BGA2717
MMIC wideband amplifier
Rev. 3 — 8 September 2011
Product data sheet
1. Product profile
1.1 General description
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 SMD plastic package.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
Internally matched to 50
Wide frequency range (3.2 GHz at 3 dB bandwidth)
Flat 24 dB gain (1 dB up to 2.8 GHz)
2.5 dBm output power at 1 dB compression point
Good linearity for low current (IP3out = 10 dBm)
Low second harmonic; 38 dBc at PD = 40 dBm
Low noise figure; 2.3 dB at 1 GHz
Unconditionally stable (K 2).
1.3 Applications
LNB IF amplifiers
Cable systems
ISM
General purpose.
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
VS
DC supply voltage
-
IS
supply current
-
s212
insertion power gain
f = 1 GHz
-
NF
noise figure
f = 1 GHz
PL(sat)
saturated load power
f = 1 GHz
Typ
Max
Unit
5
6
V
8
-
mA
24
-
dB
-
2.3
-
dB
-
1
-
dBm
BGA2717
NXP Semiconductors
MMIC wideband amplifier
2. Pinning information
Table 2.
Pinning
Pin
Description
1
VS
2, 5
GND2
3
RF_OUT
4
GND1
6
RF_IN
Simplified outline
6
5
Symbol
4
1
6
1
2
3
4
3
2, 5
sym052
3. Ordering information
Table 3.
Ordering information
Type number
BGA2717
Package
Name
Description
Version
-
plastic surface mounted package; 6 leads
SOT363
4. Marking
Table 4.
Marking
Type number
Marking code
BGA2717
1B-
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
BGA2717
Product data sheet
Symbol
Parameter
Conditions
Min
Max
Unit
VS
DC supply voltage
RF input AC
coupled
-
6
V
IS
supply current
-
15
mA
Ptot
total power dissipation
-
200
mW
Tsp 90 C
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
PD
maximum drive power
-
10
dBm
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-sp)
thermal resistance from junction
to solder point
Ptot = 200 mW;
Tsp 90 C
300
K/W
7. Characteristics
Table 7.
Characteristics
VS = 5 V; IS = 8 mA; Tj = 25 C; measured on demo board; unless otherwise specified.
Symbol
Parameter
IS
supply current
s212
insertion power
gain
Typ
Max
Unit
6
8
10
mA
18
18.6
20
dB
f = 1 GHz
23
23.9
25
dB
f = 1.8 GHz
24
25
27
dB
f = 2.2 GHz
24
25.1
27
dB
f = 2.6 GHz
22
24
26
dB
f = 3 GHz
20
22.1
24
dB
f = 1 GHz
15
19
-
dB
f = 2.2 GHz
8
9.4
-
dB
s222
output return
losses
f = 1 GHz
8
10
-
dB
f = 2.2 GHz
5
6.8
-
dB
s122
isolation
f = 1.6 GHz
54
55
-
dB
f = 2.2 GHz
38
39
-
dB
f = 1 GHz
-
2.3
2.5
dB
NF
noise figure
f = 2.2 GHz
-
2.9
3.1
dB
B
bandwidth
at s212 3 dB below flat
gain at 1 GHz
3
3.2
-
GHz
K
stability factor
f = 1 GHz
-
13
-
f = 2.2 GHz
-
1.7
-
PL(sat)
saturated load
power
f = 1 GHz
0
1.4
-
dBm
f = 2.2 GHz
1
+0.1
-
dBm
load power
at 1 dB gain compression;
f = 1 GHz
4
2.6
-
dBm
at 1 dB gain compression;
f = 2.2 GHz
5
3.1
-
dBm
PL(1dB)
IM2
second order
at PD = 40 dBm;
intermodulation f0 = 1 GHz
product
36
38
-
dBc
IP3in
input, third
order intercept
point
f = 1 GHz
15
13.9
-
dBm
f = 2.2 GHz
20
18.8
-
dBm
output, third
order intercept
point
f = 1 GHz
9
10
-
dBm
f = 2.2 GHz
4
6.3
-
dBm
IP3out
Product data sheet
f = 100 MHz
Min
input return
losses
s112
BGA2717
Conditions
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Rev. 3 — 8 September 2011
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
8. Application information
Figure 1 shows a typical application circuit for the BGA2717 MMIC. The device is
internally matched to 50 , and therefore does not need any external matching. The value
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF
for applications above 100 MHz. However, when the device is operated below 100 MHz,
the capacitor value should be increased.
