BGU8019
XS
ON
6
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS,
Galileo, and Compass
Rev. 5 — 21 May 2021
1
Product data sheet
Product profile
1.1 General description
The BGU8019 is, also known as the GPS1202M, a Low Noise Amplifier (LNA) for GNSS
receiver applications, available in a small plastic 6-pin extremely thin leadless package.
The BGU8019 requires one external matching inductor.
The BGU8019 adapts itself to the changing environment resulting from co-habitation of
different radio systems in modern cellular handsets. It has been designed for low power
consumption and optimal performance when jamming signals from co-existing cellular
transmitters are present. At low jamming power levels it delivers 18.5 dB gain at a noise
figure of 0.55 dB. During high jamming power levels, resulting for example from a cellular
transmit burst, it temporarily increases its bias current to improve sensitivity.
1.2 Features and benefits
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Cover full GNSS L1 band, from 1559 MHz to 1610 MHz
Noise figure (NF) = 0.55 dB
Gain = 18.5 dB
High input 1 dB compression point of -7 dBm
High out of band IP3i of 6 dBm
Supply voltage 1.5 V to 3.1 V
Self-shielding package concept
Integrated supply decoupling capacitor
Optimized performance at a supply current of 4.6 mA
Power-down mode current consumption < 1 μA
Integrated temperature stabilized bias for easy design
Require only one input matching inductor
Input and output DC decoupled
ESD protection on all pins (HBM > 2 kV)
Integrated matching for the output
Available in 6-pins leadless package 1.1 mm × 0.7 mm × 0.37 mm; 0.4 mm pitch:
SOT1232
• 180 GHz transit frequency - SiGe:C technology
• Moisture sensitivity level of 1
BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
1.3 Applications
LNA for GPS, GLONASS, Galileo, and Compass (BeiDou) in:
•
•
•
•
•
•
•
•
smart phones
feature phones,
tablet PCs
digital still cameras
digital video cameras
RF front-end modules
complete GNSS modules
personal health applications
1.4 Quick reference data
Table 1. Quick reference data
f = 1575 MHz; VCC = 2.85 V; VI(ENABLE) ≥ 0.8 V; Pi < -40 dBm; Tamb = 25 °C; input matched to 50 Ω
using a 6.8 nH inductor, see Figure 1; unless otherwise specified.
Symbol Parameter
Product data sheet
Min Typ
Max Unit
VCC
supply voltage
1.5
-
3.1
V
ICC
supply current
-
4.6
6.6
mA
Gp
power gain
no jammer
NF
noise figure
Pi(1dB)
input power at 1 dB gain
compression
IP3i
input third-order intercept point
[1]
[2]
[3]
BGU8019
Conditions
Pi = -40 dBm, no jammer
16.5 18.5 20.5 dB
[1]
-
0.55 1.1
dB
-11
-7
-
dBm
[2]
0
6
-
dBm
[3]
0
6
-
dBm
PCB losses are subtracted.
f1 = 1713 MHz; f2 = 1851 MHz; Pi = -20 dBm per carrier
f1 = 1713 MHz, Pi = -20 dBm; f2 = 1850 MHz, Pi = -65 dBm
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 21 May 2021
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2 / 19
BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
2
Pinning information
Table 2. Pinning
Pin
Description
1
GND
2
VCC
3
RF_OUT
4
GND_RF
5
RF_IN
6
ENABLE
Simplified outline
Graphic symbol
4
6 2
3
5
5
2
3
1 4
aaa-006408
6
1
Transparent top view
3
Ordering information
Table 3. Ordering information
Type number
4
Package
Name
Description
Version
BGU8019
XSON6
plastic extremely thin small outline package; no leads; 6
terminals; body 1.1 × 0.7 × 0.37 mm
SOT1232
OM7848
EVB
BGU8019 evaluation board, MMIC only
-
OM7849
EVB
BGU8019 evaluation board, front-end EVB
-
Marking code
Table 4. Marking code
Type number
Marking code
Date code
BGU8019
A
YWW
one digit device name
YWW
pin one identifier
plant code identifier
aaa-034078
Figure 1. Marking diagram
BGU8019
Product data sheet
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
5
Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Absolute Maximum Ratings are given as Limiting Values of stress conditions during operation, that must not be exceeded
under the worst probable conditions.
