BAV99

BAV99 series High-speed switching diodes Rev. 07 — 14 April 2010 Product data sheet 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Package NXP BAV99 BAV99S BAV99W SOT23 SOT363 SOT323 JEITA SC-88 SC-70 JEDEC TO-236AB dual series quadruple; 2 series dual series Configuration Package configuration small very small very small Type number 1.2 Features and benefits High switching speed: trr ≤ 4 ns Low leakage current Small SMD plastic packages Low capacitance: Cd ≤ 1.5 pF Reverse voltage: VR ≤ 100 V AEC-Q101 qualified 1.3 Applications High-speed switching General-purpose switching Reverse polarity protection 1.4 Quick reference data Table 2. Symbol Per diode IR VR trr [1] Quick reference data Parameter reverse current reverse voltage reverse recovery time [1] Conditions VR = 80 V Min - Typ - Max 0.5 100 4 Unit μA V ns When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA. NXP Semiconductors BAV99 series High-speed switching diodes 2. Pinning information Table 3. Pin 1 2 3 Pinning Description anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) 1 2 006aaa144 Simplified outline Graphic symbol BAV99; BAV99W 3 3 1 2 006aaa763 BAV99S 1 2 3 4 5 6 anode (diode 1) cathode (diode 2) cathode (diode 3), anode (diode 4) anode (diode 3) cathode (diode 4) cathode (diode 1), anode (diode 2) 1 2 3 1 2 3 006aab101 6 5 4 6 5 4 3. Ordering information Table 4. Ordering information Package Name BAV99 BAV99S BAV99W SC-88 SC-70 Description plastic surface-mounted package; 3 leads plastic surface-mounted package; 6 leads plastic surface-mounted package; 3 leads Version SOT23 SOT363 SOT323 Type number 4. Marking Table 5. BAV99 BAV99S BAV99W [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China Marking codes Marking code[1] A7* K1* A7* Type number BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 2 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode VRRM VR IF repetitive peak reverse voltage reverse voltage forward current BAV99 BAV99S BAV99W IFRM IFSM repetitive peak forward current non-repetitive peak forward current square wave tp = 1 μs tp = 1 ms tp = 1 s Ptot total power dissipation BAV99 BAV99S BAV99W Per device Tj Tamb Tstg [1] [2] [3] [4] [5] [1][4] [3] [1] [2] [1] [1] [2] Parameter Conditions Min - Max 100 100 215 125 200 150 130 500 Unit V V mA mA mA mA mA mA [5] 4 1 0.5 250 250 200 150 +150 +150 A A A mW mW mW °C °C °C Tamb ≤ 25 °C Tamb ≤ 85 °C Tamb ≤ 25 °C −65 −65 junction temperature ambient temperature storage temperature Single diode loaded. Double diode loaded. Tj = 25 °C prior to surge. Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Soldering points at pins 2, 3, 5 and 6. BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 3 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 6. Thermal characteristics Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient BAV99 BAV99W Rth(j-sp) thermal resistance from junction to solder point BAV99 BAV99S BAV99W [1] [2] [3] Single diode loaded. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Soldering points at pins 2, 3, 5 and 6. [3] Conditions in free air [1][2] Min Typ Max Unit - - 500 625 K/W K/W - - 360 260 300 K/W K/W K/W 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Per diode VF forward voltage IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA IR reverse current VR = 25 V VR = 80 V VR = 25 V; Tj = 150 °C VR = 80 V; Tj = 150 °C Cd trr VFR [1] [2] Parameter Conditions Min [1] [2] Typ - Max 715 855 1 1.25 30 0.5 30 50 1.5 4 1.75 Unit mV mV V V nA μA μA μA pF ns V diode capacitance reverse recovery time forward recovery voltage f = 1 MHz; VR = 0 V - When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA. When switched from IF = 10 mA; tr = 20 ns. BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 4 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 103 IF (mA) 102 006aab132 102 IR (μA) 10 1 10−1 006aab133 (1) (2) 10 10−2 (1) (2) (3) (4) (3) 1 10−3 10−4 (4) 10−1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VF (V) 10−5 0 20 40 60 80 VR (V) 100 (1) Tamb = 150 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (4) Tamb = −40 °C (1) Tamb = 150 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (4) Tamb = −40 °C Fig 1. Forward current as a function of forward voltage; typical values mbg446 Fig 2. Reverse current as a function of reverse voltage; typical values mbg704 0.8 Cd (pF) 0.6 102 IFSM (A) 10 0.4 1 0.2 0 0 4 8 12 VR (V) 16 10−1 1 10 102 103 tp (μs) 104 f = 1 MHz; Tamb = 25 °C Based on square wave currents. Tj = 25 °C; prior to surge Fig 3. Diode capacitance as a function of reverse