BTA208-600D,127

TO -2 20A B BTA208-600D 3Q Hi-Com Triac 11 August 2014 Product data sheet 1. General description Planar passivated high commutation three quadrant triac in a SOT78 (TO-220AB) plastic package. This "series D" triac balances the requirements of commutation performance and gate sensitivity and is intended for interfacing with low power drivers and logic ICs including microcontrollers 2. Features and benefits • • • • • • • 3Q technology for improved noise immunity Direct interfacing with low power drivers and logic ICs High commutation capability High voltage capability Planar passivated for voltage ruggedness and reliability Triggering in three quadrants only Very sensitive gate for easy logic level triggering 3. Applications • • Electronic thermostats General purpose motor controls 4. Quick reference data Table 1. Quick reference data Symbol Parameter VDRM Conditions Min Typ Max Unit repetitive peak offstate voltage - - 600 V ITSM non-repetitive peak on- full sine wave; Tj(init) = 25 °C; state current tp = 20 ms; Fig. 4; Fig. 5 - - 65 A IT(RMS) RMS on-state current - - 8 A - - 5 mA - - 5 mA full sine wave; Tmb ≤ 102 °C; Fig. 1; Fig. 2; Fig. 3 Static characteristics IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 Scan or click this QR code to view the latest information for this product BTA208-600D NXP Semiconductors 3Q Hi-Com Triac Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2- G-; - - 5 mA Tj = 25 °C; Fig. 7 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate mb T2 mounting base; main terminal 2 mb Graphic symbol T2 sym051 T1 G 1 2 3 TO-220AB (SOT78) 6. Ordering information Table 3. Ordering information Type number BTA208-600D BTA208-600D Product data sheet Package Name Description Version TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 2 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VDRM repetitive peak off-state voltage IT(RMS) RMS on-state current full sine wave; Tmb ≤ 102 °C; Fig. 1; Min Max Unit - 600 V - 8 A - 65 A - 71 A Fig. 2; Fig. 3 ITSM non-repetitive peak on-state current full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 full sine wave; Tj(init) = 25 °C; tp = 16.7 ms I t I t for fusing tp = 10 ms; SIN - 21 A s dIT/dt rate of rise of on-state current IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C 2 2 over any 20 ms period 003aaf581 10 IT(RMS) (A) Fig. 1. 20 6 15 4 10 2 5 0 - 50 0 50 100 0 10- 2 150 Tmb (°C) RMS on-state current as a function of mounting base temperature; maximum values Fig. 2. BTA208-600D Product data sheet 003aaf617 25 IT(RMS) (A) 102 °C 8 2 1 10 surge duration (s) f = 50 Hz; Tmb = 102 °C RMS on-state current as a function of surge duration; maximum values All information provided in this document is subject to legal disclaimers. 11 August 2014 10- 1 © NXP Semiconductors N.V. 2014. All rights reserved 3 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac 003aaf618 12 Ptot (W) 10 8 6 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α = 180° 120° 101 Tmb(max) (°C) 105 90° α 109 60° 30° 113 4 117 2 121 0 0 2 4 6 8 125 10 IT(RMS) (A) α = conduction angle a = form factor = IT(RMS) / IT(AV) Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values 003aaa968 80 ITSM (A) 60 40 ITSM IT 20 t 1/f 0 Tj(init) = 25 °C max 1 102 10 number of cycles 103 f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA208-600D Product data sheet All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 4 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac 003aab121 103 ITSM IT t ITSM (A) tp Tj(init) = 25 °C max (1) 102 10 10- 2 10- 1 1 10 tp (ms) 102 tp ≤ 20 ms (1) dIT/dt limit Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values BTA208-600D Product data sheet All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 5 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base full cycle; Fig. 6 - - 2 K/W half cycle; Fig. 6 - - 2.4 K/W thermal resistance from junction to ambient in free air - 60 - K/W Rth(j-a) 003aag087 10 (1) Zth(j-mb) (K/W) (2) 1 10-1 10-2 10-5 P tp 10-4 10-3 10-2 10-1 1 tp (s) t 10 (1) Unidirectional (half cycle) (2) Bidirectional (full cycle) Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width BTA208-600D Product data sheet All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 6 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; - - 5 mA - - 5 mA - - 5 mA - - 15 mA - - 15 mA - - 25 mA Static characteristics IGT gate trigger current Tj = 25 °C; Fig. 