BTA312B-600C,118

BTA312B-600C 3Q Hi-Com Triac Rev. 02 — 30 November 2010 Product data sheet 1. Product profile 1.1 General description Planar passivated high commutation three quadrant triac in a SOT404 plastic package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. This "series C" triac will commutate the full RMS current at the maximum rated junction temperature without the aid of a snubber. 1.2 Features and benefits „ 3Q technology for improved noise immunity „ High commutation capability with maximum false trigger immunity „ High immunity to false turn-on by dV/dt „ High voltage capability „ Planar passivated for voltage ruggedness and reliability „ Surface mountable package „ Triggering in three quadrants only 1.3 Applications „ Electronic thermostats (heating and cooling) „ Rectifier-fed DC inductive loads e.g. DC motors and solenoids „ High power motor controls e.g. washing machines and vacuum cleaners 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VDRM repetitive peak off-state voltage ITSM non-repetitive peak on-state current IT(RMS) RMS on-state current Conditions Min Typ Max Unit - - 600 V full sine wave; Tj(init) = 25 °C; tp = 20 ms; see Figure 4; see Figure 5 - - 95 A full sine wave; Tmb ≤ 101 °C; see Figure 3; see Figure 1; see Figure 2 - - 12 A BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac Table 1. Symbol Quick reference data …continued Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 7 2 - 35 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 7 2 - 35 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; see Figure 7 2 - 35 mA Static characteristics IGT gate trigger current 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 T1 main terminal 1 Simplified outline 2 T2 main terminal 2 3 G gate mb T2 mounting base; main terminal 2 mb Graphic symbol T2 T1 G sym051 2 1 3 SOT404 (D2PAK) 3. Ordering information Table 3. Ordering information Type number BTA312B-600C BTA312B-600C Product data sheet Package Name Description D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads SOT404 (one lead cropped) All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 Version © NXP B.V. 2010. All rights reserved. 2 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDRM repetitive peak off-state voltage - 600 V IT(RMS) RMS on-state current full sine wave; Tmb ≤ 101 °C; see Figure 3; see Figure 1; see Figure 2 - 12 A ITSM non-repetitive peak on-state current full sine wave; Tj(init) = 25 °C; tp = 20 ms; see Figure 4; see Figure 5 - 95 A I2t I2t full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 105 A tp = 10 ms; sine-wave pulse - 45 A2s dIT/dt rate of rise of on-state current IT = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C for fusing over any 20 ms period 003aab687 50 IT(RMS) (A) 003aab686 15 IT(RMS) (A) 40 10 30 20 5 10 0 10-2 Fig 1. 10-1 RMS on-state current as a function of surge duration; maximum values BTA312B-600C Product data sheet 0 -50 1 10 surge duration (s) Fig 2. 0 50 100 150 Tmb (°C) RMS on-state current as a function of mounting base temperature; maximum values All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 3 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 003aab690 16 Ptot (W) conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 12 α = 180° 120° 90° α 60° 30° 8 4 0 0 Fig 3. 3 6 9 12 IT(RMS) (A) Total power dissipation as a function of RMS on-state current; maximum values 003aab680 100 ITSM (A) 80 60 40 ITSM IT t 20 1/f Tj(init) = 25 °C max 0 1 102 10 103 number of cycles (n) Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA312B-600C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 4 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 003aab691 103 ITSM (A) (1) 102 ITSM IT t tp Tj(init) = 25 °C max 10 10-5 Fig 5. 10-4 10-3 10-2 tp (s) 10-1 Non-repetitive peak on-state current as a function of pulse duration; maximum values BTA312B-600C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 5 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base full cycle; see Figure 6 - - 1.5 K/W half cycle; see Figure 6 - - 2 K/W thermal resistance from junction to ambient printed circuit board mounted; minimum footprint - 55 - K/W Rth(j-a) 003aab775 10 Zth(j-mb) (K/W) 1 (1) 10−1 (2) P 10−2 tp 10−3 10−5 10−4 10−3 10−2 10−1 1 t 10 tp (s) (1) Unidirectional (half cycle) (2) Bidirectional (full cycle) Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration BTA312B-600C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 6 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 7 2 - 35 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 7 2 - 35 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; see Figure 7 2 - 35 mA VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C; see Figure 8 - - 50 mA VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; see Figure 8 - - 60 mA VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; see Figure 8 - - 50 mA Static characteristics IGT IL gate trigger current latching current IH holding current VD = 12 V; Tj = 25 °C; see Figure 9 - - 35 mA VT on-state voltage IT = 15 A; Tj = 25 °C; see Figure 10 - 1.3 1.6 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; see Figure 11 - 0.8 1.5 V VD = 400 V; IT = 0.1 A; Tj = 125 °C; see Figure 11 0.25 0.4 - V VD = 600 V; Tj = 125 °C - 0.1 0.5 mA ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 125 °C; exponential waveform; gate open circuit 500 - - V/µs dIcom/dt rate of change of commutating current VD = 400 V; Tj = 125 °C; IT(RMS) = 12 A; dVcom/dt = 20 V/µs; gate open circuit; "without snubber" condition 20 - - A/ms tgt gate-controlled turn-on time ITM = 20 A; VD = 600 V; IG = 0.1 A; dIG/dt = 5 A/µs - 2 - µs BTA312B-600C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 7 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 001aac669 3 001aab100 3 (1) IGT IL IGT(25°C) IL(25°C) 2 2 (2) (3) 1 1 0 −50 0 50 100 0 −50 150 Tj (°C) 0 50 100 150 Tj (°C) (1) T2- G(2) T2+ G(3) T2+ G+ Fig 7. Normalized gate trigger current as a function of junction temperature Fig 8. Normalized latching current as a function of junction temperature 001aab099 3 003aab678 40 IT (A) IH IH(25°C) 30 2 20 1 (1) 10 0 −50 0 50 100 150 Tj (°C) (2) (3) 0 0 0.5 1 1.5 2 VT (V) 2.5 Vo = 1.127 V; Rs = 0.027 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. Normalized holding current as a function of junction temperature BTA312B-600C Product data sheet Fig 10. On-state current as a function of on-state voltage All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 8 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 001aab101 1.6 VGT VGT(25°C) 1.2 0.8 0.4 −50 0 50 100 150 Tj (°C) Fig 11. Normalized gate trigger voltage as a function of junction temperature BTA312B-600C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 9 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 7. Package outline SOT404 Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) A A1 E mounting base D1 D HD 2 Lp 1 3 c b e e Q 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D max. D1 E e Lp HD Q mm 4.50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 11 1.60 1.20 10.30 9.70 2.54 2.90 2.10 15.80 14.80 2.60 2.20 OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-02-11 06-03-16 SOT404 Fig 12. Package outline SOT404 (D2PAK) BTA312B-600C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 10 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BTA312B-600C v.2 20101130 Product data sheet - BTA312B_SER_B_C v.1 Modifications: BTA312B_SER_B_C v.1 BTA312B-600C Product data sheet • • Type number BTA312B-600C separated from data sheet BTA312B_SER_B_C v.1. Various changes to content. 20070412 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 - © NXP B.V. 2010. All rights reserved. 11 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective BTA312B-600C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 12 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BTA312B-600C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 30 November 2010 © NXP B.V. 2010. All rights reserved. 13 of 14 BTA312B-600C NXP Semiconductors 3Q Hi-Com Triac 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Contact information. . . . . . . . . . . . . . . . . . . . . .13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 November 2010 Document identifier: BTA312B-600C