BTA204S-800C

BTA204S series B and C Three-quadrant triacs high commutation Rev. 03 — 24 May 2005 Product data sheet 1. Product profile 1.1 General description Passivated high commutation triac in a SOT428 (DPAK) plastic package. Intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. These devices will commutate the full rated RMS current at the maximum rated junction temperature, without the aid of a snubber. 1.2 Features s High maximum junction temperature s High commutation capability 1.3 Applications s Motor control s Industrial and domestic heating 1.4 Quick reference data s VDRM ≤ 600 V (BTA204S-600B) s VDRM ≤ 600 V (BTA204S-600C) s ITSM ≤ 25 A s VDRM ≤ 800 V (BTA204S-800B) s VDRM ≤ 800 V (BTA204S-800C) s IT(RMS) ≤ 4 A 2. Pinning information Table 1: Pin 1 2 3 mb Pinning Description main terminal 1 (T1) main terminal 2 (T2) gate (G) mounting base [1] Simplified outline mb Symbol T2 sym051 T1 G 2 1 3 SOT428 (DPAK) [1] Connected to main terminal 2 (T2) Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 3. Ordering information Table 2: Ordering information Package Name BTA204S-600B BTA204S-600C BTA204S-800B BTA204S-800C DPAK Description plastic single-ended surface mounted package; 3 leads (one lead cropped) Version SOT428 Type number 4. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDRM IT(RMS) ITSM Parameter repetitive peak off-state voltage RMS on-state current non-repetitive peak on-state current Conditions BTA204S-600B; BTA204S-600C BTA204S-800B; BTA204S-800C full sine wave; Tmb ≤ 107 °C; see Figure 4 and 5 full sine wave; Tj = 25 °C prior to surge; see Figure 2 and 3 t = 20 ms t = 16.7 ms I2t dIT/dt IGM VGM PGM PG(AV) Tstg Tj [1] [1] Min - Max 600 800 4 Unit V V A - 25 27 3.1 100 2 5 5 0.5 +150 125 A A A2s A/µs A V W W °C °C I2t for fusing t = 10 ms ITM = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/µs repetitive rate of rise of on-state current after triggering peak gate current peak gate voltage peak gate power average gate power storage temperature junction temperature over any 20 ms period −40 - Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 6 A/µs. 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 2 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 8 Ptot (W) 6 α α 001aac660 101 Tmb(max) 104 (°C) 107 110 113 116 α = 180 120 90 60 30 4 2 119 122 0 0 1 2 3 4 IT(RMS) (A) 5 125 α = conduction angle Fig 1. Total power dissipation as a function of RMS on-state current; maximum values 30 IT ITSM (A) 20 001aac331 ITSM t T Tj(init) = 25 °C max 10 0 1 10 102 n 103 f = 50 Hz Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal cycles; maximum values 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 3 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 103 IT ITSM (A) 001aac330 ITSM t T Tj(init) = 25 °C max 102 (2) (1) 10 10−5 10−4 10−3 10−2 t (s) 10−1 tp ≤ 20 ms (1) dlT/dt limit (2) T2− G+ quadrant Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values 12 IT(RMS) (A) 8 3 001aac333 5 IT(RMS) (A) 4 001aac662 107 °C 2 4 1 0 10−2 10−1 1 10 surge duration (s) 0 −50 0 50 100 Tmb (°C) 150 f = 50 Hz; Tmb ≤ 107 °C Fig 4. RMS on-state current as a function of surge duration; maximum values Fig 5. RMS on-state current as a function of mounting base temperature 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 4 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 5. Thermal characteristics Table 4: Rth(j-mb) Rth(j-a) Thermal characteristics Conditions full cycle half cycle printed-circuit board (FR4) mounted as in Figure 13 Min Typ 75 Max 3.0 3.7 Unit K/W K/W K/W thermal resistance from junction to mounting base thermal resistance from junction to ambient Symbol Parameter 10 unidirectional Zth(j−mb) (K/W) 1 bidirectional 001aac681 10−1 PD 10−2 10−5 tp t 10−4 10−3 10−2 10−1 1 tp (S) 10 Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 5 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 6. Static characteristics Table 5: Static characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions BTA204S-600B BTA204S-800B Min IGT gate trigger current VD = 12 V; IT = 0.1 A see Figure 8 T2+ G+ T2+ G− T2− G− IL latching current VD = 12 V; IGT = 0.1 A; see Figure 10 T2+ G+ T2+ G− T2− G− IH VT VGT ID holding current on-state voltage gate trigger voltage off-state leakage current VD = 12 V; IGT = 0.1 A; see Figure 11 IT = 5 A; see Figure 9 VD = 12 V; IT = 0.1 A; see Figure 7 VD = 400 V; IT = 0.1 A; Tj = 125 °C VD = VDRM(max); Tj = 125 °C 0.25 1.4 0.7 0.4 0.1 30 45 30 30 1.7 1.5 0.5 0.25 1.4 0.7 0.4 0.1 20 30 20 20 1.7 1.5 0.5 mA mA mA mA V V V mA [1] BTA204S-600C BTA204S-800C Min Typ Max 35 35 35 Unit Typ - Max 50 50 50 mA mA mA [1] Device does not trigger in the T2− G+ quadrant. 