The 22 nF supply decoupling capacitor C1 should be located as close as possible to the
MMIC.
The printed-circuit board (PCB) top ground plane, connected to pins 2, 4 and 5 must be as
close as possible to the MMIC, and ideally directly beneath it. When using via holes, use
multiple via holes, located as close as possible to the MMIC.
VS
C1
1
VS
C2
RF input
6 RF_IN
RF_OUT 3
GND1
4
C3
RF output
GND2
2, 5
mgu435
Fig 1.
Typical application circuit.
Figure 2 shows the PCB layout, used for the standard demonstration board.
BGA2717
Product data sheet
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
30 mm
PHILIPS
PH
30 mm
IN
OUT
V+
PHILIPS
PH
DUT
C3
C2
IN
OUT
C1
V+
001aab255
Material = FR4; thickness = 0.6 mm, r = 4.6.
Fig 2.
PCB layout and demonstration board showing components.
8.1 Grounding and output impedance
If the grounding is not optimal, the gain becomes less flat and the 50 output matching
becomes worse. If a better output matching to 50 is required, a 12 resistor (R1) can
be placed in series with C3 (see Figure 3). This will significantly improve the output
impedance, at the cost of 1 dB gain and 1 dB output power.
BGA2717
Product data sheet
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
VS
C1
VS
C2
RF input
RF_OUT
RF_IN
GND1
C3
R1
RF output
GND2
001aab346
Fig 3.
Application circuit for better output impedance into 50 .
8.2 Application examples
The MMIC is very suitable as IF amplifier in e.g. LNBs. The excellent wideband
characteristics make it an ideal building block (see Figure 4). As second amplifier after an
LNA, the MMIC offers an easy matching, low noise solution (see Figure 5).
mixer
to IF circuit
or demodulator
from
RF circuit
wideband
amplifier
oscillator
Fig 4.
mgu438
Application as IF amplifier.
mixer
to IF circuit
or demodulator
antenna
LNA
wideband
amplifier
oscillator
Fig 5.
BGA2717
Product data sheet
mgu439
Application as RF amplifier.
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
6 of 15
BGA2717
NXP Semiconductors
MMIC wideband amplifier
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
4 GHz
0.2
180°
0
0.2
0.5
100 MHz
2
5
0°
0
−5
−0.2
−135°
10
−2
−0.5
−45°
−1
1.0
−90°
001aab265
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .
Fig 6.
Input reflection coefficient (s11); typical values.
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
100 MHz
+0.2
0.4
+5
0.2
180°
0
0.2
0.5
1
2
5
10
0°
0
4 GHz
−5
−0.2
−135°
−2
−0.5
−45°
−1
−90°
1.0
001aab266
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .
Fig 7.
BGA2717
Product data sheet
Output reflection coefficient (s22); typical values.
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
001aab267
0
001aab268
30
|s21| 2
(dB)
|s12 | 2
(dB)
(2)
(1)
−20
20
(3)
−40
−60
10
0
0
1000
2000
3000
4000
0
1000
2000
3000
4000
f (MHz)
f (MHz)
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .
PD = 35 dBm; Zo = 50 .
(1) IS = 8.9 mA; VS = 5.5 V.
(2) IS = 8 mA; VS = 5 V.
(3) IS = 7.2 mA; VS = 4.5 V.
Isolation (s122) as a function of frequency;
typical values.
Fig 8.
001aab269
10
PL
(dBm)
Insertion gain (s212) as a function of
frequency; typical values.
Fig 9.
001aab270
10
PL
(dBm)
(1)
(1)
(2)
0
(3)
−10
−10
−20
−20
−30
−50
−40
−30
−20
(2)
0
(3)
−10
PD (dBm)
f = 1 GHz; Zo = 50 .
−30
−50
−40
(1) VS = 5.5 V.
(2) VS = 5 V.
(2) VS = 5 V.
(3) VS = 4.5 V.
(3) VS = 4.5 V.
Fig 10. Load power as a function of drive power at
1 GHz; typical values.
Product data sheet
−20
−10
PD (dBm)
f = 2.2 GHz; Zo = 50 .
(1) VS = 5.5 V.
BGA2717
−30
Fig 11. Load power as a function of drive power at
2.2 GHz; typical values.
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
001aab271
4
001aab272
25
K
NF
(dB)
20
3
(3)
15
(2)
(1)
2
10
1
5
0
0
0
500
1000
1500
2000
2500
f (MHz)
Zo = 50 .
