BGA7027

BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Rev. 1 — 11 August 2010 Preliminary data sheet 1. Product profile 1.1 General description The BGA7027 MMIC is a one-stage amplifier, offered in a low-cost surface-mount package. It delivers 28 dBm output power at 1 dB gain compression and a superior performance up to 2700 MHz. 1.2 Features and benefits 400 MHz to 2700 MHz frequency operating range 11 dB small signal gain at 2 GHz 28 dBm output power at 1 dB gain compression Integrated active biasing External matching allows broad application optimization of the electrical performance 5 V single supply operation ESD protection at all pins 1.3 Applications Broadband CPE/MoCA WLAN/ISM/RFID Wireless infrastructure (base station, repeater, backhaul systems) Industrial applications E-metering Satellite Master Antenna TV (SMATV) 1.4 Quick reference data Table 1. Quick reference data Input and output impedances matched to 50 Ω. Typical values at: ICC = 170 mA; VCC = 5 V; Tcase = 25 °C; unless otherwise specified. Symbol Parameter f Gp PL(1dB) IP3O [1] [2] Conditions [1] Min 400 [2] Typ 11 28 43 Max - Unit dB dBm dBm frequency gain power output power at 1 dB gain compression output third-order intercept point f = 2140 MHz f = 2140 MHz f = 2140 MHz 2700 MHz - Operation outside this range is possible but not guaranteed. PL = 17 dBm per tone; spacing = 1 MHz. NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 2. Pinning information Table 2. Pin 1 2 3 Pinning Description VCC(RF) GND RF_IN [1] [2] [1] Simplified outline Graphic symbol 3 2 3 2 1 1 sym130 [1] [2] This pin is DC-coupled and requires an external DC-blocking capacitor. The center metal base of the SOT89 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Ordering information Package Name BGA7027 Description plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads Version SOT89 Type number 4. Functional diagram BIAS ENABLE BANDGAP V/I CONVERTER RF_IN 3 1 VCC(RF) 2 GND 014aab020 Fig 1. Functional diagram BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 2 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC Pi(RF) Tcase Tj VESD Parameter supply voltage RF input power case temperature junction temperature electrostatic discharge voltage Human Body Model (HBM); according to JEDEC standard 22-A114E Charged Device Model (CDM); according to JEDEC standard 22-C101B Conditions Min −40 Max 5.7 +85 150 2000 Unit V dBm °C °C V - 500 V 6. Thermal characteristics Table 5. Symbol Rth(j-c) Thermal characteristics Parameter thermal resistance from junction to case Conditions Tcase = 85 °C; VCC = 5 V; ICC = 170 mA Typ 38 Unit K/W 7. Static characteristics Table 6. Characteristics Input and output impedances matched to 50 Ω. Typical values at Tcase = 25 °C, unless otherwise specified. Symbol VCC ICC Parameter supply voltage supply current VCC = 5.0 V Conditions Min 145 Typ 5.0 170 Max 195 Unit V mA 8. Dynamic characteristics Table 7. Characteristics Input and output impedances matched to 50 Ω. Typical values at VCC = 5 V; Tcase = 25 °C, NXP application circuit; unless otherwise specified. Symbol Parameter f Gp frequency gain power f = 940 MHz f = 1960 MHz f = 2140 MHz PL(1dB) output power at 1 dB gain compression f = 940 MHz f = 1960 MHz f = 2140 MHz Conditions [1] [2] [2] [2] Min 400 - Typ 19 12 11 28 28 28 Max 2700 - Unit MHz dB dB dB dBm dBm dBm BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 3 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Table 7. Characteristics …continued Input and output impedances matched to 50 Ω. Typical values at VCC = 5 V; Tcase = 25 °C, NXP application