BSP32,115

DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage M3D087 BSP31; BSP32; BSP33 PNP medium power transistors Product data sheet Supersedes data of 1997 Apr 08 1999 Apr 26 NXP Semiconductors Product data sheet PNP medium power transistors BSP31; BSP32; BSP33 FEATURES PINNING • High current (max. 1 A) PIN • Low voltage (max. 80 V). DESCRIPTION 1 base 2, 4 APPLICATIONS collector 3 emitter • Telephony and general industrial applications. DESCRIPTION 4 handbook, halfpage 2, 4 PNP medium power transistor in a SOT223 plastic package. NPN complements: BSP41 and BSP43. 1 3 1 2 3 Top view MAM288 Fig.1 Simplified outline (SOT223) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCBO VCEO PARAMETER collector-base voltage CONDITIONS MIN. MAX. UNIT open emitter BSP31 − −70 V BSP32; BSP33 − −90 V BSP31 − −60 V BSP32; BSP33 − −80 V collector-emitter voltage open base VEBO emitter-base voltage − −5 V IC collector current (DC) − −1 A ICM peak collector current − −2 A IBM peak base current − −200 mA Ptot total power dissipation − 1.3 W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C open collector Tamb = 25 °C; note 1 Note 1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”. 1999 Apr 26 2 NXP Semiconductors Product data sheet PNP medium power transistors BSP31; BSP32; BSP33 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS Rth j-a thermal resistance from junction to ambient Rth j-s thermal resistance from junction to soldering point VALUE UNIT 93 K/W 12 K/W note 1 Note 1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook”. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICBO PARAMETER CONDITIONS MIN. MAX. UNIT IE = 0; VCB = −60 V − −100 nA IE = 0; VCB = −60 V; Tj = 150 °C − −50 μA IC = 0; VEB = −5 V − −100 nA IC = −100 μA; VCE = −5 V; note 1 10 − IC = −100 mA; VCE = −5 V; note 1 40 120 IC = −500 mA; VCE = −5 V; note 1 30 − IC = −100 μA; VCE = −5 V; note 1 30 − IC = −100 mA; VCE = −5 V; note 1 100 300 IC = −500 mA; VCE = −5 V; note 1 50 − collector-emitter saturation voltage IC = −150 mA; IB = −15 mA; note 1 − −250 mV IC = −500 mA; IB = −50 mA; note 1 − −500 mV IC = −150 mA; IB = −15 mA; note 1 − −1 V collector cut-off current IEBO emitter cut-off current hFE DC current gain BSP32 DC current gain BSP31; BSP33 VCEsat VBEsat base-emitter saturation voltage IC = −500 mA; IB = −50 mA; note 1 − −1.2 V Cc collector capacitance IE = ie = 0; VCB = −10 V; f = 1 MHz − 20 pF Ce emitter capacitance IC = ic = 0; VEB = −0.5 V; f = 1 MHz − 120 pF fT transition frequency IC = −50 mA; VCE = −10 V; f = 100 MHz 100 − MHz − 500 ns − 650 ns Switching times (between 10% and 90% levels) ton turn-on time toff turn-off time ICon = −100 mA; IBon = −5 mA; IBoff = 5 mA Note 1. Pulse test: tp ≤ 300 μs; δ ≤ 0.01. 1999 Apr 26 3 NXP Semiconductors Product data sheet PNP medium power transistors BSP31; BSP32; BSP33 PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION SOT223 1999 Apr 26 REFERENCES IEC JEDEC EIAJ SC-73 4 EUROPEAN PROJECTION ISSUE DATE 97-02-28 99-09-13 NXP Semiconductors Product data sheet PNP medium power transistors BSP31; BSP32; BSP33 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 1999 Apr 26 5 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 115002/00/03/pp6 Date of release: 1999 Apr 26 Document order number: 9397 750 05772