DISCRETE SEMICONDUCTORS
DATA SHEET
ook, halfpage
M3D088
BF862 N-channel junction FET
Product specification Supersedes data of 1999 Jun 29 2000 Jan 05
Philips Semiconductors
Product specification
N-channel junction FET
FEATURES • High transition frequency for excellent sensitivity in AM car radios • High transfer admittance. APPLICATIONS • Pre-amplifiers in AM car radios.
handbook, halfpage 2
BF862
PINNING SOT23 PIN 1 2 3 source drain gate DESCRIPTION
1
DESCRIPTION Silicon N-channel symmetrical junction field-effect transistor in a SOT23 package. Drain and source are interchangeable.
3
Top view Marking code: 2Ap.
MAM036
g
d s
Fig.1 Simplified outline and symbol.
QUICK REFERENCE DATA SYMBOL VDS VGSoff IDSS Ptot yfs Tj PARAMETER drain-source voltage gate-source cut-off voltage drain-source current total power dissipation transfer admittance junction temperature CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B. Ts ≤ 90 °C CONDITIONS MIN. − −0.3 10 − 35 − TYP. − −0.8 − − 45 − MAX. 20 −1.2 25 300 − 150 UNIT V V mA mW mS °C
2000 Jan 05
2
Philips Semiconductors
Product specification
N-channel junction FET
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDS VDG VGS IDS IG Ptot Tstg Tj Note 1. Main heat transfer is via the gate lead. THERMAL CHARACTERISTICS SYMBOL Rth j-s Note 1. Soldering point of the gate lead. PARAMETER thermal resistance from junction to soldering point CONDITIONS note 1 VALUE 200 PARAMETER drain-source voltage drain-gate voltage gate-source voltage drain-source current forward gate current total power dissipation storage temperature junction temperature Ts ≤ 90 °C; note 1 CONDITIONS MIN. − − − − − − −65 −
BF862
MAX. 20 20 −20 40 10 300 +150 150
UNIT V V V mA mA mW °C °C
UNIT K/W
handbook, halfpage
400
MCD808
Ptot (mW) 300
200
100
0 0 40 80 120 Ts (°C) 160
Fig.2 Power derating curve.
2000 Jan 05
3
Philips Semiconductors
Product specification
N-channel junction FET
STATIC CHARACTERISTICS Tj = 25 °C; unless otherwise specified. SYMBOL V(BR)GSS VGS VGSoff IGSS IDSS PARAMETER gate-source breakdown voltage gate-source forward voltage gate-source cut-off voltage reverse gate current drain-source current CONDITIONS IGS = −1 µA; VDS = 0 VDS = 0; IG = 1 mA VDS = 8 V; ID = 1 µA VGS = −15 V; VDS = 0 VGS = 0; VDS = 8 V − −0.3 − 10 MIN. −20 − − −0.8 − − TYP.
BF862
MAX. − 1 −1.2 −1 25
UNIT V V V nA mA
DYNAMIC CHARACTERISTICS Common source; Tamb = 25 °C; VGS = 0; VDS = 8 V; unless otherwise specified. SYMBOL yfs gos Ciss Crss en fT PARAMETER common source forward transfer admittance common source output conductance input capacitance reverse transfer capacitance equivalent noise input voltage transition frequency CONDITIONS Tj = 25 °C Tj = 25 °C f = 1 MHz f = 1 MHz f = 100 kHz MIN. 35 − − − − − TYP. 45 180 10 1.9 0.8 715 MAX. − 400 − − − − UNIT mS µS pF pF nV/√Hz MHz
2000 Jan 05
4
Philips Semiconductors
Product specification
N-channel junction FET
BF862
handbook, halfpage
40
MCD809
handbook, halfpage
300
MCD810
IDSS (mA) 30
gos (µS) 200
20
100 10
0 0
−0.5
−1
VGSoff (V)
−1.5
0 0 10 20 IDSS (mA) 30
VDS = 8 V; Tj = 25 °C. VDS = 8 V; Tj = 25 °C.
Fig.4 Fig.3 Drain saturation current as a function of gate-source cut-off voltage; typical values.
