BAV102

BAV102; BAV103 Single general-purpose switching diodes Rev. 03 — 16 August 2007 Product data sheet 1. Product profile 1.1 General description Single general-purpose switching diodes, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages. Table 1. Product overview Package NXP BAV102 BAV103 SOD80C JEITA single Configuration Type number 1.2 Features I High switching speed: trr ≤ 50 ns I Low leakage current I Low capacitance: Cd ≤ 5 pF I Small hermetically sealed glass SMD package 1.3 Applications I High-speed switching I General-purpose switching I Voltage clamping I Reverse polarity protection 1.4 Quick reference data Table 2. Symbol IF VR Quick reference data Parameter forward current reverse voltage BAV102 BAV103 trr [1] [2] [3] Conditions [1][2] Min [3] Typ - Max 250 150 200 50 Unit mA V V ns reverse recovery time Pulse test: tp ≤ 300 µs; δ ≤ 0.02. - Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA. NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes 2. Pinning information Table 3. Pin 1 2 Pinning Description cathode anode [1] Simplified outline Symbol k a 1 2 006aab040 [1] The marking band indicates the cathode. 3. Ordering information Table 4. Ordering information Package Name BAV102 BAV103 Description hermetically sealed glass surface-mounted package; 2 connectors Version SOD80C Type number 4. Marking Table 5. BAV102 BAV103 [1] green: made in Philippines Marking codes Marking code[1] marking band Type number 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VRRM Parameter repetitive peak reverse voltage BAV102 BAV103 VR reverse voltage BAV102 BAV103 IF IFRM forward current repetitive peak forward current [1][2] Conditions Min Max Unit - 200 250 150 200 250 625 V V V V mA mA BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 August 2007 2 of 10 NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol IFSM Parameter non-repetitive peak forward current Conditions square wave tp = 1 µs tp = 100 µs tp = 1 s Ptot Tj Tamb Tstg [1] [2] [3] [3] Min [2] Max 9 3 1 400 175 +175 +175 Unit A A A mW °C °C °C total power dissipation junction temperature ambient temperature storage temperature Pulse test: tp ≤ 300 µs; δ ≤ 0.02. Tamb ≤ 25 °C −65 −65 Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Tj = 25 °C prior to surge. 6. Thermal characteristics Table 7. Symbol Rth(j-a) Rth(j-t) [1] Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to tie-point Conditions in free air [1] Min - Typ - Max 375 300 Unit K/W K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol VF Parameter forward voltage IF = 100 mA IF = 200 mA IR reverse current BAV102 BAV103 Cd trr [1] [2] Conditions [1] Min [2] Typ - Max 1.0 1.25 100 100 100 100 5 50 Unit V V nA µA nA µA pF ns VR = 150 V VR = 150 V; Tj = 150 °C VR = 200 V VR = 200 V; Tj = 150 °C f = 1 MHz; VR = 0 V diode capacitance reverse recovery time Pulse test: tp ≤ 300 µs; δ ≤ 0.02. - When switched from IF = 30 mA to IR = 30 mA; RL = 100 Ω; measured at IR = 3 mA. BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 August 2007 3 of 10 NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes 600 IF (mA) mbg459 102 IFSM (A) 10 mbg703 400 (1) (2) (3) 200 1 0 0 1 VF (V) 2 10−1 1 10 102 103 tp (µs) 104 (1) Tamb = 150 °C; typical values (2) Tamb = 25 °C; typical values (3) Tamb = 25 °C; maximum values Based on square wave currents. Tj = 25 °C; prior to surge Fig 1. Forward current as a function of forward voltage mgd009 Fig 2. Non-repetitive peak forward current as a function of pulse duration; maximum values mgd005 103 IR (µA) 102 1.6 Cd (pF) 1.4 10 1.2 1 1.0 10−1 10−2 0 100 Tj (°C) 200 0.8 0 10 VR (V) 20 VR = VRmax Solid line: maximum values Dotted line: typical values f = 1 MHz; Tamb = 25 °C Fig 3. Reverse current as a function of junction temperature Fig 4. Diode capacitance as a function of reverse voltage; typical values BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 August 2007 4 of 10 NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes 300 IF (mA) 200 mbh278 300 VR (V) (1) mgl588 200 (2) 100 100 0 0 100 Tamb (°C) 200 0 0 100 Tamb (°C) 200 FR4 PCB, standard footprint FR4 PCB, standard footprint (1) BAV103 (2) BAV102 Fig 5. Forward current as a function of ambient temperature; derating curve Fig 6. Reverse voltage as a function of ambient temperature; derating curve 8. Test information tr D.U.T. RS = 50 Ω V = VR + IF × RS IF SAMPLING OSCILLOSCOPE Ri = 50 Ω VR mga881 tp t 10 % + IF trr t 90 % input signal output signal (1) (1) IR = 1 mA Fig 7. Reverse recovery time test circuit and waveforms BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 August 2007 5 of 10 NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes 9. Package outline 3.7 3.3 0.3 0.3 1.60 1.45 Dimensions in mm 06-03-16 Fig 8. Package outline SOD80C 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAV102 BAV103 [1] For further information and the availability of packing methods, see Section 14. Package SOD80C Description 4 mm pitch, 8 mm tape and reel Packing quantity 2500 -115 10000 -135 BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 August 2007 6 of 10 NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes 11. Soldering 4.55 4.30 2.30 solder lands solder paste 2.25 1.70 1.60 solder resist occupied area Dimensions in mm 0.90 (2x) sod080c Fig 9. Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 solder lands solder resist 2.90 1.70 occupied area tracks Dimensions in mm sod080c Fig 10. Wave soldering footprint SOD80C BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 August 2007 7 of 10 NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes 12. Revision history Table 10. Revision history Release date 20070816 Data sheet status Product data sheet Change notice Supersedes BAV100_2 Document ID BAV102_BAV103_3 Modifications: • • • • • • • • • • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Type numbers BAV100 and BAV101 have been removed Section 1.1 “General description”: amended Table 1 “Product overview”: added Table 2 “Quick reference data”: added Section 3 “Ordering information”: added Figure 7: figure title amended Figure 8: superseded by minimized package outline drawing Section 10 “Packing information”: added Section 11 “Soldering”: added Section 13 “Legal information”: updated Product specification Product specification BAV100_1 - BAV100_2 BAV100_1 19960917 19960423 BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 August 2007 8 of 10 NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com BAV102_BAV103_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 August 2007 9 of 10 NXP Semiconductors BAV102; BAV103 Single general-purpose switching diodes 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 August 2007 Document identifier: BAV102_BAV103_3