BAS70VV

BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 09 — 13 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Package NXP 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY SOD323 SOD523 SOT23 SOD123F SOD882 SOT323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT143B SOT363 SOT666 SOT666 SOT363 JEITA SC-76 SC-79 SC-70 SC-70 SC-70 SC-70 SC-88 SC-88 single diode single diode single diode single diode single diode single diode dual series dual series dual common cathode dual common cathode dual common anode dual common anode dual isolated dual isolated dual isolated triple isolated quadruple; 2 series Configuration Type number 1.2 Features High switching speed High breakdown voltage Low leakage current Low capacitance 1.3 Applications Ultra high-speed switching Voltage clamping NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 1.4 Quick reference data Table 2. Symbol Per diode IF VF VR [1] Quick reference data Parameter forward current forward voltage reverse voltage IF = 1 mA [1] Conditions Min - Typ - Max 70 410 70 Unit mA mV V Pulse test: tp ≤ 300 μs; δ ≤ 0.02. 2. Pinning information Table 3. Pin 1 2 Pinning Description cathode anode [1] Simplified outline Symbol BAS70H; 1PS76SB70; 1PS79SB70 1 1 001aab540 2 sym001 2 BAS70L 1 2 cathode anode [1] 1 1 2 2 sym001 Transparent top view BAS70; BAS70W 1 2 3 anode not connected cathode 1 2 006aaa144 3 1 3 2 n.c. 006aaa436 BAS70-04; BAS70-04W 1 2 3 anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) 1 2 006aaa144 3 1 3 2 006aaa437 BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 2 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Pinning …continued Description anode (diode 1) anode (diode 2) cathode (diode 1), cathode (diode 2) 1 2 006aaa144 Table 3. Pin 1 2 3 Simplified outline Symbol BAS70-05; BAS70-05W 3 1 3 2 006aaa438 BAS70-06; BAS70-06W 1 2 3 cathode (diode 1) cathode (diode 2) anode (diode 1), anode (diode 2) 1 2 006aaa144 3 1 3 2 006aaa439 BAS70-07 1 2 3 4 cathode (diode 1) cathode (diode 2) anode (diode 2) anode (diode 1) 1 2 1 2 006aaa434 4 3 4 3 BAS70-07S; BAS70-07V 1 2 3 4 5 6 BAS70VV 1 2 3 4 5 6 anode (diode 1) anode (diode 2) anode (diode 3) cathode (diode 3) 1 2 3 sym046 anode (diode 1) not connected cathode (diode 2) anode (diode 2) not connected cathode (diode 1) 1 1 2 3 001aab555 6 5 4 6 5 4 2 3 006aaa440 6 5 4 6 5 4 cathode (diode 2) cathode (diode 1) 1 2 3 BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 3 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Pinning …continued Description anode (diode 1) cathode (diode 2) anode (diode 3), cathode (diode 4) anode (diode 4) cathode (diode 3) cathode (diode 1), anode (diode 2) 1 2 3 006aaa256 Table 3. Pin BAS70XY 1 2 3 4 5 6 Simplified outline Symbol 6 5 4 6 5 4 1 2 3 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Ordering information Package Name 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY SC-76 SC-79 SC-70 SC-70 SC-70 SC-70 SC-88 SC-88 Description plastic surface-mounted package; 2 leads plastic surface-mounted package; 2 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 2 leads leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.5 mm plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 4 leads plastic surface-mounted package; 6 leads plastic surface-mounted package; 6 leads plastic surface-mounted package; 6 leads plastic surface-mounted package; 6 leads Version SOD323 SOD523 SOT23 SOD123F SOD882 SOT323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT143B SOT363 SOT666 SOT666 SOT363 Type number BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 4 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 4. Marking Table 5. Marking codes Marking code[1] S2 G 73* AH S8 73* 74* 74* 75* Type number BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY Marking code[1] 75* 76* 76* 77* 77* 77 N1 70* Type number 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode VR IF IFRM IFSM Tj Tamb Tstg [1] Parameter reverse voltage forward current repetitive peak forward current non-repetitive peak forward current junction temperature ambient temperature storage temperature Conditions Min - Max 70 70 70 100 150 +150 +150 Unit V mA mA mA °C °C °C tp ≤ 1 s; δ ≤ 0.5 tp ≤ 10 ms [1] −65 −65 Tj = 25 °C prior to