BAT54CM

DISCRETE SEMICONDUCTORS DATA SHEET M3D883 BAT54CM Schottky barrier double diode Product data sheet 2003 Nov 11 NXP Semiconductors Product data sheet Schottky barrier double diode FEATURES • Low forward voltage • Leadless ultra small plastic package (1.0 × 0.6 × 0.5 mm) • Boardspace 1.17 mm2 (approx. 10% of SOT23) • Power dissipation comparable to SOT23. APPLICATIONS • Ultra high-speed switching • Voltage clamping • Protection circuits • Mobile communications, digital (still) cameras, PDAs and PCMCIA cards. DESCRIPTION Planar Schottky barrier double diode encapsulated in a SOT883 leadless ultra small plastic package. Top view handbook, halfpage BAT54CM PINNING PIN 1 2 3 anode (a1) anode (a2) common cathode DESCRIPTION 1 3 2 cathode mark MARKING 1 TYPE NUMBER BAT54CM MARKING CODE S3 3 2 Bottom view MLE232 Fig.1 Simplified outline (SOT883) and symbol. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BAT54CM − DESCRIPTION leadless ultra small plastic package; 3 solder lands; body 1.0 × 0.6 × 0.5 mm VERSION SOT883 2003 Nov 11 2 NXP Semiconductors Product data sheet Schottky barrier double diode LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VR IF IFRM IFSM Tstg Tj Ptot Note 1. Refer to SOT883 standard mounting conditions (footprint); FR4 with 60 μm copper strip line. THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line. Soldering Reflow soldering is the only recommended soldering method. ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL Per diode VF forward voltage see Fig.2; IF = 0.1 mA I F = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR Cd Note 1. Pulsed test: tp ≤ 300 μs; δ ≤ 0.02. continuous reverse current diode capacitance VR = 25 V; note 1; see Fig.3 f = 1 MHz; VR = 1 V; see Fig.4 240 320 400 500 800 2 10 PARAMETER CONDITIONS MAX. PARAMETER thermal resistance from junction to ambient note 1 CONDITIONS VALUE 500 PARAMETER continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature total power dissipation (per package) Tamb ≤ 25 °C; note 1 tp ≤ 1 s; δ ≤ 0.5 tp < 10 ms CONDITIONS − − − − −65 − − MIN. BAT54CM MAX. 30 200 300 600 +150 150 250 V UNIT mA mA mA °C °C mW UNIT K/W UNIT mV mV mV mV mV μA pF 2003 Nov 11 3 NXP Semiconductors Product data sheet Schottky barrier double diode BAT54CM MSA892 10 3 handbook, halfpage IF (mA) 10 2 (1) (2) (3) 10 3 I R (μA) 10 2 (2) (1) MSA893 10 10 1 (1) (2) (3) 1 (3) 10 1 10 1 0 0.4 0.8 VF (V) 1.2 0 10 20 VR (V) 30 (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. Fig.2 Forward current as a function of forward voltage; typical values. Fig.3 Reverse current as a function of reverse voltage; typical values. handbook, halfpage 15 MSA891 Cd (pF) 10 5 0 0 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 °C. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2003 Nov 11 4 NXP Semiconductors Product data sheet Schottky barrier double diode PACKAGE OUTLINE BAT54CM Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm SOT883 L 2 b e L1 3 b1 1 e1 A A1 E D 0 0.5 scale 1 mm DIMENSIONS (mm are the original dimensions) UNIT mm A (1) 0.50 0.46 A1 max. 0.03 b 0.20 0.12 b1 0.55 0.47 D 0.62 0.55 E 1.02 0.95 e 0.35 e1 0.65 L 0.30 0.22 L1 0.30 0.22 Note 1. Including plating thickness OUTLINE VERSION SOT883 REFERENCES IEC JEDEC JEITA SC-101 EUROPEAN PROJECTION ISSUE DATE 03-02-05 03-04-03 2003 Nov 11 5 NXP Semiconductors Product data sheet Schottky barrier double diode DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes 1. Please consult the most recently issued document before initiating or completing a design. PRODUCT STATUS(2) Development Qualification Production DEFINITION BAT54CM This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2003 Nov 11 6 above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/01/pp7 Date of release: 2003 Nov 11 Document order number: 9397 750 11909