circuit; unless otherwise specified. Symbol Parameter IP3O output third-order intercept point Conditions f = 940 MHz f = 1960 MHz f = 2140 MHz NF noise figure f = 940 MHz f = 1960 MHz f = 2140 MHz RLin input return loss f = 940 MHz f = 1960 MHz f = 2140 MHz RLout output return loss f = 940 MHz f = 1960 MHz f = 2140 MHz [1] [2] [3] Operation outside this range is possible but not guaranteed. Defined at Pi(RF) = −40 dBm; small signal conditions. PL= 17 dBm per tone; spacing = 1 MHz. [2] [2] [2] [2] [2] [2] [3] [3] [3] Min - Typ 42 43 43 2.5 3.5 3.8 −15 −8 −8 −11 −19 −22 Max - Unit dBm dBm dBm dB dB dB dB dB dB dB dB dB 9. Scattering parameters Table 8. Scattering parameters at 5 V, MMIC only VCC = 5 V; ICC = 180 mA; Tcase = 25 °C. f (MHz) s11 Magnitude (ratio) 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 BGA7027 s21 Angle (degree) 178 176 173 171 168 165 162 160 157 154 152 150 149 148 147 146 146 Magnitude (ratio) 8.03 6.55 5.55 4.80 4.24 3.80 3.46 3.14 2.85 2.61 2.39 2.20 2.03 1.88 1.75 1.64 1.53 Angle (degree) 93 89 85 82 79 76 72 69 66 63 61 58 56 54 63 51 50 s12 Magnitude (ratio) 0.01 0.01 0.02 0.02 0.02 0.02 0.03 0.03 0.03 0.03 0.03 0.03 0.04 0.04 0.04 0.04 0.04 Angle (degree) 49 53 55 56 56 56 55 54 53 52 50 49 48 47 47 46 46 s22 Magnitude (ratio) 0.76 0.75 0.75 0.75 0.75 0.75 0.76 0.76 0.76 0.76 0.77 0.78 0.78 0.79 0.80 0.80 0.80 Angle (degree) −176 −178 179 177 175 173 170 167 165 163 161 160 159 157 157 157 157 © NXP B.V. 2010. All rights reserved. 0.92 0.92 0.92 0.92 0.92 0.92 0.92 0.92 0.92 0.92 0.93 0.93 0.93 0.93 0.94 0.94 0.94 All information provided in this document is subject to legal disclaimers. Preliminary data sheet Rev. 1 — 11 August 2010 4 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Table 8. Scattering parameters at 5 V, MMIC only …continued VCC = 5 V; ICC = 180 mA; Tcase = 25 °C. f (MHz) s11 Magnitude (ratio) 2100 2200 2300 2400 2500 2600 2700 0.93 0.93 0.93 0.92 0.91 0.91 0.89 Angle (degree) 146 147 147 147 147 148 147 s21 Magnitude (ratio) 1.45 1.39 1.33 1.29 1.26 1.24 1.23 Angle (degree) 49 49 48 48 47 46 45 s12 Magnitude (ratio) 0.04 0.05 0.05 0.05 0.05 0.06 0.06 Angle (degree) 46 46 45 45 45 45 44 s22 Magnitude (ratio) 0.81 0.81 0.81 0.80 0.80 0.80 0.79 Angle (degree) 157 157 158 159 160 160 161 10. Reliability information Table 9. Life test HTOL Reliability Conditions Intrinsic failure rate according to JESD85; confidence level 60 %; Tj = 55 °C; 4 activation energy = 0.7 eV; acceleration factor determined according to the Arrhenius equation 11. Moisture sensitivity Table 10. Moisture sensitivity level Class 1 Test methodology JESD-22-A113 BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 5 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 12. Application information 12.1 920 MHz to 960 MHz R1 C8 VCC C7 C9 L2 L1 C10 50 Ω MSL1 C1 MSL2 MSL3 MSL4 RF_IN VCC(RF) MSL5 MSL6 MSL7 MSL8 C6 MSL9 50 Ω C2 C3 BGA7027 C4 C5 001aam066 See Table 11 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm. Fig 2. 5 V application schematic; 920 MHz to 960 MHz 32 PL(1dB) (dBm) 30 001aam130 26 Gp (dB) 24 001aam131 (3) (1) 28 (2) 22 26 20 (1) (2) (3) 24 18 22 0.92 0.93 0.94 0.95 f (GHz) 0.96 16 0.92 0.93 0.94 0.95 f (GHz) 0.96 (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. Fig 3. Output power at 1 dB gain compression as a function of frequency Fig 4. Power gain as a function of frequency BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 6 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 0 RLin, RLout, ISL (dB) −10 001aam132 46 IP3O (dBm) 44 001aam133 (2) (1) (2) (3) 42 (1) 40 −20 (3) 38 −30 0.92 0.93 0.94 0.95 f (GHz) 0.96 36 0.92 0.93 0.94 0.95 f (GHz) 0.96 Tcase = 25 °C. (1) RLin. (2) RLout. (3) ISL. PL = 17 dBm; tone spacing = 1 MHz (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. Fig 5. Input return loss, output return loss and isolation as a function of frequency Fig 6. Output third-order intercept point as a function of frequency GND GND GND GND GND VCC R1 J3 C9 J1 L2 MSL1 C1 C10 MSL3 MSL2 MSL4 C2 C3 C8 C7 L1 MSL6 MSL7 MSL8 C5 C4 J2 MSL5 C6 MSL9 RF in RF out 001aam068 See Table 11 for a list of components. Fig 7. 