BTA312-800ET

BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature Rev. 01 — 6 April 2007 Product data sheet 1. Product profile 1.1 General description Passivated, new generation, high commutation, high temperature triacs in a SOT78 plastic package 1.2 Features I High operating junction temperature I Very high commutation performance maximized at each gate sensitivity I High immunity to dV/dt 1.3 Applications I High temperature, high power motor control - e.g. vacuum cleaners I Refrigeration and air conditioning compressors I Heating and cooking appliances I Non-linear rectifier-fed motor loads I Electronic thermostats for heating and cooling loads I Solid state relays 1.4 Quick reference data I VDRM ≤ 600 V (BTA312-600CT) I VDRM ≤ 800 V (BTA312-800ET) I ITSM ≤ 95 A (t = 20 ms) I IGT ≤ 35 mA (BTA312-600CT) I IGT ≤ 10 mA (BTA312-800ET) I IT(RMS) ≤ 12 A 2. Pinning information Table 1. Pin 1 2 3 mb Pinning Description main terminal 1 (T1) main terminal 2 (T2) gate (G) mounting base; main terminal 2 (T2) Simplified outline mb Symbol T2 sym051 T1 G 1 2 3 SOT78 (TO-220AB) NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 3. Ordering information Table 2. Ordering information Package Name BTA312-600CT BTA312-800ET SC-46 Description plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB Version SOT78 Type number 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDRM IT(RMS) ITSM Parameter repetitive peak off-state voltage RMS on-state current non-repetitive peak on-state current Conditions BTA312-600CT BTA312-800ET full sine wave; Tmb ≤ 126 °C; see Figure 4 and 5 full sine wave; Tj = 25 °C prior to surge; see Figure 2 and 3 t = 20 ms t = 16.7 ms I2t dIT/dt IGM PGM PG(AV) Tstg Tj [1] [1] Min - Max 600 800 12 Unit V V A - 95 105 45 100 2 5 0.5 +150 150 A A A2s A/µs A W W °C °C I2t for fusing t = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs rate of rise of on-state current peak gate current peak gate power average gate power storage temperature junction temperature over any 20 ms period −40 - Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 2 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 16 Ptot (W) 12 003aab690 conduction angle (degrees) 30 60 90 120 180 form factor a 4 2.8 2.2 1.9 1.57 α = 180° 120° α 90° 60° 30° 8 4 0 0 3 6 9 IT(RMS) (A) 12 α = conduction angle Fig 1. Total power dissipation as a function of RMS on-state current; maximum values 003aab680 100 ITSM (A) 80 60 40 IT ITSM t 1/f Tj(init) = 25 °C max 20 0 1 10 102 number of cycles (n) 103 f = 50 Hz Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 3 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 103 ITSM (A) (1) 003aab691 102 IT ITSM t tp Tj(init) = 25 °C max 10 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit Fig 3. Non-repetitive peak on-state current as a function of pulse duration; maximum values 003aab687 003aab688 50 IT(RMS) (A) 40 15 IT(RMS) (A) 10 30 20 5 10 0 10-2 10-1 1 10 surge duration (s) 0 -50 0 50 100 150 Tmb (°C) f = 50 Hz Tmb = 126 °C Fig 4. RMS on-state current as a function of surge duration; maximum values Fig 5. RMS on-state current as a function of mounting base temperature; maximum values BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 4 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 5. Thermal characteristics Table 4. Symbol Rth(j-mb) Rth(j-a) Thermal characteristics Parameter Conditions Min Typ 60 Max 2.0 1.5 Unit K/W K/W K/W thermal resistance from junction to half cycle; see Figure 6 mounting base full cycle; see Figure 6 thermal resistance from junction to in free air ambient 10 Zth(j-mb) (K/W) 1 (1) 003aab775 10−1 (2) P 10−2 tp t 10−3 10−5 10−4 10−3 10−2 10−1 1 tp (s) 10 (1) Unidirectional (half cycle) (2) Bidirectional (full cycle) Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 5 