surge. BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 5 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 6. Thermal characteristics Table 7. Symbol Rth(j-a) Per device thermal resistance from junction to ambient SOT23 SOT143B SOT363 (BAS70-07S) SOT666 (BAS70VV) SOT666 (BAS70-07V) SOD123F SOD323 SOD523 SOD882 SOT323 Rth(j-sp) thermal resistance from junction to solder point SOT363 (BAS70XY) [1] [2] [3] [3] [2] [2] [2] [2] [2] Thermal characteristics Parameter Conditions in free air [1] Min Typ Max Unit - - 500 500 416 700 416 330 450 450 500 625 K/W K/W K/W K/W K/W K/W K/W K/W K/W K/W - - 260 K/W Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. Soldering point at pins 2, 3, 5 and 6. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Per diode VF forward voltage IF = 1 mA IF = 10 mA IF = 15 mA IR Cd [1] [1] Parameter Conditions Min Typ Max Unit - - 410 750 1 100 10 2 mV mV V nA μA pF reverse current diode capacitance Pulse test: tp ≤ 300 μs; δ ≤ 0.02. VR = 50 V VR = 70 V VR = 0 V; f = 1 MHz BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 6 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 102 IF (mA) 10 mra803 102 IR (μA) 10 mra805 (1) 1 1 10−1 10−1 (1) (2) (3) (4) (2) 10−2 (3) 10−2 0 0.2 0.4 0.6 0.8 VF (V) 1 10−3 0 20 40 60 VR (V) 80 (1) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (4) Tamb = −40 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (3) Tamb = 25 °C Fig 1. Forward current as a function of forward voltage; typical values 103 mra802 Fig 2. Reverse current as a function of reverse voltage; typical values mra804 2 Cd (pF) 1.5 rdif (Ω) 102 1 10 0.5 1 10−1 1 10 IF (mA) 102 0 0 20 40 60 VR (V) 80 f = 10 kHz Tamb = 25 °C; f = 1 MHz Fig 3. Differential forward resistance as a function of forward current; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 7 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 8. Package outline 1.35 1.15 1 0.45 0.15 1.1 0.8 0.85 0.75 1 0.65 0.58 2.7 2.3 1.8 1.6 1.65 1.25 1.55 1.15 2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17 Dimensions in mm 0.34 0.26 2 0.17 0.11 02-12-13 Fig 5. Package outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-79) 1.7 1.5 1 1.2 1.0 3.0 2.8 3 1.1 0.9 0.45 0.15 2.5 1.4 2.1 1.2 3.6 3.4 2.7 2.5 0.55 0.35 1 2 1.9 Dimensions in mm 0.48 0.38 0.15 0.09 04-11-04 Dimensions in mm 2 0.70 0.55 0.25 0.10 04-11-29 Fig 7. Package outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F 0.62 0.55 2 0.50 0.46 2.2 1.8 3 0.45 0.15 1.1 0.8 0.30 0.22 0.65 0.30 0.22 0.55 0.47 Dimensions in mm 1.02 0.95 2.2 1.35 2.0 1.15 1 1 cathode marking on top side 1.3 03-04-17 Dimensions in mm 2 0.4 0.3 0.25 0.10 04-11-04 Fig 9. Package outline SOD882 Fig 10. Package outline SOT323 (SC-70) © NXP B.V. 2010. All rights reserved. BAS70_1PS7XSB70_SER_9 Product data sheet Rev. 09 — 13 January 2010 8 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 3.0 2.8 1.9 4 3 0.45 0.15 1.1 0.9 6 2.2 1.8 5 4 0.45 0.15 1.1 0.8 2.5 2.1 1.4 1.2 2.2 1.35 2.0 1.15 pin 1 index 1 0.88 0.78 1.7 Dimensions in mm 2 0.48 0.38 0.15 0.09 1 0.65 1.3 04-11-16 Dimensions in mm 2 3 0.3 0.2 0.25 0.10 06-03-16 Fig 11. Package outline SOT143B 1.7 1.5 6 5 Fig 12. Package outline SOT363 (SC-88) 0.6 0.5 4 0.3 0.1 1.7 1.5 1.3 1.1 pin 1 index 1 0.5 1 Dimensions in mm 2 3 0.27 0.17 0.18 0.08 04-11-08 Fig 13. Package outline SOT666 BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 9 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY SOD323 SOD523 SOT23 SOD882 SOT323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT363 SOT666 SOT666 SOT363 Description 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2 [1] [2] [3] [2] [3] [2] [3] Packing quantity 3000 4000 8000 10000 -115 -115 -215 -115 -115 -215 -115 -215 -115 -215 -115 -215 -115 -125 -115 -125 -115 -115 -315 -315 -315 -135 -135 -235 -135 -315 -135 -235 -135 -235 -135 -235 -135 -235 -135 -165 -135 -165 SOD123F 4 mm pitch, 8 mm tape and reel SOT143B 4 mm pitch, 8 mm tape and reel For further information and the availability of packing methods, see Section 13. T1: normal taping T2: reverse taping BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 10 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 14. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 15. Wave soldering footprint SOD323 (SC-76) 2.15 1.20 0.50 0.60 solder lands solder paste solder resist occupied area 1.80 1.90 0.30 0.40 mgs343 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 16. Reflow soldering footprint SOD523 (SC-79) BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 11 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 2.90 2.50 solder lands solder resist 0.85 3.00 0.85 1.30 3 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 2 1 2.70 occupied area solder paste Dimensions in mm Fig 17. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 4.60 4.00 1.20 3 1 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 18. Wave soldering footprint SOT23 (TO-236AB) BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 12 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 19. Reflow soldering footprint SOD123F 1.30 R = 0.05 (8×) 0.30 R = 0.05 (8×) 0.90 0.60 0.70 0.80 (2×) (2×) (2×) solder lands solder paste solder resist occupied area 0.30 (2×) 0.40 (2×) 0.50 (2×) mbl872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD882 BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 13 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.60 2.35 0.85 (3×) 3 0.50 (3×) 1.90 1 solder resist occupied area Dimensions in mm 0.55 (3×) 2.40 msa429 Dimensions in mm Fig 21. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3.65 2.10 3 2.70 solder lands 1 0.90 (2×) solder resist occupied area Dimensions in mm preferred transport direction during soldering msa419 Dimensions in mm Fig 22. Wave soldering footprint SOT323 (SC-70) BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 14 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 3.25 0.60 (3x) 0.50 (3x) solder lands 0.60 (4x) 4 2.70 1 2 3 1.30 3.00 occupied area solder paste solder resist msa441 0.90 1.00 2.50 Dimensions in mm Fig 23. Reflow soldering footprint SOT143B 4.45 1.20 (3×) 4 3 1.15 4.00 4.60 solder lands 1 2 solder resist occupied area Dimensions in mm 1.00 3.40 preferred transport direction during soldering msa422 Dimensions in mm Fig 24. Wave soldering footprint SOT143B BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 15 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 2.65 0.60 (2×) 2.35 0.40 0.90 2.10 (2×) 0.50 (4×) solder paste solder lands solder resist occupied area 0.50 (4×) 1.20 2.40 MSA432 Dimensions in mm Fig 25. Reflow soldering footprint SOT363 (SC-88) 1.5 solder lands 4.5 0.3 2.5 solder resist occupied area 1.5 Dimensions in mm preferred transport direction during soldering 1.3 2.45 5.3 1.3 sot363_fw Fig 26. Wave soldering footprint SOT363 (SC-88) BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 16 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 2.75 2.45 2.1 1.6 solder lands 0.4 (6×) 0.25 (2×) 0.55 (2×) 0.3 (2×) placement area solder paste occupied area 0.325 0.375 (4×) (4×) 1.7 0.45 (4×) 0.5 (4×) 0.6 (2×) 0.65 (2×) sot666_fr 0.538 2 1.7 1.075 Dimensions in mm Reflow soldering is the only recommended soldering method. Fig 27. Reflow soldering footprint SOT666 BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 17 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 11. Revision history Table 10. Revision history Release date Data sheet status Product data sheet Change notice Supersedes BAS70_1PS7XSB70_SER_8 Document ID Modifications: BAS70_1PS7XSB70_SER_9 20100113 • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Product data sheet Product data sheet BAS70_1PS7XSB70_SER_7 1PS76SB70_2 1PS79SB70_1 BAS70H_1 BAS70L_1 BAS70-07V_1 BAS70VV_1 BAS70W_3 BAS70-07S_4 BAS70_SERIES_6 1PS76SB70_1 BAS70W_2 BAS70_07S_3 BAS70_5 BAS70_1PS7XSB70_SER_8 20060504 BAS70_1PS7XSB70_SER_7 20050718 1PS76SB70_2 1PS79SB70_1 BAS70H_1 BAS70L_1 BAS70-07V_1 BAS70VV_1 BAS70W_3 BAS70-07S_4 BAS70_SERIES_6 20040126 19980716 20050425 20030520 20020117 20040910 19990326 20030411 20011011 Product specification Product specification Product data sheet Product specification Product specification Product data sheet Product specification Product specification Product specification - BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 18 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 19 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 January 2010 Document identifier: BAS70_1PS7XSB70_SER_9