DISCRETE SEMICONDUCTORS
DATA SHEET
BF904WR
N-channel dual-gate MOS-FET
Product specification
Supersedes data of 1995 Apr 25
2010 Sep 15
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
FEATURES
PINNING
Specially designed for use at 5 V supply voltage
Short channel transistor with high forward transfer
admittance to input capacitance ratio
Low noise gain controlled amplifier up to 1 GHz
Superior cross-modulation performance during AGC.
PIN
SYMBOL
DESCRIPTION
1
s, b
2
d
drain
3
g2
gate 2
4
g1
gate 1
source
APPLICATIONS
VHF and UHF applications with 3 to 7 V supply voltage
such as television tuners and professional
communications equipment.
d
handbook, halfpage
3
4
DESCRIPTION
g2
Enhancement type field-effect transistor in a plastic
microminiature SOT343R package. The transistor
consists of an amplifier MOS-FET with source and
substrate interconnected and an internal bias circuit to
ensure good cross-modulation performance during AGC.
g1
2
1
Top view
Marking code: MC*
CAUTION
The device is supplied in an antistatic package. The
gate-source input must be protected against static
discharge during transport or handling.
s,b
MAM192
* = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
Fig.1 Simplified outline (SOT343R) and symbol.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDS
drain-source voltage
7
V
ID
drain current
30
mA
Ptot
total power dissipation
280
mW
Tj
operating junction temperature
150
C
yfs
forward transfer admittance
22
25
30
mS
Cig1-s
input capacitance at gate 1
2.2
2.6
pF
Crs
reverse transfer capacitance
f = 1 MHz
25
35
fF
F
noise figure
f = 800 MHz
2
dB
2010 Sep 15
2
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage
7
V
ID
drain current
30
mA
IG1
gate 1 current
10
mA
IG2
gate 2 current
10
mA
Ptot
total power dissipation
280
mW
Tstg
storage temperature
65
+150
C
Tj
operating junction temperature
+150
C
up to Tamb = 50 C; see Fig.2;
note 1
Note
1. Device mounted on a printed-circuit board.
MLD150
300
handbook, halfpage
Ptot
(mW)
200
100
0
0
50
100
150
200
Tamb ( oC)
Fig.2 Power derating curve.
2010 Sep 15
3
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
note 1
350
K/W
Rth j-s
thermal resistance from junction to soldering point
Ts = 91 C; note 2
210
K/W
Notes
1. Device mounted on a printed-circuit board.
2. Ts is the temperature at the soldering point of the source lead.
STATIC CHARACTERISTICS
Tj = 25 C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
V(BR)G1-SS
gate 1-source breakdown voltage
V(BR)G2-SS
V(F)S-G1
MIN.
MAX.
UNIT
VG2-S = VDS = 0; IG1-S = 10 mA
6
15
V
gate 2-source breakdown voltage
VG1-S = VDS = 0; IG2-S = 10 mA
6
15
V
forward source-gate 1 voltage
VG2-S = VDS = 0; IS-G1 = 10 mA
0.5
1.5
V
V(F)S-G2
forward source-gate 2 voltage
VG1-S = VDS = 0; IS-G2 = 10 mA
0.5
1.5
V
VG1-S(th)
gate 1-source threshold voltage
VG2-S = 4V; VDS = 5 V; ID = 20 A
0.3
1
V
VG2-S(th)
gate 2-source threshold voltage
VG1-S = VDS = 5 V; ID = 20 A
0.3
1.2
V
IDSX
drain-source current
VG2-S = 4 V; VDS = 5 V; RG1 = 120 k;
note 1
8
13
mA
IG1-SS
gate 1 cut-off current
VG2-S = VDS = 0; VG1-S = 5 V
50
nA
IG2-SS
gate 2 cut-off current
VG1-S = VDS = 0; VG2-S = 5 V
50
nA
Note
1. RG connects gate 1 to VGG = 5 V.
DYNAMIC CHARACTERISTICS
Common source; Tamb = 25 C; VDS = 5 V; VG2-S = 4 V; ID = 10 mA; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
yfs
forward transfer admittance
pulsed; Tj = 25 C
22
TYP.
MAX.
25
30
UNIT
mS
Cig1-s
input capacitance at gate 1
f = 1 MHz
2.2
2.6
pF
Cig2-s
input capacitance at gate 2
f = 1 MHz
1
1.5
2
pF
Cos
drain-source capacitance
f = 1 MHz
1
1.3
1.6
pF
Crs
reverse transfer capacitance f = 1 MHz
F
noise figure
2010 Sep 15
25
35
fF
f = 200 MHz; GS = 2 mS; BS = BSopt
1
1.5
dB
f = 800 MHz; GS = GSopt; BS = BSopt
2
2.8
dB
4
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
MRA769
MLD268
40
0
handbook,
gain halfpage
reduction
(dB)
10
Y fs
(mS)
30
20
20
30
40
10
50
0
50
0
50
100
0
150
o
T j ( C)
1
2
3
4
VAGC (V)
f = 50 MHz.