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 6. Static characteristics Table 5. Static characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter IGT gate trigger current Conditions VD = 12 V; IT = 0.1 A; see Figure 8 T2+ G+ T2+ G− T2− G− IL latching current VD = 12 V; IGT = 0.1 A; see Figure 10 T2+ G+ T2+ G− T2− G− IH VT VGT ID holding current on-state voltage gate trigger voltage VD = 12 V; IGT = 0.1 A; see Figure 11 IT = 15 A; see Figure 9 VD = 12 V; IT = 0.1 A; see Figure 7 VD = 400 V; IT = 0.1 A; Tj = 150 °C 0.25 1.3 0.8 0.4 50 60 50 35 1.6 1.5 2 0.25 1.3 0.7 0.4 25 30 25 15 1.6 1.5 2 mA mA mA mA V V V mA 2 2 2 35 35 35 10 10 10 mA mA mA BTA312-600CT Min Typ Max BTA312-800ET Min Typ Max Unit off-state current VD = VDRM(max); Tj = 150 °C BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 6 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 7. Dynamic characteristics Table 6. Dynamic characteristics Conditions VDM = 0.67 × VDRM(max); Tj = 150 °C; exponential waveform; gate open circuit VDM = 400 V; Tj = 150 °C; IT(RMS) = 12 A; without snubber; gate open circuit VDM = 400 V; Tj = 150 °C; IT(RMS) = 12 A; dV/dt = 10 V/µs; gate open circuit VDM = 400 V; Tj = 150 °C; IT(RMS) = 12 A; dV/dt = 1 V/µs; gate open circuit tgt gate-controlled ITM = 20 A; VD = VDRM(max); IG = 0.1 A; turn-on time dIG/dt = 5 A/µs BTA312-600CT Min dVD/dt rate of rise of off-state voltage 300 Typ Max BTA312-800ET Min 30 Typ Max V/µs Unit Symbol Parameter dIcom/dt rate of change of commutating current 8 13 20 - 2 - 2 3.5 5 - 2 - A/ms A/ms A/ms µs 1.6 VGT VGT(25°C) 1.2 001aag168 3 IGT IGT(25°C) 2 001aag165 (1) (2) (3) 0.8 1 0.4 −50 0 50 100 Tj (°C) 150 0 −50 0 50 100 Tj (°C) 150 (1) T2− G− (2) T2+ G− (3) T2+ G+ Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. Normalized gate trigger current as a function of junction temperature BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 7 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 40 IT (A) 30 003aab678 3 IL IL(25°C) 2 001aag166 20 1 10 (1) (2) (3) 0 0 0.5 1 1.5 2 VT (V) 2.5 0 −50 0 50 100 Tj (°C) 150 Vo = 1.127 V Rs = 0.027 Ω (1) Tj = 150 °C; typical values (2) Tj = 150 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. On-state current as a function of on-state voltage 3 IH IH(25°C) 2 Fig 10. Normalized latching current as a function of junction temperature 001aag167 1 0 −50 0 50 100 Tj (°C) 150 Fig 11. Normalized holding current as a function of junction temperature BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 8 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 8. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 E p A A1 q D1 mounting base D L1 L2 Q L b1 1 2 3 b c e e 0 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.7 4.1 A1 1.40 1.25 b 0.9 0.6 b1 1.45 1.00 c 0.7 0.4 D 16.0 15.2 D1 6.6 5.9 E 10.3 9.7 e 2.54 L 15.0 12.8 L1 3.30 2.79 L2 max. 3.0 p 3.8 3.5 q 3.0 2.7 Q 2.6 2.2 OUTLINE VERSION SOT78 REFERENCES IEC JEDEC 3-lead TO-220AB JEITA SC-46 EUROPEAN PROJECTION ISSUE DATE 05-03-22 05-10-25 Fig 12. Package outline SOT78 (3-lead TO-220AB) BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 9 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 9. Revision history Table 7. Revision history Release date 20070406 Data sheet status Product data sheet Change notice Supersedes Document ID BTA312_SER_CT_ET_1 BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 10 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 10.3 Disclaimers Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com BTA312_SER_CT_ET_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 6 April 2007 11 of 12 NXP Semiconductors BTA312 series CT and ET 12 A Three-quadrant triacs high commutation high temperature 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 April 2007 Document identifier: BTA312_SER_CT_ET_1