BTA208S-600F,118

DP AK BTA208S-600F 3Q Hi-Com Triac Rev. 5 — 13 April 2011 Product data sheet 1. Product profile 1.1 General description Planar passivated high commutation three quadrant triac in a SOT428 plastic package. This "series F" triac balances the requirements of commutation performance and gate sensitivity. The "less sensitive gate" "series F" is intended for interfacing with low power drivers including microcontrollers. 1.2 Features and benefits „ 3Q technology for improved noise immunity „ Less sensitive gate suitable for higher "noise" environment applications „ Good immunity to false turn-on by dV/dt „ Planar passivated for voltage ruggedness and reliability „ High commutation capability with maximum false trigger immunity „ Surface-mountable package „ Triggering in three quadrants only „ High voltage capability 1.3 Applications „ Electronic thermostats „ General purpose motor controls 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VDRM repetitive peak off-state voltage ITSM non-repetitive peak on-state current IT(RMS) RMS on-state current Conditions Min Typ Max Unit - - 600 V full sine wave; Tj(init) = 25 °C; tp = 20 ms; see Figure 4; see Figure 5 - - 65 A full sine wave; Tmb ≤ 102 °C; see Figure 1; see Figure 2; see Figure 3 - - 8 A BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac Table 1. Symbol Quick reference data …continued Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 7 - - 25 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 7 - - 25 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; see Figure 7 - - 25 mA Static characteristics IGT gate trigger current 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate mb T2 mounting base; main terminal 2 Simplified outline mb Graphic symbol T2 T1 G sym051 2 1 3 SOT428 (DPAK) 3. Ordering information Table 3. Ordering information Type number BTA208S-600F BTA208S-600F Product data sheet Package Name Description Version DPAK plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) SOT428 All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 2 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VDRM repetitive peak off-state voltage IT(RMS) RMS on-state current ITSM non-repetitive peak on-state current Min Max Unit - 600 V full sine wave; Tmb ≤ 102 °C; see Figure 1; see Figure 2; see Figure 3 - 8 A full sine wave; Tj(init) = 25 °C; tp = 20 ms; see Figure 4; see Figure 5 - 65 A full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 72 A I2t I2t for fusing tp = 10 ms; sine-wave pulse - 21 A2s dIT/dt rate of rise of on-state current IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs IGM peak gate current - 2 A VGM peak gate voltage - 5 V PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C over any 20 ms period 003aaf581 10 IT(RMS) IT(RMS) (A) 102 °C (A) 8 20 6 15 4 10 2 5 0 −50 Fig 1. 003aaf617 25 0 0 50 100 150 Tmb (°C) RMS on-state current as a function of heatsink temperature; maximum values BTA208S-600F Product data sheet Fig 2. 10−2 10−1 1 10 surge duration (s) RMS on-state current as a function of surge duration; maximum value All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 3 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 003aaf618 12 Ptot (W) 10 8 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 α = 180° 120° 101 Tmb(max) (°C) 105 90° α 109 60° 6 113 30° 4 117 2 121 0 0 2 4 6 125 10 8 IT(RMS) (A) Fig 3. Total power dissipation as a function of RMS on-state current; maximum values 003aaa968 80 ITSM (A) 60 40 IT 20 ITSM t T Tj(init) = 25 °C max 0 1 102 10 103 number of cycles Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA208S-600F Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 4 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 003aab121 103 ITSM IT t ITSM (A) tp Tj(init) = 25 °C max (1) 102 10 10−2 10−1 1 102 10 tp (ms) Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base full cycle; see Figure 6 - - 2 K/W half cycle; see Figure 6 - - 2.4 K/W in free air - 75 - K/W thermal resistance from junction to ambient Rth(j-a) 003aaf584 10 Zth(j-mb) (K/W) unidirectional 1 bidirectional 10−1 P tp 10−2 10−5 10−4 10−3 10−2 10−1 1 t 10 tp (s) Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width