 22 Overvoltage detection. . . . . . . . . . . . . . . . . . . 22 Junction temperature information . . . . . . . . . . 22 Diagnostic information . . . . . . . . . . . . . . . . . . 23 Bit VIN_OV . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Bit VIN_UV . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Bit SPI_err . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Bit Tj_err . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Bit VGG_err . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Bit VGG_ok. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 8.10.7 Bits Vout1_ok and Vout2_ok . . . . . . . . . . . . . 8.11 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.11.1 SPI introduction . . . . . . . . . . . . . . . . . . . . . . . 8.11.2 Typical use case illustration (write/read) . . . . 8.11.3 Diagnostics for the SPI . . . . . . . . . . . . . . . . . 8.11.4 Register map . . . . . . . . . . . . . . . . . . . . . . . . . 8.11.4.1 Control registers. . . . . . . . . . . . . . . . . . . . . . . 8.11.4.2 Configuration registers. . . . . . . . . . . . . . . . . . 8.11.4.3 Internal registers . . . . . . . . . . . . . . . . . . . . . . 8.11.4.4 Diagnostic registers . . . . . . . . . . . . . . . . . . . . 9 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal characteristics . . . . . . . . . . . . . . . . . 11 Static characteristics . . . . . . . . . . . . . . . . . . . 12 Dynamic characteristics. . . . . . . . . . . . . . . . . 13 Application information . . . . . . . . . . . . . . . . . 14 Test information . . . . . . . . . . . . . . . . . . . . . . . 14.1 Quality information . . . . . . . . . . . . . . . . . . . . . 15 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information . . . . . . . . . . . . . . . . . . . . . . 17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 17.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 17.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information . . . . . . . . . . . . . . . . . . . . 19 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 24 24 27 28 28 29 30 31 31 32 32 33 35 37 37 37 38 39 40 40 40 40 41 41 42 42 43 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2018. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 January 2018 Document identifier: ASL4501SHN