BAT754L

DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage MBD128 BAT754L Schottky barrier triple diode Product data sheet 2001 Jan 18 NXP Semiconductors Product data sheet Schottky barrier triple diode FEATURES • Very low forward voltage • Guard ring protected • Low diode capacitance • Three independent diodes in a small plastic SMD package. APPLICATIONS • Ultra high-speed switching • Voltage clamping • Protection circuits • Blocking diodes • Low power consumption applications (e.g. hand-held applications). DESCRIPTION 1 2 6 5 4 6 5 BAT754L PINNING PIN 1 2 3 4 5 6 anode 1 anode 2 anode 3 cathode 3 cathode 2 cathode 1 DESCRIPTION 4 3 Three internal (galvanic) isolated silicon epitaxial Schottky barrier diodes in a SOT363 small SMD plastic package. MARKING TYPE NUMBER BAT754L MARKING CODE L1 1 Top view 2 3 MBL256 Fig.1 Simplified outline (SOT363) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode VR IF IFRM IFSM Tstg Tj Tamb continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature operating ambient temperature tp < 1 s; δ < 0.5 tp < 10 ms − − − − −65 − −65 30 200 300 600 +150 125 +125 V mA mA mA °C °C °C PARAMETER CONDITIONS MIN. MAX. UNIT 2001 Jan 18 2 NXP Semiconductors Product data sheet Schottky barrier triple diode THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Refer to SOT363 standard mounting conditions. ELECTRICAL CHARACTERISTICS Tamb = 25 °C; unless otherwise specified. SYMBOL Per diode VF forward voltage note 1; see Fig.2 IF = 0.1 mA I F = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR Cd Note 1. Pulse test: pulse width = 300 μs; δ = 0.02. reverse current diode capacitance VR = 25 V; note 1; see Fig.3 VR = 1 V; f = 1 MHz; see Fig.4 200 260 340 420 750 2 10 PARAMETER CONDITIONS PARAMETER thermal resistance from junction to ambient note 1 CONDITIONS BAT754L VALUE 416 UNIT K/W MAX. UNIT mV mV mV mV mV μA pF 2001 Jan 18 3 NXP Semiconductors Product data sheet Schottky barrier triple diode BAT754L MSA892 10 3 handbook, halfpage IF (mA) 10 2 (1) (2) (3) 10 3 I R (μA) 10 2 (2) (1) MSA893 10 10 1 (1) (2) (3) 1 (3) 10 1 10 1 0 0.4 0.8 VF (V) 1.2 0 10 20 VR (V) 30 (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. Fig.2 Forward current as a function of forward voltage; typical values. Fig.3 Reverse current as a function of reverse voltage; typical values. handbook, halfpage 15 MSA891 Cd (pF) 10 5 0 0 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 °C. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2001 Jan 18 4 NXP Semiconductors Product data sheet Schottky barrier triple diode PACKAGE OUTLINE BAT754L Plastic surface mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC EIAJ SC-88 EUROPEAN PROJECTION ISSUE DATE 97-02-28 2001 Jan 18 5 NXP Semiconductors Product data sheet Schottky barrier triple diode DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes 1. Please consult the most recently issued document before initiating or completing a design. PRODUCT STATUS(2) Development Qualification Production DEFINITION BAT754L This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 2001 Jan 18 6 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/01/pp7 Date of release: 2001 Jan 18 Document order number: 9397 750 07668