BGA2869,115

BGA2869 MMIC wideband amplifier Rev. 3 — 10 July 2015 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package. 1.2 Features and benefits          Internally matched to 50  A gain of 31.7 dB at 950 MHz Output power at 1 dB gain compression = 10 dBm at 950 MHz Supply current = 24.0 mA at a supply voltage of 5.0 V Reverse isolation > 39 dB up to 2150 MHz Good linearity with low second order and third order products Noise figure = 3.1 dB at 950 MHz Unconditionally stable (K > 1) No output inductor required 1.3 Applications  LNB IF amplifiers  General purpose low noise wideband amplifier for frequencies between DC and 2.2 GHz 2. Pinning information Table 1. Pinning Pin Description 1 VCC 2, 5 GND2 3 RF_OUT 4 GND1 6 RF_IN Simplified outline 6 5 Graphic symbol 1 4 6 1 2 3 3 4 2, 5 sym052 BGA2869 NXP Semiconductors MMIC wideband amplifier 3. Ordering information Table 2. Ordering information Type number BGA2869 Package Name Description Version - plastic surface-mounted package; 6 leads SOT363 4. Marking Table 3. Marking Type number Marking code Description BGA2869 MD* * = - : made in Hong Kong * = p : made in Hong Kong * = W : made in China * = t : made in Malaysia 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage RF input AC coupled 0.5 +7.0 V ICC supply current - 36 mA Ptot total power dissipation Tsp = 90 C - 200 mW Tstg storage temperature 40 +125 C Tj junction temperature - 125 C Pdrive drive power - +10 dBm 6. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to Ptot = 200 mW; Tsp = 90 C solder point Conditions Typ Unit 300 K/W 7. Characteristics Table 6. Characteristics VCC = 5.0 V; ZS = ZL = 50 ; Pi = 34 dBm; Tamb = 25 C; measured on demo board; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage 4.5 5.0 5.5 V ICC supply current 21.8 24.0 26.0 mA BGA2869 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier Table 6. Characteristics …continued VCC = 5.0 V; ZS = ZL = 50 ; Pi = 34 dBm; Tamb = 25 C; measured on demo board; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Gp f = 250 MHz 30.5 31.1 31.7 dB f = 950 MHz 31.0 31.7 32.4 dB f = 2150 MHz 30.7 32.2 33.6 dB f = 250 MHz 12 14 16 dB f = 950 MHz 16 18 20 dB f = 2150 MHz 7 13 20 dB f = 250 MHz 10 15 19 dB f = 950 MHz 20 21 22 dB f = 2150 MHz 8 10 13 dB f = 250 MHz 41 61 81 dB f = 950 MHz 46 47 49 dB f = 2150 MHz 37 39 42 dB f = 250 MHz 2.6 3.1 3.6 dB f = 950 MHz 2.6 3.1 3.5 dB RLin RLout ISL NF power gain input return loss output return loss isolation noise figure f = 2150 MHz 2.8 3.2 3.6 dB B3dB 3 dB bandwidth 3 dB below gain at 1 GHz 2.8 3.0 3.2 GHz K Rollett stability factor f = 250 MHz 9 14 19 f = 950 MHz 2 3 4 PL(sat) PL(1dB) IP3I IP3O PL(2H) IM2 f = 2150 MHz 1 1 2 f = 250 MHz 12 12 13 dBm f = 950 MHz 10 12 13 dBm f = 2150 MHz 9 10 11 dBm output power at 1 dB gain compression f = 250 MHz 9 10 11 dBm f = 950 MHz 9 10 11 dBm f = 2150 MHz 8 9 10 dBm f1 = 250 MHz; f2 = 251 MHz 11 9 6 dBm f1 = 950 MHz; f2 = 951 MHz 11 9 7 dBm f1 = 2150 MHz; f2 = 2151 MHz 16 13 10 dBm f1 = 250 MHz; f2 = 251 MHz 20 23 25 dBm f1 = 950 MHz; f2 = 951 MHz 20 23 25 dBm f1 = 2150 MHz; f2 = 2151 MHz 16 19 22 dBm f1H = 250 MHz; f2H = 500 MHz 69 67 65 dBm f1H = 950 MHz; f2H = 1900 MHz 53 51 49 dBm f1 = 250 MHz; f2 = 251 MHz 40 42 44 dBc f1 = 950 MHz; f2 = 951 MHz 34 36 38 dBc saturated output power Pdrive = 41 dBm (for each tone) input third-order intercept point output third-order intercept point Pdrive = 38 dBm second harmonic output power second-order intermodulation distance BGA2869 Product data sheet Pdrive = 41 dBm (for each tone) Pdrive = 38 dBm (for each tone) All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier 8. Application information Figure 1 shows a typical application circuit for the BGA2869 MMIC. The device is internally matched to 50 , and therefore does not need any external matching. The value of the input and output DC blocking capacitors C1 and C2 should not be more than 470 pF for applications above 100 MHz. However, when the device is operated below 100 MHz, the capacitor value should be increased. The location of the 470 pF supply decoupling capacitor (Cdec) can be precisely chosen for optimum performance. The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes as close as possible to the MMIC. 96 &GHF & 5)LQSXW 96 5)B287 & 5)B,1 *1' 5)RXWSXW *1' DDD Fig 1. Typical application circuit 8.1 Application examples wideband amplifier mixer from RF circuit LNA to IF circuit or demodulator oscillator mixer to IF circuit or demodulator antenna oscillator 001aaf762 001aaf763 The MMIC is very suitable as IF amplifier in e.g. LNB’s. The excellent wideband characteristics make it an easy building block. Fig 2. wideband amplifier Application as IF amplifier As second amplifier after an LNA, the MMIC offers an easy matching, low noise solution. Fig 3. Application as RF amplifier 8.2 Tables Table 7. Supply current over temperature and supply voltages Typical values. Symbol ICC BGA2869 Product data sheet Parameter Conditions supply current Tamb (C) Unit 40 +25 +85 VCC = 4.5 V 23.60 21.80 20.30 mA VCC = 5.0 V 25.80 24.00 22.40 mA VCC = 5.5 V 27.80 26.00 24.50 mA All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier Table 8. Second harmonic output power over temperature and supply voltages Typical values. Symbol Parameter Conditions Tamb (C) Unit 40 +25 +85 PL(2H) second harmonic output power f = 250 MHz; Pdrive = 38 dBm VCC = 4.5 V 58 67 68 dBm VCC = 5.0 V 72 67 61 dBm VCC = 5.5 V 64 60 58 dBm f = 950 MHz; Pdrive = 38 dBm VCC = 4.5 V 69 55 50 dBm VCC = 5.0 V 55 51 48 dBm VCC = 5.5 V 51 49 46 dBm Table 9. Input power at 1 dB gain compression over temperature and supply voltages Typical values. Symbol Parameter Pi(1dB) Conditions input power at 1 dB gain compression Tamb (C) Unit 40 +25 +85 VCC = 4.5 V 21 21 21 dBm VCC = 5.0 V 20 20 20 dBm VCC = 5.5 V 19 20 20 dBm VCC = 4.5 V 21 21 21 dBm VCC = 5.0 V 21 21 21 dBm VCC = 5.5 V 20 20 20 dBm VCC = 4.5 V 22 22 23 dBm VCC = 5.0 V 21 22 23 dBm VCC = 5.5 V 21 22 24 dBm f = 250 MHz f = 950 MHz f = 2150 MHz BGA2869 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier Table 10. Output power at 1 dB gain compression over temperature and supply voltages Typical values. Symbol Parameter Conditions PL(1dB) output power at 1 dB gain compression f = 250 MHz Tamb (C) Unit 40 +25 +85 VCC = 4.5 V 9 9 8 dBm VCC = 5.0 V 11 10 10 dBm VCC = 5.5 V 12 11 11 dBm VCC = 4.5 V 9 8 8 dBm VCC = 5.0 V 10 10 9 dBm VCC = 5.5 V 11 11 10 dBm VCC = 4.5 V 9 8 6 dBm VCC = 5.0 V 10 9 7 dBm VCC = 5.5 V 11 9 7 dBm f = 950 MHz f = 2150 MHz Table 11. Saturated output power over temperature and supply voltages Typical values. Symbol Parameter Conditions PL(sat) saturated output power f = 250 MHz Tamb (C) Unit 40 +25 +85 VCC = 4.5 V 11 11 10 dBm VCC = 5.0 V 13 12 12 dBm VCC = 5.5 V 14 13 13 dBm VCC = 4.5 V 11 11 11 dBm VCC = 5.0 V 12 12 12 dBm VCC = 5.5 V 14 13 13 dBm VCC = 4.5 V 10 9 8 dBm VCC = 5.0 V 11 10 8 dBm VCC = 5.5 V 12 10 9 dBm f = 950 MHz f = 2150 MHz BGA2869 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier Table 12. Second-order intermodulation distance over temperature and supply voltages Typical values. Symbol Parameter Conditions Tamb (C) IM2 second-order intermodulation distance f1 = 250 MHz; f2 = 251 MHz; Pdrive = 38 dBm Unit 40 +25 +85 VCC = 4.5 V 36 