BGA3022Y

+6 2  BGA3022 1.2 GHz 18 dB gain CATV amplifier Rev. 2 — 25 February 2015 Product data sheet 1. Product profile 1.1 General description The BGA3022 MMIC is a dual wideband amplifier with internal biasing. It is a Medium Power Amplifier (MPA), specifically designed as an output stage for high linearity CATV optical mini- and midi-nodes, operating over a frequency range of 40 MHz to 1200 MHz. The MPA is housed in a lead free 8-pin HSO8 package. 1.2 Features and benefits  Internally biased  Frequency range of 40 MHz to 1200 MHz  High linearity with an IP3O of 47 dBm and an IP2O of 85 dBm  Operating from 5 V to 8 V supply  High gain output 1dB compression point of 30 dBm  75  input and output impedance  ICC(tot) can be controlled between 175 mA and 350 mA  Integrated feedback 1.3 Applications  CATV infrastructure network medium power output stage in optical nodes (FTTx), distribution amplifiers, trunk amplifiers and line extenders 1.4 Quick reference data Table 1. Quick reference data Tamb = 25 C; typical values at VCC = 8 V; ZS = ZL = 75 ; input and output connected with 1:1 balun, VI(CTRL) = 3.3 V or open (maximum total supply current); 40 MHz  f1  1200 MHz unless otherwise specified. Symbol Parameter Conditions Min VCC supply voltage RF input AC coupled 7.6 8.0 8.4 V ICC(tot) total supply current 175 350 - mA Tamb ambient temperature 40 - +85 C PL(1dB) output power at 1 dB gain compression IP3O output third-order intercept point [1] IP2O output second-order intercept point [2] Typ Max Unit - 30 - dBm - 47 - dBm - 85 - dBm [1] Fundamental frequency f1 = 500 MHz, fundamental frequency f2 = 501 MHz. The intermodulation product (IM3) is measured at 2  f1  f2 = 499 MHz. The output power of the fundamental frequencies is 10 dBm per frequency. [2] Fundamental frequency f1 = 240 MHz, fundamental frequency f2 = 260 MHz. The intermodulation product (IM2) is measured at f1 + f2 = 500 MHz. The output power of the fundamental frequencies is 10 dBm per frequency. BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 2. Pinning information 2.1 Pinning $03$B,1  703B6(16  &75/   $03$B287 %*$ $03%B,1   9&&  9&&  $03%B287 DDD Fig 1. Pin configuration for SOT786-2 2.2 Pin description Table 2. Pin description Symbol Pin Description AMPA_IN 1 input amplifier A TMP_SENS 2 temperature sense CTRL 3 total supply current control AMPB_IN 4 input amplifier B AMPB_OUT 5 output amplifier B [1] VCC 6 supply [1] VCC 7 supply [1] AMPA_OUT 8 GND output amplifier A [1] exposed die pad [2] ground [1] See Figure 2 for correct connection. [2] The center metal base of the HSO8 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Ordering information Type number BGA3022 BGA3022 Product data sheet Package Name Description Version HSO8 plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad SOT786-2 All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage RF input AC coupled 0.6 +12 V VI(CTRL) input voltage on pin CTRL 0.6 +8 V VI(TMP_SENS) input voltage on pin TMP_SENS 0.6 +8 V - 20 dBm [1] Pi input power Tstg storage temperature 65 +150 C Tj junction temperature - 150 C Tamb ambient temperature 40 +85 C VESD electrostatic discharge voltage Human Body Model (HBM); According JEDEC standard 22-A114E 2 - kV Charged Device Model (CDM); According JEDEC standard 22-C101B 500 - V Typ Unit 15 K/W [1] single tone; on balun Pi = 17 dBm on AMPA_IN (pin 1) and AMPB_IN (pin 4). 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-c) BGA3022 Product data sheet Conditions thermal resistance from junction to case [1][2] [1] Case is ground solder pad. [2] Thermal resistance measured using infrared measurement technique, device mounted on application board and placed in still air. All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 6. Characteristics Table 6. Characteristics at VCC = 8 V; ICC = 350 mA Tamb = 25 C; typical values at VCC = 8 V; ZS = ZL = 75 ; input and output connected with 1:1 balun, VI(CTRL) = 3.3 V or open (maximum total supply current); 40 MHz  f1  1200 MHz unless otherwise specified. Symbol Parameter VCC supply voltage ICC(tot) total supply current s212 insertion power gain Product data sheet Min Typ Max Unit RF input AC coupled 7.6 8.0 8.4 V - 350 - mA - 18 - dB - 1.9 - dB - 0.25 - dB - 30 - dBm f = 40 MHz SLsl slope straight line FL flatness of frequency response PL(1dB) output power at 1 dB gain compression IP3O output third-order intercept point [2] - 47 - dBm IP2O output second-order intercept point [3] - 85 - dBm CTB composite triple beat VO = 43 dBmV [4] - 65 - dBc CSO composite second-order distortion VO = 43 dBmV [4] - 75 - dBc NF noise figure f = 500 MHz - 5.1 - dB RLin input return loss RLout BGA3022 Conditions output return loss [1] f = 40 MHz to 80 MHz - 18 - dB f = 80 MHz to 160 MHz - 19 - dB f = 160 MHz to 320 MHz - 19 - dB f = 320 MHz to 640 MHz - 19 - dB f = 640 MHz to 1000 MHz - 19 - dB f = 1000 MHz to 1200 MHz - 15 - dB f = 40 MHz to 80 MHz - 18 - dB f = 80 MHz to 160 MHz - 20 - dB f = 160 MHz to 320 MHz - 18 - dB f = 320 MHz to 640 MHz - 17 - dB f = 640 MHz to 1000 MHz - 17 - dB f = 1000 MHz to 1200 MHz - 15 - dB [1] Flatness is defined as peak deviation to straight line. [2] Fundamental frequency f1 = 500 MHz, fundamental frequency f2 = 501 MHz. The intermodulation product (IM3) is measured at 2  f1  f2 = 499 MHz. The output power of the fundamental frequencies is 10 dBm per frequency. [3] Fundamental frequency f1 = 240 MHz, fundamental frequency f2 = 260 MHz. The intermodulation product (IM2) is measured at f1 + f2 = 500 MHz. The output power of the fundamental frequencies is 10 dBm per frequency. [4] Measured with 79 NTSC channels. All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier Table 7. Characteristics at VCC = 8 V; ICC = 175 mA Tamb = 25 C; typical values at VCC = 8 V; ZS = ZL = 75 ; input and output connected with 1:1 balun, VI(CTRL) = 0 V (minimum total supply current); 40 MHz  f1  1200 MHz unless otherwise specified. Symbol Parameter Product data sheet Min Typ Max Unit RF input AC coupled 7.6 8.0 8.4 V - 175 - mA - 18 - dB - 2.2 - dB - 0.35 - dB - 24 - dBm VCC supply voltage ICC(tot) total supply current s212 insertion power gain SLsl slope straight line FL flatness of frequency response PL(1dB) output power at 1 dB gain compression IP3O output third-order intercept point [2] - 38 - dBm IP2O output second-order intercept point [3] - 69 - dBm CTB composite triple beat VO = 35 dBmV [4] - 66 - dBc [4] - 75 - dBc f = 40 MHz [1] CSO composite second-order distortion VO = 35 dBmV NF noise figure f = 500 MHz - 3.8 - dB RLin input return loss f = 40 MHz to 80 MHz - 20 - dB f = 80 MHz to 160 MHz - 20 - dB f = 160 MHz to 320 MHz - 19 - dB f = 320 MHz to 640 MHz - 19 - dB f = 640 MHz to 1000 MHz - 18 - dB f = 1000 MHz to 1200 MHz - 14 - dB RLout BGA3022 Conditions output return loss f = 40 MHz to 80 MHz - 23 - dB f = 80 MHz to 160 MHz - 21 - dB f = 160 MHz to 320 MHz - 18 - dB f = 320 MHz to 640 MHz - 17 - dB f = 640 MHz to 1000 MHz - 15 - dB f = 1000 MHz to 1200 MHz - 12 - dB [1] Flatness is defined as peak deviation to straight line. [2] Fundamental frequency f1 = 500 MHz, fundamental frequency f2 = 501 MHz. The intermodulation product (IM3) is measured at 2  f1  f2 = 499 MHz. The output power of the fundamental frequencies is 10 dBm per frequency. [3] Fundamental frequency f1 = 240 MHz, fundamental frequency f2 = 260 MHz. The intermodulation product (IM2) is measured at f1 + f2 = 500 MHz. The output power of the fundamental frequencies is 10 dBm per frequency. [4] Measured with 79 NTSC channels. All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier Table 8. Characteristics at VCC = 5 V; ICC = 165 mA Tamb = 25 C; typical values at VCC = 5 V; ZS = ZL = 75 ; input and output connected with 1:1 balun, VI(CTRL) = 0 V (minimum total supply current); 40 MHz  f1  1200 MHz unless otherwise specified. Symbol Parameter VCC supply voltage ICC(tot) total supply current s212 insertion power gain SLsl slope straight line FL flatness of frequency response PL(1dB) output power at 1 dB gain compression IP3O output third-order intercept point IP2O output second-order intercept point CTB composite triple beat Product data sheet Min Typ Max Unit RF input AC coupled 4.75 5.00 5.25 V - - f = 40 MHz 165 mA - 18 - dB - 2.2 - dB - 0.35 - dB - 24 - dBm [2] - 38 - dBm [3] - 71 - dBm VO = 35 dBmV [4] - 66 - dBc [4] - 75 - dBc [1] CSO composite second-order distortion VO = 35 dBmV NF noise