BTA208X-800B

TO -2 20F BTA208X-800B 3Q Hi-Com Triac Rev. 03 — 3 February 2011 Product data sheet 1. Product profile 1.1 General description Planar passivated high commutation three quadrant triac in a SOT186A "full pack" plastic package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. This "series B" triac will commutate the full rated RMS current at the maximum rated junction temperature without the aid of a snubber. 1.2 Features and benefits  3Q technology for improved noise immunity  High commutation capability with maximum false trigger immunity  High immunity to false turn-on by dV/dt  High voltage capability  Isolated mounting base package  Planar passivated for voltage ruggedness and reliability  Triggering in three quadrants only 1.3 Applications  Electronic thermostats  General purpose motor controls  Rectifier-fed DC inductive loads e.g. DC motors and solenoids 1.4 Quick reference data Table 1. Symbol VDRM ITSM Quick reference data Parameter repetitive peak off-state voltage non-repetitive peak on-state current RMS on-state current full sine wave; Tj(init) = 25 °C; tp = 20 ms; see Figure 4; see Figure 5 full sine wave; Th ≤ 73 °C; see Figure 3; see Figure 1; see Figure 2 VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 7 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; see Figure 7 Conditions Min Typ Max Unit 800 65 V A IT(RMS) - - 8 A Static characteristics IGT gate trigger current 2 2 2 18 21 34 50 50 50 mA mA mA NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 2. Pinning information Table 2. Pin 1 2 3 mb Pinning information Symbol Description T1 T2 G n.c. main terminal 1 main terminal 2 gate mounting base; isolated mb T2 sym051 Simplified outline Graphic symbol T1 G 123 SOT186A (TO-220F) 3. Ordering information Table 3. Ordering information Package Name BTA208X-800B TO-220F Description plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 "full pack" Version SOT186A Type number 4. Limiting values Table 4. Symbol VDRM IT(RMS) ITSM Limiting values Parameter repetitive peak off-state voltage RMS on-state current non-repetitive peak on-state current full sine wave; Th ≤ 73 °C; see Figure 3; see Figure 1; see Figure 2 full sine wave; Tj(init) = 25 °C; tp = 20 ms; see Figure 4; see Figure 5 full sine wave; Tj(init) = 25 °C; tp = 16.7 ms I2t dIT/dt IGM VGM PGM PG(AV) Tstg Tj I2t for fusing rate of rise of on-state current peak gate current peak gate voltage peak gate power average gate power storage temperature junction temperature over any 20 ms period tp = 10 ms; sine-wave pulse IT = 0.2 A; IG = 0.2 A; dIG/dt = 0.2 A/µs Conditions Min -40 Max 800 8 65 71 21 100 2 5 5 0.5 150 125 Unit V A A A A2s A/µs A V W W °C °C In accordance with the Absolute Maximum Rating System (IEC 60134). BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 2 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 10 IT(RMS) (A) 8 73 °C 003aaa969 25 IT(RMS) (A) 20 003aaa970 6 15 4 10 2 5 0 −50 0 0 50 100 Th (°C) 150 10−2 10−1 1 10 surge duration (s) Fig 1. RMS on-state current as a function of heatsink temperature; maximum values Fig 2. RMS on-state current as a function of surge duration; maximum values 003aaa967 12 Ptot (W) 10 conduction angle (degrees) 30 60 90 120 180 form factor a 4 2.8 2.2 1.9 1.57 α = 180° 120° α 90° 60° 30° 71 Th(max) (°C) 80 8 89 6 98 4 107 2 116 0 0 2 4 6 8 IT(RMS) (A) 125 10 Fig 3. Total power dissipation as a function of RMS on-state current; maximum values BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 3 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 80 ITSM (A) 60 003aaa968 40 IT 20 ITSM t T Tj(init) = 25 °C max 0 1 10 102 number of cycles 103 Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values 003aab121 103 IT ITSM (A) (1) 102 ITSM t tp Tj(init) = 25 °C max 10 10−2 10−1 1 10 tp (ms) 102 Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 4 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 5. Thermal characteristics Table 5. Symbol Rth(j-h) Thermal characteristics Parameter thermal resistance from junction to heatsink Conditions full cycle or half cycle; with heatsink compound; see Figure 6 full cycle or half cycle; without heatsink compound; see Figure 6 Rth(j-a) thermal resistance from junction to ambient in free air Min Typ 55 Max 4.5 6.5 Unit K/W K/W K/W 10 Zth(j-h) (K/W) 1 (1) (2) 003aaf915 (3) (4) 10−1 P 10−2 t tp 10−3 10−5 10−4 10−3 10−2 10−1 1 tp (s) 10 (1) Unidirectional (half cycle) without heatsink compound (2) Unidirectional (half cycle) with heatsink compound (3) Bidirectional (full cycle) without heatsink compound (4) Bidirectional (full cycle) with heatsink compound Fig 6. Transient thermal impedance from junction to heatsink as a function