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 7 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; Fig. 7 IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; Fig. 8 VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; Fig. 8 VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; Fig. 8 IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - - 15 mA VT on-state voltage IT = 10 A; Tj = 25 °C; Fig. 10 - - 1.65 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; - 0.7 1 V 0.25 0.4 - V VD = 600 V; Tj = 125 °C - - 0.5 mA VDM = 402 V; Tj = 110 °C; (VDM = 67% 20 - - V/µs 6 - - A/ms 2 - - A/ms Fig. 11 VD = 400 V; IT = 0.1 A; Tj = 125 °C; Fig. 11 ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage of VDRM); exponential waveform; gate open circuit dIcom/dt rate of change of commutating current VD = 400 V; Tj = 125 °C; IT(RMS) = 8 A; dVcom/dt = 0.1 V/µs; gate open circuit VD = 400 V; Tj = 125 °C; IT(RMS) = 8 A; dVcom/dt = 10 V/µs; gate open circuit; Fig. 12 BTA208-600D Product data sheet All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 7 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac 3 003aac888 001aab100 3 (1) IGT IL IL(25°C) IGT(25°C) 2 2 (2) (3) 1 1 0 - 50 0 50 100 Tj (°C) 0 -50 150 (1) T2- G(2) T2+ G(3) T2+ G+ Fig. 7. Fig. 8. 0 50 100 Tj (°C) 150 Normalized latching current as a function of junction temperature Normalized gate trigger current as a function of junction temperature 001aab099 3 003aaa971 25 IT (A) IH IH(25°C) 20 2 15 10 1 5 0 -50 Fig. 9. 0 50 100 Tj (°C) 0 150 (1) 0 (2) 1 (3) 2 VT (V) 3 Vo = 1.264 V; Rs = 0.0378 Ω Normalized holding current as a function of junction temperature (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 10. On-state current as a function of on-state voltage BTA208-600D Product data sheet All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 8 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac 001aab101 1.6 VGT 003aag068 103 VGT(25°C) dlcom/dt (A/ms) 1.2 102 0.8 10 0.4 -50 0 50 100 Tj (°C) 1 150 20 60 100 Tj (°C) 140 Fig. 11. Normalized gate trigger voltage as a function of Fig. 12. Rate of change of commutating current as a junction temperature function of junction temperature; minimum values BTA208-600D Product data sheet All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 9 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac 10. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 E A A1 p q mounting base D1 D L1(1) L2(1) Q L b1(2) (3×) b2(2) (2×) 1 2 3 b(3×) e c e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) L2(1) max. p q Q mm 4.7 4.1 1.40 1.25 0.9 0.6 1.6 1.0 1.3 1.0 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 2.54 15.0 12.8 3.30 2.79 3.0 3.8 3.5 3.0 2.7 2.6 2.2 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. OUTLINE VERSION SOT78 REFERENCES IEC JEDEC JEITA 3-lead TO-220AB SC-46 EUROPEAN PROJECTION ISSUE DATE 08-04-23 08-06-13 Fig. 13. Package outline TO-220AB (SOT78) BTA208-600D Product data sheet All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 10 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 11. Legal information 11.1 Data sheet status Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. 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A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. 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Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 11 / 13 BTA208-600D NXP Semiconductors 3Q Hi-Com Triac grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. 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Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 2 6 Ordering information ............................................. 2 7 Limiting values .......................................................3 8 Thermal characteristics .........................................6 9 Characteristics ....................................................... 7 10 Package outline ................................................... 10 11 11.1 11.2 11.3 11.4 Legal information .................................................11 Data sheet status ............................................... 11 Definitions ...........................................................11 Disclaimers .........................................................11 Trademarks ........................................................ 12 © NXP Semiconductors N.V. 2014. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 August 2014 BTA208-600D Product data sheet All information provided in this document is subject to legal disclaimers. 11 August 2014 © NXP Semiconductors N.V. 2014. All rights reserved 13 / 13