BGO827

BGO827; BGO827/FC0; BGO827/SC0 870 MHz optical receivers Rev. 5 — 29 September 2010 Product data sheet 1. Product profile 1.1 General description High dynamic range optical receiver amplifier modules in a standard SOT115 package where the non-jacketed fiber has either no connector or has an FC/APC or SC/APC connector. The amplifier supply voltage pin and the photodiode bias voltage pin both connect to 24 V (DC). The modules have a mono mode optical input suitable for 1290 nm to 1600 nm wavelengths, a terminal to monitor the photodiode current and an electrical output having a characteristic impedance of 75 Ω. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Excellent linearity Low noise Excellent flatness Standard CATV outline Rugged construction Gold metallization ensures excellent reliability High optical input power range 1.3 Applications CATV optical node systems operating in the 40 MHz to 870 MHz frequency range. NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers 1.4 Quick reference data Table 1. Symbol f s22 d2 F Itot Quick reference data Parameter frequency range output return losses optical input return losses second order distortion equivalent noise input total current consumption (DC) f = 854.5 MHz f = 40 MHz to 870 MHz VB = 24 V f = 40 MHz to 870 MHz Conditions Min 40 11 45 175 Typ Max 870 −57 8.5 205 Unit MHz dB dB dB pA/√Hz mA 2. Pinning information Table 2. Pin 1 2, 3 4 5 7, 8 9 Pinning Description monitor current common +VB of the photodiode +VB of the amplifier common output 1 2, 3, 7, 8 sym098 Simplified outline Graphic symbol BGO827 (SOT115T) 4 5 1 579 9 BGO827/FC0 (SOT115X) 1 2, 3 4 5 7, 8 9 monitor current common +VB of the photodiode +VB of the amplifier common output 1 2, 3, 7, 8 sym098 1 579 4 5 9 BGO827/SC0 (SOT115Y) 1 2, 3 4 5 7, 8 9 monitor current common +VB of the photodiode +VB of the amplifier common output 1 2, 3, 7, 8 sym098 1 579 4 5 9 BGO827_FC0_SC0 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 5 — 29 September 2010 2 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers 3. Ordering information Table 3. Ordering information Package Name BGO827 Description Version rectangular single-ended package; aluminium flange; 2 vertical mounting SOT115T holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads SOT115X Type number BGO827/FC0 - BGO827/SC0 - SOT115Y 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol f Tstg Tmb Pin ESD Parameter frequency range storage temperature mounting base temperature optical input power ESD sensitivity continuous human body model; R = 1.5 kΩ; C = 100 pF Conditions Min 40 −40 −20 500 Max 870 +85 +85 5 Unit MHz °C °C mW V 5. Characteristics Table 5. Characteristics Bandwidth 40 MHz to 870 MHz; VB = 24 V; Tmb = 30 °C; ZL = 75 Ω. Symbol S Parameter responsivity BGO827 BGO827/FC0; BGO827/SC0 ΔS responsivity difference responsivity at Tmb = 85 °C − responsivity at Tmb = 30 °C; f = 870 MHz f = 40 MHz to 870 MHz f = 40 MHz to 870 MHz slope at Tmb = 85 °C − slope at Tmb = 30 °C f = 40 MHz to 870 MHz λ = 1300 nm 800 750 −50 V/W V/W V/W Conditions Min Typ Max Unit FL SL ΔSL s22 flatness straight line (peak to valley) slope straight line slope difference output return losses optical input return losses 0 11 45 −0.35 - 1 2 - dB dB dB dB dB BGO827_FC0_SC0 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 5 — 29 September 2010 3 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers Table 5. Characteristics …continued Bandwidth 40 MHz to 870 MHz; VB = 24 V; Tmb = 30 °C; ZL = 75 Ω. Symbol d2 Parameter second order distortion Conditions fm = 446.5 MHz fm = 746.5 MHz fm = 854.5 MHz Δd2 second order distortion difference d2 at Tmb = 85 °C − d2 at Tmb = 30 °C d2 at Tmb = −20 °C − d2 at Tmb = 30 °C d3 Δd3 third order distortion third order distortion difference fm = 853.25 MHz d3 at Tmb = 85 °C − d3 at Tmb = 30 °C d3 at Tmb = −20 °C − d3 at Tmb = 30 °C F equivalent noise input f = 40 MHz to 450 MHz f = 450 MHz to 750 MHz f = 750 MHz to 870 MHz sλ λ L spectral sensitivity optical wavelength length of optical fiber BGO827 BGO827/FC0; BGO827/SC0 Itot Ibias [1] [2] [3] [4] [5] [6] [5][6] [1][2] [1][3] [1][4] Min 0.85 0.9 1290 Typ 2.5 −1.5 1 −1 - Max −68 −63 −57 −73 7 8 8.5 1600 861 205 25 Unit dB dB dB dB dB dB dB dB pA/√Hz pA/√Hz pA/√Hz A/W A/W nm m mm mA mA λ = 1310 ±20 nm λ = 1550 ±20 nm SM type; 9/125 μm 1 746 175 - total current consumption (DC) diode bias current at pin 4 (DC) Two laser test; each laser with a modulation index of 40 %; Popt = 1 mW (total) fm = 446.5 MHz; fp = 97.25 MHz; fq = 349.25 MHz fm = 746.5 MHz; fp = 133.25 MHz; fq = 613.25 MHz fm = 854.5 MHz; fp = 133.25 MHz; fq = 721.25 MHz Three laser test; each laser with a modulation index of 60 %; Popt = 1 mW (total) fm = 853.25 MHz; fp = 133.25 MHz; fq = 265.25 MHz; fr = 721.25 MHz Pin 1 10 kΩ photo current 1 kΩ mlb151 Fig 1. Monitor current pin BGO827_FC0_SC0 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 5 — 29 September 2010 4 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads D E S2 Z p N1 N2 M A2 1 A L S1 F S W d B U2 Q yMB p e e1 q2 q1 yMB xMB b wM 2 3 4 5 7 8 9 N SOT115T M1 M2 c U1 q 0 optical input DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. 