figure f = 500 MHz - 3.8 - dB RLin input return loss f = 40 MHz to 80 MHz - 20 - dB f = 80 MHz to 160 MHz - 20 - dB f = 160 MHz to 320 MHz - 19 - dB f = 320 MHz to 640 MHz - 19 - dB f = 640 MHz to 1000 MHz - 18 - dB f = 1000 MHz to 1200 MHz - 14 - dB RLout BGA3022 Conditions output return loss f = 40 MHz to 80 MHz - 23 - dB f = 80 MHz to 160 MHz - 21 - dB f = 160 MHz to 320 MHz - 18 - dB f = 320 MHz to 640 MHz - 17 - dB f = 640 MHz to 1000 MHz - 17 - dB f = 1000 MHz to 1200 MHz - 13 - dB [1] Flatness is defined as peak deviation to straight line. [2] Fundamental frequency f1 = 500 MHz, fundamental frequency f2 = 501 MHz. The intermodulation product (IM3) is measured at 2  f1  f2 = 499 MHz. The output power of the fundamental frequencies is 10 dBm per frequency. [3] Fundamental frequency f1 = 240 MHz, fundamental frequency f2 = 260 MHz. The intermodulation product (IM2) is measured at f1 + f2 = 500 MHz. The output power of the fundamental frequencies is 10 dBm per frequency. [4] Measured with 79 NTSC channels. All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 7. Application information The BGA3022 can be used in other applications. Please contact your local sales representative for more information. Application notes are available on the NXP website. *1' WHPS *1' 9FF VHQVH ,'& &75/ 7.1 Application board - & & & & & 5 8     / / &  - & 7 & & 5),1  7 /  & & & 5 & -   & 5)287 DDD See Table 9 for list of components. Fig 2. BGA3022 Product data sheet Circuit MPA only evaluation board All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier - & & & & 5 7 - & & & & / 8 & 7 / - 5 & & / & & & DDD See Table 9 for list of components. Fig 3. Printed-Circuit Board (PCB) layout MPA only evaluation board Table 9. List of components See Figure 2 for schematics and Figure 3 for Printed-Circuit Board (PCB). BGA3022 Product data sheet Component Description Value Remarks C1, C3, C4, C5, C9, C11, C12, C13 capacitor 10 nF Murata GRM155R71E103KA01D C2 capacitor 0.47 pF Phycomp 2238 869 14477 C10 capacitor 100 nF Murata GRM155R61A104KA01D C6, C7, C14, C15 capacitor 1 pF Murata GRM1555C1H1R0CA01D J1, J2 F-connector 75  Bomar 861V509ER6 J3 header 6-pin - Molex 22-29-2061 L1 SMD inductor 1.0 nH Murata LQG15HS1N0S02D L2, L3 choke - Murata BLM15HD182SN1D R3 chip resistor 15  Yageo RC0402FR-0715RL R4 chip resistor 0 Murata RC0402JR-070RL T1 balun transformer - MACOM MABA-007159-000000 T2 balun transformer - MACOM MABA-010245-CT1160 U1 BGA3022 - NXP All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 627        ‘           ‘    VROGHUPDVNWRSKROH VROGHUSDVWH WRSPHWDO YLDKROH 'LPHQVLRQVLQPP Fig 4. DDD Recommended Printed-Circuit Board (PCB) footprint BGA3022 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 8. Package outline +62SODVWLFWKHUPDOHQKDQFHGVPDOORXWOLQHSDFNDJH OHDGVERG\ZLGWKPPH[SRVHGGLHSDG 627 ' $ ( ; F \ H[SRVHGGLHSDG Y +( $ = 'K   (K $ $ $ $ ș /S SLQLQGH[  /  H GHWDLO; Z ES   PP VFDOH 'LPHQVLRQVPPDUHWKHRULJLQDOGLPHQVLRQV 8QLW PP PD[ QRP PLQ $ $ $    $ ES F ' 'K ( (K        +(       /     H /S Z \    Y    5HIHUHQFHV ,(& -('(& -(,7$  ƒ  ƒ VRWBSR (XURSHDQ SURMHFWLRQ ,VVXHGDWH   627 Fig 5. ș  1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 2XWOLQH YHUVLRQ = Package outline SOT786-2 (HSO8) BGA3022 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 9. Abbreviations Table 10. Abbreviations Acronym Description CATV Community Antenna TeleVision FTTx Fiber To The “x” MMIC Monolithic Microwave Integrated Circuit MPA Medium Power Amplifier SMD Surface Mounted Device 10. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes BGA3022 v.2 20150225 Product data sheet - BGA3022 v.1 BGA3022 v.1 20141128 Preliminary data sheet - - BGA3022 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BGA3022 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGA3022 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 25 February 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 14 BGA3022 NXP Semiconductors 1.2 GHz 18 dB gain CATV amplifier 13. Contents 1 1.1 1.2 1.3 1.4 2 2.1 2.2 3 4 5 6 7 7.1 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 7 Application board . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 February 2015 Document identifier: BGA3022