Common-source output conductance as a function of drain saturation current; typical values.
handbook, halfpage
60
MCD811
handbook, halfpage
60
MCD812
yfs (mS) 50
yfs (mS) 40
40
20 30
20 0 10 20 IDSS (mA) 30
0 0 10 20 ID (mA) 30
VDS = 8 V; Tj = 25 °C.
VDS = 8 V; Tj = 25 °C.
Fig.5
Forward transfer admittance as a function of drain saturation current; typical values.
Fig.6
Forward transfer admittance as a function of drain current; typical values.
2000 Jan 05
5
Philips Semiconductors
Product specification
N-channel junction FET
BF862
handbook, halfpage
30
MCD813
handbook, halfpage
20
MCD814
ID (mA) 20 max
ID (mA)
VGS = 0 V
16 −0.1 V 12 −0.2 V typ 8 −0.3 V −0.4 V −0.5 V
10 min 4
0
−1
−0.8
−0.6
−0.4
−0.2 VGS (V)
0 0 0 4 8 VDS (V) 12
VDS = 8 V; Tj = 25 °C.
VDS = 8 V; Tj = 25 °C.
Fig.7
Drain current as a function of gate-source voltage; typical values.
Fig.8
Drain current as a function of drain-source voltage; typical values.
−104 handbook, halfpage IG (nA) −102 ID = 20 mA
MCD815
10 mA 1 mA 0.1 mA
handbook, halfpage
12
MCD816
C (pF) 8
−1 Cis
−10−2
IGSS
4
Crs
−10−4
0
5
10
15
20 25 VDG (V)
0 −8
−6
−4
−2
VGS (V)
0
VDS = 8 V; f = 1 MHz; Tj = 25 °C. VDS = 8 V; Tj = 25 °C.
Fig.9
Gate current as a function of drain-gate voltage; typical values.
Fig.10 Input and reverse transfer capacitance as functions of gate-source voltage; typical values.
2000 Jan 05
6
Philips Semiconductors
Product specification
N-channel junction FET
BF862
102 handbook, halfpage yis (mS) 10
MCD817
handbook, halfpage
10
MCD818
−103
yrs (mS) bis
yrs
ϕrs (deg)
1
1
ϕrs
−102
10−1 gis 10−2 10−1 1 10 102 103 10−1 10−1 1 10 102 −10 103
f (MHz)
f (MHz)
VDS = 8 V; VGS = 0; Tamb = 25 °C.
VDS = 5 V; VG2 = 4 V. ID = 15 mA; Tamb = 25 °C.
Fig.11 Common-source input admittance as a function of frequency; typical values.
Fig.12 Common-source reverse admittance as a function of frequency; typical values.
102 handbook, halfpage yfs yfs (mS) ϕfs 10
MCD819
−102
102 handbook, halfpage yos (mS) 10 bos
MCD820
ϕfs (deg)
−10
1 gos
1 10−1
1
10
102
f (MHz)
−1 103
10−1 10−1
1
10
102
f (MHz)
103
VDS = 8 V; VGS = 0; Tamb = 25 °C. VDS = 8 V; VGS = 0; Tamb = 25 °C.
Fig.13 Common-source forward transfer admittance as a function of frequency; typical values.
Fig.14 Common-source output admittance as a function of frequency; typical values.
2000 Jan 05
7
Philips Semiconductors
Product specification
N-channel junction FET
PACKAGE OUTLINE Plastic surface mounted package; 3 leads
BF862
SOT23
D
B
E
A
X
HE
vMA
3
Q A A1
1
e1 e bp
2
wMB detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max. 0.1 bp 0.48 0.38 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 0.95 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1
OUTLINE VERSION SOT23
REFERENCES IEC JEDEC TO-236AB EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 99-09-13
2000 Jan 05
8
Philips Semiconductors
Product specification
N-channel junction FET
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
BF862
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
2000 Jan 05
9
Philips Semiconductors
Product specification
N-channel junction FET
NOTES
BF862
2000 Jan 05
10
Philips Semiconductors
Product specification
N-channel junction FET
NOTES
BF862
2000 Jan 05
11
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Internet: http://www.semiconductors.philips.com
SCA 69
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Printed in The Netherlands
125004/03/pp12
Date of release: 2000
Jan 05
Document order number:
9397 750 06562