9.5 b c D d E max. max. max. e e1 F 5 scale 10 mm S1 S2 U1 U2 8.2 7.8 W w x 0.7 y 0.1 Z max. 12 16.7 4.95 44.75 16.1 4.55 44.25 6-32 0.25 UNC L min. 8.8 M 2.5 M1 1.6 M2 N min. N1 10.7 0.0 N2 5 0 p 4.15 3.85 Q max. 2.4 q q1 q2 S 4.2 mm 20.8 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 0.9 1000 38.1 25.4 10.2 OUTLINE VERSION SOT115T REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-02-04 10-06-18 Fig 2. Package outline SOT115T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. BGO827_FC0_SC0 Product data sheet Rev. 5 — 29 September 2010 5 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads E S2 Z D p N1 N2 M M1 SOT115X M2 A2 1 A L S1 F S c d B U2 Q q2 yMB p q1 W e e1 yMB xMB b wM 2 3 4 5 7 8 9 N R U1 q 0 Scale 25 mm connector 0 5 scale 10 mm S 4.2 S1 S2 U1 U2 8.2 7.8 p 4.15 3.85 W w x 0.7 y 0.1 Z max. 12 16.7 4.95 44.75 16.1 4.55 44.25 DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. 9.5 b c D d E max. max. max. e e1 F L min. 8.8 M 2.5 M1 1.6 M2 0.9 N N1 N2 5 0 6-32 0.25 UNC Q max. 2.4 q q1 q2 R min. 35 mm 20.8 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 861 10.7 746 0.0 38.1 25.4 10.2 OUTLINE VERSION SOT115X REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-02-04 10-06-18 Fig 3. Package outline SOT115X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. BGO827_FC0_SC0 Product data sheet Rev. 5 — 29 September 2010 6 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads E S2 Z D p N1 N2 M M1 SOT115Y M2 A2 1 A L S1 F S c d B U2 Q q2 yMB p q1 W e e1 yMB xMB b wM 2 3 4 5 7 8 9 N R U1 q 0 25 mm Scale connector 0 5 scale 10 mm S S1 S2 U1 U2 W w x 0.7 y 0.1 Z max. 12 4.2 16.7 4.95 44.75 16.1 4.55 44.25 L min. 8.8 8.2 6-32 0.25 7.8 UNC Q max. 2.4 DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. 9.5 b c D d E max. max. max. e e1 F M 2.5 M1 1.6 M2 0.9 N N1 N2 5 0 p 4.15 3.85 q q1 q2 R min. 35 mm 20.8 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 0.38 861 10.7 746 0.0 38.1 25.4 10.2 OUTLINE VERSION SOT115Y REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-02-05 10-06-18 Fig 4. Package outline SOT115Y All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. BGO827_FC0_SC0 Product data sheet Rev. 5 — 29 September 2010 7 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers 7. Handling information Fiberglass optical coupling: maximum tensile strength = 5 N; minimum bending radius = 35 mm. 8. Revision history Table 6. Revision history Release date 20100929 Data sheet status Product data sheet Change notice Supersedes BGO827_FC0_SC0 v.4 Document ID BGO827_FC0_SC0 v.5 Modifications: • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Package outline and simplified outline drawings have been updated to the latest version. Product data sheet Product specification Product specification Product specification BGO827_FC0_SC0 v.3 BGO827_FC0_SC0 v.2 BGO827_FC0_SC0 v.1 - BGO827_FC0_SC0 v.4 (9397 750 14436) BGO827_FC0_SC0 v.3 (9397 750 13061) BGO827_FC0_SC0 v.2 (9397 750 10522) BGO827_FC0_SC0 v.1 (9397 750 09934) 20050329 20040407 20021210 20020627 BGO827_FC0_SC0 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 5 — 29 September 2010 8 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers 9. Legal information 9.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. © NXP B.V. 2010. All rights reserved. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BGO827_FC0_SC0 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 5 — 29 September 2010 9 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGO827_FC0_SC0 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 5 — 29 September 2010 10 of 11 NXP Semiconductors BGO827; BGO827/FC0/SC0 870 MHz optical receivers 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Handling information. . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 September 2010 Document identifier: BGO827_FC0_SC0