5 V application reference board; 920 MHz to 960 MHz BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 7 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Table 11. List of components of 920 MHz to 960 MHz, 5 V application See Figure 2 and Figure 7 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description C1, C6 C2 C3 C4 C5 C7 C8 C9 C10 J1, J2 J3 L1 L2[1] MSL1[2] MSL2[2] MSL3[2] MSL4[2] MSL5[2] MSL6[2] MSL7[2] MSL8[2] MSL9[2] R1 [1] [2] Value 68 pF 5.6 pF 2.7 pF 1.0 pF 3.9 pF 68 pF 100 nF 10 μF 68 nF SMA 6 pins 22 nH 33 nH 1.14 mm × 0.8 mm × 10.95 mm 1.14 mm × 0.8 mm × 4.3 mm 1.14 mm × 0.8 mm × 1.7 mm 1.14 mm × 0.8 mm × 4.8mm 1.14 mm × 0.8 mm × 2.7 mm 1.14 mm × 0.8 mm × 3.2 mm 1.14 mm × 0.8 mm × 4.0 mm 1.14 mm × 0.8 mm × 1.6 mm 1.14 mm × 0.8 mm × 10.95 mm 0Ω Function DC blocking input match input match output match output match RF decoupling LF decoupling LF decoupling IMD3 suppression Remarks Murata, GRM1885C1H680JA01D Murata, GRM1885C1H5R6CZ01D Murata, GRM1885C1H2R7CZ01D Murata, GRM1885C1H1R0CZ01D Murata, GRM1885C1H3R9CZ01D Murata, GRM1885C1H680JA01D AVX, 0603YC104KAT2A AVX, 1206ZG106ZAT2A Murata, GRM1888R71H683KA93D Emerson Network Power, 142-0701-841 MOLEX capacitor capacitor capacitor capacitor capacitor capacitor capacitor capacitor capacitor RF connector DC connector inductor inductor micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline resistor DC Feed IMD3 suppression input match input match input match input match output match output match output match output match output match Tyco Electronics, 36501J022JTDG Tyco Electronics, 36501J033JTDG Multicomp, MC 0.063W 0603 0R Low Q inductor. MSL1 to MSL9 dimensions are specified as Width (W), Spacing (S) and Length (L). BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 8 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 12.2 1930 MHz to 1990 MHz R1 C6 VCC C5 C7 L1 50 Ω MSL1 C1 MSL2 MSL3 RF_IN VCC(RF) MSL4 MSL5 MSL6 C4 MSL7 50 Ω C8 L2 C2 BGA7027 C3 001aam069 See Table 12 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm. Fig 8. 5 V application schematic; 1930 MHz to 1990 MHz 32 PL(1dB) (dBm) 30 001aam134 18 Gp (dB) 16 001aam135 28 (3) (1) (2) 14 (1) (2) (3) 26 12 24 10 22 1.93 1.95 1.97 f (GHz) 1.99 8 1.93 1.95 1.97 f (GHz) 1.99 (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. Fig 9. Output power at 1 dB gain compression as a function of frequency Fig 10. Power gain as a function of frequency BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 9 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 0 RLin, RLout, ISL (dB) −10 001aam136 46 IP3O (dBm) 001aam137 (1) (2) (3) (1) 44 (2) 42 (3) 40 −20 38 −30 1.93 1.95 1.97 f (GHz) 1.99 36 1.93 1.95 1.97 f (GHz) 1.99 Tcase = 25 °C. (1) RLin. (2) RLout. (3) ISL. PL = 17 dBm; tone spacing = 1 MHz (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. Fig 11. Input return loss, output return loss and isolation as a function of frequency Fig 12. Output third-order intercept point as a function of frequency GND GND GND GND GND VCC R1 J3 C7 J1 L2 C8 MSL1 C1 MSL2 MSL3 C2 C6 C5 L1 MSL5 MSL6 C3 J2 MSL4 C4 MSL7 RF in RF out 001aam072 See Table 12 for a list of components. Fig 13. 