Tj = 25 C.
Fig.3
Forward transfer admittance as a function
of junction temperature; typical values.
Fig.4
MLD270
MRA771
120
Typical gain reduction as a function of
AGC voltage.
20
handbook, halfpage
Vunw
ID
(dB μV)
(mA)
V G2 S = 4 V
110
15
100
10
3V
2.5 V
2V
1.5 V
5
90
1V
80
0
0
10
20
30
40
50
gain reduction (dB)
0
0.4
0.8
1.2
1.6
2.0
V G1 S (V)
VGG = 5 V; fw = 50 MHz.
funw = 60 MHz; Tamb = 25 C; RG1 = 120 k
Fig.5
VDS = 5 V.
Tj = 25 C.
Unwanted voltage for 1% cross-modulation
as a function of gain reduction; typical
values; see Fig.19.
2010 Sep 15
Fig.6 Transfer characteristics; typical values.
5
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
MLD269
MLD271
20
150
handbook, halfpage
handbook, halfpage
V G1 S = 1.4 V
ID
(mA)
16
V G2 S = 4 V
3.5 V
I G1
(μA)
1.3 V
3V
100
1.2 V
12
1.1 V
8
2.5 V
1.0 V
50
2V
0.9 V
4
0
0
0
2
4
6
8
10
V DS (V)
0
0.5
1.0
1.5
2.0
2.5
V G1 S (V)
VDS = 5 V.
Tj = 25 C.
VG2-S = 4 V.
Tj = 25 C.
Fig.8
Fig.7 Output characteristics; typical values.
Gate 1 current as a function of gate 1
voltage; typical values.
MLD273
MLD272
16
40
handbook, halfpage
handbook, halfpage
y fs
(mS)
ID
(mA)
V G2 S = 4 V
12
30
3.5 V
3V
20
8
2.5 V
4
10
2V
0
0
0
4
8
12
16
0
20
I D (mA)
VDS = 5 V.
Tj = 25 C.
Fig.9
2010 Sep 15
10
20
30
40
50
I G1 (μA)
VDS = 5 V; VG2-S = 4 V.
Tj = 25 C.
Forward transfer admittance as a
function of drain current; typical values.
Fig.10 Drain current as a function of gate 1 current;
typical values.
6
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
MLD275
MLD274
12
20
handbook, halfpage
handbook, halfpage
R G1 = 47 kΩ
ID
(mA)
ID
68 kΩ
82 kΩ
(mA)
15
100 kΩ
8
120 kΩ
150 kΩ
10
180 kΩ
220 kΩ
4
5
0
0
0
1
2
3
4
0
5
2
4
VGG (V)
VDS = 5 V; VG2-S = 4 V.
RG1 = 120 k (connected to VGG); Tj = 25 C.
6
V GG = V DS (V)
VG2-S = 4 V.
RG1 connected to VGG; Tj = 25 C.
Fig.11 Drain current as a function of gate 1
supply voltage (= VGG); typical values;
see Fig.19.
Fig.12 Drain current as a function of gate 1
(= VGG) and drain supply voltage;
typical values; see Fig.19.
MLD276
12
MLB945
40
handbook, halfpage
handbook, halfpage
V GG = 5 V
4.5 V
ID
I G1
(μA)
4V
(mA)
V GG = 5 V
30
3.5 V
8
8
4.5 V
3V
4V
3.5 V
20
3V
4
10
0
0
2
4
V G2 S (V)
0
6
0
VDS = 5 V; Tj = 25 C.
RG = 120 k (connected to VGG).
4
V G2 S (V)
6
VDS = 5 V; Tj = 25 C.
RG = 120 k (connected to VGG).
Fig.13 Drain current as a function of gate 2 voltage;
typical values; see Fig.19.
2010 Sep 15
2
Fig.14 Gate 1 current as a function of gate 2
voltage; typical values; see Fig.19.
7
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
MLD277
10 2
handbook, halfpage
MLD278
10 3
y is
(mS)
10 3
ϕ rs
(deg)
y rs
(μS)
10 2
10
ϕ rs
10 2
y rs
b is
1
10
10
g is
10 1
10
102
f (MHz)
1
1
10 3
10
102
f (MHz)
10 3
VDS = 5 V; VG2 = 4 V.
ID =10 mA; Tamb = 25 C.
VDS = 5 V; VG2 = 4 V.
ID = 10 mA; Tamb = 25 C.
