BAP51LX

BAP51LX Silicon PIN diode Rev. 01 — 26 June 2007 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD882T leadless ultra small plastic SMD package. 1.2 Features I I I I I High speed switching for RF signals Low diode capacitance Low forward resistance Very low series inductance For applications up to 3 GHz 1.3 Applications I RF attenuators and switches 2. Pinning information Table 1. Pin 1 2 Discrete pinning Description cathode anode 1 2 sym006 Simplified outline [1] Symbol Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 2. Ordering information Name BAP51LX Description leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.4 mm Version SOD882T Type number Package NXP Semiconductors BAP51LX Silicon PIN diode 4. Marking Table 3. BAP51LX Marking Marking code L2 Type number 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF Ptot Tstg Tj Parameter reverse voltage forward current total power dissipation storage temperature junction temperature Tsp = 90 °C Conditions Min −65 −65 Max 60 100 140 +150 +150 Unit V mA mW °C °C 6. Thermal characteristics Table 5. Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Typ 66 Unit K/W 7. Characteristics Table 6. Characteristics Tamb = 25 °C unless otherwise specified. Symbol VF IR Cd Parameter forward voltage reverse current diode capacitance Conditions IF = 50 mA VR = 50 V see Figure 1; f = 1 MHz; VR = 0 V VR = 1 V VR = 5 V rD diode forward resistance see Figure 2; f = 100 MHz; IF = 0.5 mA IF = 1 mA IF = 10 mA IF = 100 mA ISL isolation see Figure 3; VR = 0 V; f = 900 MHz f = 1800 MHz f = 2450 MHz BAP51LX_1 Min - Typ 0.95 0.30 0.22 0.17 4.9 3.2 1.4 0.9 19 15 13 Max 1.1 100 0.40 0.30 9 6.5 2.5 1.5 - Unit V nA pF pF pF Ω Ω Ω Ω dB dB dB 2 of 8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 26 June 2007 NXP Semiconductors BAP51LX Silicon PIN diode Table 6. Characteristics …continued Tamb = 25 °C unless otherwise specified. Symbol Lins Parameter insertion loss Conditions see Figure 4; IF = 0.5 mA; f = 900 MHz f = 1800 MHz f = 2450 MHz Lins insertion loss see Figure 4; IF = 1 mA; f = 900 MHz f = 1800 MHz f = 2450 MHz Lins insertion loss see Figure 4; IF = 10 mA; f = 900 MHz f = 1800 MHz f = 2450 MHz Lins insertion loss see Figure 4; IF = 100 mA; f = 900 MHz f = 1800 MHz f = 2450 MHz τL charge carrier life time when switched from IF = 10 mA to IR = 6 mA; RL = 100 Ω; measured at IR = 3 mA IF = 100 mA; f = 100 MHz 0.09 0.10 0.12 0.55 dB dB dB µs 0.12 0.14 0.15 dB dB dB 0.25 0.26 0.27 dB dB dB 0.36 0.36 0.38 dB dB dB Min Typ Max Unit LS series inductance - 0.4 - nH 400 Cd (fF) 300 001aag633 102 rD (Ω) 10 001aag634 200 1 100 0 0 4 8 12 16 VR (V) 20 10−1 10−1 1 10 IF (mA) 102 f = 1 MHz; Tj = 25 °C. f = 100 MHz; Tj = 25 °C. Fig 1. Diode capacitance as a function of reverse voltage; typical values Fig 2. Forward resistance as a function of forward current; typical values BAP51LX_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 26 June 2007 3 of 8 NXP Semiconductors BAP51LX Silicon PIN diode 0 ISL (dB) −10 001aag635 0 Lins (dB) −0.2 (1) (2) (3) 001aag636 −0.4 −20 −0.6 −30 (4) −0.8 −40 0 1000 2000 f (MHz) 3000 −1.0 0 1000 2000 f (MHz) 3000 Tamb = 25 °C Diode zero biased and inserted in series with a 50 Ω stripline circuit Tamb = 25 °C (1) IF = 100 mA (2) IF = 10 mA (3) IF = 1 mA (4) IF = 0.5 mA Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network Fig 3. Isolation of the diode as a function of frequency; typical values Fig 4. Insertion loss of the diode as a function of frequency; typical values BAP51LX_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 26 June 2007 4 of 8 NXP Semiconductors BAP51LX Silicon PIN diode 8. Package outline Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm (2 ×) w M SOD882T L1 (2×) A 1 2 b (2 ×) (2 ×) w e1 M B A A1 y E A D (1) B 0 DIMENSIONS (mm are the original dimensions) UNIT mm A 0.40 0.36 A1 max 0.04 b 0.55 0.45 D 0.65 0.55 E 1.05 0.95 e1 0.65 L1 0.30 0.22 w 0.1 y 0.03 0.5 scale 1 mm Note 1. The marking bar indicates the cathode OUTLINE VERSION SOD882T REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-12-14 06-04-12 Fig 5. Package outline SOD882T BAP51LX_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 26 June 2007 5 of 8 NXP Semiconductors BAP51LX Silicon PIN diode 9. Abbreviations Table 7. Acronym PIN SMD RF Abbreviations Description P-type, Intrinsic, N-type Surface Mounted Device Radio Frequency 10. Revision history Table 8. Revision history Release date 20070626 Data sheet status Product data sheet Change notice Supersedes Document ID BAP51LX_1 BAP51LX_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 26 June 2007 6 of 8 NXP Semiconductors BAP51LX Silicon PIN diode 11. Legal information 11.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com BAP51LX_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 26 June 2007 7 of 8 NXP Semiconductors BAP51LX Silicon PIN diode 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 2 5 6 6 7 7 7 7 7 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 June 2007 Document identifier: BAP51LX_1