Symbol
VCC
Parameter
Conditions
supply voltage
VI(ENABLE)
RF input AC coupled
input voltage on pin ENABLE
VI(ENABLE) < VCC + 0.6 V
Min
Max
Unit
[1]
-0.5
5
V
[1][2]
-0.5
5
V
-0.5
5
V
-0.5
5
V
-
10
dBm
-
55
mW
VI(RF_IN)
input voltage on pin RF_IN
DC, VI(RF_IN) < VCC + 0.6 V
[1][2][3]
VI(RF_OUT)
input voltage on pin RF_OUT
DC, VI(RF_OUT) < VCC + 0.6 V
[1][2][3]
[1]
Pi
input power
Ptot
total power dissipation
Tstg
storage temperature
-65
150
°C
Tj
junction temperature
-
150
°C
VESD
electrostatic discharge voltage
Human Body Model (HBM) According to
ANSI/ESDA/JEDEC standard JS-001
-
±2
kV
Charged Device Model (CDM) According to
JEDEC standard JESD22-C101C
-
±1
kV
[1]
[2]
[3]
Tsp ≤ 130 °C
Stressed with pulses of 200 ms in duration, with application circuit as in Figure 1.
Warning: due to internal ESD diode protection, the applied DC voltage shall not exceed VCC + 0.6 V and shall not exceed 5.0 V in order to avoid excess
current.
The RF input and RF output are AC coupled through internal DC blocking capacitors.
6
Recommended operating conditions
Table 6. Operating conditions
7
Symbol
Parameter
Conditions
Min Typ Max Unit
VCC
supply voltage
1.5
-
3.1
V
Tamb
ambient temperature
-40
25
85
°C
VI(ENABLE)
input voltage on pin ENABLE
OFF state
-
-
0.3
V
ON state
0.8
-
-
V
Thermal characteristics
Table 7. Thermal characteristics
BGU8019
Product data sheet
Symbol
Parameter
Conditions
Rth(j-sp)
thermal resistance from junction to solder point
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 21 May 2021
Typ
Unit
225
K/W
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
8
Characteristics
Table 8. Characteristics at VCC = 1.8 V
f = 1575 MHz; VCC = 1.8 V; VI(ENABLE) ≥ 0.8 V; Pi < -40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 6.8 nH inductor,
see Figure 1; unless otherwise specified.
Symbol
Parameter
Conditions
ICC
supply current
VI(ENABLE) ≥ 0.8 V
Gp
power gain
RLin
RLout
ISL
input return loss
output return loss
Min
Typ
Max
Unit
Pi < -40 dBm
-
4.4
6.4
mA
Pi = -20 dBm
-
9
-
mA
VI(ENABLE) ≤ 0.3 V
-
-
1
µA
no jammer
16
18
20
dB
Pjam = -20 dBm; fjam = 850 MHz
-
20
-
dB
Pjam = -20 dBm; fjam = 1850 MHz
-
20
-
dB
Pi < -40 dBm
9
12
-
dB
Pi = -20 dBm
-
20
-
dB
Pi < -40 dBm
8
13
-
dB
Pi = -20 dBm
-
12
-
dB
isolation
NF
noise figure
Pi(1dB)
input power at 1 dB gain
compression
IP3i
input third-order intercept point
27
30
-
dB
Pi = -40 dBm, no jammer
[1]
-
0.55
1.1
dB
Pi = -40 dBm, no jammer
[2]
-
0.60
1.15
dB
Pjam = -20 dBm; fjam = 850 MHz
[2]
-
0.9
-
dB
Pjam = -20 dBm; fjam = 1850 MHz
[2]
-
1.3
-
dB
-13
-10
-
dBm
[3]
-3
3
-
dBm
[4]
-3
3
-
dBm
-
-47
-
dBm
-
-89
-
dBm
third-order intermodulation
distortion
measured at output pin
[3]
measured at output pin
[4]
ton
turn-on time
time from VI(ENABLE) ON, to 90 % of the
gain
-
-
2
µs
toff
turn-off time
time from VI(ENABLE) OFF, to 10 % of the
gain
-
-
1
µs
IMD3
[1]
[2]
[3]
[4]
PCB losses are subtracted
Including PCB losses
f1 = 1713 MHz; f2 = 1851 MHz; Pi = -20 dBm per carrier
f1 = 1713 MHz, Pi = -20 dBm; f2 = 1850 MHz, Pi = -65 dBm
BGU8019
Product data sheet
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Rev. 5 — 21 May 2021
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5 / 19
BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
Table 9. Characteristics at VCC = 2.85 V
f = 1575 MHz; VCC = 2.85 V; VI(ENABLE) ≥ 0.8 V; Pi < -40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 6.8 nH inductor,
see Figure 1; unless otherwise specified.