5 V application reference board; 1930 MHz to 1990 MHz BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 10 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Table 12. List of components of 1930 MHz to 1990 MHz, 5 V application See Figure 8 and Figure 13 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description C1, C4 C2 C3 C5 C6 C7 C8 J1, J2 J3 L1 L2[1] MSL1[2] MSL2[2] MSL3[2] MSL4[2] MSL5[2] MSL6[2] MSL7[2] R1 [1] [2] Value 15 pF 2.4 pF 2.0 pF 15 pF 100 nF 10 μF 68 nF SMA 6 pins 22 nH 33 nH 1.14 mm × 0.8 mm × 10.95 mm 1.14 mm × 0.8 mm × 10.6 mm 1.14 mm × 0.8 mm × 1.0 mm 1.14 mm × 0.8 mm × 2.7 mm 1.14 mm × 0.8 mm × 2.0 mm 1.14 mm × 0.8 mm × 6.8 mm 1.14 mm × 0.8 mm × 10.95 mm 0Ω Function DC blocking input match output match RF decoupling LF decoupling LF decoupling IMD3 suppression Remarks Murata, GRM1885C1H150JA01D Murata, GRM1885C1H2R4CZ01D Murata, GRM1885C1H2R0CZ01D Murata, GRM1885C1H150JA01D AVX, 0603YC104KAT2A AVX, 1206ZG106ZAT2A Murata, GRM1888R71H683KA93D Emerson Network Power, 142-0701-841 MOLEX capacitor capacitor capacitor capacitor capacitor capacitor capacitor RF connector DC connector inductor inductor micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline micro stripline resistor DC Feed IMD3 suppression input match input match input match output match output match output match output match Tyco Electronics, 36501J022JTDG Tyco Electronics, 36501J033JTDG Multicomp. MC 0.063W 0603 0R Low Q inductor. MSL1 to MSL7 dimensions are specified as Width (W), Spacing (S) and Length (L). 12.3 2110 MHz to 2170 MHz R1 C6 VCC C5 C7 L1 50 Ω MSL1 C1 MSL2 RF_IN C2 VCC(RF) MSL3 MSL4 C4 MSL5 50 Ω C8 L2 BGA7027 C3 001aam070 See Table 13 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm. Fig 14. 5 V application schematic; 2110 MHz to 2170 MHz BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 11 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 32 PL(1dB) (dBm) 30 001aam138 18 Gp (dB) 16 001aam139 (3) 28 (1) (2) 14 (1) (2) (3) 26 12 24 10 22 2.11 2.13 2.15 f (GHz) 2.17 8 2.11 2.13 2.15 f (GHz) 2.17 (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. Fig 15. Output power at 1 dB gain compression as a function of frequency Fig 16. Power gain as a function of frequency 0 RLin, RLout, ISL (dB) −10 001aam140 46 IP3O (dBm) (1) (2) (3) 001aam141 (1) 44 42 (2) (3) 40 −20 38 −30 2.11 2.13 2.15 f (GHz) 2.17 36 2.11 2.13 2.15 f (GHz) 2.17 Tcase = 25 °C. (1) RLin. (2) RLout. (3) ISL. PL = 17 dBm; tone spacing = 1 MHz (1) Tcase = 25 °C. (2) Tcase = 85 °C. (3) Tcase = −40 °C. Fig 17. Input return loss, output return loss and isolation as a function of frequency Fig 18. Output third-order intercept point as a function of frequency BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 12 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier GND GND GND GND GND VCC R1 J3 C7 J1 C6 L2 C8 L1 MSL1 C1 MSL2 C3 C2 MSL3 MSL4 C4 MSL5 C5 J2 RF in RF out 001aam071 See Table 13 for a list of components. Fig 19. 5 V application reference board; 2110 MHz to 2170 MHz BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 13 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Table 13. List of components of 2110 MHz to 2170 MHz, 5 V application See Figure 14 and Figure 19 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description C1, C4 C2 C3 C5 C6 C7 C8 J1, J2 J3 L1 L2[1] MSL1[2] MSL2[2] MSL3[2] MSL4[2] MSL5[2] R1 [1] [2] Value 15 pF 2.2 pF 2.0 pF 15 pF 100 nF 10 μF 68 nF SMA 6 pins 22 nH 33 nH 1.14 mm × 0.8 mm × 10.95 mm 1.14 mm × 0.8 mm × 11.3 