Fig.15 Input admittance as a function of frequency;
typical values.
MLD279
10 2
y fs
MLD280
10 2
10
handbook, halfpage
yos
(mS)
ϕ fs
y fs
(mS)
Fig.16 Reverse transfer admittance and phase as
a function of frequency; typical values.
(deg)
bos
1
ϕ fs
10
10
gos
10
10 2
10
1
1
10
102
f (MHz)
10 3
VDS = 5 V; VG2 = 4 V.
ID = 10 mA; Tamb = 25 C.
102
f (MHz)
10 3
VDS = 5 V; VG2 = 4 V.
ID = 10 mA; Tamb = 25 C.
Fig.17 Forward transfer admittance and phase as
a function of frequency; typical values.
2010 Sep 15
1
Fig.18 Output admittance as a function of
frequency; typical values.
8
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
VAGC
R1
10 k Ω
C1
4.7 nF
C2
R GEN
50 Ω
R2
50 Ω
C3
DUT
4.7 nF
12 pF
L1
≈ 450 nH
RL
50 Ω
C4
R G1
4.7 nF
VI
VGG
V DS
Fig.19 Cross-modulation test set-up.
2010 Sep 15
9
MLD171
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
Table 1
f
(MHz)
BF904WR
Scattering parameters: VDS =5 V; VG2-S = 4 V; ID = 10 mA
s11
MAGNITUDE
(ratio)
40
0.989
s21
ANGLE
(deg)
s12
s22
MAGNITUDE
(ratio)
ANGLE
(deg)
MAGNITUDE
(ratio)
2.420
175.7
0.000
79.9
0.993
1.6
3.4
ANGLE
(deg)
MAGNITUDE
(ratio)
ANGLE
(deg)
100
0.985
8.3
2.414
169.1
0.001
78.3
0.992
3.9
200
0.976
16.4
2.368
158.8
0.003
80.3
0.987
7.8
300
0.958
24.1
2.301
148.5
0.004
73.7
0.980
11.4
400
0.942
32.0
2.251
138.8
0.005
70.7
0.974
15.2
500
0.918
39.3
2.170
129.5
0.005
67.2
0.966
18.7
600
0.899
46.0
2.080
120.7
0.005
67.8
0.958
22.2
700
0.876
52.6
2.001
112.1
0.005
68.6
0.951
25.5
800
0.852
58.8
1.924
103.2
0.005
72.9
0.944
28.9
900
0.823
64.9
1.829
94.7
0.005
78.7
0.937
32.1
1000
0.800
70.9
1.747
86.5
0.005
88.3
0.933
35.2
1200
0.750
82.4
1.621
70.7
0.005
120.5
0.928
41.7
1400
0.719
92.7
1.535
54.6
0.008
139.8
0.930
48.4
1600
0.682
102.5
1.424
39.4
0.010
137.8
0.924
54.9
1800
0.642
109.8
1.349
22.5
0.013
156.8
0.928
62.9
2000
0.602
116.5
1.283
1.1
0.018
175.1
0.928
73.1
2200
0.547
124.9
1.130
15.1
0.014
172.6
0.887
81.0
2400
0.596
128.7
1.018
49.1
0.040
163.9
0.837
95.8
2600
0.682
132.6
0.979
79.4
0.077
164.0
0.778
109.6
2800
0.771
142.5
0.804
116.2
0.120
178.8
0.629
119.5
3000
0.793
157.5
0.541
153.5
0.149
158.3
0.479
119.9
Table 2
Noise data: VDS = 5 V; VG2-S = 4 V; ID = 10 mA
opt
f
(MHz)
Fmin
(dB)
(ratio)
(deg)
800
2.00
.686
49.6
2010 Sep 15
10
rn
50.40
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
PACKAGE OUTLINE
Plastic surface-mounted package; reverse pinning; 4 leads
D
SOT343R
E
B
A
X
HE
y
v M A
e
3
4
Q
A
A1
c
2
w M B
1
bp
Lp
b1
e1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.4
0.3
0.7
0.5
0.25
0.10
2.2
1.8
1.35
1.15
1.3
1.15
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
97-05-21
06-03-16
SOT343R
2010 Sep 15
EUROPEAN
PROJECTION
11
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
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Semiconductors product is suitable and fit for the
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the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
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customer(s). NXP does not accept any liability in this
respect.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
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Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
2010 Sep 15
12
NXP Semiconductors
Product specification
N-channel dual-gate MOS-FET
BF904WR
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
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Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
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the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
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national authorities.
2010 Sep 15
13
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Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for the marking codes
and the package outline drawings which were updated to the latest version.
Contact information
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© NXP B.V. 2010
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Date of release: 2010 Sep 15
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