BTA208S-600F Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 5 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 7 - - 25 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 7 - - 25 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; see Figure 7 - - 25 mA VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 8 - - 30 mA VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 8 - - 40 mA VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; see Figure 8 - - 40 mA Static characteristics IGT IL gate trigger current latching current IH holding current VD = 12 V; Tj = 25 °C; see Figure 9 - - 30 mA VT on-state voltage IT = 10 A; Tj = 25 °C; see Figure 10 - - 1.65 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; see Figure 11 - - 1.5 V VD = 400 V; IT = 0.1 A; Tj = 125 °C; see Figure 11 0.25 - - V VD = 600 V; Tj = 125 °C - - 0.5 mA ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 110 °C; exponential waveform; gate open circuit 70 - - V/µs dIcom/dt rate of change of commutating current VD = 400 V; Tj = 125 °C; IT(RMS) = 8 A; dVcom/dt = 10 V/µs; gate open circuit; see Figure 12 14 - - A/ms BTA208S-600F Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 6 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 003aac888 3 001aab100 3 (1) IGT IL IGT(25°C) IL(25°C) 2 2 (2) (3) 1 1 0 −50 0 50 100 0 −50 150 Tj (°C) 0 50 100 150 Tj (°C) (1) T2- G(2) T2+ G(3) T2+ G+ Fig 7. Normalized gate trigger current as a function of junction temperature 001aab099 3 Fig 8. Normalized latching current as a function of junction temperature 003aaa971 25 IT (A) IH IH(25°C) 20 2 15 10 1 5 (1) 0 −50 (2) (3) 0 0 50 100 150 0 1 2 VT (V) Tj (°C) 3 Vo = 1.264 V; Rs = 0.0378 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. Normalized holding current as a function of junction temperature BTA208S-600F Product data sheet Fig 10. On-state current as a function of on-state voltage All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 7 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 001aab101 1.6 003aaa973 103 VGT dIcom/dt (A/ms) VGT(25°C) 102 1.2 typ min 0.8 0.4 −50 10 1 0 50 100 150 Fig 11. Normalized gate trigger voltage as a function of junction temperature BTA208S-600F Product data sheet 20 Tj (°C) 60 100 Tj (°C) 140 Fig 12. Rate of change of commutating current as a function of junction temperature; typical and minimum values All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 8 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 7. Package outline Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) SOT428 y E A A A1 b2 E1 mounting base D2 D1 HD 2 L L2 1 L1 3 b1 b w M c A e e1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 b2 c D1 D2 min E E1 min e e1 HD L L1 min L2 w y max mm 2.38 2.22 0.93 0.46 0.89 0.71 1.1 0.9 5.46 5.00 0.56 0.20 6.22 5.98 4.0 6.73 6.47 4.45 2.285 4.57 10.4 9.6 2.95 2.55 0.5 0.9 0.5 0.2 0.2 OUTLINE VERSION SOT428 REFERENCES IEC JEDEC JEITA TO-252 SC-63 EUROPEAN PROJECTION ISSUE DATE 06-02-14 06-03-16 Fig 13. Package outline SOT428 (DPAK) BTA208S-600F Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 9 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BTA208S-600F v.5 20110413 - Modifications: BTA208S_SERIES_D_E_F_4 BTA208S-600F Product data sheet Product data sheet BTA208S_SERIES_D_E_F_4 • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Type number BTA208S-600F separated from data sheet BTA208S_SERIES_D_E_F_4. 20020301 Product specification - All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 BTA208S_SERIES_D_E_F_3 © NXP B.V. 2011. All rights reserved. 10 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 9. Legal information 9.1 Data sheet status Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective BTA208S-600F Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 11 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BTA208S-600F Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 April 2011 © NXP B.V. 2011. All rights reserved. 12 of 13 BTA208S-600F NXP Semiconductors 3Q Hi-Com Triac 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Contact information. . . . . . . . . . . . . . . . . . . . . .12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 April 2011 Document identifier: BTA208S-600F