1.6 VGT (Tj) VGT (25°C) 1.2 001aac334 3 IGT (Tj) IGT (25°C) 2 (2) 001aac677 (1) (3) 0.8 1 0.4 −50 0 50 100 Tj (°C) 150 0 −50 0 50 100 Tj (°C) 150 (1) T2− G− (2) T2+ G− (3) T2+ G+ Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. Normalized gate trigger current as a function of junction temperature 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 6 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 12 IT (A) 8 (1) (2) (3) 001aac338 3 IL(Tj) IL(25°C) 2 001aac336 4 1 0 0 1 2 VT (V) 3 0 −50 0 50 100 Tj (°C) 150 VO = 1.27 V; RS = 0.091 Ω (1) Tj = 125 °C; typical values (2) Tj = 25 °C; maximum values (3) Tj = 125 °C; maximum values Fig 9. On-state current as a function of on-state voltage; typical values 3 IH(Tj) IH(25°C) 2 Fig 10. Normalized latching current as a function of junction temperature 001aac337 1 0 −50 0 50 100 Tj (°C) 150 Fig 11. Normalized holding current as a function of junction temperature 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 7 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 7. Dynamic characteristics Table 6: Dynamic characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions BTA204S-600B BTA204S-800B Min Typ dVD/dt critical rate of rise of off-state voltage critical rate of change of commutating current VDM = 0.67VDRM(max); Tj = 125 °C; exponential waveform; gate open circuit VDM = 400 V; Tj = 125 °C; IT(RMS) = 4A; dVcom/dt = 20 V/µs; gate open circuit 1000 Max BTA204S-600C BTA204S-800C Min Typ 1000 Max V/µs Unit dIcom/dt 6 - - 3 - - A/ms tgt gate controlled turn-on time ITM = 12 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs - 2 - - 2 - µs 8. Package information Refer to mounting instructions for SOT428 (DPAK) package. Plastic meets requirements of UL94 V-0 at 1⁄8 inch. 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 8 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 9. Package outline Plastic single-ended surface mounted package (DPAK); 3 leads (one lead cropped) SOT428 y E b2 A A1 A E1 mounting base D1 HD D2 2 L2 1 3 L L1 b1 e e1 b w M A c 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 2.38 2.22 A1 0.93 0.73 b 0.89 0.71 b1 1.1 0.9 b2 5.46 5.00 c 0.56 0.20 D1 6.22 5.98 D2 min 4.0 E 6.73 6.47 E1 min 4.45 e 2.285 e1 4.57 HD 10.4 9.6 L 2.95 2.55 L1 min 0.5 L2 0.9 0.5 w 0.2 y max 0.2 OUTLINE VERSION SOT428 REFERENCES IEC JEDEC TO-252 JEITA SC-63 EUROPEAN PROJECTION ISSUE DATE 05-02-09 05-02-11 Fig 12. Package outline SOT428 (DPAK) 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 9 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 10. Mounting 7.00 6.15 5.90 5.80 1.80 1.00 4.60 5.75 5.65 4.725 6.50 1.15 3.60 2.45 6.00 6.00 6.125 2.40 2.30 0.30 solder lands solder resist occupied area solder paste 1.50 1.30 1.40 1.65 4.57 SOT428 Dimensions in mm Fig 13. SOT428 (DPAK): minimum pad sizes for surface mounting 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 10 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 11. Revision history Table 7: Revision history Release date Data sheet status 20050524 Product data sheet Change notice Doc. number 9397 750 14862 Supersedes BTA204S_SERIES_B_C_2 Document ID BTA204S_SER_B_C_3 Modifications: • • • The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors 500 V types removed Alternative pinning types removed Product specification Objective specification n.a. n.a. BTA204S_SERIES_B_C_1 - BTA204S_SERIES_B_C_2 19981201 BTA204S_SERIES_B_C_1 19971001 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 11 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 12. Data sheet status Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). III Product data Production [1] [2] [3] Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 13. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 15. Trademarks Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 16. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com 9397 750 14862 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 — 24 May 2005 12 of 13 Philips Semiconductors BTA204S series B and C Three-quadrant triacs high communication 17. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Package information . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information . . . . . . . . . . . . . . . . . . . . 12 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 24 May 2005 Document number: 9397 750 14862 Published in The Netherlands