voltage; typical values Fig 4. Non-repetitive peak forward current as a function of pulse duration; maximum values BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 5 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 8. Test information tr D.U.T. RS = 50 Ω V = VR + IF × RS IF SAMPLING OSCILLOSCOPE Ri = 50 Ω VR mga881 tp t 10 % + IF trr t 90 % input signal output signal (1) (1) IR = 1 mA Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle δ = 0.05 Oscilloscope: rise time tr = 0.35 ns Fig 5. Reverse recovery time test circuit and waveforms I 1 kΩ 450 Ω I 90 % V RS = 50 Ω D.U.T. OSCILLOSCOPE Ri = 50 Ω 10 % t tr tp input signal VFR t output signal mga882 Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp ≥ 100 ns; duty cycle δ ≤ 0.005 Fig 6. Forward recovery voltage test circuit and waveforms 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 6 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 9. Package outline 2.2 1.8 6 0.45 0.15 2.5 1.4 2.1 1.2 2.2 1.35 2.0 1.15 pin 1 index 5 4 0.45 0.15 1.1 0.8 3.0 2.8 3 1.1 0.9 1 2 1 0.48 0.38 0.15 0.09 04-11-04 Dimensions in mm 0.65 1.3 2 3 0.3 0.2 0.25 0.10 06-03-16 1.9 Dimensions in mm Fig 7. Package outline BAV99 (SOT23/TO-236AB) Fig 8. Package outline BAV99S (SOT363/SC-88) 2.2 1.8 3 0.45 0.15 1.1 0.8 2.2 1.35 2.0 1.15 1 2 0.4 0.3 1.3 0.25 0.10 04-11-04 Dimensions in mm Fig 9. Package outline BAV99W (SOT323/SC-70) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAV99 BAV99S BAV99W [1] [2] [3] BAV99_SER_7 Package SOT23 SOT363 SOT323 Description 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2 4 mm pitch, 8 mm tape and reel [2] [3] Packing quantity 3000 -215 -115 -125 -115 10000 -235 -135 -165 -135 For further information and the availability of packing methods, see Section 14. T1: normal taping T2: reverse taping All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 7 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 11. Soldering 3.3 2.9 1.9 solder lands solder resist 3 1.7 2 solder paste 0.6 (3×) occupied area Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr 0.7 (3×) Fig 10. Reflow soldering footprint BAV99 (SOT23/TO-236AB) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig 11. Wave soldering footprint BAV99 (SOT23/TO-236AB) BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 8 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 2.65 solder lands 2.35 1.5 0.6 0.5 (4×) (4×) 0.4 (2×) solder resist solder paste 0.5 (4×) 0.6 (4×) 1.8 0.6 (2×) occupied area Dimensions in mm sot363_fr Fig 12. Reflow soldering footprint BAV99S (SOT363/SC-88) 1.5 solder lands 4.5 0.3 2.5 solder resist occupied area 1.5 Dimensions in mm preferred transport direction during soldering 1.3 2.45 5.3 1.3 sot363_fw Fig 13. Wave soldering footprint BAV99S (SOT363/SC-88) BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 9 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 2.65 1.85 1.325 solder lands 2 solder resist solder paste occupied area Dimensions in mm 2.35 0.6 (3×) 3 1.3 0.5 (3×) 1 0.55 (3×) sot323_fr Fig 14. Reflow soldering footprint BAV99W (SOT323/SC-70) 4.6 2.575 1.425 (3×) solder lands solder resist occupied area 3.65 2.1 1.8 Dimensions in mm preferred transport direction during soldering 09 (2×) sot323_fw Fig 15. Wave soldering footprint BAV99W (SOT323/SC-70) BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 10 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 12. Revision history Table 10. Revision history Release date 20100414 Data sheet status Product data sheet Change notice Supersedes BAV99_SER_6 Document ID BAV99_SER_7 Modifications: • • • Section 1.2 “Features and benefits”: updated Section 8.1 “Quality information”: added Section 13 “Legal information”: updated Product data sheet Product data sheet BAV99_SER_5 BAV99_4 BAV99S_3 BAV99W_4 BAV99_3 BAV99S_N_2 BAV99W_3 BAV99_SER_6 BAV99_SER_5 20100310 20080820 BAV99_4 BAV99S_3 BAV99W_4 20011015 20010514 19990511 Product specification Product specification Product specification - BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 11 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or BAV99_SER_7 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 12 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BAV99_SER_7 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 07 — 14 April 2010 13 of 14 NXP Semiconductors BAV99 series High-speed switching diodes 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information . . . . . . . . . . . . . . . . . . . . . 7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 April 2010 Document identifier: BAV99_SER_7