Symbol
Parameter
Conditions
ICC
supply current
VI(ENABLE) ≥ 0.8 V
Gp
power gain
RLin
RLout
ISL
input return loss
output return loss
Min
Typ
Max
Unit
Pi < -40 dBm
-
4.6
6.6
mA
Pi = -20 dBm
-
10
-
mA
VI(ENABLE) ≤ 0.3 V
-
-
1
µA
no jammer
16.5
18.5
20.5
dB
Pjam = -20 dBm; fjam = 850 MHz
-
20.0
-
dB
Pjam = -20 dBm; fjam = 1850 MHz
-
20.5
-
dB
Pi < -40 dBm
8
13
-
dB
Pi = -20 dBm
-
22
-
dB
Pi < -40 dBm
8
13
-
dB
Pi = -20 dBm
-
12
-
dB
isolation
NF
noise figure
Pi(1dB)
input power at 1 dB gain
compression
IP3i
input third-order intercept point
27
30
-
dB
Pi = -40 dBm, no jammer
[1]
-
0.55
1.1
dB
Pi = -40 dBm, no jammer
[2]
-
0.60
1.15
dB
Pjam = -20 dBm; fjam = 850 MHz
[2]
-
0.9
-
dB
Pjam = -20 dBm; fjam = 1850 MHz
[2]
-
1.3
-
dB
-11
-7
-
dBm
[3]
0
6
-
dBm
[4]
0
6
-
dBm
-
-53
-
dBm
-
-96
-
dBm
third-order intermodulation
distortion
measured at output pin
[3]
measured at output pin
[4]
ton
turn-on time
time from VI(ENABLE) ON, to 90 % of the
gain
-
-
2
µs
toff
turn-off time
time from VI(ENABLE) OFF, to 10 % of the
gain
-
-
1
µs
IMD3
[1]
[2]
[3]
[4]
PCB losses are subtracted
Including PCB losses
f1 = 1713 MHz; f2 = 1851 MHz; Pi = -20 dBm per carrier
f1 = 1713 MHz, Pi = -20 dBm; f2 = 1850 MHz, Pi = -65 dBm
BGU8019
Product data sheet
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Rev. 5 — 21 May 2021
© NXP B.V. 2021. All rights reserved.
6 / 19
BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
9
Application information
9.1 GNSS application
Vcc
VCTRL
RFin
L1
6
C1
RFout
2 3
5
IC1
4
1
aaa-006409
For a list of components see Table 10.
Figure 2. Schematics GNSS evaluation board
Table 10. List of components
For schematics see Figure 1.
Component
Description
Value
Remarks
C1
decoupling capacitor
1 nF
to suppress power supply noise
IC1
BGU8019
-
NXP
L1
high-quality matching inductor
6.8 nH
Murata LQW15A
9.2 Graphs
6.0
ICC
(mA)
aaa-009946
6.0
ICC
(mA)
5.5
aaa-009945
5.5
5.0
4.5
5.0
(4)
(3)
(2)
(1)
4.0
(3)
4.5
3.5
(2)
(1)
4.0
1.0
3.0
-55
1.5
2.0
2.5
3.0
VCC (V)
3.5
-35
-15
5
25
45
65
85
Tamb (°C)
105
Pi = -45 dBm.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
Pi = -45 dBm.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
Figure 3. Supply current as a function of supply
voltage; typical values
Figure 4. Supply current as a function of ambient
temperature; typical values
BGU8019
Product data sheet
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
Gp
(dB)
Gp
(dB)
aaa-009947
20
aaa-009948
24
20
16
16
12
8
8
4
4
0
500
(4)
(3)
(2)
(1)
12
(1)
(2)
(3)
0
500
1000
1500
2000
2500
f (MHz)
3000
Pi = -45 dBm; VCC = 1.8 V.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
1000
1500
2000
2500
f (MHz)
3000
Tamb = 25 °C; VCC = 1.8 V.