of pulse duration 6. Isolation characteristics Table 6. Symbol Visol(RMS) Isolation characteristics Parameter RMS isolation voltage Conditions from all terminals to external heatsink; sinusoidal waveform; clean and dust free ; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; Th = 25 °C from main terminal 2 to external heatsink ; f = 1 MHz; Th = 25 °C Min Typ Max 2500 Unit V Cisol isolation capacitance - 10 - pF BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 5 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 7. Characteristics Table 7. Symbol IGT Characteristics Parameter gate trigger current Conditions VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 7 VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 7 VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; see Figure 7 IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 8 VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 8 VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; see Figure 8 IH VT VGT holding current on-state voltage gate trigger voltage VD = 12 V; Tj = 25 °C; see Figure 9 IT = 10 A; Tj = 25 °C; see Figure 10 VD = 12 V; IT = 0.1 A; Tj = 25 °C; see Figure 11 VD = 400 V; IT = 0.1 A; Tj = 125 °C ID dVD/dt dIcom/dt off-state current rate of rise of off-state voltage rate of change of commutating current VD = 800 V; Tj = 125 °C VDM = 536 V; Tj = 125 °C; exponential waveform; gate open circuit VD = 400 V; Tj = 125 °C; IT(RMS) = 8 A; dVcom/dt = 20 V/µs; gate open circuit; snubberless condition; see Figure 12 Dynamic characteristics 1000 4000 14 V/µs A/ms Min 2 2 2 0.25 Typ 18 21 34 31 34 30 31 1.3 0.7 0.4 0.1 Max 50 50 50 60 90 60 60 1.65 1.5 0.5 Unit mA mA mA mA mA mA mA V V V mA Static characteristics BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 6 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 3 (1) 003aac888 3 IL IL(25°C) 2 001aab100 IGT IGT(25°C) 2 (2) (3) 1 1 0 −50 0 50 100 Tj (°C) 150 0 −50 0 50 100 Tj (°C) 150 (1) T2- G(2) T2+ G(3) T2+ G+ Fig 7. Normalized gate trigger current as a function of junction temperature 3 IH IH(25°C) 2 15 001aab099 Fig 8. Normalized latching current as a function of junction temperature 25 003aaa971 IT (A) 20 10 1 5 (1) (2) (3) 0 −50 0 0 50 100 Tj (°C) 150 0 1 2 VT (V) 3 Vo = 1.264 V; Rs = 0.0378 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. Normalized holding current as a function of junction temperature Fig 10. On-state current as a function of on-state voltage BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 7 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 1.6 VGT VGT(25°C) 1.2 001aab101 103 dIcom/dt (A/ms) 102 typ min 003aaa973 0.8 10 0.4 −50 1 0 50 100 Tj (°C) 150 20 60 100 Tj (°C) 140 Fig 11. Normalized gate trigger voltage as a function of junction temperature Fig 12. Rate of change of commutating current as a function of junction temperature; typical and minimum values BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 8 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 8. Package outline Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 'full pack' SOT186A E P q D1 T mounting base A A1 D j L2 b1 L b2 L1 K Q 1 2 b e e1 3 wM c 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.6 4.0 A1 2.9 2.5 b 0.9 0.7 b1 1.1 0.9 b2 1.4 1.0 c 0.7 0.4 D 15.8 15.2 D1 6.5 6.3 E 10.3 9.7 e 2.54 e1 5.08 j 2.7 1.7 K 0.6 0.4 L L1 L2 max. 3 (1) P 3.2 3.0 Q 2.6 2.3 q 3.0 2.6 T (2) w 0.4 14.4 3.30 13.5 2.79 2.5 Notes 1. Terminal dimensions within this zone are uncontrolled. 2. Both recesses are ∅ 2.5 × 0.8 max. depth OUTLINE VERSION SOT186A REFERENCES IEC JEDEC 3-lead TO-220F JEITA EUROPEAN PROJECTION ISSUE DATE 02-04-09 06-02-14 Fig 13. Package outline SOT186A (TO-220F) BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 9 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 9. Revision history Table 8. Revision history Release date 20110203 Data sheet status Product data sheet Product data sheet Change notice Supersedes BTA208X-800B v.2 BTA208X_SERIES_B v.1 Document ID BTA208X-800B v.3 Modifications: BTA208X-800B v.2 • Various changes to content. 20101109 BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 10 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 11 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BTA208X-800B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 03 — 3 February 2011 12 of 13 NXP Semiconductors BTA208X-800B 3Q Hi-Com Triac 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Isolation characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Contact information. . . . . . . . . . . . . . . . . . . . . .12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 February 2011 Document identifier: BTA208X-800B