BB181

BB181 VHF variable capacitance diode Rev. 03 — 16 February 2009 Product data sheet 1. Product profile 1.1 General description The BB181 is a variable capacitance diode, fabricated in planar technology and encapsulated in the SOD523 (SC-79) ultra small plastic SMD package. 1.2 Features I Excellent linearity I Ultra small plastic SMD package I Cd(28V) : 1 pF; Cd(0V5) to Cd(28V) ratio : 14 1.3 Applications I Electronic tuning in satellite tuners I Tunable coupling I Voltage Controlled Oscillators (VCO) 2. Pinning information Table 1. Pin 1 2 Pinning Description cathode anode [1] Simplified outline Graphic symbol 1 2 sym008 [1] The marking bar indicates the cathode. 3. Ordering information Table 2. Ordering information Package Name BB181 SC-79 Description plastic surface mounted package; 2 leads Version SOD523 Type number NXP Semiconductors BB181 VHF variable capacitance diode 4. Marking Table 3. BB181 Marking codes Marking code N Type number 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR IF Tstg Tj reverse voltage forward current storage temperature junction temperature Conditions Min Max 30 20 Unit V mA −55 +150 °C −55 +150 °C 6. Characteristics Table 5. Characteristics Tj = 25 °C unless otherwise specified. Symbol IR Parameter reverse current Conditions see Figure 2 VR = 30 V VR = 30 V; Tj = 85 °C rs Cd diode series resistance diode capacitance f = 470 MHz at Cd = 9 pF f = 1 MHz; see Figure 1 and Figure 3 VR = 0.5 V VR = 28 V Cd(0V5)/Cd(28V) diode capacitance ratio (0.5 V to 28 V) f = 1 MHz 8 0.7 12 17 1.055 16 pF pF 10 200 3 nA nA Ω Min Typ Max Unit BB181_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 16 February 2009 2 of 6 NXP Semiconductors BB181 VHF variable capacitance diode 15 Cd (pF) mbe872 10 5 0 10−1 1 10 VR (V) 102 f = 1 MHz; Tj = 25 °C. Fig 1. Diode capacitance as a function of reverse voltage; typical values 103 IR (nA) 102 mlc816 10−3 mlc815 TCd (K−1) 10−4 10 1 0 20 40 60 80 Tj (°C) 100 10−5 10−1 1 10 VR (V) 102 Tj = 0 °C to 85 °C. Fig 2. Reverse current as a function of junction temperature; maximum values Fig 3. Temperature coefficient of diode capacitance as a function of reverse voltage; typical values BB181_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 16 February 2009 3 of 6 NXP Semiconductors BB181 VHF variable capacitance diode 7. Package outline Plastic surface-mounted package; 2 leads SOD523 A c HE vMA D A 0 0.5 scale 1 mm 1 E bp 2 DIMENSIONS (mm are the original dimensions) UNIT mm A 0.65 0.58 bp 0.34 0.26 c 0.17 0.11 D 1.25 1.15 E 0.85 0.75 HE 1.65 1.55 v 0.1 (1) Note 1. The marking bar indicates the cathode. OUTLINE VERSION SOD523 REFERENCES IEC JEDEC JEITA SC-79 EUROPEAN PROJECTION ISSUE DATE 02-12-13 06-03-16 Fig 4. Package outline SOD523 (SC-79) 8. Abbreviations Table 6. Acronym SMD VHF Abbreviations Description Surface Mounted Device Very High Frequency 9. Revision history Table 7. BB181_3 Modifications: BB181_N_2 BB181_1 Revision history Release date 20090216 Data sheet status Product data sheet Change notice Supersedes BB181_N_2 Document ID • The format of this data sheet has been redesigned to comply with the new presentation and information standard of NXP semiconductors Product data sheet Product specification BB181_1 - 20080102 19981126 BB181_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 16 February 2009 4 of 6 NXP Semiconductors BB181 VHF variable capacitance diode 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BB181_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 16 February 2009 5 of 6 NXP Semiconductors BB181 VHF variable capacitance diode 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 4 4 4 5 5 5 5 5 5 6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 February 2009 Document identifier: BB181_3