1. Pi = -45 dBm
2. Pi = -30 dBm
3. Pi = -20 dBm
4. Pi = -15 dBm
Figure 5. Power gain as a function of frequency; typical Figure 6. Power gain as a function of frequency; typical
values
values
Gp
(dB)
aaa-009949
20
Gp
(dB)
16
(4)
(3)
(2)
(1)
12
aaa-009950
22
18
10
4
0
500
10
(4)
(3)
(2)
(1)
8
ICC
(mA)
14
Gp
14
18
6
ICC
1000
1500
Pi = -45 dBm; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
2000
2500
f (MHz)
3000
6
-50
-40
-30
-20
Pi (dBm)
2
-10
f = 1575 MHz; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
Figure 7. Power gain as a function of frequency; typical Figure 8. Power gain and supply current as function of
values
input power; typical values
BGU8019
Product data sheet
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Rev. 5 — 21 May 2021
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
aaa-009951
1.1
NF
(dB)
1.0
aaa-009952
1.6
NF
(dB)
1.2
0.9
0.8
0.8
(1)
(2)
(4)
(3)
0.7
(2)
0.4
0.6
0.5
1500
(3)
1525
1550
1575
1600
1625
f (MHz)
1650
(1)
0.0
1.4
Tamb = 25 °C; no jammer, including PCB losses.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
1.8
2.2
2.6
3.0
VCC (V)
3.4
f = 1575 MHz; no jammer, including PCB losses.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
Figure 9. Noise figure as a function of frequency; typical Figure 10. Noise figure as a function of supply voltage;
values
typical values
aaa-009953
1.4
NF
(dB)
1.2
1.0
(1)
(2)
(3)
(4)
0.8
0.6
0.4
0.2
-50
-25
0
25
50
75
Tamb (°C)
100
f = 1575 MHz; no jammer, including PCB losses.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
Figure 11. Noise figure as a function of ambient temperature; typical values
BGU8019
Product data sheet
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Rev. 5 — 21 May 2021
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
NF
(dB)
aaa-009954
4
NF
(dB)
3
3
(1)
(2)
(4)
(3)
2
(1)
(2)
(3)
(4)
2
1
1
0
-50
aaa-009955
4
-40
-30
-20
-10
Pjam (dBm)
0
-50
0
fjam = 850 MHz; Tamb = 25 °C; f = 1575 MHz; including PCB
losses.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
-40
-30
-20
-10
Pjam (dBm)
0
fjam = 1850 MHz; Tamb = 25 °C; f = 1575 MHz; including
PCB losses.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
Figure 12. Noise figure as a function of jamming power; Figure 13. Noise figure as a function of jamming power;
typical values
typical values
RLin
(dB)
RLin
(dB)
aaa-009956
0
aaa-009957
0
-8
-4
(3)
(2)
(1)
-8
-16
(1)
(2)
(3)
(4)
-24
-12
-32
-16
-20
500
-40
500
1000
1500
2000
2500
f (MHz)
3000
1000
1500
2000
2500
f (MHz)
3000
Pi = -45 dBm; VCC = 1.8 V.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
Tamb = 25 °C; VCC = 1.8 V.
1. Pi = -45 dBm
2. Pi = -30 dBm
3. Pi = -20 dBm
4. Pi = -15 dBm
Figure 14. Input return loss as a function of frequency;
typical values
Figure 15. Input return loss as a function of frequency;
typical values
BGU8019
Product data sheet
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Rev. 5 — 21 May 2021
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
RLin
(dB)
aaa-009958
0
RLin
(dB)
aaa-009959
0
-5
-4
(1)
(2)
(3)
(4)
-8
-10
(1)
(2)
(3)
(4)
-15
-12
-20
-16
-20
500
-25
1000
1500
2000
2500
f (MHz)
3000
-30
-50
-40
-30
-20
Pi (dBm)
-10
Pi = -45 dBm; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
f = 1575 MHz; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
Figure 16. Input return loss as a function of frequency;
typical values
Figure 17. Input return loss as a function of input
power; typical values
RLout
(dB)
RLout
(dB)
aaa-009961
0
aaa-009962
0
-4
-4
-8
-8
-12
-12
(3)
(2)
(1)
(4)
(3)
(2)
(1)
-16
-16
-20
500
-20
500
1000
1500
2000
2500
f (MHz)
3000
1000
1500
2000
2500
f (MHz)
3000
Pi = -45 dBm; VCC = 1.8 V.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
Tamb = 25 °C; VCC = 1.8 V.