0
1000
2000
3000
4000
f (MHz)
IS = 8 mA; VS = 5 V; Zo = 50 .
(1) IS = 8.9 mA; VS = 5.5 V.
(2) IS = 8 mA; VS = 5 V.
(3) IS = 7.2 mA; VS = 4.5 V.
Fig 12. Noise figure as a function of frequency; typical
values.
BGA2717
Product data sheet
Fig 13. Stability factor as a function of frequency;
typical values.
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
Table 8.
Scattering parameters
VS = 5 V; IS = 8 mA; PD = 35 dBm; Zo = 50 ; Tamb = 25 C.
f (MHz)
s11
s21
s12
s22
K-factor
Magnitude Angle
(ratio)
(deg)
Magnitude Angle
(ratio)
(deg)
Magnitude Angle
(ratio)
(deg)
Magnitude Angle
(ratio)
(deg)
100
0.074378
13.78537
8.465495
22.90763
0.003859
66.39435
0.450496
79.88713
12.2
200
0.076338
13.70153
9.420359
7.358555
0.003112
122.2687
0.354179
40.70919
14.9
400
0.123748
1.402521
11.56481
14.92222
0.002011
40.5142
0.312568
0.3804
19.1
600
0.145511
31.32646
13.31271
37.77988
0.001659
156.393
0.3038
25.36808
20.2
800
0.134956
67.10955
14.56872
61.08808
0.00169
164.4454
0.30873
46.7704
18.1
1000
0.114063
111.2495
15.61733
84.67015
0.002146
174.8593
0.319208
68.71787
13.2
1200
0.101959
168.8557
16.45625
107.9167
0.002901
139.8136
0.335623
91.58398
9.2
1400
0.125656
129.9717
17.05668
131.63
0.004053
123.527
0.353582
116.5485
6.2
1600
0.16736
85.791
17.49643
155.2301
0.005545
107.0763
0.366893
140.7537
4.3
1800
0.234721
51.43065
17.90167
179.6656
0.007498
105.9423
0.404064
167.9683
2.9
2000
0.285944
16.46701
17.86635
155.5993
0.009779
90.10168
0.42512
163.3173
2.2
2200
0.339673
11.74152
17.96498
130.5601
0.011736
75.19814
0.459194
135.039
1.7
2400
0.393746
47.58817
17.32414
103.3297
0.013927
53.10814
0.459988
103.1106
1.5
2600
0.384353
81.55786
15.87927
77.84766
0.015937
21.70136
0.428158
75.83004
1.5
2800
0.376183
112.353
14.44081
52.77053
0.016795
4.656224
0.393701
50.16202
1.7
3000
0.358586
142.5801
12.67831
30.51455
0.01786
19.19006
0.3497
26.66791
1.9
3200
0.345562
171.7261
11.27597
10.04765
0.019217
32.22469
0.30875
6.504047
2.0
3400
0.33312
160.2254
10.43483
9.842264
0.020551
49.16136
0.279672
12.63121
2.1
3600
0.331268
133.8644
9.743293
30.36495
0.020908
59.65434
0.248479
33.64811
2.2
3800
0.337502
108.48
9.072149
50.7401
0.022136
78.78085
0.21362
56.42401
2.3
4000
0.344645
84.75183
8.513716
71.86536
0.022792
94.87525
0.168643
80.24833
2.4
BGA2717
Product data sheet
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Rev. 3 — 8 September 2011
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10 of 15
BGA2717
NXP Semiconductors
MMIC wideband amplifier
9. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
c
bp
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT363
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Fig 14. Package outline; SOT363 (SC-88).
BGA2717
Product data sheet
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Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
10. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGA2717 v.3
20110908
Product data sheet
-
BGA2717 v.2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Package outline drawings have been updated to the latest version.
BGA2717 v.2
(9397 750 13293)
20040924
Product data sheet
-
BGA2717_N v.1
BGA2717_N v.1
(9397 750 12828)
20040202
Preliminary data sheet
-
-
BGA2717
Product data sheet
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Rev. 3 — 8 September 2011
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BGA2717
NXP Semiconductors
MMIC wideband amplifier
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BGA2717
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
13 of 15
BGA2717
NXP Semiconductors
MMIC wideband amplifier
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BGA2717
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
14 of 15
BGA2717
NXP Semiconductors
MMIC wideband amplifier
13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Grounding and output impedance . . . . . . . . . . 5
Application examples . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 September 2011
Document identifier: BGA2717
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