BFU660F

BFU660F NPN wideband silicon RF transistor Rev. 1 — 11 January 2011 Product data sheet 1. Product profile 1.1 General description NPN silicon microwave transistor for high speed, low noise applications in a plastic, 4-pin dual-emitter SOT343F package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 1.2 Features and benefits Low noise high linearity RF transistor High output third-order intercept point 27 dBm at 1.8 GHz 40 GHz fT silicon technology 1.3 Applications Analog/digital cordless applications X-band high output buffer amplifier ZigBee SDARS second stage LNA LTE, cellular, UMTS NXP Semiconductors BFU660F NPN wideband silicon RF transistor 1.4 Quick reference data Table 1. Symbol VCBO VCEO VEBO IC Ptot hFE CCBS fT IP3O Gp(max) NF Quick reference data Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current total power dissipation DC current gain collector-base capacitance transition frequency output third-order intercept point maximum power gain noise figure Tsp ≤ 90 °C IC = 10 mA; VCE = 2 V; Tj = 25 °C VCB = 2 V; f = 1 MHz IC = 20 mA; VCE = 1 V; f = 2 GHz; Tamb = 25 °C IC = 40 mA; VCE = 4 V; f = 5.8 GHz; Tamb = 25 °C IC = 30 mA; VCE = 1 V; f = 1.8 GHz; Tamb = 25 °C IC = 6 mA; VCE = 2 V; f = 1.8 GHz; ΓS = Γopt; Tamb = 25 °C IC = 60 mA; VCE = 4 V; ZS = ZL = 50 Ω; f = 1.8 GHz; Tamb = 25 °C [2] [1] Conditions open emitter open base open collector Min Typ 90 30 135 138 21 28 24 0.65 Max Unit 16 5.5 2.5 60 225 180 fF GHz dBm dB dB V V V mA mW PL(1dB) output power at 1 dB gain compression - 17 - dBm [1] [2] Tsp is the temperature at the solder point of the emitter lead. Gp(max) is the maximum power gain, if K > 1. If K < 1 then Gp(max) = MSG. 2. Pinning information Table 2. Pin 1 2 3 4 Discrete pinning Description emitter base emitter collector 1, 3 2 1 mbb159 Simplified outline 3 4 Graphic symbol 4 2 3. Ordering information Table 3. Ordering information Package Name BFU660F Description plastic surface-mounted flat pack package; reverse pinning; 4 leads Version SOT343F Type number BFU660F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 2 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor 4. Marking Table 4. BFU660F Marking Marking D3* Description * = p : made in Hong Kong * = t : made in Malaysia * = w : made in China Type number 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC Ptot Tstg Tj [1] Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current total power dissipation storage temperature junction temperature Conditions open emitter open base open collector Tsp ≤ 90 °C [1] Min −65 - Max 16 5.5 2.5 60 225 +150 150 Unit V V V mA mW °C °C Tsp is the temperature at the solder point of the emitter lead. 6. Thermal characteristics Table 6. Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Typ 270 Unit K/W 300 Ptot (mW) 250 001aam822 200 150 100 50 0 0 40 80 120 Tsp (°C) 160 Fig 1. BFU660F Power derating curve All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 3 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified Symbol Parameter Conditions IC = 2.5 μA; IE = 0 mA IC = 1 mA; IB = 0 mA IE = 0 mA; VCB = 8 V IC = 10 mA; VCE = 2 V VCB = 2 V; f = 1 MHz VEB = 0.5 V; f = 1 MHz VCB = 2 V; f = 1 MHz IC = 20 mA; VCE = 1 V; f = 2 GHz; Tamb = 25 °C IC = 30 mA; VCE = 1 V; Tamb = 25 °C f = 1.5 GHz f = 1.8 GHz f = 2.4 GHz f = 5.8 GHz |s21|2 insertion power gain IC = 30 mA; VCE = 1 V; Tamb = 25 °C f = 1.5 GHz f = 1.8 GHz f = 2.4 GHz f = 5.8 GHz NF noise figure IC = 6 mA; VCE = 2 V; ΓS = Γopt; Tamb = 25 °C f = 1.5 GHz f = 1.8 GHz f = 2.4 GHz f = 5.8 GHz Gass associated gain IC = 6 mA; VCE = 2 V; ΓS = Γopt; Tamb = 25 °C f = 1.5 GHz f = 1.8 GHz f = 2.4 GHz f = 5.8 GHz PL(1dB) output power at 1 dB gain compression IC = 60 mA; VCE = 4 V; ZS = ZL = 50 Ω; Tamb = 25 °C f = 1.5 GHz f = 1.8 GHz f = 2.4 GHz f = 5.8 GHz 17 17 16 18.5 dBm dBm dBm dBm 21 20 17.5 12 dB dB dB dB 0.60 0.65 0.70 1.20 dB dB dB dB 20 18.5 16 8.5 dB dB dB dB [1] Min Typ 16 5.5 90 30 135 297 664 138 21 Max Unit 60 100 180 fF fF fF GHz V V mA nA V(BR)CBO collector-base breakdown voltage V(BR)CEO collector-emitter breakdown voltage IC ICBO hFE CCES CEBS CCBS fT Gp(max) collector current collector-base cut-off current DC current gain collector-emitter capacitance emitter-base capacitance collector-base capacitance transition frequency maximum power gain - 25 24 22 12.5 - dB dB dB dB BFU660F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 4 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor Table 7. Characteristics …continued Tj = 25 °C unless otherwise specified Symbol IP3O Parameter output third-order intercept point Conditions IC = 40 mA; VCE = 4 V; ZS = ZL = 50 Ω; Tamb = 25 °C f = 1.5 GHz f = 1.8 GHz f = 2.4 GHz f = 5.8 GHz [1] Gp(max) is the maximum power gain, if K > 1. If K < 1 then Gp(max) = MSG. Min Typ Max Unit - 27 27 27 28 - dBm dBm dBm dBm 60 IC (mA) 40 001aam823 200 hFE 001aam824 (1) (2) (3) (4) (5) (6) 150 100 20 (7) (8) 50 0 0 1 2 3 4 VCE (V) 5 0 0 20 40 IC (mA) 60 Tamb = 25 °C. (1) IB = 400 μA (2) IB = 350 μA (3) IB = 300 μA (4) IB = 250 μA (5) IB = 200 μA (6) IB = 150 μA (7) IB = 100 μA (8) IB = 50 μA VCE = 2 V; Tamb = 25 °C. Fig 2. Collector current as a function of collector-emitter voltage; typical values Fig 3. DC current gain as a function of collector current; typical values BFU660F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 5 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor 200 CCBS (fF) 160 001aam825 25 fT (GHz) 20 001aam826 120 15 80 10 40 5 0 0 4 8 VCB (V) 12 0 0 20 40 60 80 100 IC (mA) f = 1 MHz, Tamb = 25 °C. VCE = 1 V; f = 2 GHz; Tamb = 25 °C. Fig 4. Collector-base capacitance as a function of collector-base voltage; typical values 30 G (dB) 20 MSG Fig 5. Transition frequency as a function of collector current; typical values 001aam827 (1) (2) (3) (4) Gp(max) 10 0 0 20 40 60 80 100 IC (mA) VCE = 1 V; Tamb = 25 °C. (1) f = 1.5 GHz (2) f = 1.8 GHz (3) f = 2.4 GHz (4) f = 5.8 GHz (5) f = 12 GHz Fig 6. Gain as a function of collector current; typical value BFU660F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 6 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor 40 G (dB) 30 001aam828 40 G (dB) 30 MSG 001aam829 20 MSG 20 |S21|2 Gp(max) |S21|2 10 Gp(max) 10 0 0 2 4 6 8 f (GHz) 10 0 0 2 4 6 8 f (GHz) 10 VCE = 1 V; IC = 5 mA; Tamb = 25 °C. VCE = 1 V; IC = 30 mA; Tamb = 25 °C. Fig 7. 3 NFmin (dB) 2 Gain as a function of frequency; typical values 001aam830 Fig 8. 2.0 NFmin (dB) 1.5 Gain as a function of frequency; typical values 001aam831 1.0 (1) 1 (2) (3) (4) 0.5 0 0 5 10 15 20 IC (mA) 25 0 0 2 4 6 f (GHz) 8 VCE = 2 V; Tamb = 25 °C. (1) f = 5.8 GHz (2) f = 2.4 GHz (3) f = 1.8 GHz (4) f = 1.5 GHz VCE = 2 V; IC = 6 mA; Tamb = 25 °C. Fig 9. Minimum noise figure as a function of collector current; typical values Fig 10. Minimum noise figure as a function of frequency; typical values BFU660F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 7 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor 8. Package outline Plastic surface-mounted flat pack package; reverse pinning; 4 leads SOT343F D A E y HE X e 3 4 A c Lp w M 2 1 w M A bp e1 b1 A detail X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.75 0.65 bp 0.4 0.3 b1 0.7 0.5 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 1.15 HE 2.2 2.0 Lp 0.48 0.38 w 0.2 y 0.1 OUTLINE VERSION SOT343F REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-07-12 06-03-16 Fig 11. Package outline SOT343F BFU660F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 8 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor 9. Abbreviations Table 8. Acronym DC LNA LTE NPN RF SDARS UMTS Abbreviations Description Direct Current Low Noise Amplifier Long Term Evolution Negative-Positive-Negative Radio Frequency Satellite Digital Audio Radio Service Universal Mobile Telecommunications System 10. Revision history Table 9. Revision history Release date 20110111 Data sheet status Product data sheet Change notice Supersedes Document ID BFU660F v.1 BFU660F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 9 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor 11. Legal information 11.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. © NXP B.V. 2011. All rights reserved. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BFU660F All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 11 January 2011 10 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BFU660F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 11 January 2011 11 of 12 NXP Semiconductors BFU660F NPN wideband silicon RF transistor 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 January 2011 Document identifier: BFU660F