1. Pi = -45 dBm
2. Pi = -30 dBm
3. Pi = -20 dBm
4. Pi = -15 dBm
Figure 18. Output return loss as a function of
frequency; typical values
Figure 19. Output return loss as a function of
frequency; typical values
BGU8019
Product data sheet
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Rev. 5 — 21 May 2021
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11 / 19
BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
RLout
(dB)
aaa-009963
0
RLout
(dB)
-4
-4
-8
-8
-12
-20
500
1000
1500
2000
(4)
(3)
(2)
(1)
-12
(4)
(3)
(2)
(1)
-16
aaa-009966
0
-16
2500
f (MHz)
3000
-20
-50
-40
-30
-20
Pi (dBm)
-10
Pi = -45 dBm; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
f = 1575 MHz; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
Figure 20. Output return loss as a function of
frequency; typical values
Figure 21. Output return loss as a function of input
power; typical values
ISL
(dB)
ISL
(dB)
aaa-009967
0
aaa-009968
0
-10
-10
-20
-20
(1)
(2)
(3)
-30
-30
-40
(4)
(3)
(2)
(1)
-40
-50
500
-50
500
1000
1500
2000
2500
f (MHz)
3000
1000
1500
2000
2500
f (MHz)
3000
Pi = -45 dBm; VCC = 1.8 V.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
Tamb = 25 °C; VCC = 1.8 V.
1. Pi = -45 dBm
2. Pi = -30 dBm
3. Pi = -20 dBm
4. Pi = -15 dBm
Figure 22. Isolation as a function of frequency; typical
values
Figure 23. Isolation as a function of frequency; typical
values
BGU8019
Product data sheet
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
aaa-009969
0
ISL
(dB)
-10
aaa-009971
0
ISL
(dB)
-10
-20
(1)
(2)
(3)
(4)
-20
-30
-30
-40
-50
500
(1)
(2)
(4)
(3)
1000
1500
2000
2500
f (MHz)
3000
-40
-50
-40
-30
-20
Pi (dBm)
-10
Pi = -45 dBm; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
f = 1575 MHz; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
Figure 24. Isolation as a function of frequency; typical
values
Figure 25. Isolation as a function of input power; typical
values
Pi(1dB)
(dBm)
aaa-009972
0
Pi(1dB)
(dBm)
-4
-4
-8
-8
(3)
(2)
(1)
-12
(3)
(2)
(1)
-12
-16
-20
1.0
aaa-009973
0
-16
1.5
2.0
2.5
3.0
VCC (V)
3.5
-20
1.0
1.5
2.0
2.5
3.0
VCC (V)
3.5
f = 850 MHz.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
f = 1850 MHz.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
Figure 26. Input power at 1 dB gain compression as a
function of supply voltage; typical values
Figure 27. Input power at 1 dB gain compression as a
function of supply voltage; typical values
BGU8019
Product data sheet
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Rev. 5 — 21 May 2021
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
Pi(1dB)
(dBm)
aaa-009974
0
aaa-009975
8.5
IP3i
(dBm)
6.5
-5
IMD3 at 1575 MHz
-78
IMD3
(dBm)
-82
4.5
-86
2.5
-90
0.5
-94
-1.5
-98
-10
(3)
(2)
(1)
-15
-20
1.0
1.5
2.0
2.5
3.0
VCC (V)
f = 1575 MHz.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
-3.5
1
1.5
2
2.5
3
VCC (V)
-102
3.5
f1 = 1713 MHz; f2 = 1851 MHz; Pi = -20 dBm at f1; Pi = -65
dBm at f2; Tamb = 25 °C.
Figure 28. Input power at 1 dB gain compression as a
function of supply voltage; typical values
K
IP3i
3.5
K
aaa-009976
102
Figure 29. Input third order intercept point and third
order intermodulation distortion as function of supply
voltage; typical values
aaa-009977
102
(1)
(2)
(3)
(4)
10
10
(3)
(2)
(1)
1
1
10-1
10-1
0
2000
4000
6000
8000
f (MHz)
10000
0
2000
4000
6000
8000
f (MHz)
10000
Pi = -45 dBm; VCC = 1.8 V.
1. Tamb = -40 °C
2. Tamb = +25 °C
3. Tamb = +85 °C
Pi = -45 dBm; Tamb = 25 °C.