mm 1.14 mm × 0.8 mm × 3.2 mm 1.14 mm × 0.8 mm × 8.0 mm 1.14 mm × 0.8 mm × 10.95 mm 0Ω Function DC blocking input match output match RF decoupling LF decoupling LF decoupling IMD3 suppression Remarks Murata, GRM1885C1H150JA01D Murata, GRM1885C1H2R2CZ01D Murata, GRM1885C1H1R0CZ01D Murata, GRM1885C1H150JA01D AVX, 0603YC104KAT2A AVX, 1206ZG106ZAT2A Murata, GRM1888R71H683KA92D Emerson Network Power, 142-0701-841 MOLEX capacitor capacitor capacitor capacitor capacitor capacitor capacitor RF connector DC connector inductor inductor micro stripline micro stripline micro stripline micro stripline micro stripline resistor DC Feed IMD3 suppression input match input match output match output match output match Tyco Electronics, 36501J022JTDG Tyco Electronics, 36501J033JTDG Multicomp, MC 0.063W 0603 0R Low Q inductor. MSL1 to MSL5 dimensions are specified as Width (W), Spacing (S) and Length (L). 12.4 PCB stack through via RF & analog routing 35 μm (1 oz.) copper + 0.3 μm gold plating RO4003C, 0.51 mm (20 mil) RF & analog ground 35 μm (1 oz.) copper (1) 0.2 mm (8 mil) analog routing 35 μm (1 oz.) copper FR4, 0.15 mm (6 mil) 35 μm (1 oz.) copper 014aab045 RF & analog ground RO4003C dielectric constant εr = 3.38. Fig 20. PCB stack BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 14 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 13. Package outline Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 D B A bp3 E HE Lp 1 2 bp2 wM B bp1 e1 e 3 c 0 2 scale 4 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.6 1.4 bp1 0.48 0.35 bp2 0.53 0.40 bp3 1.8 1.4 c 0.44 0.23 D 4.6 4.4 E 2.6 2.4 e 3.0 e1 1.5 HE 4.25 3.75 Lp 1.2 0.8 w 0.13 OUTLINE VERSION SOT89 REFERENCES IEC JEDEC TO-243 JEITA SC-62 EUROPEAN PROJECTION ISSUE DATE 06-03-16 06-08-29 Fig 21. Package outline SOT89 BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 15 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 14. Abbreviations Table 14. Acronym CPE ESD HTOL ISM MMIC RFID TX W-LAN Abbreviations Description Customer-Premises Equipment ElectroStatic Discharge High Temperature Operating Life Industrial, Scientific and Medical Monolithic Microwave Integrated Circuit Radio Frequency IDentification Transmit Wireless Local Area Network 15. Revision history Table 15. Revision history Release date 20100811 Data sheet status Preliminary data sheet Change notice Supersedes Document ID BGA7027 v.1 BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 16 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. © NXP B.V. 2010. All rights reserved. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BGA7027 All information provided in this document is subject to legal disclaimers. Preliminary data sheet Rev. 1 — 11 August 2010 17 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGA7027 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 1 — 11 August 2010 18 of 19 NXP Semiconductors BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 18. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 15 16 16.1 16.2 16.3 16.4 17 18 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 3 Dynamic characteristics . . . . . . . . . . . . . . . . . . 3 Scattering parameters . . . . . . . . . . . . . . . . . . . . 4 Reliability information . . . . . . . . . . . . . . . . . . . . 5 Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 6 920 MHz to 960 MHz . . . . . . . . . . . . . . . . . . . . 6 1930 MHz to 1990 MHz . . . . . . . . . . . . . . . . . . 9 2110 MHz to 2170 MHz . . . . . . . . . . . . . . . . . 11 PCB stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 August 2010 Document identifier: BGA7027