BAP64-02,115

BAP64-02 Silicon PIN diode Rev. 11 — 20 March 2019 1 Product data sheet Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small plastic SMD package. 1.2 Features and benefits • • • • • • • High voltage, current controlled RF resistor for RF attenuators and switches Low diode capacitance Low diode forward resistance Very low series inductance For applications up to 6 GHz AEC-Q101 qualified 1.3 Applications • RF attenuators and switches 2 Pinning information Table 1. Discrete pinning Pin 1 cathode 2 anode [1] 3 Description Simplified outline Symbol [1] 1 2 sym006 The marking bar indicates the cathode. Ordering information Table 2. Ordering information Type number Package BAP64-02 Name Description Version - plastic surface-mounted package; 2 leads SOD523 BAP64-02 NXP Semiconductors Silicon PIN diode 4 Marking Table 3. Marking 5 Type number Marking code BAP64-02 S Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). 6 Symbol Parameter VR Conditions Min Max Unit reverse voltage - 175 V IF forward current - 100 mA Ptot total power dissipation - 715 mW Tstg storage temperature -65 +150 °C Tj junction temperature -65 +150 °C Typ Unit 85 K/W Tsp = 90 °C Thermal characteristics Table 5. Thermal characteristics 7 Symbol Parameter Conditions Rth(j-sp) thermal resistance from junction to solder point Characteristics Table 6. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 50 mA - 0.95 1.1 V IR reverse current VR = 60 V - - 10 μA VR = 20 V - - 1 μA VR = 0 V - 0.48 - pF VR = 1 V - 0.35 - pF - 0.23 0.35 pF IF = 0.5 mA - 20 40 Ω IF = 1 mA - 10 20 Ω IF = 10 mA - 2.0 3.8 Ω IF = 100 mA - 0.7 1.35 Ω Cd diode capacitance see Figure 1; f = 1 MHz; VR = 20 V rD diode forward resistance BAP64-02 Product data sheet see Figure 2; f = 100 MHz; All information provided in this document is subject to legal disclaimers. Rev. 11 — 20 March 2019 [1] © NXP B.V. 2019. All rights reserved. 2/9 BAP64-02 NXP Semiconductors Silicon PIN diode Symbol Parameter Conditions Min Typ Max Unit τL charge carrier life time when switched from IF = 10 mA to IR = 6 mA; RL = 100 Ω; measured at IR = 3 mA - 1.55 - μs LS series inductance - 0.6 - nH [1] Guaranteed on AQL basis: inspection level S4, AQL 1.0. mgl857 500 Cd (fF) mgl856 102 rD ( ) 400 10 300 200 1 100 0 0 4 8 12 16 VR (V) 20 10-1 10-1 1 10 IF (mA) 102 f = 1 MHz; Tj = 25 °C. f = 100 MHz; Tj = 25 °C. Figure 1. Diode capacitance as a function of reverse voltage; typical values Figure 2. Forward resistance as a function of forward current; typical values BAP64-02 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 20 March 2019 © NXP B.V. 2019. All rights reserved. 3/9 BAP64-02 NXP Semiconductors Silicon PIN diode Lins (dB) aaa-016195 0 (1) (2) -1 ISL (dB) (3) aaa-016189 0 (4) -2 -5 -3 -10 -4 -15 -20 -5 -25 0 1 2 3 4 5 f (GHz) 6 Tamb = 25 °C Diode zero biased and inserted in series with a 50 Ω stripline circuit Tamb = 25 °C 1. IF = 100 mA 2. IF = 10 mA 3. IF = 1 mA 4. IF = 0.5 mA Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network Figure 3. Isolation of the diode as a function of frequency; typical values Figure 4. Insertion loss of the diode as a function of frequency; typical values -30 0 1 BAP64-02 Product data sheet 2 3 4 5 f (GHz) 6 All information provided in this document is subject to legal disclaimers. Rev. 11 — 20 March 2019 © NXP B.V. 2019. All rights reserved. 4/9 BAP64-02 NXP Semiconductors Silicon PIN diode 8 Package outline Plastic surface-mounted package; 2 leads SOD523 A c v M A HE A D 1 E 0 0.5 1 mm scale 2 DIMENSIONS (mm are the original dimensions) bp UNIT A bp c D E HE v mm 0.65 0.58 0.34 0.26 0.17 0.11 1.25 1.15 0.85 0.75 1.65 1.55 0.1 (1) Note 1. The marking bar indicates the cathode. REFERENCES OUTLINE VERSION IEC JEDEC EUROPEAN PROJECTION JEITA SOD523 ISSUE DATE 02-12-13 06-03-16 SC-79 Figure 5. Package outline SOD523 9 Abbreviations Table 7. Abbreviations Acronym Description AQL acceptable quality level PIN P-type, intrinsic, N-type SMD surface mounted device S4 special inspection level 4 10 Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BAP64-02 v.11 20190311 Product data sheet - BAP64-02 v.10 Modifications: • changed VR condition of IR from 175 V to 60 V BAP64-02 v.10 20150512 - BAP64-02 v.9 Modifications: • AEC-Q101 qualified BAP64-02 v.9 20141215 - BAP64-02 v.8 BAP64-02 Product data sheet Product data sheet Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 20 March 2019 © NXP B.V. 2019. All rights reserved. 5/9 BAP64-02 NXP Semiconductors Silicon PIN diode Document ID Release date Data sheet status Change notice Supersedes BAP64-02 v.8 20140428 Product data sheet - BAP64-02 v.7 BAP64-02 v.7 20140211 Product data sheet - BAP64-02_N v.6 BAP64-02_N v.6 20080109 Product data sheet - BAP64-02 v.5 BAP64-02 v.5 (9397 750 06912) 20000323 Product specification - BAP64-02 v.4 BAP64-02 v.4 (9397 750 06418) 19990921 Preliminary specification - BAP64-02_N v.3 BAP64-02_N v.3 (9397 750 06086) 19990616 Preliminary specification - BAP64-02 v.2 BAP64-02 v.2 (9397 750 05556) 19990510 Objective specification - BAP64-02_N v.1 BAP64-02_N v.1 (9397 750 05492) 19981204 Objective specification - - BAP64-02 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 11 — 20 March 2019 © NXP B.V. 2019. All rights reserved. 6/9 BAP64-02 NXP Semiconductors Silicon PIN diode 11 Legal information 11.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. notice. This document supersedes and replaces all information supplied prior to the publication hereof. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without BAP64-02 Product data sheet Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected All information provided in this document is subject to legal disclaimers. Rev. 11 — 20 March 2019 © NXP B.V. 2019. All rights reserved. 7/9 BAP64-02 NXP Semiconductors Silicon PIN diode to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 11.4 Trademarks BAP64-02 Product data sheet Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. Rev. 11 — 20 March 2019 © NXP B.V. 2019. All rights reserved. 8/9 BAP64-02 NXP Semiconductors Silicon PIN diode Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 Product profile .................................................... 1 General description ............................................1 Features and benefits ........................................1 Applications ........................................................1 Pinning information ............................................ 1 Ordering information .......................................... 1 Marking .................................................................2 Limiting values .................................................... 2 Thermal characteristics ......................................2 Characteristics .................................................... 2 Package outline ...................................................5 Abbreviations ...................................................... 5 Revision history .................................................. 5 Legal information ................................................ 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2019. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 March 2019 Document identifier: BAP64-02