39 42 dBc VCC = 5.0 V 40 42 45 dBc VCC = 5.5 V 43 45 48 dBc VCC = 4.5 V 33 34 36 dBc VCC = 5.0 V 35 36 37 dBc VCC = 5.5 V 37 37 37 dBc f1 = 950 MHz; f2 = 951 MHz; Pdrive = 38 dBm Table 13. Output third-order intercept point over temperature and supply voltages Typical values. Symbol Parameter Conditions IP3O output third-order intercept point f1 = 250 MHz; f2 = 251 MHz; Pdrive = 41 dBm Tamb (C) 40 +25 Unit +85 VCC = 4.5 V 21 21 20 dBm VCC = 5.0 V 23 23 22 dBm VCC = 5.5 V 25 25 24 dBm VCC = 4.5 V 21 21 20 dBm VCC = 5.0 V 23 23 22 dBm VCC = 5.5 V 25 24 23 dBm f1 = 950 MHz; f2 = 951 MHz; Pdrive = 41 dBm f1 = 2150 MHz; f2 = 2151 MHz; Pdrive = 41 dBm VCC = 4.5 V 21 19 17 dBm VCC = 5.0 V 22 19 17 dBm VCC = 5.5 V 22 20 17 dBm Table 14. 3 dB bandwidth over temperature and supply voltages Typical values. Symbol B3dB BGA2869 Product data sheet Parameter Conditions 3 dB bandwidth Tamb (C) Unit 40 +25 +85 VCC = 4.5 V 3.15 2.98 2.80 GHz VCC = 5.0 V 3.14 2.96 2.79 GHz VCC = 5.5 V 3.12 2.95 2.77 GHz All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier 9. Test information 3 3 3 3 3 3 3 3 3 5)287 6(0,&21'8&7256 %*$[[[627(9% & *1' 9&& 3 3 3 3 3 3 3 3 3 3 3  *1' 5),1 & DDD For decoupling a decoupling capacitor (Cdec) is used on one of the positions of P5 to P24. The results mentioned in this data sheet have been obtained using the decoupling capacitor Cdec on position P22. The distance between the center of pin 1 and the center of position P22 is 7.43 mm. Fig 4. Table 15. PCB layout and demo board with components List of components used for the typical application Component Description Value C1, C2 470 pF 0603 multilayer ceramic chip capacitor Dimensions Remarks 470 pF 0603 P5 to P24 [1] position for multilayer ceramic chip capacitor Cdec IC1 [1] BGA2869 Product data sheet BGA2869 MMIC - X7R RF coupling capacitor X7R RF decoupling capacitor SOT363 For decoupling a decoupling capacitor (Cdec) is used on one of the positions of P5 to P24. The results mentioned in this data sheet have been obtained using the decoupling capacitor Cdec on position P22. All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier 10. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC SOT363 Fig 5. JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Package outline SOT363 BGA2869 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier 11. Abbreviations Table 16. Abbreviations Acronym Description IF Intermediate Frequency LNA Low-Noise Amplifier LNB Low-Noise Block converter PCB Printed-Circuit Board SMD Surface Mounted Device 12. Revision history Table 17. Revision history Document ID Release date Data sheet status Change notice Supersedes BGA2869 v.3 20150710 Product data sheet - BGA2869 v.2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. BGA2869 v.2 20130826 Product data sheet - BGA2869 v.1 BGA2869 v.1 20120717 Product data sheet - - BGA2869 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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This document supersedes and replaces all information supplied prior to the publication hereof. BGA2869 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGA2869 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 10 July 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 13 BGA2869 NXP Semiconductors MMIC wideband amplifier 15. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 8.1 8.2 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Application information. . . . . . . . . . . . . . . . . . . 4 Application examples . . . . . . . . . . . . . . . . . . . . 4 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 July 2015 Document identifier: BGA2869