1. VCC = 1.5 V
2. VCC = 1.8 V
3. VCC = 2.85 V
4. VCC = 3.1 V
Figure 30. Rollett stability factor as a function of
frequency; typical values
Figure 31. Rollett stability factor as a function of
frequency; typical values
BGU8019
Product data sheet
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
10 Package outline
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1.1 x 0.7 x 0.37 mm
(6×)
A
D
SOT1232
e
3
4
e1
E
v
e1
1
pin 1
index area
pin 1
index area
A1
B
y
6
v
y1 C
A
A B
A B
b (6×)
L
(6×)
C
(4×)
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
A1
D
E
min 0.34
0.65 1.05
nom 0.37
0.70 1.10
max 0.40 0.04 0.75 1.15
e1
e
b
0.4
0.4
L
0.17 0.17
0.20 0.20
0.25 0.25
V
Y
Y1
0.1
0.05
0.1
Note
1. Dimension A is including plating thickness.
Outline
version
sot1232_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
13-04-12
13-11-08
SOT1232
Figure 32. Package outline SOT1232 (XSON6)
BGU8019
Product data sheet
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Rev. 5 — 21 May 2021
© NXP B.V. 2021. All rights reserved.
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BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
11 Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe
precautions for handling electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5,
JESD625-A or equivalent standards.
12 Abbreviations
Table 11. Abbreviations
Acronym
Description
ESD
electrostatic discharge
GLONASS
global navigation satellite system
GNSS
global navigation satellite system
GPS
global positioning system
HBM
human body model
MMIC
monolithic microwave-integrated circuit
PCB
printed circuit board
SiGe:C
silicon germanium carbon
13 Revision history
Table 12. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU8019 v.5
20210521
Product data sheet
2021050321
BGU8019 v.4.2
Modifications:
• added Min, and or Max values to some characteristics at 2.85 V
• changed conditions, footnotes, and Minimum, and Typical values on IP3i
• added extra Typical value, and footnote to IMD3
BGU8019 v.4.2
20190516
Modifications:
• added general Marking diagram
BGU8019 v.4.1
20190510
Modifications:
• adapted date code notation to the Marking code table
BGU8019 v.4
20181123
Modifications:
• adapted different min and max values in the characteristics
• adapted in band, and out of band condition to IP3i parameter
• changed the name of the application into GNSS application
BGU8019 v.3
20170118
Modifications:
• Section 1: added GPS1202M according to our new naming convention
BGU8019 v.2
20140603
Product data sheet
-
BGU8019 v.1
BGU8019 v.1
20131112
Preliminary data sheet
-
-
BGU8019
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 21 May 2021
-
BGU8019 v.4.1
-
BGU8019 v.4
-
-
BGU8019 v.3
BGU8019 v.2
© NXP B.V. 2021. All rights reserved.
16 / 19
BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
14 Legal information
14.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
14.2 Definitions
Draft — A draft status on a document indicates that the content is still
under internal review and subject to formal approval, which may result
in modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included in a draft version of a document and shall have no
liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
BGU8019
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 21 May 2021
© NXP B.V. 2021. All rights reserved.
17 / 19
BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
BGU8019
Product data sheet
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Security — Customer understands that all NXP products may be subject
to unidentified or documented vulnerabilities. Customer is responsible
for the design and operation of its applications and products throughout
their lifecycles to reduce the effect of these vulnerabilities on customer’s
applications and products. Customer’s responsibility also extends to other
open and/or proprietary technologies supported by NXP products for use
in customer’s applications. NXP accepts no liability for any vulnerability.
Customer should regularly check security updates from NXP and follow up
appropriately. Customer shall select products with security features that best
meet rules, regulations, and standards of the intended application and make
the ultimate design decisions regarding its products and is solely responsible
for compliance with all legal, regulatory, and security related requirements
concerning its products, regardless of any information or support that may
be provided by NXP. NXP has a Product Security Incident Response Team
(PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation,
reporting, and solution release to security vulnerabilities of NXP products.
14.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 21 May 2021
© NXP B.V. 2021. All rights reserved.
18 / 19
BGU8019
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo, and Compass
Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
9.2
10
11
12
13
14
Product profile .................................................... 1
General description ............................................1
Features and benefits ........................................1
Applications ........................................................2
Quick reference data ......................................... 2
Pinning information ............................................ 3
Ordering information .......................................... 3
Marking code .......................................................3
Limiting values .................................................... 4
Recommended operating conditions ................ 4
Thermal characteristics ......................................4
Characteristics .................................................... 5
Application information ......................................7
GNSS application .............................................. 7
Graphs ............................................................... 7
Package outline .................................................15
Handling information ........................................ 16
Abbreviations .................................................... 16
Revision history ................................................ 16
Legal information .............................................. 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2021.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 May 2021
Document identifier: BGU8019
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