BSS83
MOSFET N-channel enhancement switching transistor
Rev. 03 — 21 November 2007 Product data sheet
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NXP Semiconductors
Product specification
MOSFET N-channel enhancement switching transistor
DESCRIPTION Symmetrical insulated-gate silicon MOS field-effect transistor of the N-channel enhancement mode type. The transistor is sealed in a SOT143 envelope and features a low ON resistance and low capacitances. The transistor is protected against excessive input voltages by integrated back-to-back diodes between gate and substrate. APPLICATIONS • analog and/or digital switch • switch driver PINNING 1 2 3 4 = substrate (b) = source = drain = gate Fig.1 Simplified outline and symbol.
1 Top view 2
MAM389
BSS83
Marking code: BSS83 = % M9
handbook, halfpage
4
3
d b g s
Note 1. Drain and source are interchangeable.
QUICK REFERENCE DATA Drain-source voltage Source-drain voltage Drain-substrate voltage Source-substrate voltage Drain current (DC) Total power dissipation up to Tamb = 25 °C Gate-source threshold voltage VDS = VGS; VSB = 0; ID = 1 µA Drain-source ON-resistance VGS = 10 V; VSB = 0; ID = 0.1 mA Feed-back capacitance VGS = VBS = −15 V; VDS = 10 V; f = 1 MHz Crss typ. 0.6 pF RDSon < 45 Ω VGS(th) > < 0.1 V 2.0 V VDS VSD VDB VSB ID Ptot max. max. max. max. max. max. 10 V 10 V 15 V 15 V 50 mA 230 mW
Rev. 03 - 21 November 2007
2 of 9
NXP Semiconductors
Product specification
MOSFET N-channel enhancement switching transistor
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Drain-source voltage Source-drain voltage Drain-substrate voltage Source-substrate voltage Drain current (DC) Total power dissipation up to Tamb = 25 Storage temperature range Junction temperature THERMAL RESISTANCE From junction to ambient in free air(1) Rth j-a = °C(1) VDS VSD VDB VSB ID Ptot Tstg Tj max. max. max. max. max. max. max. 10 V 10 V 15 V 15 V
BSS83
50 mA 230 mW 125 °C
−65 to + 150 °C
430 K/W
Rev. 03 - 21 November 2007
3 of 9
NXP Semiconductors
Product specification
MOSFET N-channel enhancement switching transistor
CHARACTERISTICS Tamb = 25 °C unless otherwise specified Drain-source breakdown voltage VGS = VBS = −5 V; ID = 10 nA Source-drain breakdown voltage VGD = VBD = −5 V; ID = 10 nA Drain-substrate breakdown voltage VGB = 0; ID = 10 nA; open source Source-substrate breakdown voltage VGB = 0; ID = 10 nA; open drain Drain-source leakage current VGS = VBS = −2 V; VDS = 6,6 V Source-drain leakage current VGD = VBD = −2 V; VSD = 6,6 V Forward transconductance at f = 1 kHz VDS = 10 V; VSB = 0; ID = 20 mA Gate-source threshold voltage VDS = VGS; VSB = 0; ID = 1 µA Drain-source ON-resistance ID = 0,1 mA; VGS = 5 V; VSB = 0 VGS = 10 V; VSB = 0 VGS = 3,2 V; VSB = 6,8 V (see Fig.4) Gate-substrate zener voltages VDB = VSB = 0; −IG = 10 µA VDB = VSB = 0; +IG = 10 µA Capacitances at f = 1 MHz VGS = VBS = −15 V; VDS = 10 V Feed-back capacitance Input capacitance Output capacitance Switching times (see Fig.2) VDD = 10 V; Vi = 5 V ton toff Note 1. Device mounted on a ceramic substrate of 8 mm × 10 mm × 0,7 mm. typ. typ. Crss Ciss Coss typ. typ. typ. VZ(1) VZ(2) > > RDSon RDSon RDSon < < typ. < VGS(th) > < gfs > typ. ISDoff < IDSoff < V(BR)SBO > V(BR)DBO > V(BR)SDX > V(BR)DSX >
BSS83
10 V 10 V 15 V 15 V 10 nA 10 nA 10 mS 15 mS 0,1 V 2,0 V
70 Ω 45 Ω 80 Ω 120 Ω 12,5 V 12,5 V
0,6 pF 1,5 pF 1,0 pF 1,0 ns 5,0 ns
Rev. 03 - 21 November 2007
4 of 9
NXP Semiconductors
Product specification
MOSFET N-channel enhancement switching transistor
Pulse generator: Ri tr tf tp δ = < < = < 50 Ω 0,5 ns 1,0 ns 20 ns 0,01
BSS83
handbook, full pagewidth
VDD
50 Ω
0.1 µF Vo 630 Ω INPUT
90%
90%
10% tr tf ton 90%
10% toff 90%
Vi 50 Ω
T.U.T
OUTPUT
MBK297
10%
10%
MBK296
Fig.2 Switching times test circuit and input and output waveforms.
handbook, halfpage
60
MDA250
handbook, halfpage
1.2
MDA251
ID (mA) 40
VGS = 4.5 V 4V
ID (mA) 0.8 3.5 V 3V
VGS = 10 V
5V
4V
3.2 V 3V
20
2.5 V 2V
0.4 2V
0 0 4 8 VDS (V) 12
0 0 40 80 VDSon (mV) 120
Tj = 25 °C.
Tj = 25 °C.
Fig.3 VSB = 0; typical values.
Fig.4 VSB = 6,8 V; typical values.
Rev. 03 - 21 November 2007
5 of 9
NXP Semiconductors
Product specification
MOSFET N-channel enhancement switching transistor
BSS83
handbook, halfpage
50
MDA252
ID (mA) 40
handbook, halfpage
12
MDA253
ID (mA) 8
VSB = 0 V 4 V 12 V 8V
30
20 4 10
0 0 1 2 3 VGS (V) 4
0 0 1 2 3 VGSth (V) 4
Tj = 25 °C.
Tj = 25 °C.
Fig.5 VDS = 10 V; VBS = 0; typical values.
Fig.6 VDS = VGS = VGS(th).
handbook, halfpage
1.2
MDA254
ID (mA) 0.8
VGS = 10 V 5 V 4 V
3V
2V
0.4
0 0 20 40 60 80 100 VDSon (mV)
Tj = 25 °C.
Fig.7 VSB = 0; typical values.
Rev. 03 - 21 November 2007
6 of 9
NXP Semiconductors
Product specification
MOSFET N-channel enhancement switching transistor
PACKAGE OUTLINE Plastic surface mounted package; 4 leads
BSS83
SOT143B
D
B
E
A
X
y vMA HE
e bp wM B
4
3
Q
A
A1 c
1
b1 e1
2
Lp detail X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max 0.1 bp 0.48 0.38 b1 0.88 0.78 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 1.7 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1 y 0.1
OUTLINE VERSION SOT143B
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
Rev. 03 - 21 November 2007
7 of 9
NXP Semiconductors
BSS83
MOSFET N-channel enhancement switching transistor
Legal information
Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
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Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
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For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
Rev. 03 - 21 November 2007
8 of 9
NXP Semiconductors
BSS83
MOSFET N-channel enhancement switching transistor
Revision history
Revision history Document ID BSS83_N_3 Modifications: BSS83_CNV_2 Release date 20071121 Data sheet status Product data sheet Product specification Change notice Supersedes BSS83_CNV_2 -
•
Page 2; column 2; Marking code; row 1 changed
19910401
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 November 2007 Document identifier: BSS83_N_3