BAP50-05
Silicon PIN diode
Rev. 3.1 — 8 February 2019
1
Product data sheet
Product profile
1.1 General description
Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD
package.
1.2 Features and benefits
• Two elements in common cathode configuration in a small-sized plastic SMD package
• Low diode capacitance
• Low diode forward resistance
1.3 Applications
• General RF application
2
Pinning information
Table 1. Discrete pinning
Pin
Description
1
anode
2
anode
3
common cathode
Simplified outline
Graphic symbol
3
3
1
2
aaa-029921
1
Top view
2
BAP50-05
NXP Semiconductors
Silicon PIN diode
3
Ordering information
Table 2. Ordering information
Type number Package
BAP50-05
4
Name
Description
Version
-
plastic surface-mounted package; 3 leads
SOT023
Marking
Table 3. Marking code
5
Type number
Marking code
BAP50-05
1C%
Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
6
Symbol
Parameter
VR
Conditions
Min
Max
Unit
continuous reverse
voltage
-
50
V
IF
continuous forward
current
-
50
mA
Ptot
total power dissipation
-
250
mW
Tstg
storage temperature
-65
+150
°C
Tj
junction temperature
-65
+150
°C
Typ
Unit
220
K/W
Tsp ≤ 90 °C
Thermal characteristics
Table 5. Thermal characteristics
BAP50-05
Product data sheet
Symbol
Parameter
Rth(j-sp)
thermal resistance from
junction to solder point
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 8 February 2019
© NXP B.V. 2019. All rights reserved.
2/9
BAP50-05
NXP Semiconductors
Silicon PIN diode
7
Characteristics
Table 6. Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 50 mA
-
0.95
1.1
V
VR
reverse voltage
IR = 10 μA
50
-
-
V
IR
reverse current
VR = 50 V
-
-
100
nA
Cd
diode capacitance
f = 1 MHz (see Figure 1)
VR = 0 V
-
0.45
-
pF
VR = 1 V
-
0.35
0.6
pF
VR = 5 V
-
0.3
0.5
pF
rD
[1]
diode forward resistance
f = 100 MHz (see Figure 2)
IF = 0.5 mA
[1]
-
25
40
Ω
IF = 1 mA
[1]
-
14
25
Ω
IF = 10 mA
[1]
-
3
5
Ω
Guaranteed on AQL basis: inspection level S4, AQL 1.0.
BAP50-05
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 8 February 2019
© NXP B.V. 2019. All rights reserved.
3/9
BAP50-05
NXP Semiconductors
Silicon PIN diode
8
Graphical data
aaa-029884
103
aaa-029876
103
rD
(Ω)
Cd
(fF)
102
10
102
10-1
1
10
VR (V)
1
10-2
102
10-1
1
IF (mA)
10
f = 1 MHz; Tj = 25 °C.
f = 100 MHz; Tj = 25 °C.
Figure 1. Diode capacitance as a function of reverse
voltage (typical values)
Figure 2. Diode forward resistance as a function of
forward current (typical values)
aaa-029877
0
(1)
Lins
(dB)
ISL
(dB)
(2)
-1
aaa-029882
0
-5
(3)
-2
-10
-3
-15
-4
-20
-5
0.5
1
1.5
2
2.5
3
f (GHz)
-25
0.5
1
1.5
2
2.5
3
f (GHz)
Diode inserted in series with a 50 Ω strip line circuit and
biased via the analyzer T-network. Tamb = 25 °C.
(1) IF = 10 mA
(2) IF = 1 mA
(3) IF = 0.5 mA
Diode zero biased and inserted in series with a 50 Ω strip
line circuit. Tamb = 25 °C.
Figure 3. Insertion loss of the diode as a function of
frequency (typical values)
Figure 4. Isolation of the diode as a function of
frequency (typical values)
BAP50-05
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 8 February 2019
© NXP B.V. 2019. All rights reserved.
4/9
BAP50-05
NXP Semiconductors
Silicon PIN diode
9
Package outline
Plastic surface-mounted package; 3 leads
SOT23
B
D
A
E
X
HE
v
A
3
Q
A
A1
1
c
2
e1
bp
w
B
Lp
e
detail X
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
max
nom
min
A
A1
1.1
0.1
0.9
bp
c
D
E
0.48 0.15
3.0
1.4
0.38 0.09
2.8
1.2
e
e1
1.9
0.95
HE
Lp
Q
2.5
0.45 0.55
2.1
0.15 0.45
v
w
0.2
0.1
sot023_po
Outline
version
References
IEC
SOT23
JEDEC
JEITA
European
projection
Issue date
14-06-19
14-09-22
TO-236AB
Figure 5. Package outline SOT023
BAP50-05
Product data sheet
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Rev. 3.1 — 8 February 2019
© NXP B.V. 2019. All rights reserved.
5/9
BAP50-05
NXP Semiconductors
Silicon PIN diode
10 Abbreviations
Table 7. Abbreviations
Acronym
Description
AQL
acceptable quality level
PIN
P-type, intrinsic, N-type
RF
radio frequency
S4
special inspection level 4
SMD
surface-mounted device
11 Revision history
Table 8. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAP50-05 v.3.1
20190208
Product data sheet
-
BAP50-05 v.3
Modifications:
• aligned the title of the data sheet with the description on the Internet
BAP50-05 v.3
20181126
Modifications:
• Section 1.2 "Features and benefits" has been updated.
• The "Legal information" pages have been updated.
BAP50-05 v .2.1
19990510
BAP50-05
Product data sheet
Product data sheet
Product data sheet
-
-
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 8 February 2019
BAP50-05 v.2.1
BAP50-05 v.1
© NXP B.V. 2019. All rights reserved.
6/9
BAP50-05
NXP Semiconductors
Silicon PIN diode
12 Legal information
12.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
BAP50-05
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 8 February 2019
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7/9
BAP50-05
NXP Semiconductors
Silicon PIN diode
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
BAP50-05
Product data sheet
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Security — While NXP Semiconductors has implemented advanced
security features, all products may be subject to unidentified vulnerabilities.
Customers are responsible for the design and operation of their applications
and products to reduce the effect of these vulnerabilities on customer’s
applications and products, and NXP Semiconductors accepts no liability for
any vulnerability that is discovered. Customers should implement appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
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8/9
BAP50-05
NXP Semiconductors
Silicon PIN diode
Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
11
12
Product profile .................................................... 1
General description ............................................1
Features and benefits ........................................1
Applications ........................................................1
Pinning information ............................................ 1
Ordering information .......................................... 2
Marking .................................................................2
Limiting values .................................................... 2
Thermal characteristics ......................................2
Characteristics .................................................... 3
Graphical data ..................................................... 4
Package outline ...................................................5
Abbreviations ...................................................... 6
Revision history .................................................. 6
Legal information ................................................ 7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 February 2019
Document identifier: BAP50-05
